TW201608343A - Decompression drying device, substrate processing device and decompression drying method - Google Patents

Abstract

An object of the invention is to provide a technique of performing depression processing in a depression drying device at a depression speed closer to a desired depression speed. The depression drying device (1) accommodates a substrate (G) where a processing liquid adheres in a chamber (20), and reduces pressure in the chamber (20), thereby drying the substrate (G). The depression drying device (1) includes: the chamber (20), accommodating the substrate (G); an evacuation means (30); a valve (45), regulating a flow rate of evacuation; a learning means (80), obtaining depression curve data in the chamber (20); an input means (70), inputting a target pressure value and a target arrival time; and a control unit (60), controlling an aperture of the valve (45). The control unit (60) obtains the depression curve data in an environment where the chamber (20) in use is installed, and adjusts the aperture of the valve (45) based on the depression curve data, the target pressure value and the target arrival time. Accordingly, regardless of individual differences or installation environments of devices, depression processing can be performed at a depression speed closer to a desired depression speed.

Description

Vacuum drying device, substrate processing device, and vacuum drying method

The present invention relates to a technique for drying a substrate to which a treatment liquid is attached under reduced pressure.

Conventionally, a semiconductor wafer (wafer), a glass substrate for a liquid crystal display device, a glass substrate for a plasma display panel (PDP), a glass substrate for a photo mask, and a color filter (color) In the manufacturing process of the substrate for a precision electronic device such as a substrate, a substrate for a recording disk, a substrate for a solar cell, or a substrate for an electronic paper, the processing liquid applied to the substrate is dried to use a reduced pressure. Drying device. The vacuum drying apparatus has a chamber that houses a substrate, and an exhaust device that discharges gas in the chamber. A conventional vacuum drying apparatus is described, for example, in Patent Document 1.

When a treatment liquid such as a photo resist applied to a substrate is dried to form a film, there is a fear that a sudden boiling occurs when a rapid pressure reduction is performed. The bump is caused by the rapid evaporation of the solvent component in the photoresist applied to the surface of the substrate. If a sudden boiling occurs in the vacuum drying treatment, a defoaming phenomenon in which vesicles are formed on the surface of the photoresist is generated. Therefore, in the vacuum drying treatment, it is necessary to depressurize the chamber in a rapid manner in the initial stage, and to perform pressure reduction in stages. [PRIOR ART DOCUMENT] [Patent Document 1] [Patent Document 1] Japanese Patent Laid-Open No. 2006-261379

[Problems to be solved by the invention]

In order to change the pressure in the chamber in stages, it is necessary to adjust the decompression speed. In the vacuum drying apparatus described in Patent Document 1, in the pressure reduction treatment, the gas in the chamber is discharged, and an inert gas (gas) is supplied to the chamber to adjust the pressure reduction rate. Further, in order to appropriately adjust the decompression speed, a valve that can change the opening degree in a plurality of stages is provided between the supply source of the inert gas and the chamber.

Further, as another method of adjusting the decompression speed in the chamber, a valve that can change the opening degree in a plurality of stages may be provided between the chamber and the exhaust device. At this time, the amount of exhaust gas from the chamber can be adjusted in stages.

Regardless of the adjustment of the supply amount of the inert gas and the amount of the exhaust gas from the chamber, in order to perform the pressure reduction treatment at the required decompression speed, it is necessary to set the valve to be decompressed. The corresponding opening of the speed. However, even when the same valve opening degree is set for the vacuum drying device of the same type, the decompression speed varies depending on the individual difference of the device or the difference in the installation environment. Therefore, there is a case where there is a deviation between the required decompression speed and the actual decompression speed.

The present invention has been made in view of such circumstances, and an object thereof is to provide a technique in which a decompression drying apparatus having a valve that can change a degree of opening in a plurality of stages can be made closer to a desired decompression speed. The pressure rate is reduced under reduced pressure.

[Technical means to solve the problem]

In order to solve the problem, the first invention of the present application is a vacuum drying apparatus for drying a substrate to which a treatment liquid is attached, the vacuum drying apparatus comprising: a chamber for accommodating the substrate; a gas unit, wherein the chamber is decompressed and decompressed; a valve is interposed between the chamber and the decompression and exhaust unit, and a valve opening degree is used to adjust a flow rate of the decompressed exhaust gas; Obtaining a decompression curve data indicating a pressure change in the chamber caused by the decompressed exhaust gas for each prescribed opening degree of the valve; the input unit, the input target pressure value, and the target reaching time And a control unit that controls an opening degree of the valve; and the control unit adjusts an opening degree of the valve based on the decompression curve data, the input target pressure value, and the target reaching time .

A second invention of the present application is the vacuum drying apparatus according to the first invention, wherein a plurality of the target pressure values and the target reaching time are continuously input to the input unit.

A third invention of the present invention is the vacuum drying apparatus according to the first aspect of the invention, comprising a plurality of the valves, wherein the control unit causes all of the plurality of valves to operate at the same opening degree.

A fourth invention of the present application is the reduced-pressure drying apparatus according to the first invention, wherein the valve adjusts the opening degree by changing the angle of the valve.

A fifth invention of the present invention is the vacuum drying apparatus according to the first aspect of the present invention, wherein the pressure reduction profile includes: a pressure drop portion, a pressure in the chamber decreases as time passes; and a pressure stabilization portion, the chamber The pressure is stabilized at a predetermined pressure value; and when the target pressure value is lower than the original pressure value in the chamber, the control unit refers to the pressure drop portion to set the opening degree of the valve. The control unit sets the opening degree of the valve with reference to the pressure stabilization unit while the target pressure value is substantially the same as the original pressure value in the chamber.

A sixth invention of the present application is the vacuum drying apparatus according to the first invention, comprising a plurality of the chambers, and the learning unit acquires the inherent decompression curve data for each of the chambers.

A seventh invention of the present invention is a substrate processing apparatus that performs coating and development of a resist liquid on the substrate, and includes: a coating portion that applies the resist liquid to the substrate before exposure processing; The vacuum drying apparatus according to any one of the sixth inventions, wherein the substrate to which the resist liquid is adhered is dried under reduced pressure, and a developing unit that performs development processing on the substrate subjected to the exposure processing.

An eighth invention of the present application is a vacuum drying method for drying a substrate by accommodating a substrate to which a treatment liquid is attached, and decompressing the chamber, the vacuum drying method comprising: a) a learning step of acquiring a decompression curve data indicating a pressure change in the chamber caused by the decompression exhaust gas for each prescribed opening degree of a valve that adjusts a flow rate of the decompressed exhaust gas from the chamber; b) an input step of inputting a target pressure value and a target reaching time; and c) a vacuum drying step, after the learning step and the input step, based on the decompression curve data, the input target pressure value And the target reaches the time to adjust the opening of the valve.

A ninth invention of the present application is the reduced-pressure drying method according to the eighth invention, wherein in the inputting step, a plurality of the target pressure values and the target reaching time are continuously input.

The tenth invention of the present invention is the vacuum drying method according to the eighth invention or the ninth invention, wherein the pressure reduction profile data includes: a pressure drop portion, a pressure in the chamber decreases as time passes; and a pressure stabilization portion, The pressure in the chamber is stabilized at a predetermined pressure value; and in the vacuum drying step, when the target pressure value is lower than an original pressure value in the chamber, the pressure drop portion is referred to The opening degree of the valve is set, and the opening degree of the valve is set with reference to the pressure stabilizing portion while the target pressure value is substantially the same as the original pressure value in the chamber.

[Effects of the Invention]

According to the first to tenth inventions of the present application, the decompression curve data of the chamber used in the installation environment is obtained, and the opening degree of the valve is adjusted based on the decompression curve data. Therefore, regardless of the individual difference of the apparatus or the setting environment, the pressure reduction treatment can be performed at a decompression speed closer to the required decompression speed.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

1. First Embodiment

<1-1. Configuration of substrate processing apparatus>

FIG. 1 is a schematic view showing a configuration of a substrate processing apparatus 9 including a vacuum drying apparatus 1 according to the first embodiment. The substrate processing apparatus 9 of the present embodiment is a device that applies a resist liquid to a glass substrate G for a liquid crystal display device, and performs development after exposure and exposure. Hereinafter, the glass substrate G for a liquid crystal display device is referred to as a substrate G.

The substrate processing apparatus 9 includes a loading unit 90, a cleaning unit 91, a dehydration bake unit 92, a coating unit 93, a vacuum drying apparatus 1 as a reduced-pressure drying unit, and a pre-bake unit 94. The exposure unit 95, the developing unit 96, the rinse unit 97, the post bake unit 98, and the carry-out unit 99 serve as a plurality of processing units. Each processing unit of the substrate processing apparatus 9 is disposed adjacent to each other in the stated order. The substrate G is transported to each processing unit in the above-described order in accordance with the progress of the processing by a transfer mechanism (not shown) as indicated by a broken line arrow.

The loading unit 90 carries the substrate G to be processed in the substrate processing apparatus 9 into the substrate processing apparatus 9. The cleaning unit 91 cleans the substrate G carried into the loading unit 90, and removes organic contamination or metal contamination, oil and fat, natural oxide film, and the like, which are caused by fine particles. The dewatering portion 92 heats the substrate G to vaporize the cleaning liquid adhering to the substrate G in the cleaning portion 91, thereby drying the substrate G.

The application unit 93 applies a treatment liquid to the surface of the substrate G that has been subjected to the drying treatment in the dewatering portion 92. In the coating portion 93 of the present embodiment, a resist liquid is applied to the surface of the substrate G. Then, the vacuum drying apparatus 1 evaporates the solvent of the resist liquid applied to the surface of the substrate G by pressure reduction, and the substrate G is dried. The pre-baking portion 94 is a heat treatment portion, and heats the substrate G after the vacuum drying treatment in the vacuum drying device 1 to cure the resist component on the surface of the substrate G. Thereby, a thin film of the processing liquid, that is, a resist film is formed on the surface of the substrate G.

Next, the exposure unit 95 performs exposure processing on the surface of the substrate G on which the resist film is formed. The exposure unit 95 irradiates the far ultraviolet rays through the photomask on which the circuit pattern is drawn, and transfers the pattern to the resist film. The developing unit 96 immerses the substrate G exposed in the exposure unit 95 in the developing solution to perform development processing.

The rinsing unit 97 rinsing the substrate G developed in the developing unit 96 by the rinsing liquid. Thereby, the progress of the development processing is stopped. The post-baking portion 98 heats the substrate G to vaporize the rinse liquid adhering to the substrate G in the rinse portion 97, thereby drying the substrate G. The substrate G subjected to the processing in each processing unit of the substrate processing apparatus 9 is transported to the carry-out unit 99. Then, the substrate G is carried out from the carry-out unit 99 to the outside of the substrate processing apparatus 9.

Further, although the substrate processing apparatus 9 of the present embodiment has the exposure unit 95, the exposure unit may be omitted in the substrate processing apparatus of the present invention. In this case, the substrate processing apparatus may be used in combination with another exposure apparatus.

< 1-2. Composition of vacuum drying device>

FIG. 2 is a schematic view showing a configuration of the reduced-pressure drying device 1 of the present embodiment. As described above, the vacuum drying apparatus 1 is a device that dries the substrate G coated with a treatment liquid such as a resist liquid under reduced pressure. As shown in FIG. 2, the vacuum drying apparatus 1 has a chamber 20, an exhaust pump 30, a piping portion 40, an inert gas supply unit 50, a control unit 60, and an input unit 70.

The chamber 20 has a base portion 21 and a lid portion 22. The base portion 21 is a plate-shaped member that expands in a substantially level. The lid portion 22 is a lid-shaped tubular member that covers the upper portion of the base portion 21. The substrate G is housed inside the casing including the base portion 21 and the lid portion 22. Further, a seal material 221 is provided at a lower end portion of the lid portion 22. Thereby, the communication between the inside and the outside of the chamber 20 at the contact portion between the base portion 21 and the lid portion 22 is blocked.

An exhaust port 23 is provided in the base portion 21. Thereby, the gas in the chamber 20 can be discharged to the outside of the chamber 20 via the exhaust port 23. In the chamber 20 of the present embodiment, four exhaust ports 23 are provided. In Fig. 2, only two of the four exhaust ports 23 are shown. Further, the number of the exhaust ports 23 provided in the chamber 20 may be one, two or three, or five or more.

Inside the chamber 20, a support mechanism 24 is provided. The support mechanism 24 has a support plate 241, a plurality of support pins (pin) 242, and a support post 243. The support plate 241 is a plate-shaped member that expands in a substantially level. The support plate 241 holds a plurality of support pins 242. The substrate G is placed on the upper end of the plurality of support pins 242, and the substrate G is supported from the back surface. The support pins 242 extend upward from the support plate 241, respectively. The plurality of support pins 242 are dispersedly arranged in the horizontal direction. Thereby, the substrate G is stably supported. The support column 243 is a member that supports the support plate 241. The lower end portion of the support post 243 is fixed to the base portion 21. Further, the lower end portion of the support column 243 may be fixed to another member such as a lifting device.

Further, a pressure sensor 25 for measuring the pressure in the chamber 20 is provided in the chamber 20. The pressure sensor 25 of the present embodiment is provided in the base portion 21, but a pressure sensor may be provided in the individual pipe 41 of the piping portion 40 or the first common pipe 42.

The exhaust pump 30 is a pump that discharges the gas in the chamber 20. The exhaust pump 30 is connected to the exhaust port 23 of the chamber 20 via the piping portion 40. Thereby, when the exhaust pump 30 is driven, the gas in the chamber 20 is discharged to the outside of the vacuum drying apparatus 1 through the exhaust port 23 and the piping portion 40. The exhaust pump 30 is a reduced-pressure exhausting means that exhausts the inside of the chamber 20 by driving at a fixed output. The adjustment of the exhaust velocity from the chamber 20 is performed by a valve 45 to be described later.

The piping unit 40 has four individual pipes 41, a first common pipe 42, a second common pipe 43, and two branch pipes 44. The upstream end of each of the individual pipes 41 is connected to the exhaust port 23, and the downstream end is connected to the first common pipe 42. In the present embodiment, the downstream end of the two individual pipes 41 is connected to one end of the first common pipe 42, and the downstream end of the two separate pipes 41 is connected to the first common pipe 42. The other end.

The downstream end of the second common pipe 43 is connected to the exhaust pump 30. The upstream end of each of the two branch pipes 44 is connected to the middle of the pipe of the first common pipe 42, and the downstream end is connected to The second end portion of the upstream side of the pipe 43 is shared. Thereby, the inside of the chamber 20 and the exhaust pump 30 communicate with each other via the four exhaust ports 23, the four individual pipes 41, the first common pipe 42, the two branch pipes 44, and the second common pipe 43.

In the branch pipe 44, a valve 45 is provided, respectively. The valve 45 is interposed between the chamber 20 and the exhaust pump 30 to regulate the flow rate of the reduced pressure exhaust gas. The valve 45 of the present embodiment is a butterfly valve that adjusts the opening degree by changing the angle of the valve. Further, in the present embodiment, the valve 45 is a butterfly valve, but a globe valve or other valve may be used as long as it is a valve that can adjust the flow rate of the decompressed exhaust gas by the opening degree thereof.

Further, in the present embodiment, the two valves 45 operate at the same opening degree. That is, if the control unit 60 sets the opening degree of the valve 45 to 20%, the opening degrees of the two valves 45 are both adjusted to 20%.

The inert gas supply unit 50 supplies an inert gas into the chamber 20. The inert gas supply unit 50 includes an inert gas supply pipe 51, an inert gas supply source 52, and an opening and closing valve 53. One end of the inert gas supply pipe 51 is connected to the internal space of the chamber 20, and the other end is connected to the inert gas supply source 52. The inert gas supply source 52 of the present embodiment supplies dry nitrogen gas as an inert gas. The on-off valve 53 is provided in the inert gas supply pipe 51. Therefore, if the opening and closing valve 53 is opened, the inert gas is supplied from the inert gas supply source 52 into the chamber 20. Further, if the opening and closing valve 53 is closed, the supply of the inert gas from the inert gas supply source 52 to the chamber 20 is stopped.

Further, the inert gas supply unit 50 may supply another dry inert gas such as argon instead of nitrogen. Further, the vacuum drying apparatus 1 may have an air supply unit that supplies the atmosphere instead of the inert gas supply unit 50.

The control unit 60 controls each unit of the reduced-pressure drying device 1. As schematically shown in Fig. 2, the control unit 60 includes a computer having a calculation processing unit 61 such as a central processing unit (CPU) and a random access memory (RAM). A storage unit 63 such as a memory 62 and a hard disk drive. Further, the control unit 60 is electrically connected to the pressure sensor 25, the exhaust pump 30, the two valves 45, the opening and closing valve 53, and the input unit 70, respectively.

The control unit 60 temporarily reads the computer program or data stored in the storage unit 63 into the memory 62, and the arithmetic processing unit 61 performs arithmetic processing based on the computer program and the data, thereby performing the pressure reduction drying device. The movement of each part in 1 is controlled. Thereby, the reduced pressure drying process in the vacuum drying apparatus 1 is performed. Further, the control unit 60 may control only the reduced-pressure drying device 1 or may control the entire substrate processing device 9.

The input unit 70 is an input unit for the user to input the target pressure value and the target arrival time. The input unit 70 of the present embodiment is an input panel provided in the substrate processing apparatus 9, but the input unit 70 may be another type of input unit (for example, a keyboard or a mouse). If the target pressure value and the target reaching time are input to the input unit 70, the data is taken in to the control unit 60.

< 1-3. Flow of vacuum drying treatment>

Next, the decompression drying process in the vacuum drying apparatus 1 will be described with reference to Figs. 3 to 5 . FIG. 3 is a flow chart showing the flow of the reduced-pressure drying process in the vacuum drying apparatus 1. FIG. 4 is a view showing an example of the decompression curve data D. FIG. 5 is a view showing an example of the target pressure reduction waveform R.

As shown in Fig. 3, first, the vacuum drying apparatus 1 performs a learning step (step ST101). In the learning step, the decompression drying apparatus 1 acquires the decompression curve data D (refer to FIG. 4) indicating the pressure change in the chamber 20 caused by the decompression exhaust gas for each opening degree of the predetermined valve 45.

In the learning step of step ST101, after the pressure in the chamber 20 is brought to atmospheric pressure of 100,000 [Pa] by opening to the atmosphere, the exhaust pump 30 is driven, and the valve 45 is opened at a predetermined opening degree. Moreover, the pressure change in the chamber 20 is measured by the pressure sensor 25 after the valve 45 is opened until a prescribed time elapses. Thereby, the control unit 60 acquires the decompression curve data D. The pressure reduction curve data D is obtained for each of the plurality of opening degrees by performing such pressure measurement for each of the predetermined opening degrees. The decompression curve data D is held in the storage portion 63, for example, in the form of tabular data indicating the correspondence between the elapsed time and the pressure value for each opening degree of the valve 45.

In the present embodiment, as shown in FIG. 4, the opening degree of the valve 45 is 5%, 7%, 8%, 10%, 12%, 15%, 20%, 50%, and 100%, respectively. Decompression curve data D. As described above, in the present embodiment, the pressure sensor 25 and the control unit 60 constitute a learning unit 80 that acquires the decompression curve data D for each predetermined opening degree of the valve 45.

In the present embodiment, after the learning step of step ST101 is performed, the vacuum drying process of the substrate G is performed. First, the target pressure value and the target reaching time are input to the input unit 70 (step ST102). In the present embodiment, a plurality of consecutive target pressure values and target arrival times are input to the input unit 70. An example of the target decompression waveform R including the plurality of target pressure values and the target arrival time is shown in FIG. 5.

In the target decompression waveform R of the example of FIG. 5, in the first period T1, the target pressure value is 10,000 [Pa], and the target reaching time is 20 [sec]. In the second period T2, the target pressure value is 400 [Pa], and the target reaching time is 10 [sec]. In the third period T3, the target pressure value is 400 [Pa], and the target reaching time is 10 [sec]. That is, in the third period T3, the pressure value is maintained at 400 [Pa]. Further, in the fourth period T4, the target pressure value is 20 [Pa], and the target reaching time is 5 [sec]. Moreover, after the fourth period T4 reaches the target pressure value, the pressure in the chamber 20 is returned to the atmospheric pressure by an inert gas purge. By performing pressure reduction in stages in the same manner as the target pressure reduction waveform R of the example of FIG. 5, the treatment liquid applied to the surface of the substrate G is prevented from boiling.

Next, the substrate G is carried into the chamber 20 (step ST103). At this time, in a state where the valve 45 and the opening and closing valve 53 are closed, the lid portion 22 of the chamber 20 is raised by the chamber opening and closing mechanism (not shown). The chamber 20 is thus opened. Then, the substrate G coated with the treatment liquid is carried into the chamber 20 and placed on the support pin 242. Thereafter, the lid portion 22 is lowered by the chamber opening and closing mechanism. The chamber 20 is thereby closed, thereby accommodating the substrate G in the chamber 20.

In the present embodiment, the substrate loading step of step ST103 is performed after the input step of step ST102, but the order of step ST102 and step ST103 may be reversed.

Then, based on the target pressure value and the target reaching time input in step ST102, the inside of the chamber 20 is depressurized, whereby the substrate G to which the processing liquid adheres is dried (step ST104). In step ST104, the control unit 60 selects the decompression curve data D having the waveform along the target decompression waveform R, and selects the valve 45 for each period based on the opening degree of the valve 45 in the decompression curve data D. The opening degree, the target decompression waveform R includes a target pressure value and a target arrival time.

As shown in FIG. 4, the decompression curve data D includes a pressure drop portion D1 and a pressure stabilizing portion D2, respectively. At the pressure drop portion D1, the pressure in the chamber 20 drops as time passes. On the other hand, in the pressure stabilizing portion D2, the pressure in the chamber 20 and the exhaust pressure of the decompressed exhaust gas are in equilibrium, or the amount of exhaust gas from the inside of the chamber 20 to the exhaust pump 30 and from the outside of the chamber 20 to the chamber The inflow amount of the gas in the chamber 20 is in an equilibrium state, whereby the pressure in the chamber 20 is stabilized at a predetermined pressure value.

In step ST104, the opening degree of the valve 45 is determined based on the pressure drop portion D1 of the decompression curve data D in the first period T1, the second period T2, and the fourth period T4 of the pressure drop. Further, in the third period T3 during which the pressure is maintained, the opening degree of the valve 45 is determined based on the pressure stabilizing portion D2 of the decompression curve data D.

For example, in the first period T1, it is necessary to decompress from atmospheric pressure 100,000 [Pa] to 10,000 [Pa] during a period of 20 [sec]. The control unit 60 refers to the pressure drop portion D1 of the decompression curve data D, and the first period is when the period from 100,000 [Pa] decompression to 10,000 [Pa] is about 20 [sec] based on the opening degree of 8%. The opening of the valve 45 of T1 is set to 8%.

Then, in the second period T2, it is necessary to decompress from the target pressure value 10,000 [Pa] of the first period T1 to 400 [Pa] in a period of 10 [sec]. On the other hand, referring to the pressure drop portion D1 of the decompression curve data D, when the opening degree is 12%, the period from 10,000 [Pa] to 400 [Pa] is about 9 [sec]. Further, when the opening degree is 10%, the period from 10,000 [Pa] to 400 [Pa] is about 12 [sec].

Based on this, in the present embodiment, the control unit 60 sets the opening degree of the valve 45 in the second period T2 to 10%. In other words, when there is no opening degree of the required target decompression waveform R in the plurality of opening degrees in which the decompression curve data D has been acquired, the control unit 60 of the present embodiment selects from among the approximate two kinds of opening degrees. Small degree. If the opening degree at which the decompression speed is slower than the target decompression waveform R is selected as described above, the pressure in the chamber 20 can be prevented from being lower than the target decompression waveform R. Therefore, the boiling of the treatment liquid applied to the substrate G is further suppressed. At this time, the control unit 60 may extend the second period T2 to 12 [sec] based on the decompression curve data D of 10% of the opening degree.

Further, the control unit 60 may calculate the opening degree in accordance with the target decompression waveform R by calculation based on the two kinds of opening degrees approximate to the target decompression waveform R during the period. At this time, the opening degree of the valve 45 in the second period T2 is set to the opening degree calculated by calculation.

Next, the target pressure value 400 [Pa] of the third period T3 is the same pressure value as the target pressure value 400 [Pa] of the second period T2. That is, in the third period T3, it is necessary to maintain the pressure in the chamber 20 at 400 [Pa] for 10 [sec]. The control unit 60 refers to the pressure stabilizing portion D2 of the decompression curve data D, and maintains the opening degree of the valve 45 in the third period T3 to 7% when the pressure is maintained at about 400 [Pa] when the opening degree is 7%.

Then, in the fourth period T4, it is necessary to decompress from the target pressure value 400 [Pa] of the third period T3 to 20 [Pa] in the period of 5 [sec]. The control unit 60 refers to the pressure drop portion D1 of the decompression curve data D, and based on the case where the degree of decompression from 400 [Pa] to 20 [Pa] is about 5 [sec] based on the opening degree of 50%, the fourth period T4 is obtained. The opening of the valve 45 is set to 50%.

After the end of the fourth period T4, the control unit 60 closes the valve 45 to stop the exhaust gas from the chamber 20. Then, the opening and closing valve 53 is opened to perform purging of the inert gas from the inert gas supply source 52 into the chamber 20. Thereby, the air pressure in the chamber 20 is raised to atmospheric pressure. When the pressure in the chamber 20 becomes atmospheric pressure, the opening and closing valve 53 is closed. Thereby the vacuum drying step ends.

Thereafter, the substrate G is carried out from the chamber 20 (step ST105). In the same manner as in step ST103, in the state in which the valve 45 and the on-off valve 53 are closed, the lid opening and closing mechanism of the chamber 20 is raised by the chamber opening and closing mechanism. The chamber 20 is thus opened. Then, the substrate G subjected to the reduced-pressure drying treatment is carried out to the outside of the chamber 20.

If the setting environment of the vacuum drying apparatus 1 is different, even if the opening degree of the valve 45 is the same, the decompression speed in the chamber 20 is different. Therefore, there is a concern that there is a deviation between the required decompression speed and the actual decompression speed according to the installation environment of the decompression drying apparatus 1.

In the present embodiment, the learning step of step ST101 is performed before the decompression drying process of the substrate G by step ST102, step ST103, step ST104, and step ST105. Thereby, the decompression curve data D is acquired in the same installation environment as in the case where the vacuum drying apparatus 1 performs the vacuum drying process of the substrate G. By performing the reduced-pressure drying treatment based on the decompression curve data D, it is possible to suppress the occurrence of a deviation between the required decompression speed and the actual decompression speed. That is, the pressure reduction process can be performed at a decompression speed which is closer to the required decompression speed.

Further, the learning step of step ST101 may not be performed every time the vacuum drying processing of the substrate G is performed by the steps ST102, ST103, ST104, and ST105. The learning step can also be carried out during the setting or removal of the reduced-pressure drying device 1, or during regular maintenance.

In addition, even if the plurality of vacuum drying apparatuses 1 manufactured by the same design are subjected to a vacuum drying treatment by the opening degree of the same valve 45 due to a manufacturing error or the like, the inside of the chamber 20 of each of the vacuum drying apparatuses 1 is used. There is also a deviation in the decompression speed. By obtaining the decompression curve data D before the decompression drying process in each of the decompression drying apparatuses 1 as in the present embodiment, it is possible to suppress the following cases: The decompression speed required by the individual difference of the decompression drying apparatus 1 There is a divergence between the actual decompression speeds. That is, the pressure reduction process can be performed at a decompression speed which is closer to the required decompression speed.

As described above, according to the vacuum drying apparatus 1 of the present embodiment, regardless of the individual difference or the installation environment of the apparatus, the decompression speed close to the required decompression speed can be reduced in each period of the target decompression waveform R. Pressure treatment. Thereby, the sudden boiling of the resist liquid is suppressed, and a smooth resist film can be obtained.

< 2. Modifications>

Although an embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and may be modified as described below, for example.

In the vacuum drying apparatus of the embodiment, the time taken for the decompression from the original pressure value to the target pressure value in each of the decompression curve data for each period of the target decompression waveform R is The target reaching time is compared to set the valve opening degree, but the present invention is not limited thereto. In the vacuum drying apparatus of the present invention, parameters such as a decompression speed or a decompression acceleration may be calculated from the respective decompression curve data, and the opening degree of the valve may be set based on the parameter. Further, the decompression drying apparatus of the present invention may use other algorithms to set the opening degree of the valve based on the decompression curve data.

Further, in the above embodiment, the reduced-pressure drying device has only one chamber, but the present invention is not limited thereto. The reduced-pressure drying device may have a plurality of chambers and a plurality of piping portions connected to the respective chambers. At this time, the control unit preferably acquires the inherent decompression curve data for each of the plurality of chambers. Thereby, a decompression waveform closer to the target decompression waveform can be realized in accordance with the inherent pressure change characteristics of the respective chambers.

Further, in the above-described embodiment, the piping portion has two valves, but the number of valves provided in the piping portion may be one or three or more.

Further, in the above-described embodiment, the two valves are operated at the same opening degree, but they may be operated at different opening degrees. At this time, it is sufficient to create a form data in which the opening degrees of the respective valves are combined.

Further, the vacuum drying apparatus of the above embodiment is a part of the substrate processing apparatus, but the vacuum drying apparatus of the present invention may be an independent apparatus that is not provided together with other processing units. Further, in the vacuum drying apparatus according to the above embodiment, the substrate to which the resist liquid is adhered is dried. However, the vacuum drying apparatus of the present invention may dry the substrate to which the other processing liquid adheres.

In addition, the vacuum drying apparatus of the embodiment is a glass substrate for a liquid crystal display device, but the vacuum drying apparatus of the present invention may be a glass substrate for a PDP, a semiconductor wafer, a glass substrate for a photomask, or a color filter. Other substrates for precision electronic devices such as a substrate for a light sheet, a substrate for a recording disk, and a substrate for a solar cell are used as processing targets.

Further, each element appearing in the above-described embodiments and modifications may be appropriately combined within a range in which no contradiction occurs.

1‧‧‧Decompression drying device (decompression drying section)
9‧‧‧Substrate processing unit
20‧‧‧ chamber
21‧‧‧Base section
22‧‧‧ 盖部
23‧‧‧Exhaust port
24‧‧‧Support institutions
25‧‧‧ Pressure Sensor
30‧‧‧Exhaust pump (decompression exhaust unit)
40‧‧‧Pipe Department
41‧‧‧Single piping
42‧‧‧The first total piping
43‧‧‧Second total piping
44‧‧‧ branch piping
45‧‧‧ valve
50‧‧‧Inert gas supply
51‧‧‧Inert gas supply piping
52‧‧‧Inert gas supply
53‧‧‧Opening and closing valve
60‧‧‧Control Department
61‧‧‧Operation Processing Department
62‧‧‧ memory
63‧‧‧ Storage Department
70‧‧‧Input unit (input unit)
80‧‧‧Learning unit
90‧‧‧ Moving into the Department
91‧‧‧Cleaning Department
92‧‧‧Dewatering Department
93‧‧‧ Coating Department
94‧‧‧Pre-bake department
95‧‧‧Exposure Department
96‧‧‧Development Department
97‧‧‧Fishing Department
98‧‧‧ After baking department
99‧‧‧ Moving out
221‧‧‧ Sealing material
241‧‧‧Support board
242‧‧‧Support pins
243‧‧‧Support column
D‧‧‧decompression curve data
D1‧‧‧ Pressure Drop Department
D2‧‧‧Pressure Stabilization Department
G‧‧‧Substrate
R‧‧‧ target decompression waveform
ST101～ST105‧‧‧Steps
The first period of T1‧‧
Second period of T2‧‧
T3‧‧‧ third period
Fourth period of T4‧‧

FIG. 1 is a schematic view showing a configuration of a substrate processing apparatus according to a first embodiment. FIG. 2 is a schematic view showing a configuration of a vacuum drying apparatus according to the first embodiment. 3 is a flow chart showing the flow of the reduced-pressure drying process of the first embodiment. 4 is a view showing an example of decompression curve data of the first embodiment. FIG. 5 is a view showing an example of a target decompression waveform of the first embodiment.

1‧‧‧Decompression drying device (decompression drying section)

20‧‧‧ chamber

21‧‧‧Base section

22‧‧‧ 盖部

23‧‧‧Exhaust port

24‧‧‧Support institutions

25‧‧‧ Pressure Sensor

30‧‧‧Exhaust pump (decompression exhaust unit)

40‧‧‧Pipe Department

41‧‧‧Single piping

42‧‧‧The first total piping

43‧‧‧Second total piping

44‧‧‧ branch piping

45‧‧‧ valve

50‧‧‧Inert gas supply

51‧‧‧Inert gas supply piping

52‧‧‧Inert gas supply

53‧‧‧Opening and closing valve

60‧‧‧Control Department

61‧‧‧Operation Processing Department

62‧‧‧ memory

63‧‧‧ Storage Department

70‧‧‧Input unit (input unit)

80‧‧‧Learning unit

221‧‧‧ Sealing material

241‧‧‧Support board

242‧‧‧Support pins

243‧‧‧Support column

G‧‧‧Substrate

Claims (10)

A vacuum drying device for drying a substrate to which a treatment liquid is attached, the vacuum drying device comprising: a chamber for accommodating the substrate; a decompression exhaust unit for decompressing and decompressing the chamber a valve interposed between the chamber and the decompression exhaust unit, utilizing an opening degree of the valve to adjust a flow rate of the decompressed exhaust gas; a learning unit for each of the prescribed valves And obtaining a decompression curve data indicating a pressure change in the chamber caused by the decompressed exhaust gas; an input unit inputting a target pressure value and a target arrival time; and a control unit controlling the opening degree of the valve And the control unit adjusts an opening degree of the valve based on the decompression curve data, the input target pressure value, and the target reaching time. The reduced-pressure drying apparatus according to claim 1, wherein: the plurality of the target pressure values and the target reaching time are input to the input unit. The reduced-pressure drying apparatus according to claim 1, wherein the control unit includes a plurality of the valves, and the control unit causes all of the plurality of valves to operate at the same opening degree. The vacuum drying apparatus according to claim 1, wherein: the valve adjusts the opening degree by changing an angle of the valve. The vacuum drying apparatus according to claim 1, wherein: the pressure reduction curve data includes: a pressure drop portion, a pressure in the chamber decreases as time passes; and a pressure stabilization portion, the chamber The pressure is stabilized at a predetermined pressure value; and when the target pressure value is lower than the original pressure value in the chamber, the control unit refers to the pressure drop portion to set the opening degree of the valve. The control unit sets the opening degree of the valve with reference to the pressure stabilizing portion while the target pressure value is substantially the same as the original pressure value in the chamber. The reduced-pressure drying apparatus according to claim 1, wherein: the plurality of the chambers are included, and the learning unit acquires the inherent decompression curve data for each of the chambers. A substrate processing apparatus for applying and developing a resist liquid to a substrate, the substrate processing apparatus comprising: a coating portion that applies the resist liquid to the substrate before exposure processing; and the first to the first patent application The vacuum drying apparatus according to any one of the six aspects, wherein the substrate to which the resist liquid is adhered is dried under reduced pressure, and the developing unit performs development processing on the substrate subjected to the exposure processing. A vacuum drying method for drying a substrate by accommodating a substrate to which a treatment liquid is attached, and decompressing the chamber, the vacuum drying method comprising: a learning step for adjusting Decompression curve data indicating a change in pressure in the chamber caused by decompression exhaust gas is acquired for each prescribed opening degree of a valve for reducing the flow rate of the exhaust gas in the chamber; an input step, inputting a target pressure value and a target And a reduced pressure drying step, after the learning step and the inputting step, adjusting the opening degree of the valve based on the decompression curve data, the input target pressure value, and the target reaching time. The reduced-pressure drying method according to claim 8, wherein: in the inputting step, inputting the plurality of the target pressure values and the target reaching time. The vacuum drying method according to the eighth or the ninth aspect, wherein the pressure reduction curve data includes: a pressure drop portion, a pressure in the chamber decreases as time passes; and a pressure stabilization portion, The pressure in the chamber is stabilized at a predetermined pressure value; and in the vacuum drying step, when the target pressure value is lower than an original pressure value in the chamber, the pressure drop portion is referred to The opening degree of the valve is set, and the opening degree of the valve is set with reference to the pressure stabilizing portion while the target pressure value is substantially the same as the original pressure value in the chamber.