TW201607666A - 工作台裝置、搬運裝置、半導體製造裝置及檢查裝置 - Google Patents

工作台裝置、搬運裝置、半導體製造裝置及檢查裝置 Download PDF

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Publication number
TW201607666A
TW201607666A TW104110447A TW104110447A TW201607666A TW 201607666 A TW201607666 A TW 201607666A TW 104110447 A TW104110447 A TW 104110447A TW 104110447 A TW104110447 A TW 104110447A TW 201607666 A TW201607666 A TW 201607666A
Authority
TW
Taiwan
Prior art keywords
axis
wedge
bearing
axis direction
piston
Prior art date
Application number
TW104110447A
Other languages
English (en)
Chinese (zh)
Inventor
Toshinori Satou
Original Assignee
Nsk Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nsk Ltd filed Critical Nsk Ltd
Publication of TW201607666A publication Critical patent/TW201607666A/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Machine Tool Units (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW104110447A 2014-04-01 2015-03-31 工作台裝置、搬運裝置、半導體製造裝置及檢查裝置 TW201607666A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014075514A JP5776812B1 (ja) 2014-04-01 2014-04-01 テーブル装置、及び搬送装置

Publications (1)

Publication Number Publication Date
TW201607666A true TW201607666A (zh) 2016-03-01

Family

ID=54192583

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104110447A TW201607666A (zh) 2014-04-01 2015-03-31 工作台裝置、搬運裝置、半導體製造裝置及檢查裝置

Country Status (5)

Country Link
JP (1) JP5776812B1 (ja)
KR (1) KR101848396B1 (ja)
CN (1) CN106457493B (ja)
TW (1) TW201607666A (ja)
WO (1) WO2015152246A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI715728B (zh) * 2016-03-29 2021-01-11 日商迪思科股份有限公司 移動體進給機構及加工裝置

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10928744B2 (en) 2016-10-20 2021-02-23 Molecular Imprints, Inc. Positioning substrates in imprint lithography processes
CN106926508B (zh) * 2017-04-14 2018-07-24 梁丽明 一种液压机移动工作台的导向装置
CN107262437B (zh) * 2017-07-31 2019-12-06 京东方科技集团股份有限公司 一种清洗装置
AT520419B1 (de) * 2017-09-06 2019-07-15 Anton Paar Gmbh Positioniereinrichtung zum Positionieren eines Funktionskörpers
JP7011535B2 (ja) * 2018-06-07 2022-01-26 株式会社日立ハイテク ステージ装置、及び荷電粒子線装置
CN112388339A (zh) * 2019-08-15 2021-02-23 科德数控股份有限公司 一种连杆转台及其解耦控制方法
JP7435613B2 (ja) * 2019-09-03 2024-02-21 株式会社ニコン 移動体装置及び加工システム
KR20220164227A (ko) 2021-06-04 2022-12-13 지찬혁 옷이 엉키지 않는 세탁기
CN118204789A (zh) * 2024-05-21 2024-06-18 誊展精密科技（深圳）有限公司 五轴运动平台

Family Cites Families (16)

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Publication number Priority date Publication date Assignee Title
JPS62102946A (ja) * 1985-10-28 1987-05-13 Toyoda Mach Works Ltd ワ−ク段取補正装置
CN2148634Y (zh) * 1992-05-30 1993-12-08 李鹏生 共基面二维超精密工作台
JP3678887B2 (ja) 1997-03-18 2005-08-03 株式会社リコー 三次元形状測定装置
JP4335425B2 (ja) 2000-08-28 2009-09-30 住友重機械工業株式会社 ステージ装置
JP4160824B2 (ja) 2002-12-20 2008-10-08 日本トムソン株式会社 昇降用案内ユニット及びそれを組み込んだステージ装置
TWI260646B (en) * 2003-03-28 2006-08-21 Sumitomo Heavy Industries X-Y axis stage device
JP4335704B2 (ja) 2003-03-28 2009-09-30 住友重機械工業株式会社 Ｘ−ｙステージ装置
JP2007078126A (ja) * 2005-09-15 2007-03-29 Tokyo Univ Of Science 非接触支持装置
JP4545697B2 (ja) * 2006-02-17 2010-09-15 住友重機械工業株式会社 ステージ装置
TWI457193B (zh) * 2006-03-02 2014-10-21 Sumitomo Heavy Industries Stage device
JP2007310019A (ja) * 2006-05-16 2007-11-29 Nsk Ltd 位置決めテーブル装置
JP4425943B2 (ja) * 2007-03-19 2010-03-03 日本精工株式会社 ワークチャック
JP4219398B2 (ja) * 2007-06-08 2009-02-04 株式会社堀場製作所 ステージ装置
CN101947747A (zh) * 2010-08-26 2011-01-19 天津大学 机床误差补偿装置及含有该装置的数控机床
JP5590187B1 (ja) * 2013-05-20 2014-09-17 日本精工株式会社 テーブル装置、搬送装置、及び半導体製造装置
JP5541398B1 (ja) * 2013-07-02 2014-07-09 日本精工株式会社 テーブル装置、及び搬送装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI715728B (zh) * 2016-03-29 2021-01-11 日商迪思科股份有限公司 移動體進給機構及加工裝置

Also Published As

Publication number Publication date
JP2015196222A (ja) 2015-11-09
CN106457493A (zh) 2017-02-22
KR20160127812A (ko) 2016-11-04
JP5776812B1 (ja) 2015-09-09
WO2015152246A1 (ja) 2015-10-08
CN106457493B (zh) 2018-10-16
KR101848396B1 (ko) 2018-04-12

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