TW201607392A - 基板材之表面處理裝置 - Google Patents

基板材之表面處理裝置 Download PDF

Info

Publication number
TW201607392A
TW201607392A TW103137384A TW103137384A TW201607392A TW 201607392 A TW201607392 A TW 201607392A TW 103137384 A TW103137384 A TW 103137384A TW 103137384 A TW103137384 A TW 103137384A TW 201607392 A TW201607392 A TW 201607392A
Authority
TW
Taiwan
Prior art keywords
base material
surface treatment
spray nozzle
treatment apparatus
etching
Prior art date
Application number
TW103137384A
Other languages
English (en)
Chinese (zh)
Inventor
Keishi Kiyokawa
Toshio Hayashi
Hirokazu Tsuboi
Original Assignee
Aikei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aikei Co Ltd filed Critical Aikei Co Ltd
Publication of TW201607392A publication Critical patent/TW201607392A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)
TW103137384A 2013-09-17 2014-10-29 基板材之表面處理裝置 TW201607392A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013191301 2013-09-17
JP2014160228A JP2015084407A (ja) 2013-09-17 2014-08-06 基板材の表面処理装置

Publications (1)

Publication Number Publication Date
TW201607392A true TW201607392A (zh) 2016-02-16

Family

ID=53047866

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103137384A TW201607392A (zh) 2013-09-17 2014-10-29 基板材之表面處理裝置

Country Status (4)

Country Link
JP (1) JP2015084407A (ko)
KR (1) KR20160017589A (ko)
CN (1) CN105807565A (ko)
TW (1) TW201607392A (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7007060B2 (ja) * 2018-05-21 2022-01-24 東京化工機株式会社 基板材のエッチング装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3120073B2 (ja) * 1999-02-22 2000-12-25 東京化工機株式会社 薬液処理装置
JP3518676B2 (ja) * 2000-05-11 2004-04-12 東京化工機株式会社 プリント配線基板材の表面処理装置
JP3479636B2 (ja) 2000-08-28 2003-12-15 東京化工機株式会社 プリント配線基板材の搬送機構
JP2006222117A (ja) 2005-02-08 2006-08-24 Tokyo Kakoki Kk 基板材の搬送装置
JP2011023378A (ja) * 2009-07-13 2011-02-03 Tokyo Kakoki Kk 基板材の表面処理装置
CN102368140B (zh) * 2010-09-30 2013-03-20 四川虹欧显示器件有限公司 显影方法及显影设备
CN202995257U (zh) * 2012-11-12 2013-06-12 昆山允升吉光电科技有限公司 一种新型显影喷淋机构

Also Published As

Publication number Publication date
KR20160017589A (ko) 2016-02-16
JP2015084407A (ja) 2015-04-30
CN105807565A (zh) 2016-07-27

Similar Documents

Publication Publication Date Title
JP4644303B2 (ja) 基板材の表面処理装置
KR100713235B1 (ko) 박판재(薄板材)의 표면처리장치
KR101217371B1 (ko) 기판 처리 장치
JP2008285323A (ja) 基板材のコンベア
CN101155479A (zh) 药液处理装置
JP6189279B2 (ja) エッチング装置
JP5701551B2 (ja) 基板処理装置
TWI327450B (en) Conveyer for surface treatment
US20130260041A1 (en) Apparatus for coating substrate and method for coating substrate
TW201607392A (zh) 基板材之表面處理裝置
JP5166367B2 (ja) 基板材の表面処理装置
JP7007060B2 (ja) 基板材のエッチング装置
TW556459B (en) Substrate processing equipment
JP2011023378A (ja) 基板材の表面処理装置
JP2012140677A (ja) 配線基板の製造方法
JP4945082B2 (ja) 薬液処理装置
JP3981874B2 (ja) 薬液処理方法および薬液処理装置
TWM528999U (zh) 基材蝕刻處理設備
TWI557274B (zh) 基材蝕刻處理方法
JP2004055711A (ja) 基板処理装置
JP2014175326A (ja) プリント配線板の製造方法及び薬液処理装置
JP2017133078A (ja) エッチング装置
JP2020150190A (ja) 基板処理装置および基板処理方法
JP2010040982A (ja) 基板材の表面処理装置
TW200806809A (en) Apparatus for spraying etchant and etching method