TW201535549A - 半導體裝置及楔形接合裝置 - Google Patents
半導體裝置及楔形接合裝置 Download PDFInfo
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Abstract
本發明提供一種抑制導線、焊墊間之開路、短路之產生之半導體裝置及製造其之導線接合裝置。半導體晶片於第1方向排列有長方形之成為第1連接區域之接合用焊墊。電路基板於第1方向排列有成為第2連接區域之接合用引線。第1連接區域與第2連接區域藉由利用楔形接合法之導線接合而連接。第1及第2接合點具有大致橢圓形,且於第1連接區域上,排列於與第1方向垂直之第2方向。第3接合點具有大致橢圓形,形成於第2連接區域上,第1接合點之長度方向朝向第2方向,於將連接第2接合點與第3接合點之方向作為第3方向之情形時,第2接合點之長度方向係較第2方向更朝向第3方向。
Description
本申請案享有以日本專利申請案2014-48845號(申請日:2014年3月12日)為基礎申請案之優先權。本申請案藉由參照該基礎申請案而包含基礎申請案之全部內容。
本發明之實施形態係關於一種半導體裝置及導線接合裝置。
於使用楔形接合法之導線接合中,於將導線接合於焊墊等時,有時因半導體晶片上之接合點與電路基板上之接合點之位置關係或拉繞導線之方向,而產生焊墊間短路或導線之開路。
本發明提供一種抑制導線、焊墊間之開路、短路之產生之半導體裝置及製造其之導線接合裝置。
本實施形態之半導體裝置包括電路基板及搭載於電路基板上之半導體晶片。半導體晶片於其上表面將具有長方形、且成為第1連接區域之接合用焊墊以使其短邊對向之方式於第1方向上排列有至少大於等於兩個。電路基板於上述第1方向上排列有至少大於等於兩個之成為第2連接區域之接合用引線。第1連接區域與對應於其之第2連接區域藉由利用楔形接合法之導線接合,而利用第1接合點、第2接合點、及第3接合點連接。第1及第2接合點具有大致橢圓形,且於第1連接區域上排列形成於與第1方向垂直之第2方向。第3接合點具有大致
橢圓形,且形成於第2連接區域上。第1接合點之長度方向朝向第2方向。於將連接第2接合點與第3接合點之方向作為第3方向之情形時,第2接合點之長度方向以成為係較第2方向更朝向第3方向之方向的方式形成。
10‧‧‧半導體晶片
12‧‧‧焊墊
14‧‧‧電路基板
16‧‧‧引線
18‧‧‧導線
20‧‧‧尾端
25‧‧‧第1接合點
26‧‧‧第2接合點
27‧‧‧第3接合點
30、32‧‧‧線
34‧‧‧楔形工具
36‧‧‧按壓面
38‧‧‧貫通孔
40‧‧‧接合點
42‧‧‧短路
44‧‧‧頸部
50‧‧‧導線接合裝置
52‧‧‧架台
54‧‧‧接合平台
56‧‧‧XY平台
58‧‧‧接合頭
60‧‧‧Z馬達
62‧‧‧Z驅動臂
64‧‧‧超音波換能器
66‧‧‧超音波振動子
68‧‧‧窗式夾具
70‧‧‧導線夾
72‧‧‧導線捲軸
74‧‧‧夾具開閉部
76‧‧‧控制部
78‧‧‧記憶體
80‧‧‧第1接合程式
82‧‧‧第2接合程式
84‧‧‧第3接合程式
86‧‧‧形成環路控制程式
92‧‧‧控制程式
94‧‧‧控制資料
100‧‧‧電腦
102‧‧‧XY平台I/F
104‧‧‧Z馬達I/F
106‧‧‧超音波振動子I/F
108‧‧‧夾具開閉I/F
θ‧‧‧角度
圖1係本實施形態中之導線接合裝置之構成圖之一例。
圖2係模式性地表示導線接合之概要之俯視圖之一例。
圖3(a)~(c)係用以按照步驟順序說明本實施形態中之導線接合之程序之圖之一例。
圖4係用以模式性地說明楔形工具之構造之縱剖面圖之一例。
圖5(a)~(e)係用以按照步驟順序說明本實施形態中之導線接合之程序之圖之一例。
圖6係表示導線接合方法之程序之流程圖之一例。
圖7(a)及(b)係於焊墊形成有一個接合點之情形時之俯視圖之一例。
以下,一面參照圖式一面對實施形態進行說明。再者,圖式係模式性者,厚度與平面尺寸之關係、各層之厚度之比率等未必與實際情況一致。即便於表示相同部分之情形時,亦有根據圖式而相互之尺寸或比率不同地表示之情形。又,關於上下左右之方向,亦表示以半導體基板中之電路形成面側為上之情形時之相對性的方向,未必與以重力加速度方向為基準者一致。於本案說明書與各圖中,關於已經記述之圖,對於與上述者相同之要素標註相同之符號並適當省略詳細之說明。於以下之說明中,為說明之方便起見,存在使用XYZ正交座標系之情形。於該座標系中,將相對於半導體基板之表面而平行之方向且相互正交之2個方向設為X方向及Y方向,將相對於該等X方向及Y
方向之兩者而正交之方向設為Z方向。又,於接合裝置中,將平行於平台移動面之方向且相互正交之2個方向設為X方向及Y方向,將相對於該等X方向及Y方向之兩者而垂直之方向設為Z方向。
以下,參照圖1~圖7對實施形態進行說明。圖1係本實施形態中所使用之導線接合裝置50之構成圖之一例。導線接合裝置50係使用楔形工具34作為導線接合用之工具,以楔形接合方式形成連接複數個接合對象物之導線接合之裝置。於本發明之實施形態中,所謂楔形接合法係導線接合之一方法,係指於不在導線前端形成FAB(Free Air Ball,無空氣焊球)之情況下,使用壓力(壓接)、及由超音波振動所產生之能量而將導線接合於焊墊等之接合方式。
如圖1所示,導線接合裝置50具有架台52、保持於架台52上之接合平台54及XY平台56、以及電腦100。接合平台54係載置作為接合對象物之半導體晶片10與電路基板14之接合對象物保持台。圖1表示載置有作為接合對象物之半導體晶片10與電路基板14之狀態。
接合平台54於載置或排出電路基板14等時,可相對於架台52移動。接合平台54於接合處理之期間固定於架台52。作為接合平台54,可使用例如金屬製之移動台。接合平台54例如連接於導線接合裝置50之接地電位等基準電位。於與半導體晶片10或電路基板14之間需要絕緣之情形時,可對接合平台54之必要部分實施絕緣處理。
半導體晶片10係將電晶體等積體化於矽基板而形成電子電路者。於半導體晶片10之上表面,作為電子電路之輸入端子與輸出端子等係作為複數個焊墊而引出。半導體晶片10之下表面係矽基板之背面,且係作為電子電路之接地電極。
電路基板14例如係將所期望之配線於環氧樹脂基板上圖案化而成者。電路基板14具有將半導體晶片10之下表面電性及機械性地連接
並固定之晶片焊墊、配置於該晶片焊墊之周圍之複數條引線、及自晶片焊墊或複數條引線引出之作為電路基板之輸入端子與輸出端子。導線接合係藉由以導線連接半導體晶片10上之焊墊與電路基板14上之引線之間而進行。
窗式夾具68設置於接合平台54上。窗式夾具68係於中央部具有開口之平板狀之構件,用於保持電路基板14。窗式夾具68以電路基板14之引線及半導體晶片10配置於中央部之開口中之方式定位,並且利用開口之周緣部按壓電路基板14,藉此將電路基板14固定於接合平台54。
XY平台56搭載接合頭58。XY平台56係使接合頭58移動至XY平面內之所期望之位置之移動台。XY平面係與架台52之上表面平行之平面。Y方向係與下述之安裝於接合臂(未圖示)之超音波換能器64之長度方向平行之方向。
接合頭58固定並搭載於XY平台56。接合頭58內置有Z馬達60。接合頭58係藉由Z馬達60之驅動而被進行移動控制,且經由Z驅動臂62及超音波換能器64而使楔形工具34向Z方向移動之移動機構。作為Z馬達60,可使用例如線性馬達。
Z驅動臂62具有超音波換能器64及導線夾70。超音波換能器64係根部安裝於Z驅動臂62。於超音波換能器64之前端部,安裝有插通導線18之楔形工具34。於超音波換能器64安裝有超音波振動子66。超音波換能器64將藉由超音波振動子66驅動而產生之超音波能量傳送至楔形工具34。作為超音波振動子66,可使用例如壓電元件。
導線18捲繞於導線捲軸72,該導線捲軸72設置於自接合頭58延伸之導線固持器之前端。導線18自導線捲軸72經由導線夾70而插通至楔形工具34之貫通孔,且自楔形工具34之前端突出。
導線夾70係安裝於Z驅動臂62、且配置於導線18之兩側之1組夾
板。藉由將該對向之夾板之間打開而使導線18為可自由地延伸之狀態,藉由將對向之夾板之間閉合而可使導線18之延伸停止。
電腦100係整體控制導線接合裝置50之各要素之動作。電腦100具有作為CPU(Central Processing Unit,中央處理單元)之控制部76、各種介面電路、及記憶體78。該等相互利用內部匯流排96連接。
各種介面電路係設置於作為CPU之控制部76與導線接合裝置50之各要素之間的驅動電路或緩衝電路。圖1中,將介面電路記載為I/F。電腦100具有連接於XY平台56之XY平台I/F102、連接於Z馬達60之Z馬達I/F104、連接於超音波振動子66之超音波振動子I/F106、及連接於夾具開閉部74之夾具開閉I/F108來作為各種介面電路。
記憶體78係儲存各種程式與各種控制資料之記憶裝置。各種程式係與第1導線接合處理相關之第1接合程式80、與第2導線接合處理相關之第2接合程式82、與第3導線接合處理相關之第3接合程式84、與環路控制相關之形成環路控制程式86、及與其他控制處理相關之控制程式92。又,記憶體78具有上述各種程式中所使用之控制資料94。
圖2係模式性地表示本實施形態之半導體裝置中之導線接合之概要的俯視圖(自上方觀察之圖)之一例,且表示半導體晶片10及電路基板14之一部分。如圖2所示,電路基板14於其上部具有引線16(焊墊)。電路基板14上之引線16使用例如金(Au)、銅(Cu)、鋁(Al)等導電性材料而形成。
半導體晶片10安裝於電路基板14上。於半導體晶片10上形成有焊墊12。於圖中,表示有半導體晶片10之右下部分。於圖中,左上端成為半導體晶片10之中央部。焊墊12使用例如鋁(Al)而形成。焊墊12與引線16使用導線18而連接。導線18使用例如金(Au)、銅(Cu)、鋁(Al)等導電性材料而形成。
導線18係藉由楔形接合法而接合於焊墊12及引線16。複數個焊
墊12於與半導體晶片10之一邊平行之方向(於圖中為Y方向,以下有時稱為第1方向)上隔開間隔而排列為一行。焊墊12具有長方形,該長方形於相對於第1方向而垂直之方向(於圖中為X方向,以下有時稱為第2方向)上具有長度方向。複數個焊墊12於第1方向上使其短邊對向而排列。
形成於電路基板14上之引線16以較焊墊12大之間隔排列。引線16對向於焊墊12,且排列於第1方向上。各引線16具有長方形,該長方形於沿著連接引線16與焊墊12之線之方向(以下,有時稱為第3方向)具有長度方向。
焊墊12之長度方向(第2方向)與連接焊墊12及引線16之線之方向(第3方向)所成之角度,自位於半導體晶片10中央(於圖中為右端)之焊墊12向位於半導體晶片10端部(於圖中為左端)之焊墊12變大。此係因為,焊墊12之間隔較小而密集地排列,相對於此,引線16係較焊墊12之間隔大地排列。
焊墊12之長度方向(第2方向,下述之線32之方向)與連接焊墊12及引線16之線之方向(第3方向,下述之線30之方向)亦可不一致。半導體晶片10有形成較小面積之要求。因此,形成於半導體晶片10上之圖案以可儘量密集地填充之方式佈局。又,近來伴隨著半導體晶片10之功能之高度化,而產生將焊墊12形成得較多之情形。因此,半導體晶片10上之焊墊12以可於半導體晶片10上密集地佈局,且可形成多個焊墊12之方式,於排列方向上較短地形成。因此,有焊墊12成為於排列方向上具有短邊之長方形之情形。又,焊墊12為了於有限之半導體晶片10上之面積之範圍內儘可能多地佈局,而使鄰接之焊墊12間之間隔儘可能小,以焊墊12之長度方向成為同一方向之方式排列。因此,焊墊12為了使其長度方向與和引線16連接之線之方向一致,而難以傾斜地配置。因此,焊墊12之長度方向(第2方向)與連接焊墊12及引線
16之線之方向(第3方向)不一致之情形較多,於圖中隨著朝向Y方向左側,第2方向與第3方向所成之角度變大。
其次,於本實施形態中,對使用楔形接合法將導線18接合於焊墊12及引線16表面之步驟程序之一例進行說明。首先,對本實施形態中之楔形接合法中所使用之楔形工具34進行說明。
圖4表示用以模式性地說明楔形工具34之構造之縱剖面圖之一例。圖4表示楔形工具34於沿著用以插通導線18之貫通孔38之方向之方向上之縱剖面圖。楔形工具34具有用以通過導線18之貫通孔38。貫通孔38例如以自楔形工具34後方朝向底部(下部)貫通楔形工具34之方式形成。楔形工具34於底部具有按壓面36。於接合時,如圖中箭頭所示,導線18自楔形工具34之後方供給至貫通孔38,並自貫通孔38之前端部貫穿至楔形工具34底部,且通過按壓面36下部而向前方橫方向突出。該突出之部分於接合時,例如如下述之圖3(a)~(c)、圖5(a)~(e)所示成為尾端20。
再者,如上所述,自按壓面36通過貫通孔38並朝向楔形工具34後方之方向,於楔形接合時成為接合之接合方向,並且亦成為楔形工具34之移動方向。即,楔形工具34具有特定之接合方向及移動方向。因此,於使用楔形工具34之楔形接合時,為了使楔形工具34之方向與接合方向一致,而使楔形工具34旋轉,或使電路基板14旋轉。
圖3(a)~(c)、及圖5(a)~(e)係用以按照步驟順序說明藉由導線18而將焊墊12與引線16之間連接(接合)之程序之圖之一例。圖6係表示導線接合方法之程序之流程圖之一例。導線接合方法之各程序對應於儲存於電腦100之記憶體78之各程式之處理程序,藉由控制部76而控制。以下,一面參照圖3(a)~(c)、圖5(a)~(e)、圖6、及圖7一面進行說明。本實施形態中,導線18首先接合於半導體晶片10上之焊墊12(第1連接區域),其次接合於電路基板14上之引線16(第2連接區
域)。
首先,將搭載有作為接合對象物之半導體晶片10之電路基板14定位設置於接合平台54上,藉由窗式夾具68而固定。接合平台54位於初始狀態之場所。導線18自楔形工具34之後方傾斜地供給至楔形工具34之貫通孔38。導線18之前端部自楔形工具34前端突出特定之長度。如上所述,該突出之部分其後成為尾端20。
其次,藉由控制部76而執行第1接合程式80。藉由第1接合程式80,控制部76輸出於焊墊12上形成第1接合點25之信號(指令)。藉由該指令而將來自XY平台I/F62與Z馬達I/F64之信號輸出至XY平台56與Z馬達60,從而將楔形工具34移動至焊墊12之第1接合點25之預定形成位置上方(S101)。
第1接合點25之預定形成位置設定於半導體晶片10之焊墊12上、且於圖3(a)中為X方向上側之位置,且作為座標資料儲存於控制資料94。楔形工具34之精密之位置控制係使用定位照相機等(未圖示)而進行。
其次,將來自XY平台I/F62與Z馬達I/F64之信號(指令)輸出至XY平台56與Z馬達60,以使楔形工具34之方向朝向第2方向(於圖中為X方向)之方式進行調整(S102)。繼而,將來自XY平台I/F62與Z馬達I/F64之信號(指令)輸出至XY平台56與Z馬達60,而使楔形工具34下降至焊墊12表面為止。
焊墊12中,於第1接合點25之預定形成位置上,於楔形工具34之按壓面36與焊墊12之間夾入有導線18,導線18被按壓於焊墊12表面。其次,將來自超音波振動子I/F106之信號(指令)輸出至超音波振動子66,使超音波振動子66動作。藉此,對按壓面36施加超音波振動。藉由被施加至按壓面36之超音波振動能量與利用Z馬達60之驅動控制而產生之按壓力,而將導線18接合於焊墊12。繼而,將來自XY平台
I/F62與Z馬達I/F64之信號(指令)輸出至XY平台56與Z馬達60,而使楔形工具34向按壓面36自第1接合點25離開之方向上升。
如此一來,如圖3(a)、圖5(a)所示,執行第1導線接合處理,於焊墊12上形成第1接合點25(S103)。第1接合點25之接合面如圖3(a)等所示,俯視時具有大致橢圓形,其長度方向(接合方向)成為與線32相同之方向(第2方向)。又,尾端20於第2方向(於圖中為X方向)上延伸,故而接觸於鄰接之焊墊12之可能性非常低。
其次,藉由控制部76而執行第2接合程式82。藉由第2接合程式82,控制部76輸出於引線16形成第2接合點26之指令。藉由該指令而將來自XY平台I/F62與Z馬達I/F64之信號輸出至XY平台56與Z馬達60,從而將楔形工具34移動至引線16內之第2接合點26上方(S104)。
第2接合點26之位置設定於焊墊12(焊墊12)上之第1接合點25之晶片端側,且作為座標資料儲存於控制資料94。楔形工具34之精密之位置控制係使用定位照相機等(未圖示)而進行。
又,將來自XY平台I/F62與Z馬達I/F64之信號輸出至XY平台56與Z馬達60,以楔形工具34之方向朝向第3方向之方式進行調整(S105)。藉此,楔形工具34朝向與線30大致相同之方向(第3方向)。再者,楔形工具34之方向之調整除了於使楔形工具34移動至第2接合點26上方之後進行以外,亦可一面使楔形工具34向第2接合點26上方移動一面進行。
繼而,將來自XY平台I/F62與Z馬達I/F64之信號輸出至XY平台56與Z馬達60,而使楔形工具34下降至引線16表面為止,將導線18按壓於引線16表面之第2接合點26之預定形成位置。於第2接合點26之預定形成位置上,於楔形工具34之按壓面36與焊墊12之間夾入導線18,導線18被按壓於引線16表面。
其次,將來自超音波振動子I/F106之信號輸出至超音波振動子
66,使超音波振動子66動作。藉此,對按壓面36施加超音波振動。藉由被施加至按壓面36之超音波振動能量與利用Z馬達60之驅動控制而產生之按壓力,而將導線18與焊墊12接合。如此一來,如圖3(b)及圖5(b)所示,執行焊墊12上之第2導線接合處理而形成第2接合點26(S106)。
第2接合點26之接合面如圖3(b)所示,俯視時具有橢圓形,其長度方向(接合方向)成為與連接焊墊12及引線16之線30大致相同之方向(第3方向)。
再者,該楔形工具34之方向或第2接合點26之長度方向之精度受制於導線接合裝置50之精度,並不限定於嚴格地與和線30相同之方向(即第3方向)一致。又,存在根據裝置不同而精度不同之情形,故而偏移量亦不固定。即,楔形工具34之方向或第2接合點26之長度方向,存在較線32與線30所成之角度θ大之情形,亦存在較線32與線30所成之角度θ小之情形。又,接合點25、26、27之接合形狀具有大致橢圓形,但有時亦因接合中之導線18之壓扁情況而於長度方向產生不均。
因此,楔形工具34之方向或第2接合點26之長度方向,只不過係指較線32之方向(第2方向)更朝向線30之方向(第3方向)之方向、自線32向線30之方向旋轉任意角度之方向,並不係指嚴格地與線30之方向(第3方向)相同之方向。又,由於相同之理由,楔形工具34之方向或第1接合點25之長度方向只不過係指於不接觸於尾端20所鄰接之焊墊12之範圍相對於線32之方向(第2方向)而交叉之方向、或與線32之方向(第2方向)相同之方向,並不係指嚴格地限制為與線32之方向(第2方向)相同之方向。
繼而,如圖5(c)、(d)所示,藉由控制部76而執行形成環路控制程式86。藉由形成環路控制程式86,控制部76輸出如下之信號(指令),
即對楔形工具34進行操作,而自焊墊12(第1連接區域)上之第2接合點26,朝向引線16(第2連接區域)上之第3接合點27方向形成導線18之環路形狀(圓弧形狀)。藉由該指令,而將來自XY平台I/F102、Z馬達I/F104及夾具開閉I/F108之信號輸出至XY平台56、Z馬達60及導線夾70。於是,導線接合裝置50如圖5(c)所示,於打開導線夾70之狀態下以使楔形工具34向上方上升之方式被驅動。
其次,將來自XY平台I/F102及Z馬達I/F104之信號輸出至XY平台56及Z馬達60。藉此,XY平台56及Z馬達60被移動驅動,藉此,楔形工具34向引線16內之第3接合點27之預定形成位置移動。第3接合點27之預定形成位置設定於電路基板14上之引線16上,且作為座標資料儲存於控制資料94。
於楔形工具34向第3接合點27預定形成位置移動之期間,導線18自導線捲軸72陸續送出,自楔形工具34之前端延伸出必要之導線長度。藉此,如圖5(d)、(e)所示,導線18一面進行塑性變形,一面以朝向第3接合點27描畫環路形狀(圓弧形狀)之方式延伸(將此稱為形成環路)(S107)。
此時,結合於楔形工具34之移動,導線18被楔形工具34拉伸,故而經由導線18而於第2接合點26產生拉伸應力。然後,楔形工具34一面進行形成環路一面向第3接合點27預定形成位置之上方移動(S108)。
其次,藉由控制部76而執行第3接合程式84。藉由第3接合程式84,控制部76輸出於引線16形成第3接合點27之信號(指令)。此時,楔形工具34朝向線30方向(第3方向)。引線16(焊墊)具有長方形,其長度方向朝向線30方向(第3方向)。
繼而,將來自XY平台I/F62與Z馬達I/F64之信號輸出至XY平台56與Z馬達60,使楔形工具34下降至引線16表面為止,使導線18按壓於
引線16上之第3接合點27之預定形成位置。藉此,於引線16中,導線18被夾入於楔形工具34之按壓面36與引線16之間,導線18被按壓於引線16表面。
其次,將來自超音波振動子I/F106之信號輸出至超音波振動子66,使超音波振動子66動作。藉此,對按壓面36施加超音波振動。藉由施加至按壓面36之超音波振動能量與利用Z馬達60之驅動控制而產生之按壓力,將導線18與引線16接合。如此一來,進行引線16上之第3導線接合處理,如圖3(c)及圖5(e)所示,形成第3接合點27(S109)。
第3接合點27之接合面如圖3(c)所示,俯視時具有橢圓形,其長度方向(接合方向)朝向與線30大致相同之方向、即第3方向。
再者,由於與和楔形工具34之方向或第2接合點26之長度方向之精度相關之理由相同之理由,楔形工具34之方向或第3接合點27之長度方向只不過係指較線32之方向(第2方向)更朝向線30之方向(第3方向)之方向、自線32向線30之方向旋轉任意角度之方向,並不係指嚴格地與線30之方向(第3方向)相同之方向。
繼而,將來自XY平台I/F62、Z馬達I/F64及夾具開閉I/F108之信號輸出至XY平台56、Z馬達60及導線夾70。藉此,於將楔形工具34固定之情況下夾著導線18而拉伸,將導線18於第3接合點27後方切斷(S110)。根據以上方法而可形成本實施形態之導線接合。
此處,例如,設想如下情形:未於焊墊12上設置如上述所說明之第1接合點25及第2接合點26般使長度方向(接合方向)不同之兩個接合點,如圖7(a)所示,形成長度方向(接合方向)朝向連接焊墊12與引線16之方向(線30方向)之一個接合點40。
於該情形時,導線18朝向線30之方向,故而尾端20前端向鄰接之焊墊12方向突出。鄰接之焊墊12間之距離較小,故而存在尾端20接觸於鄰接之焊墊12而於鄰接焊墊12間產生短路42之可能性。
本實施形態中,第1接合點25之長度方向(接合方向)朝向焊墊12之長度方向(線32方向,於圖中為X方向),故而尾端20亦朝向線32之方向。因此,尾端20接觸於鄰接之焊墊12之可能性極小。藉此,於鄰接焊墊12間產生短路之可能性極小。
又,例如設想如下情形:未於焊墊12上設置如上述所說明之第1接合點25及第2接合點26般使長度方向(接合方向)不同之兩個接合點,而如圖7(b)所示,形成長度方向(接合方向)朝向焊墊12之長度方向(線32方向,於圖中為X方向)之一個接合點40。於該情形時,接合點40之長度方向朝向線32之方向。
於該狀態下進行形成環路之情形時,在導線18之環路形成時施加之拉伸力向線30方向施加,但接合點40之接合方向與由導線18產生之拉伸力所施加之方向不同。因此,藉由由導線18產生之拉伸力,而使應力集中於接合點40端之一側之頸部44,故而有於該部位產生損傷(龜裂)而產生開路(斷線)不良之可能性。
本實施形態中,第2接合點26之長度方向(接合方向)朝向連接焊墊12與引線16之方向(線30方向,第3方向)。因此,於導線18之環路形成時施加之應力不會集中於頸部。因此,於該部位產生之龜裂受到抑制,從而產生導線18之開路(斷線)不良之可能性極小。
如以上所說明般,根據本實施形態,於半導體晶片10上之焊墊12具有第1接合點25與第2接合點26。於第1接合點25,其長度方向(接合方向)朝向焊墊12之長度方向、即線32方向,故而尾端20亦朝向線32之方向。即,尾端20不朝向鄰接之焊墊12之方向。藉此,可抑制尾端20接觸於鄰接之焊墊12,可抑制鄰接之焊墊12間之短路之產生。
又,本實施形態中,第2接合點26之長度方向(接合方向)朝向電路基板14上之引線16(引線16上之第3接合點27)之方向。藉此,可抑制於第2接合點26端之頸部產生由形成導線18之環路時所施加之應力
所致之龜裂,從而可抑制導線18之開路不良之產生。
即,藉由應用本實施形態,可防止因導線18之尾端20之接觸所致之焊墊間短路,且抑制接合部分之導線頸部之損傷而抑制導線開路,進而提高導線連接之良率。
上述所說明之實施形態可應用於各種半導體裝置。例如,亦可應用於NAND型或NOR型之快閃記憶體、EPROM(erasable programmable read only memory,可抹除可程式化唯讀記憶體)、或DRAM(Dynamic Random Access Memory,動態隨機存取記憶體)、SRAM(static random access memory,靜態隨機存取記憶體)、及其他半導體記憶裝置、或各種邏輯元件、其他半導體裝置。
如上所述,對本發明之幾個實施形態進行了說明,但該等實施形態係作為例而提出者,並不意圖限定發明之範圍。該等新穎之實施形態能以其他各種形態實施,可於不脫離發明之主旨之範圍內進行各種省略、置換、變更。該等實施形態或其變化包含於發明之範圍或主旨,並且包含於申請專利範圍所記載之發明及其均等之範圍。
10‧‧‧半導體晶片
12‧‧‧焊墊
14‧‧‧電路基板
16‧‧‧引線
18‧‧‧導線
20‧‧‧尾端
25‧‧‧第1接合點
26‧‧‧第2接合點
27‧‧‧第3接合點
30、32‧‧‧線
θ‧‧‧角度
Claims (5)
- 一種半導體裝置,其特徵在於包括:電路基板;及半導體晶片,其搭載於上述電路基板上;且上述半導體晶片於其上表面以相互之長邊對向之方式,於第1方向排列有兩個以上之具有長方形且成為第1連接區域之接合用焊墊,上述電路基板於上述第1方向排列有至少兩個以上之成為第2連接區域之接合用引線,上述第1連接區域及對應於其之上述第2連接區域,藉由利用楔形接合法之導線接合而利用第1接合點、第2接合點、及第3接合點連接,上述第1及第2接合點具有大致橢圓形,且於上述第1連接區域上排列形成於與第1方向垂直之第2方向,上述第3接合點具有大致橢圓形,且形成於上述第2連接區域上,上述第1接合點之長度方向朝向上述第2方向,於將連接上述第2接合點與上述第3接合點之方向作為第3方向之情形時,第2接合點之長度方向係較上述第2方向更朝向上述第3方向。
- 如請求項1之半導體裝置,其中上述第2接合點之長度方向平行於上述第3方向。
- 如請求項1之半導體裝置,其中上述第2接合點之長度方向為與上述第3接合點之長度方向相同之方向。
- 一種導線接合裝置,其包括: 平台,其可載置搭載有半導體晶片之電路基板;接合臂,其可安裝用以進行利用楔形接合法之接合之工具;及控制部,其控制上述工具之動作;且於上述半導體晶片上具有第1連接區域,上述第1連接區域於第1方向上排列有複數個,各者具有長方形,且其長度方向朝向與第1方向垂直之第2方向,於上述電路基板上具有第2連接區域,上述第2連接區域分別具有長方形,且其長度方向朝向連接上述第1連接區域與上述第2連接區域之線之方向(以下,稱為第2方向),上述控制部進行如下控制:使上述工具移動至上述第1連接區域內之第1接合點上,藉由楔形接合法而形成上述第1接合點,且使上述工具移動至在上述第1連接區域內且沿著第2方向相鄰於第1接合點之第2接合點上,於將連接上述第1連接區域與第2連接區域之方向作為第3方向之情形時,以成為較上述第2方向更朝向上述第3方向之方向的方式控制上述工具,藉由楔形接合法而來形成第2接合點,使上述工具以朝向上述方向之狀態一面進行形成環路一面移動至上述第2連接區域內之第3接合點上而形成第3接合點。
- 如請求項4之導線接合裝置,其中上述第2接合點具有大致橢圓形,且其長度方向平行於上述第3方向。
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