TW201523934A - 封裝材料及包含其之發光二極體的封裝結構 - Google Patents

封裝材料及包含其之發光二極體的封裝結構 Download PDF

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Publication number
TW201523934A
TW201523934A TW102145886A TW102145886A TW201523934A TW 201523934 A TW201523934 A TW 201523934A TW 102145886 A TW102145886 A TW 102145886A TW 102145886 A TW102145886 A TW 102145886A TW 201523934 A TW201523934 A TW 201523934A
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TW
Taiwan
Prior art keywords
wavelength converting
transparent insulating
conductive material
encapsulating material
encapsulating
Prior art date
Application number
TW102145886A
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English (en)
Chinese (zh)
Inventor
Min-Ya Chan
Chen-Chi Ma
Sheng-Tsung Hsiao
Wei-Hao Liao
Original Assignee
Lextar Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lextar Electronics Corp filed Critical Lextar Electronics Corp
Priority to TW102145886A priority Critical patent/TW201523934A/zh
Priority to JP2014024118A priority patent/JP2015115597A/ja
Publication of TW201523934A publication Critical patent/TW201523934A/zh

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TW102145886A 2013-12-12 2013-12-12 封裝材料及包含其之發光二極體的封裝結構 TW201523934A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW102145886A TW201523934A (zh) 2013-12-12 2013-12-12 封裝材料及包含其之發光二極體的封裝結構
JP2014024118A JP2015115597A (ja) 2013-12-12 2014-02-12 パッケージ材料及びそれを備えた発光ダイオードのパッケージ構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW102145886A TW201523934A (zh) 2013-12-12 2013-12-12 封裝材料及包含其之發光二極體的封裝結構

Publications (1)

Publication Number Publication Date
TW201523934A true TW201523934A (zh) 2015-06-16

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ID=53529094

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102145886A TW201523934A (zh) 2013-12-12 2013-12-12 封裝材料及包含其之發光二極體的封裝結構

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JP (1) JP2015115597A (ja)
TW (1) TW201523934A (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108213413A (zh) * 2017-12-13 2018-06-29 金堆城钼业股份有限公司 一种钼基碳纳米管电子封装材料的制备方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004307679A (ja) * 2003-04-08 2004-11-04 Fuji Photo Film Co Ltd １３族窒化物半導体ナノ粒子蛍光材料
JP4075734B2 (ja) * 2003-08-21 2008-04-16 株式会社デンソー 半導体装置の実装構造
JP4318710B2 (ja) * 2006-10-12 2009-08-26 シャープ株式会社 ナノ結晶粒子蛍光体と被覆ナノ結晶粒子蛍光体、ならびに被覆ナノ結晶粒子蛍光体の製造方法
US8361823B2 (en) * 2007-06-29 2013-01-29 Eastman Kodak Company Light-emitting nanocomposite particles
JP5158375B2 (ja) * 2009-07-27 2013-03-06 シャープ株式会社 半導体ナノ粒子蛍光体
JP4949525B2 (ja) * 2010-03-03 2012-06-13 シャープ株式会社 波長変換部材、発光装置および画像表示装置ならびに波長変換部材の製造方法

Also Published As

Publication number Publication date
JP2015115597A (ja) 2015-06-22

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