TW201523934A - Packaging material and of LED packaging structure containing the same - Google Patents

Abstract

A packaging material is provided including a transparent insulating material, a wavelength-converting material and a heat conduction material. The wavelength-converting material and the heat conduction material are mixed in the transparent insulating material. The heat conduction material is connected with part of the wavelength-converting material. An LED packaging structure containing the packaging material is also provided herein.

Description

Packaging material and package structure including the same

The present invention relates to a package material and a package structure including the same for the light emitting diode, and more particularly to a package material having a heat conductive material and a package structure including the light emitting diode thereof.

Generally, a light-emitting diode (LED) encapsulating material is blended with a phosphor powder for use as a wavelength converting substance. Among them, a short-wavelength LED (for example, a blue LED) is used as an excitation light source, and a phosphor powder blended in a packaging material is used to generate wavelength conversion to manufacture LEDs of different colors. For example, when blue light emitted by a blue LED is used to illuminate the phosphor, the phosphor absorbs the energy of the blue light and converts it into other wavelengths of longer wavelength (such as red, yellow, or green) to Manufacture LEDs that emit different colors of light.

However, in the wavelength conversion process of the above LED, the excitation energy absorbed by the phosphor powder is not completely converted into energy of other color lights, and a part is converted into heat energy. Because the thermal conductivity of the transparent insulating material in the general packaging material is too small (K value is about 0.17 W/m.K), the heat dissipation is not easy, causing the LED to accumulate excessive thermal energy, causing the LED temperature to rise. High temperature will It may damage the package structure of the LED and reduce the reliability of the LED.

Therefore, there is a need for a new packaging material and a package structure including the same to solve the defects caused by the conventional packaging material and the package structure including the same.

The present invention provides an encapsulating material and a package structure therewith for solving the lack of a conventional encapsulating material and a package structure including the same. The reliability of the package structure of the light-emitting diode is improved by improving the heat conduction efficiency of the package material.

One aspect of the present invention is to provide an encapsulating material. The encapsulating material comprises a transparent insulating material, a wavelength converting substance and a heat conducting material. The wavelength converting substance and the heat conducting material are blended in the transparent insulating material. The thermally conductive material is coupled to a portion of the wavelength converting material.

According to an embodiment of the invention, the transparent insulating material comprises a transparent thermoplastic or thermosetting resin.

According to an embodiment of the invention, the wavelength converting substance is selected from the group consisting of phosphors, dyes, pigments, and combinations thereof.

According to an embodiment of the present invention, the heat conductive material has a thermal conductivity of not less than 1.5 W/(m.K).

According to an embodiment of the invention, the thermally conductive material is in the form of a filament, a sheet or a combination thereof.

According to an embodiment of the invention, the thermally conductive material comprises a metal, a non-metal, a ceramic material or a combination thereof.

According to an embodiment of the invention, the metal comprises silver (Ag), copper (Cu), aluminum (Al), tungsten (W), magnesium (Mg), zinc (Zn), nickel (Ni), iron (Fe) , tin (Sn), lead (Pb), titanium (Ti) or a combination thereof.

According to an embodiment of the invention, the non-metal comprises graphite, graphene, carbon nanotube, diamond.

According to an embodiment of the invention, the wavelength conversion substance and the heat conductive material comprise at least one interaction force, so that a part of the wavelength conversion substance and the heat conductive material are connected to each other. The interaction force is van der Waal force, π-π force, polar force, metal coordination covalent bond or a combination thereof.

One aspect of the present invention provides a package structure for a light emitting diode. The package structure of the light emitting diode comprises at least one light emitting diode chip and the above packaging material. The encapsulating material is overlaid on the LED substrate.

One aspect of the present invention is to provide an encapsulating material. The encapsulating material comprises a transparent insulating material, a wavelength converting substance, a first heat conducting material and a second heat conducting material. The wavelength converting substance, the first heat conductive material and the second heat conductive material are blended in the transparent insulating material. The first thermally conductive material is coupled to a portion of the wavelength converting material. The second thermally conductive material is coupled to a portion of the wavelength converting material and a portion of the first thermally conductive material.

According to an embodiment of the invention, the transparent insulating material comprises a transparent thermoplastic or thermosetting resin.

According to an embodiment of the invention, the wavelength converting substance is selected from the group consisting of phosphors, dyes, pigments, and combinations thereof.

According to an embodiment of the invention, the first and second heat conductive materials have a thermal conductivity of not less than 1.5 W/(m.K).

According to an embodiment of the invention, the first and second heat conducting materials are in the form of a filament, a sheet or a combination thereof.

According to an embodiment of the invention, the first and second thermally conductive materials comprise a metal, a non-metal, a ceramic material or a combination thereof.

According to an embodiment of the invention, the metal comprises silver (Ag), copper (Cu), aluminum (Al), tungsten (W), magnesium (Mg), zinc (Zn), nickel (Ni), iron (Fe) , tin (Sn), lead (Pb), titanium (Ti) or a combination thereof.

According to an embodiment of the invention, the non-metal comprises graphite, graphene, carbon nanotube, diamond.

According to an embodiment of the invention, the wavelength conversion substance and the first and second heat conductive materials, and the first heat conductive material and the second heat conductive material respectively comprise at least one interaction force, so that a part of the wavelength conversion substance And the first and second heat conductive materials and the first heat conductive material and the second heat conductive material are coupled to each other. The interaction force is van der Waal force, π-π force, polar force, metal coordination covalent bond or a combination thereof.

One aspect of the present invention provides a package structure for a light emitting diode. The package structure of the light emitting diode comprises at least one light emitting diode chip and the above packaging material. The encapsulating material is overlaid on the LED substrate.

100, 200, 300, 420, 520, 620‧ ‧ encapsulation materials

110, 210, 310‧‧‧ Transparent insulation

120, 220, 320‧‧‧ wavelength conversion substances

130, 230‧‧‧ Thermal materials

330a‧‧‧First thermal conductive material

330b‧‧‧Second thermal material

400, 500, 600‧‧‧ package structure

410, 510, 610‧‧‧Light Emitting Diode Wafers

430, 530, 630‧‧ ‧ plastic cups

431, 531, 631‧‧‧ Gujing District

1 to 3 are schematic views of a package material according to an embodiment of the present invention; and FIGS. 4 to 6 are schematic diagrams showing a package structure of a light emitting diode according to an embodiment of the present invention.

The invention will be described in detail by way of example and with reference to the accompanying drawings In the drawings, the shape or thickness of the embodiments may be expanded to simplify or facilitate the labeling, and the parts of the elements in the drawings will be described in the text. It will be appreciated that elements not shown or described may be in a variety of styles known to those skilled in the art.

The terminology used herein is for the purpose of describing particular embodiments and is not intended to The singular forms "a", "the", "the" and "the" It is to be understood that the term "comprises" and / or "comprising" when used in the specification is intended to mean the presence of the described features, integers, steps, operations, components and/or components, but does not exclude the presence or addition. One or more other features, integers, steps, operations, components, components, and/or groups thereof. Embodiments of the present invention are described herein with reference to cross-section illustrations of the schematic illustration of the preferred embodiments (and intermediate structures) of the invention. As such, it is contemplated that the shapes of the descriptions may be varied, for example, from variations in manufacturing techniques and/or tolerances. Therefore, embodiments of the invention should not be construed as limited to the particular shapes of the embodiments described herein, but will include the The regions described in the figures are illustrative in nature and are not intended to limit the actual shape of the region of the device and are not intended to limit the scope of the invention.

1 is a schematic view of a package material 100 in accordance with an embodiment of the present invention. In FIG. 1 , the encapsulating material 100 includes a transparent insulating material 110 , a wavelength converting substance 120 , and a heat conductive material 130 .

The wavelength converting substance 120 is blended in the transparent insulating material 110, and the transparent insulating material 110 contains a transparent thermoplastic or thermosetting resin. In accordance with an embodiment of the invention, the wavelength converting material 120 is selected from the group consisting of phosphors, dyes, pigments, and combinations thereof.

The heat conductive material 130 is blended in the transparent insulating material 110 and is coupled to the partial wavelength converting substance 120. In this embodiment, the thermally conductive material 130 is filamentary and is a wire. According to an embodiment of the invention, the metal comprises silver (Ag), copper (Cu), aluminum (Al), tungsten (W), magnesium (Mg), zinc (Zn), nickel (Ni), iron (Fe), tin (Sn), lead (Pb), titanium (Ti) or a combination thereof. According to an embodiment of the invention, the thermal conductivity of the thermally conductive material 130 is not less than 1.5 W/(m.K). In this embodiment, the thermally conductive material 130 is a nanosilver wire having a thermal conductivity of about 430 W/(m.K).

In this embodiment, the wavelength converting substance 120 and the heat conductive material 130 have at least one interaction force to connect the wavelength converting substance 120 and the heat conductive material 130 to each other. The interaction force is van der Waal force, π-π force, polar force, metal coordination covalent bond or a combination thereof.

2 is a package material according to an embodiment of the invention Schematic of material 200. In FIG. 2, the encapsulating material 200 includes a transparent insulating material 210, a wavelength converting substance 220, and a heat conductive material 230.

The wavelength converting substance 220 is blended in the transparent insulating material 210, and the transparent insulating material 210 contains a transparent thermoplastic or thermosetting resin. In accordance with an embodiment of the invention, the wavelength converting material 220 is selected from the group consisting of phosphors, dyes, pigments, and combinations thereof.

The heat conductive material 230 is blended in the transparent insulating material 210 and is coupled to the partial wavelength converting material 220. In this embodiment, the thermally conductive material 230 is in the form of a sheet and is a non-metal. According to an embodiment of the invention, the non-metal comprises graphite, graphene, carbon nanotubes, diamonds. According to an embodiment of the invention, the thermal conductivity of the thermally conductive material 230 is not less than 1.5 W/(m.K). In this embodiment, the thermally conductive material 230 is graphene having a thermal conductivity of about 5,300 W/(m.K).

In this embodiment, the wavelength converting substance 220 and the heat conductive material 230 have at least one interaction force to connect the wavelength converting substance 220 and the heat conductive material 230 to each other. Among them, the interaction force is van der Waals force, π-π force, polar force, metal coordination covalent bond or a combination thereof.

3 is a schematic view of a package material 300 in accordance with an embodiment of the present invention. In FIG. 3, the encapsulating material 300 includes a transparent insulating material 310, a wavelength converting substance 320, a first heat conductive material 330a, and a second heat conductive material 330b.

The wavelength converting substance 320 is blended in the transparent insulating material 310, and the transparent insulating material 310 contains a transparent thermoplastic or thermosetting resin. According to this In one embodiment of the invention, the wavelength converting substance 320 is selected from the group consisting of phosphors, dyes, pigments, and combinations thereof.

The first heat conductive material 330a and the second heat conductive material 330b are blended in the transparent insulating material 310, and the first heat conductive material 330a and the second heat conductive material 330b are coupled to the partial wavelength converting material 320. The first heat conductive material 330a and the part of the second heat conductive material 330b are connected to each other. In this embodiment, the first heat conductive material 330a is filamentary and is a metal wire containing silver (Ag), copper (Cu), aluminum (Al), tungsten (W), magnesium (Mg), zinc ( Zn), nickel (Ni), iron (Fe), tin (Sn), lead (Pb), titanium (Ti) or a combination thereof. The second heat conductive material 330b is in the form of a sheet and is a non-metal, and includes graphite, graphene, carbon nanotubes, and diamonds. According to an embodiment of the invention, the first and second heat conductive materials 330a and 330b have a thermal conductivity of not less than 1.5 W/(m.K). In this embodiment, the first heat conductive material 330a is a nano silver wire having a thermal conductivity of about 430 W/(m.K), and the second heat conductive material 330b is graphene having a thermal conductivity of about 5,300 W/ (m.K). In an embodiment of the invention, the thermally conductive material may also be a ceramic material having good thermal conductivity.

In this embodiment, the wavelength converting substance 320 and the first and second heat conducting materials 330a and 330b have at least one interaction force to connect the wavelength converting substance 320 and the first and second heat conducting materials 330a and 330b to each other. Among them, the interaction force is van der Waals force, π-π force, polar force, metal coordination covalent bond or a combination thereof.

FIG. 4 is a schematic diagram of a package structure 400 of a light emitting diode according to an embodiment of the invention. In FIG. 4, the package structure 400 At least one light emitting diode wafer 410 and an encapsulating material 420 are included.

In this embodiment, the encapsulation material 420 is overlaid on the LED substrate 410. The encapsulation material 420 comprises a transparent insulating material, a wavelength converting substance, and a thermally conductive material.

The wavelength converting material is incorporated in a transparent insulating material. The thermally conductive material is incorporated into the transparent insulating material and is coupled to a portion of the wavelength converting material. In this embodiment, the thermally conductive material is a nanosilver. The at least one interaction between the wavelength converting substance and the thermally conductive material causes the wavelength converting substance and the thermally conductive material to be coupled to each other.

When the light-emitting diode wafer 410 emits excitation light of a short wavelength, the excitation light is absorbed by the wavelength conversion substance and emits radiation of a longer wavelength. At the same time, the thermal energy generated by the wavelength converting substance can be derived by the thermally conductive material connected to the wavelength converting substance to increase the heat transfer efficiency of the encapsulating material 420 and improve the reliability of the package structure 400 of the light emitting diode.

In FIG. 4, the package structure 400 further includes a glue cup 430 having a die bond region 431 therein. The LED wafer 410 is disposed on the die bonding region 431, and the encapsulation material 420 is filled in the plastic cup 430 and covers the LED wafer 410.

FIG. 5 is a schematic diagram of a package structure 500 of a light emitting diode according to an embodiment of the invention. In FIG. 5, the package structure 500 includes at least one light emitting diode wafer 510 and an encapsulation material 520.

In this embodiment, the encapsulation material 520 is overlaid on the LED 510. The encapsulating material 520 includes a transparent insulating material, a wavelength converting substance, and a heat conductive material.

The wavelength converting material is incorporated in a transparent insulating material. The thermally conductive material is incorporated into the transparent insulating material and is coupled to a portion of the wavelength converting material. In this embodiment, the thermally conductive material is graphene. The at least one interaction between the wavelength converting substance and the thermally conductive material causes the wavelength converting substance and the thermally conductive material to be coupled to each other.

When the light-emitting diode wafer 510 emits excitation light of a short wavelength, the excitation light is absorbed by the wavelength conversion substance and emits radiation of a longer wavelength. At the same time, the thermal energy generated by the wavelength converting substance can be derived by the thermally conductive material connected to the wavelength converting substance to increase the heat transfer efficiency of the encapsulating material 520 and improve the reliability of the package structure 500 of the light emitting diode.

In FIG. 5, the package structure 500 further includes a plastic cup 530 having a die bond region 531 therein. The LED chip 510 is disposed on the die bonding region 531, and the encapsulation material 520 is filled in the plastic cup 530 and covers the LED chip 510.

FIG. 6 is a schematic diagram of a package structure 600 of a light emitting diode according to an embodiment of the invention. In FIG. 6 , the package structure 600 includes at least one LED wafer 610 and an encapsulation material 620 .

In this embodiment, the encapsulation material 620 is overlaid on the LED substrate 610. The encapsulation material 620 includes a transparent insulating material, a wavelength converting substance, a first heat conductive material, and a second heat conductive material.

The wavelength converting material is incorporated in a transparent insulating material. The first and second heat conductive materials are blended in the transparent insulating material and are coupled to a portion of the wavelength converting substance. In this embodiment, the first thermally conductive material is nanowire and the second thermally conductive material is graphene. Wavelength converting substance and first and second heat conduction The material and the at least one interaction force between the wavelength conversion material and the first and second heat conductive materials are coupled to each other.

When the light-emitting diode wafer 610 emits excitation light of a short wavelength, the excitation light is absorbed by the wavelength conversion substance and emits radiation of a longer wavelength. At the same time, the thermal energy generated by the wavelength converting substance can be derived by the first and second heat conducting materials connected to the wavelength converting substance to increase the heat conduction efficiency of the package material 620 and improve the reliability of the package structure 600 of the light emitting diode. degree.

In FIG. 6, the package structure 600 further includes a plastic cup 630 having a die bonding region 631 therein. The LED chip 610 is disposed on the die bonding region 631, and the encapsulation material 620 is filled in the plastic cup 630 and covers the LED chip 610.

The above 3rd to 6th drawings only show that the present invention is applied to a PLCC (Plastic Leaded Chip Carrier) package type and includes a rubber cup, but the present invention is not limited thereto. In other embodiments, the present invention can be applied to contain Various types of packages of wavelength converting materials and transparent insulating materials, such as COB (Chip on board) or Emitter.

Although the embodiments of the present invention have been disclosed as above, it is not intended to limit the present invention, and any person skilled in the art can make some modifications and retouchings without departing from the spirit and scope of the present invention. The scope is defined as defined in the scope of the patent application.

100‧‧‧Packaging materials

110‧‧‧Transparent insulation

120‧‧‧ wavelength conversion substances

130‧‧‧thermal materials

Claims (20)

An encapsulating material comprising: a transparent insulating material; a wavelength converting substance blended in the transparent insulating material; and a heat conductive material blended in the transparent insulating material and coupled to a portion of the wavelength converting substance. The encapsulating material of claim 1, wherein the transparent insulating material comprises a transparent thermoplastic or thermosetting resin. The encapsulating material of claim 2, wherein the wavelength converting substance is selected from the group consisting of phosphors, dyes, pigments, and combinations thereof. The encapsulating material according to claim 3, wherein the thermal conductive material has a thermal conductivity of not less than 1.5 W/(m.K). The encapsulating material of claim 4, wherein the thermally conductive material is in the form of a filament, a sheet, or a combination thereof. The encapsulating material of claim 5, wherein the thermally conductive material comprises a metal, a non-metal, a ceramic material, or a combination thereof. The encapsulating material according to claim 6, wherein the metal comprises silver (Ag), copper (Cu), aluminum (Al), tungsten (W), magnesium (Mg), zinc (Zn), nickel (Ni), iron (Fe), tin (Sn), lead (Pb), titanium (Ti) or a combination thereof. The encapsulating material of claim 6, wherein the non-metal comprises graphite, graphene, carbon nanotube, diamond. The encapsulating material according to claim 1, wherein the wavelength converting substance and the thermally conductive material comprise at least one interaction force, so that a part of the wavelength converting substance and the heat conducting material are connected to each other, and the interaction force is Van der Waal force, π-π force, polar force, metal coordination covalent bond, or a combination thereof. A package structure for a light-emitting diode, comprising: at least one light-emitting diode wafer; and a package material according to any one of claims 1 to 9, covering the light-emitting diode wafer. An encapsulating material comprising: a transparent insulating material; a wavelength converting substance blended in the transparent insulating material; a first heat conducting material blended in the transparent insulating material and coupled to a portion of the wavelength converting substance; A second heat conductive material is blended in the transparent insulating material and is coupled to a portion of the wavelength converting material and a portion of the first heat conducting material. The encapsulating material of claim 11, wherein the transparent insulating material comprises a transparent thermoplastic or thermosetting resin. The encapsulating material of claim 12, wherein the wavelength converting material is selected from the group consisting of phosphors, dyes, pigments, and combinations thereof. The encapsulating material according to claim 13 , wherein the first and second thermally conductive materials have a thermal conductivity of not less than 1.5 W/(m.K). The encapsulating material of claim 14, wherein the first and second thermally conductive materials are in the form of a filament, a sheet, or a combination thereof. The encapsulating material of claim 15, wherein the first and second thermally conductive materials comprise a metal, a non-metal, a ceramic material, or a combination thereof. The encapsulating material according to claim 16, wherein the metal comprises silver (Ag), copper (Cu), aluminum (Al), tungsten (W), magnesium (Mg), zinc (Zn), nickel (Ni), iron (Fe), tin (Sn), lead (Pb), titanium (Ti) or a combination thereof. The encapsulating material of claim 16, wherein the non-metal comprises graphite, graphene, carbon nanotubes, diamonds. The encapsulating material according to claim 11, wherein the wavelength conversion substance and the first and second heat conductive materials, and the first heat conductive material and the second heat conductive material respectively comprise at least one interaction force, Having a portion of the wavelength converting material and the first heat conductive material and the first heat conductive material and the second heat conductive material are coupled to each other, and the interaction force is Van der Valli (van) Der Waal force), π-π force, polar force, metal coordination covalent bond or a combination thereof. A package structure of a light-emitting diode, comprising: at least one light-emitting diode wafer; and a packaging material according to any one of claims 11 to 19, covering the light-emitting diode wafer.