TW201503784A - 塑膠件的選鍍方法及行動通訊裝置的外殼 - Google Patents

塑膠件的選鍍方法及行動通訊裝置的外殼 Download PDF

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TW201503784A
TW201503784A TW102123981A TW102123981A TW201503784A TW 201503784 A TW201503784 A TW 201503784A TW 102123981 A TW102123981 A TW 102123981A TW 102123981 A TW102123981 A TW 102123981A TW 201503784 A TW201503784 A TW 201503784A
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plating
plastic
plating layer
laser
insulating member
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Yong-Sheng Zeng
Zi-Ting Huang
Yi-Zong Liu
Jian-Cheng Hua
zhi-xiang Ye
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Amphenol Taiwan Corp
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Priority to TW102123981A priority Critical patent/TW201503784A/zh
Priority to CN201410079973.9A priority patent/CN104283988A/zh
Priority to US14/322,658 priority patent/US20150011270A1/en
Publication of TW201503784A publication Critical patent/TW201503784A/zh

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Abstract

一種塑膠件的選鍍方法，包含將一塑膠原料及一雷射敏感性添加劑混合並射出成型以產生一電性絕緣件，該電性絕緣件包含一塑膠件，及散布於該塑膠件內的該雷射敏感性添加劑；以雷射照射該電性絕緣件的一表面的一預定區域，該預定區域內之雷射敏感性添加劑將雷射聚光並對該預定區域內之塑膠件產生加熱作用、碳化作用、蒸發作用及化學反應，使該預定區域內之塑膠件粗糙化；於該預定區域上形成一介面鍍層；及於該介面鍍層上形成一金屬鍍層。藉此，生產的成本得以降低，且較現有技術適用於較多種不同材質及顏色的塑膠件。

Description

塑膠件的選鍍方法及行動通訊裝置的外殼
本發明是有關於一種塑膠件的選鍍方法，特別是指一種生產成本較低之塑膠件的選鍍方法。本發明還有關於一種由前述方法所製成之行動通訊裝置的外殼。
行動通訊裝置的體積目前朝向小型化的趨勢發展。為了達成縮小行動通訊裝置的體積，目前部分行動通訊裝置的天線係形成於行動通訊裝置的背蓋的表面。目前用於實現此種結構設計的一種製程方法係將銅離子與鈀離子與塑膠原料混和並射出成型以產生以塑膠材料為主的背蓋，接著以雷射照射背蓋的預訂區域以將鈀離子及銅離子活化，最後，在預定區域被活化的鈀離子及銅離子上化鍍形成金屬鍍層，此金屬鍍層即天線之輻射導體，其中，鈀離子係用於橋接金屬鍍層及塑膠材料。此種製程如美國專利第US 7060421號所揭示者。
前述製程需將鈀離子散佈在塑膠材料中(不論是預定形成天線處或預定不形成天線處)，故鈀之用量相當大，但鈀係較為昂貴之金屬，因而造成此製程之材料成本昂貴。再者，塑膠材料添加銅離子與鈀離子後其應力特性 (如軟硬度、脆度、彈性...等)改變，因而無法符合部分業界需求，此外，前述製程僅適用於部分特定種類的塑膠材料。因此，如何發展出一種新的製程，能有效改善前述現有技術的缺點，遂成為本案進一步要探討的重點。
因此，本發明之目的，即在提供一種生產成本較低之塑膠件的選鍍方法。
本發明之另一目的，在於提供一種生產成本較低之行動通訊裝置的外殼。
於是本發明塑膠件的選鍍方法，包含(A)將一塑膠原料及一雷射敏感性添加劑混合並射出成型以產生一電性絕緣件，該電性絕緣件包含一塑膠件，及散布於該塑膠件內的該雷射敏感性添加劑；(B)以雷射照射該電性絕緣件的一表面的一預定區域，該預定區域內之雷射敏感性添加劑將雷射聚光並對該預定區域內之塑膠件產生加熱作用、碳化作用、蒸發作用及化學反應，使該預定區域內之塑膠件粗糙化；(C)於該預定區域上形成一介面鍍層；及(D)於該介面鍍層上形成一金屬鍍層。
較佳地，該介面鍍層為鈀離子。
更佳地，於步驟(C)中是透過化鍍的方式將一錫鈀合金形成於該電性絕緣件的表面，再透過酸洗的方式將該錫鈀合金的錫離子去除，使該預定區域上的鈀離子留存於該電性絕緣件的表面而形成該介面鍍層。
或者，於步驟(C)中是將該電性絕緣件浸泡於 一奈米鈀活化液，以於該預定區域上形成該介面鍍層。
較佳地，該金屬鍍層是以銅或鎳為材料製成。
較佳地，於步驟(D)中是透過化鍍的方式形成該金屬鍍層。
較佳地，該金屬鍍層能用於傳送或接收一射頻訊號。
本發明行動通訊裝置的外殼，係由如前述的塑膠件的選鍍方法所製成。
本發明之功效在於藉由使用雷射敏感性添加劑將預定區域內之塑膠件粗糙化，供介面鍍層附著於預定區域上，使材料成本較為昂貴的介面鍍層僅用於形成在預定區域上，藉此能有效減少介面鍍層之材料用量，從而降低生產的成本。
S01~S04‧‧‧流程步驟
100‧‧‧電性絕緣件
101‧‧‧表面
1‧‧‧塑膠件
2‧‧‧雷射敏感性添加劑
3‧‧‧錫鈀合金
4‧‧‧介面鍍層
5‧‧‧金屬鍍層
本發明之其他的特徵及功效，將於參照圖式的實施方式中清楚地呈現，其中：圖1是本發明塑膠件的選鍍方法的第一較佳實施例的一流程圖；圖2是該第一較佳實施例的一電性絕緣件的一微觀剖面示意圖，說明該電性絕緣件包含一塑膠件，及散布於該塑膠件內的一雷射敏感性添加劑；圖3是一類似圖2的視圖，說明以雷射照射該電性絕緣件的一表面的一預定區域，使該預定區域內之塑膠件粗糙化； 圖4是一類似圖2的視圖，說明於該電性絕緣件表面化鍍一錫鈀合金；圖5是一類似圖2的視圖，說明透過酸洗將錫離子去除而使鈀離子附著於該預定區域上，形成一介面鍍層；圖6是一類似圖2的視圖，說明於該介面鍍層上形成一金屬鍍層；及圖7是本發明行動通訊裝置的外殼的一示意圖。
參閱圖1與圖2，本發明塑膠件的選鍍方法之第一較佳實施例首先如步驟S01所示，將一塑膠原料及一雷射敏感性添加劑2混合並射出成型以產生一電性絕緣件100，電性絕緣件100包含一塑膠件1，及散布於塑膠件1內的雷射敏感性添加劑2。塑膠原料可以是ABS、PBT或PC，但不以此為限。雷射敏感性添加劑2(laser-sensitive additive)俗稱激光打標粉、激光粉、激光添加劑、光敏劑或雷雕粉，例如由德國默克(MERCK)公司所生產的產品「Lazerflair®」。雷射敏感性添加劑2的功用將在本發明的下一步驟清楚說明。
參閱圖1及圖3，接著如步驟S02所示，以雷射照射電性絕緣件100的一表面101的一預定區域，預定區域內之雷射敏感性添加劑2將雷射聚光以聚集雷射能量，並對預定區域內之塑膠件1產生加熱作用、碳化作用、蒸發作用及化學反應，使該預定區域內之塑膠件1產生微細孔，進而使預定區域內之塑膠件1粗糙化，藉以讓離子化 (奈米化)的物質可植入或附著於其上。將塑膠件1粗糙化的作用將在下一步驟清楚說明。
參閱圖1、圖4及圖5，接著如步驟S03所示，於該預定區域上形成一介面鍍層4。在本實施例中，步驟S03是先如圖4所示透過化鍍的方式將一錫鈀合金3(例如錫鈀膠體)形成於電性絕緣件100的表面101，再如圖5所示透過酸洗的方式將錫鈀合金3的錫離子去除而存留鈀離子，由於預定區域內的塑膠件1表面粗糙化，因此鈀離子可附著於預定區域上而形成介面鍍層4，反之位於預定區域外之電性絕緣件100表面101上的鈀離子因無法附著而被去除。
參閱圖1及圖6，最後如步驟S04所示，於介面鍍層4上形成一金屬鍍層5。在本實施例中，步驟S04是透過化鍍的方式形成該金屬鍍層5，且該金屬鍍層5是以銅或鎳為材料製成。以銅為例，鈀離子能吸引銅離子，使金屬鍍層5附著於介面鍍層4，進而使金屬鍍層5透過介面鍍層4附著於電性絕緣件100。更明確的說，鈀離子係作為將金屬鍍層5形成於電性絕緣件100的一催化劑(觸媒)。
參閱圖7，補充說明的是，在本實施例中，電性絕緣件100為一行動通訊裝置的外殼的殼本體，金屬鍍層5為該外殼的一天線的輻射導體，用於傳送或接收一射頻訊號。圖7所示之金屬鍍層5係形成一倒F形天線的輻射導體，但不以此為限，金屬鍍層5也可以是其形式天線的輻射導體(如NFC、單極天線...等)。另外，圖7所示之金屬 鍍層5是形成於殼本體的內表面，但金屬鍍層5形成於殼本體的位置不以此為限，金屬鍍層5也可以是形成於殼本體的外表面。
值得一提的是，與現有技術相比，由於本發明之鈀離子僅需形成於預定區域而不需要散布在整個塑膠件1內，因此鈀離子的使用量能有效降低，從而降低生產成本。此外，本發明的塑膠件1未參雜銅離子及鈀離子，因此應力特性能符合業界需求。此外，與現有製程相比，本發明適用於較多種不同材質及顏色的塑膠件。
本發明塑膠件的選鍍方法之第二較佳實施例與第一實施例相近，只是步驟S03中形成介面鍍層的方式有所不同4。在本實施例中，是將該電性絕緣件100浸泡於一奈米鈀活化液(圖未示)，以於該預定區域上形成該介面鍍層4。有關奈米鈀活化液之相關技術乃現有技術，故在此不予贅述，相關技術可參考現有文獻如「曾俊傑、陳彥政、張章平、郭俊良、葛明德(民國100年5月)：奈米鈀活化液應用於無電電鍍銅之研究。中正嶺學報，第四十卷第一期，75-84。」
綜上所述，本發明塑膠件的選鍍方法的較佳實施例透過使用雷射敏感性添加劑2將預定區域內之塑膠件1粗糙化，供介面鍍層4附著於預定區域上，使材料成本較為昂貴的介面鍍層4僅用於形成在預定區域上，藉此能有效減少介面鍍層4之材料用量，從而降低生產的成本，此外，該較佳實施例還能有效維持塑膠件1的應力特性而符 合業界需求，故確實能達成本發明之目的。
惟以上所述者，僅為本發明之較佳實施例而已，當不能以此限定本發明實施之範圍，即大凡依本發明申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾，皆仍屬本發明專利涵蓋之範圍內。
S01~S04‧‧‧流程步驟

Claims (8)

  1. 一種塑膠件的選鍍方法，包含：(A)將一塑膠原料及一雷射敏感性添加劑混合並射出成型以產生一電性絕緣件，該電性絕緣件包含一塑膠件，及散布於該塑膠件內的該雷射敏感性添加劑；(B)以雷射照射該電性絕緣件的一表面的一預定區域，使該預定區域內之塑膠件粗糙化；(C)於該預定區域上形成一介面鍍層；及(D)於該介面鍍層上形成一金屬鍍層。
  2. 如請求項1所述的塑膠件的選鍍方法，其中，該介面鍍層為鈀離子。
  3. 如請求項2所述的塑膠件的選鍍方法，其中，於步驟(C)中是透過化鍍的方式將一錫鈀合金形成於該電性絕緣件的表面，再透過酸洗的方式將該錫鈀合金的錫離子去除，使該預定區域上的鈀離子留存於該電性絕緣件的表面而形成該介面鍍層。
  4. 如請求項2所述的塑膠件的選鍍方法，其中，於步驟(C)中是將該電性絕緣件浸泡於一奈米鈀活化液，以於該預定區域上形成該介面鍍層。
  5. 如請求項1所述的塑膠件的選鍍方法，其中，該金屬鍍層是以銅或鎳為材料製成。
  6. 如請求項1所述的塑膠件的選鍍方法，其中，於步驟(D)中是透過化鍍的方式形成該金屬鍍層。
  7. 如請求項1所述的塑膠件的選鍍方法，其中，該金屬鍍 層能用於傳送或接收一射頻訊號。
  8. 一種行動通訊裝置的外殼，係由如請求項1到請求項7其中任一項所述的塑膠件的選鍍方法所製成。
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