TW201443130A - 組成物、發泡成形體及電線的製造方法 - Google Patents
組成物、發泡成形體及電線的製造方法 Download PDFInfo
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Abstract
本發明之目的係提供一種組成物,其可製造平均泡徑小且發泡率大之發泡成形體及發泡電線。本發明之組成物之特徵係含平均粒子徑為10.5μm以上之氮化硼或以(D84-D16)/D50表示之粒度分布為1.2以下之氮化硼。
Description
本發明係關於組成物、及發泡成形體及電線的製造方法。
作為電線之包覆材,欲提高電特性而被期望介電率降低,為使低介電率化有效地是將包覆材作成發泡體。以樹脂作為材料之發泡體通常係藉由使氣體存在於熔融樹脂中予以成形之發泡成形而得。
發泡體中之氣泡為了使所得發泡體之形狀或特性均一,較好係微細且均一分布。為了使氣泡細小化或均一分布,而有使發泡核劑存在於樹脂中以在發泡成形時成為產生氣泡之起點的方法。
作為添加於氟樹脂等樹脂中之發泡核劑,氮化硼(BN)由於係熱安定且為化學惰性、為低毒性、且具有因添加導致之介電率變化較少等之優異電氣性質,故而被使用。
於氟樹脂等樹脂中調配BN作為發泡核劑獲得發泡體之方法揭示有例如下述。
專利文獻1中揭示作為發泡核劑之陶瓷或該原料與沸石之組合中,以BN與沸石之組合較佳。
專利文獻2及專利文獻3中揭示使用BN作為發泡核劑之方法。
專利文獻3揭示添加表面積為5~10m2/g之BN作為發泡核劑之方法。
專利文獻4、專利文獻5及專利文獻6中揭示併用具有8.6m2/g之表面積的BN與磺酸及膦酸及該等酸之鹽。
專利文獻7及專利文獻8中揭示併用表面積約8m2/g之BN與由金屬陽離子及多原子陰離子所成之滿足特定關係式之熱安定之無機鹽,例如四硼酸鈉。
專利文獻9中揭示氟樹脂發泡體之形成中,BN較好為平均粒子徑未達10μm者,且以適當研磨機粉碎樹脂與BN。
專利文獻10中揭示混合可藉脫碳酸而發泡之樹脂粉末、BN及金屬鹽獲得摻合物,且使用壓縮機接著使用錘式研磨機等之鹽磨機予以粗研碎生成粉體,或在摻合後使用顆粒研磨機生成顆粒,且供給於擠出機之方法,摻合較好使用亨歇爾(HENSCHEL)混練機(Purnell International公司製)。
專利文獻11中揭示除了可加工之氟聚合物物質與BN以外,組合使用磺酸或膦酸或該等酸之鹽、及/或含多原子陰離子之無機鹽之發泡方法,並使BN結晶成長
至最終尺寸,平均粒子尺寸為12μm以下之方法,且記載該BN並非將各個結晶破壞之機械粉碎,而是在所成長各個結晶生成凝聚時進行脫凝聚者。
專利文獻12中記載一種樹脂組成物,其係含有氟樹脂(A)及發泡核劑(B)之樹脂組成物,其特徵係前述發泡核劑(B)之d99為15μm以下,作為發泡核劑(B)係使用氮化硼。
專利文獻13中記載含特定之含氟共聚物之組成物作為用以獲得發泡成形品之組成物,且記載該組成物亦可含氮化硼。專利文獻14及專利文獻15中記載可高速擠出之具有高熔融流動速率之含氟聚合物,且作為添加於含氟聚合物中之發泡核劑記載有氮化硼。
專利文獻16及17中記載一種氟樹脂組成物,其係由四氟乙烯/六氟丙烯系共聚物100質量份、與標準比重為2.15~2.30的聚四氟乙烯0.01~3質量份所成之氟樹脂組成物,前述氟樹脂組成物係藉由混合由前述四氟乙烯/六氟丙烯系共聚物所成之水性分散液、與由前述聚四氟乙烯所成之水性分散液後進行凝析,接著乾燥後藉熔融擠出而得,且記載由含氮化硼之組成物形成發泡電線。
專利文獻1:日本特開平8-12796號公報
專利文獻2:日本特開昭63-24503號公報
專利文獻3:日本特開昭63-110508號公報
專利文獻4:日本特開昭59-11340號公報
專利文獻5:日本特公平6-89166號公報
專利文獻6:美國專利第4877815號公報
專利文獻7:美國專利第5023279號公報
專利文獻8:日本特公平7-121999號公報
專利文獻9:日本特開平1-172431號公報
專利文獻10:日本特開平10-195216號公報
專利文獻11:日本特開平10-45931號公報
專利文獻12:國際公開第2003/000792號
專利文獻13:美國專利第3072583號公報
專利文獻14:美國專利第7122609號公報
專利文獻15:美國專利第7126056號公報
專利文獻16:國際公開第2006/123694號
專利文獻17:日本特表2010-539252號公報
鑑於上述現狀,本發明之目的係提供一種可製造平均泡徑小且發泡率大之發泡成形體及發泡電線之組成物。
本發明係一種組成物(以下亦稱為「第一組
成物」),其特徵為含有氟樹脂與平均粒子徑為10.5μm以上之氮化硼。
本發明之第一組成物中,較好氮化硼的(D84-D16)/D50所示粒度分布為1.2以下。
本發明另係一種組成物(以下亦稱為「第二組成物」),其特徵為含有氟樹脂與(D84-D16)/D50所示粒度分布為1.2以下之氮化硼。
本發明之第二組成物中,氮化硼之平均粒子徑較好為5.0μm以上。
本發明之第一及第二組成物中,氮化硼較好為經粉碎者。
本發明之第一及第二組成物中,氟樹脂較好為四氟乙烯/六氟丙烯系共聚物、四氟乙烯/全氟(烷基乙烯基醚)共聚物或四氟乙烯/乙烯系共聚物。
本發明之第一及第二組成物中,氟樹脂並無限制,但較好係經氟化處理之氟樹脂。
本發明之第一及第二組成物中,氮化硼之含有量對於氟樹脂與氮化硼之合計量而言較好為0.5質量%以上。
本發明之第一及第二組成物較好進一步含有磺酸或其鹽。
上述磺酸或其鹽較好為下述式(1)或下述式(2)所示之磺酸或者此等之鹽,式(1):
F(CF2)nSO3H (1)
(式中,n為4或5)
式(2):F(CF2)nCH2CH2SO3H (2)
(式中,n為4或5)。
本發明另係一種發泡成形體,其係由上述組成物所得者。
本發明另亦係一種電線,其係具備芯線、與包覆上述芯線之由上述組成物所得之包覆材。
本發明又係一種發泡成形體之製造方法,其特徵為含有將上述組成物進行發泡成形之步驟。
本發明接著亦係一種電線之製造方法,其特徵係含有將上述組成物包覆芯線而得電線之步驟。
本發明之組成物藉由具有上述構成,可製造平均泡徑小且發泡率大的發泡成形體及發泡電線。
圖1係實施例10所得之電線剖面照片。
本發明之第一組成物為含有氟樹脂與平均粒
子徑為10.5μm以上之氮化硼者。
本發明之第二組成物為含有氟樹脂與(D84-D16)/D50所示粒度分布為1.2以下之氮化硼者。
以下詳細說明本發明。
本發明之第一組成物中,氮化硼之平均粒子徑為10.5μm以上。過去,氮化硼之平均粒子徑有較小之傾向,並未具體檢討使用平均粒子徑較大之氮化硼。
然而,本發明之第一組成物藉由含有具有上述特定範圍之平均粒子徑之氮化硼,可製造平均泡徑小且發泡率大之發泡成形體及發泡電線。平均粒子徑未達10.5μm時,平均泡徑變大。且發泡率變小。
本發明之第一組成物中,氮化硼之平均粒子徑較好為11.0μm以上,更好為12.0μm以上,又更好為13.0μm以上,最好為15.0μm以上。藉由使氮化硼之平均粒子徑為上述範圍,可製造平均泡徑小且發泡率大之發泡成形體及發泡電線。
且,氮化硼之平均粒子徑過大時會有發生較多火花(spark)之虞。氮化硼之平均粒子徑較好為25.0μm以下,更好為20.0μm以下。
氮化硼之平均粒子徑係使用雷射繞射.散亂式粒度分布分析裝置(例如,日機裝(股)製造之Microtrack MT3300)求出之值。使用濕式法時,雖只要適當選擇介質即可,但只要使用例如甲醇等即可。
本發明之第一組成物中,氮化硼之以(D84-
D16)/D50表示之粒度分布較好為1.2以下。
D84、D50及D16係表示以氮化硼之粉體集團之總體積作為100%求出累積曲線時,其累積曲線成為84%之點的粒徑(μm)、成為50%之點的粒徑(μm)、成為16%之點的粒徑(μm)。又,粒度分布之累積係自小粒徑側進行。上述粉體集團之總體積係將氮化硼之粉體分散於甲醇等介質中調製樣品,使用雷射繞射.散亂式粒度分布分析裝置(例如,日機裝(股)製之Microtrack MT3300)而得。
藉由使氮化硼之粒度分布為上述範圍,可形成具有微細且均一氣泡之包覆材,並且可進一步抑制火花之發生。
上述粒度分布更好為1.1以下,又更好為1.0以下。粒度分布之下限並無特別限制,但例如可為0.1。
上述粒度分布(體積粒度分布)之累積曲線係使用雷射繞射.散亂式粒度分布分析裝置(例如,日機裝(股)製之Microtrack MT3300)獲得者。使用濕式法時,只要適當選擇介質即可,但若使用例如甲醇等即可。
本發明之第二組成物中,氮化硼之以(D84-D16)/D50表示之粒度分布為1.2以下。
過去,已完成使氮化硼之平均粒子徑減小之檢討,但並未著眼於氮化硼之粒度分布具體進行檢討。
本發明之第二組成物藉由含有具有上述特定範圍之平均粒子徑之氮化硼,可製造平均泡徑小且發泡率大之發泡成形體及發泡電線。
D84、D50及D16係表示以氮化硼之粉體集團之總體積作為100%求出累積曲線時,其累積曲線成為84%之點的粒徑(μm)、成為50%之點的粒徑(μm)、成為16%之點的粒徑(μm)。又,粒度分布之累積係自小粒徑側進行。上述粉體集團之總體積係將氮化硼之粉體分散於甲醇等介質中調製樣品,使用雷射繞射.散亂式粒度分布分析裝置(例如,日機裝(股)製之Microtrack MT3300)而得。
藉由使氮化硼之粒度分布為上述範圍,可形成具有微細且均一氣泡之包覆材,並且可進一步抑制火花之發生。
上述粒度分布更好為1.1以下,又更好為1.0以下。粒度分布之下限並無特別限制,但例如可為0.1。
上述粒度分布(體積粒度分布)之累積曲線係使用雷射繞射.散亂式粒度分布分析裝置獲得者。使用濕式法時,只要使用甲醇作為介質即可。
本發明之第二組成物中,氮化硼之平均粒子徑較好為5.0μm以上。更好為8.0μm以上,又更好為8.5μm以上,再更好為10.5μm以上。藉由使氮化硼之平均粒子徑為上述範圍,可製造平均泡徑更小且發泡率大之發泡成形體及發泡電線。氮化硼之平均粒子徑較好為25.0μm以下,更好為20.0μm以下。氮化硼之平均粒子徑亦可未達10.5μm。
氮化硼之平均粒子徑係使用雷射繞射.散亂式粒度分布分析裝置(例如,日機裝(股)製造之Microtrack
MT3300)求出之值。使用濕式法時,只要適當選擇介質即可,但只要使用例如甲醇等即可。
本發明之第一及第二組成物中,氮化硼較好為經粉碎者。藉由使氮化硼為經粉碎者,可製造平均泡徑小且發泡率大之發泡成形體及發泡電線。此外,可製造火花少之發泡成形體及發泡電線。
此外,上述粉碎可藉由可將氮化硼之平均粒子徑、粒度分布落入上述範圍內之方法及條件進行。例如,適當選擇粉碎機之種類、條件而進行。上述粉碎機可使用例如噴射式研磨機、錘式研磨機、球磨機、針軸研磨機等。
氮化硼亦可藉分級而調整成上述範圍之平均粒子徑、粒度分布。
本發明之第一及第二組成物之氮化硼含量相對於氟樹脂與氮化硼之合計量而言較好為0.1質量%以上,更好為0.4質量%以上,又更好為0.5質量%以上,再更好為0.6質量%以上。氮化硼含量過少時,會有所得發泡電線之包覆材中不易獲得微細氣泡之虞。
氮化硼之含量對於氟樹脂與氮化硼之合計量而言最好為0.7質量%以上。藉由使氮化硼之含量為0.7質量%以上,可製造平均泡徑與發泡率之平衡特別優異之發泡成形體及發泡電線。
氮化硼之含量相對於氟樹脂與氮化硼之合計量而言較好為2.0質量%以下,更好為1.5質量%以下,又更好為1.0質量%以下。氮化硼之含量過多時,會有製造成本變
高之虞。
本發明之第一及第二組成物中,氟樹脂若為可熔融加工者,則未特別限制,列舉為例如四氟乙烯(TFE)/六氟丙烯(HFP)系共聚物、TFE/全氟(烷基乙烯基醚)(PAVE)共聚物、TFE/乙烯系共聚物[ETFE]、氯三氟乙烯(CTFE)/乙烯共聚物[ECTFE]、聚偏氟化乙烯[PVdF]、聚氯三氟乙烯[PCTFE]、TFE/偏氟化乙烯(VdF)共聚物[VT]、聚氟化乙烯[PVF]、TFE/VdF/CTFE共聚物[VTC]、TFE/乙烯/HFP共聚物、TFE/HFP/VdF共聚物等。
作為上述PAVE列舉為例如全氟(甲基乙烯基醚)[PMVE]、全氟(乙基乙烯基醚)[PEVE]、全氟(丙基乙烯基醚)[PPVE]等。其中,以PPVE較佳。該等可使用1種或2種以上。
氟樹脂亦可在不損及各氟樹脂本質性質之範圍的量下,具有基於其他單體之聚合單位者。上述其他單體可由例如TFE、HFP、乙烯、丙烯、全氟(烷基乙烯基醚)、全氟烷基乙烯、氫氟烯烴、氟烷基乙烯、全氟(烷基烯丙基醚)等中適當選擇。構成上述其他單體之全氟烷基較好為碳數1~10者。
基於具有優異之耐熱性,氟樹脂較好為TFE/HFP系共聚物、TFE/PAVE共聚物或TFE/乙烯系共聚物,更好為TFE/HFP系共聚物或TFE/PAVE共聚物。上述氟樹脂亦可併用2種以上。且,基於具有更優異之電特
性而言亦較佳為全氟樹脂。
TFE/HFP系共聚物係TFE/HFP以質量比計較好為80~97/3~20,更好為84~92/8~16。
TFE/HFP系共聚物可為由TFE與HFP所成之2元共聚物,再者亦可為由TFE及HFP與可共聚合之輔單體所成之3元共聚物(例如,TFE/HFP/PAVE共聚物)。
TFE/HFP系共聚物亦較好含有基於PAVE之聚合單位的TFE/HFP/PAVE共聚物。
TFE/HFP/PAVE共聚物係TFE/HFP/PAVE以質量比計較好為70~97/3~20/0.1~10,更好為81~92/5~16/0.3~5。
TFE/PAVE共聚物係TFE/PAVE以質量比計較好為90~99/1~10,更好為92~97/3~8。
TFE/乙烯系共聚物係TFE/乙烯以莫耳比計較好為20~80/20~80,更好為40~65/35~60。且,TFE/乙烯系共聚物亦可含有其他單體成分。
亦即,TFE/乙烯系共聚物可為由TFE與乙烯所成之2元共聚物,進而亦可為由TFE及乙烯與可共聚合之輔單體所成之3元共聚物(例如,TFE/乙烯/HFP共聚物)。
TFE/乙烯系共聚物亦較好係含有基於HFP之聚合單位的TFE/乙烯/HFP共聚物。TFE/乙烯/HFP共聚物係TFE/乙烯/HFP以莫耳比計較好為40~65/30~60/0.5~20,更好為40~65/30~60/0.5~10。
氟樹脂之熔融流動速率(MFR)較好為0.1~100g/10分鐘,更好為4~70g/10分鐘,又更好為
19~60g/10分鐘,基於可抑制火花之發生,使發泡率變大而言,更好為34~50g/10分鐘,最好為34~42g/10分鐘。
上述MFR係基於ASTM D-1238,以直徑2.1mm、長度8mm之模嘴,以荷重5kg、372℃下測定之值。
氟樹脂可藉由使用通常之聚合方法例如乳化聚合、懸浮聚合、溶液聚合、塊狀聚合、氣相聚合等各種方法使單體成分聚合而合成。上述聚合反應中,亦可使用甲醇等鏈轉移劑。亦可不使用含金屬離子之試藥,藉由聚合且單離而製造氟樹脂。
氟樹脂宜為聚合物主鏈及聚合物側鏈之至少一者之部位具有-CF3、-CF2H等末端基者,雖為無特別限制,但較好為經氟化處理之氟樹脂。未經氟化處理之氟樹脂有時具有-COOH、-CH2OH、-COF、-CONH2等之熱及電特性不安定之末端基(以下亦稱該末端基為「不安定末端基」)。該不安定末端基可藉由上述氟化處理而減低。氟樹脂較好含較少或不含上述不安定末端基,更好上述4種不安定末端基與-CF2H末端基之合計數係每1×106個碳數為50個以下。超過50個時,有產生成形不良之虞。上述不安定末端基更好為20個以下,又更好為10個以下。本說明書中,上述不安定末端基係由紅外線吸收光譜測定所得之值。亦可不存在上述不安定末端基及-CF2H末端基而全部為-CF3末端基。
上述氟化處理可藉由使未經氟化處理之氟樹脂與含氟化合物接觸而進行。
上述含氟化合物並未特別限制,但列舉為在氟化處理條件下產生氟自由基之氟自由基源。上述氟自由基源列舉為F2氣體、CoF3、AgF2、UF6、OF2、N2F2、CF3OF及氟化丙烷(例如,IF5、ClF3)等。
上述F2氣體等之氟自由基源亦可為100%濃度者,但基於安全性方面而言較好與惰性氣體混合稀釋成5~50質量%,較好為15~30質量%後使用。上述惰性氣體列舉為氮氣、氦氣、氬氣等,但就經濟面而言以氮氣較佳。
上述氟化處理條件並未特別限制,可使經熔融狀態之氟樹脂與含氟化合物接觸,但通常可在氟樹脂之熔點以下,較好為20~220℃,更好為100~200℃之溫度下進行。上述氟化處理一般係進行1~30小時,較好為5~20小時。
上述氟化處理較好係使未經氟化處理之氟樹脂與氟氣體(F2氣體)接觸者。
本發明之第一及第二組成物亦可進一步含有多原子陰離子之無機鹽,或磺酸、膦酸、或該等之鹽。
上述含多原子陰離子之無機鹽列舉為美國專利第4,764,538號說明書中揭示者。
本發明之第一及第二組成物中,除氟樹脂、平均粒子徑為10.5μm以上之氮化硼或(D84-D16)/D50表示之粒度分布為1.2以下之氮化硼以外,亦較好進一步含磺酸或其鹽。
上述磺酸或其鹽,基於耐熱性優異,較好為鹼金屬鹽或鹼土類金屬鹽。
上述磺酸或其鹽較好為下述式(1)或下述式(2)所示之磺酸、或者此等之鹽之化合物(A):式(1):F(CF2)nSO3H (1)
(式中,n為4或5)
式(2):F(CF2)nCH2CH2SO3H (2)
(式中,n為4或5)。
藉由使用上述化合物(A),可製造平均泡徑小且發泡率大之發泡成形體及發泡電線。
基於由本發明之第一及第二組成物所得之包覆材之平均泡徑及發泡率之平衡,化合物(A)較好為以式(1)或(2)表示之磺酸、或其鹼金屬鹽或鹼土類金屬鹽。更好為以式(1)或(2)表示之磺酸之鋇鹽、鉀鹽、鈉鹽或銣鹽。
本發明之第一及第二組成物中,上述化合物(A)之含量對於氟樹脂較好為2000ppm以下,更好為1500ppm以下。更好為1000ppm以下,又更好為500ppm以下,最好為250ppm以下。
本發明之組成物中化合物(A)之含量對於氟樹脂較好為0.01ppm以上。更好為0.1ppm以上。
化合物(A)之含量過少時,所得包覆材中不易獲得微細氣泡,過多時會有產生較多火花之虞。
化合物(A)為鋇鹽時,本發明之組成物中化
合物(A)含量對於氟樹脂較好為1500ppm以下。更好為1000ppm以下,又更好為500ppm以下。
化合物(A)為鋇鹽時,本發明之組成物中化合物(A)含量對於氟樹脂較好為0.01ppm以上。更好為0.1ppm以上,又更好為1ppm以上,再更好為4ppm以上,最好為10ppm以上。
化合物(A)之含量過少時不易獲得微細之氣泡,過多時有產生較多火花之虞。
化合物(A)為鉀鹽時,本發明之組成物中化合物(A)含量對於氟樹脂較好為2000ppm以下。更好為1500ppm以下,又更好為1000ppm以下,最好為500ppm以下。
化合物(A)為鉀鹽時,本發明之組成物中化合物(A)含量對於氟樹脂較好為0.01ppm以上。更好為0.1ppm以上,又更好為1ppm以上,再更好為4ppm以上,最好為10ppm以上。
化合物(A)之含量過少時不易獲得微細之氣泡,過多時有產生較多火花之虞。
化合物(A)較好為鈉鹽。化合物(A)為鈉鹽時,本發明之組成物中化合物(A)含量對於氟樹脂較好為250ppm以下。更好為100ppm以下。
化合物(A)為鈉鹽時,本發明之組成物中化合物(A)含量對於氟樹脂較好為0.01ppm以上。更好為0.1ppm以上,又更好為1ppm以上,再更好為4ppm以
上,最好為10ppm以上。
化合物(A)之含量過少時不易獲得微細之氣泡,過多時有產生較多火花之虞。
基於可極容易地控制發泡率,化合物(A)較好為銣鹽。化合物(A)為銣鹽時,本發明之組成物中化合物(A)含量對於氟樹脂較好為500ppm以下。更好為250ppm以下。
化合物(A)為銣鹽時,本發明之組成物中化合物(A)含量對於氟樹脂較好為0.01ppm以上。更好為0.1ppm以上,又更好為1ppm以上,再更好為4ppm以上,最好為10ppm以上。
化合物(A)之含量過少時不易獲得微細之氣泡,過多時有產生較多火花之虞。
一般,相較於C-H鍵,C-F鍵之鍵能較大,為化學堅固之構造,故化合物(A)更好為不含C-H鍵之式(1)表示之磺酸或其鹽。
本發明之第一及第二組成物中除了氟樹脂、氮化硼以外,在不損及本發明效果之範圍內亦可含過去習知之填充材。
上述填充材列舉為例如石墨、碳纖維、焦炭、二氧化矽、氧化鋅、氧化鎂、氧化錫、氧化銻、碳酸鈣、碳酸鎂、玻璃、滑石、雲母(mica)、雲母、氮化鋁、磷酸鈣、絹雲母(sericite)、矽藻土、氮化矽、微細二氧化矽、氧化鋁、氧化鋯、石英粉、高嶺土、膨潤土、
氧化鈦等。上述填充材之形狀並無特別限制,列舉為纖維狀、針狀、粉末狀、粒狀、珠粒狀等。又,上述填充材係與氮化硼不同者。
本發明之第一及第二組成物中亦可為進一步含有上述氟樹脂以外之熱可塑性樹脂者。上述氟樹脂以外之熱可塑性樹脂列舉為例如聚乙烯樹脂、聚丙烯樹脂、氯乙烯樹脂、聚苯乙烯樹脂等廣用樹脂;尼龍、聚碳酸酯、聚醚醚酮樹脂、聚苯硫醚樹脂等之工程塑膠。
本發明之第一及第二組成物亦可進一步含有添加劑等其他成分。其他成分列舉為例如玻璃纖維、玻璃粉末、石綿(asbest)纖維等填充材,或補強劑、安定劑、潤滑劑、顏料、其他添加劑等。
本發明之第一及第二組成物可藉由包含例如混合平均粒子徑為10.5μm以上之氮化硼或(D84-D16)/D50表示之粒度分布為1.2以下之氮化硼、及氟樹脂而獲得混合物之混合步驟之製造方法(以下稱為「組成物之製造方法」)而得。
上述混合方法可使用例如過去習知之方法等,但較好為不易使上述氮化硼凝聚之混合方法。
上述混合方法亦列舉為例如亨歇爾混練機、螺帶式混練機(ribbon mixer)、V型摻合機、球磨機等之方法等。此外,亦舉例有例如藉由熔融混練而混合之方法。
上述組成物之製造方法亦可為包含在上述混合步驟之前,將氮化硼粉碎及/或分級,獲得平均粒子徑
為10.5μm以上之氮化硼或(D84-D16)/D50表示之粒度分布為1.2以下之氮化硼之步驟者。
上述組成物之製造方法亦可包含使由上述混合步驟所得之混合物混練之混練步驟者。藉由上述混練,可獲得顆粒。上述混練可藉由使用例如單軸螺旋擠出機、2軸螺旋擠出機等過去習知之熔融混練機之方法進行。
上述組成物之製造方法亦可包含使氟樹脂進行氟化處理之步驟者。氟化處理可使用上述方法。氟化處理可藉由例如使由上述混練所得之顆粒與含氟化合物接觸而進行。
本發明之組成物中可含有之已說明之氟樹脂以外的熱可塑性樹脂;含多原子陰離子之無機鹽;磺酸、膦酸、或其鹽;填充材;其他添加劑等各成分可依據其性質等,於上述組成物之製造方法之各步驟中適當添加。此外,亦可進一步添加氟樹脂、氮化硼。
本發明之組成物可較好地使用作為發泡性組成物。且,上述組成物可較好地使用作為發泡成形體用組成物。再者,上述組成物可較好地使用作為用以形成電線包覆材之電線包覆用組成物。
本發明之發泡成形體之製造方法包含使上述第一或第二組成物發泡成形之步驟者。
使上述組成物發泡成形之方法並無特別限制,可使用例如過去習知之方法,列舉為例如於經熔融之上述氟樹脂(熔融樹脂)中使用氣體,將本發明之樹脂組
成物投入於設計成發泡操作用之螺旋擠出機中,使用連續氣體射出法之方法等。
上述氣體可使用例如氯二氟甲烷、氮氣、二氧化碳等氣體或上述氣體之混合物,亦可作為加壓氣體導入於擠出機內之熔融樹脂中,亦可藉由將化學發泡劑混合於熔融樹脂中而產生。上述氣體係溶解於上述擠出機內之熔融樹脂中。
溶解於上述熔融樹脂中之氣體藉由熔融物之壓力在離開擠出模嘴時突然減低,而使溶解於熔融樹脂中之氣體可自熔融物釋出。自擠出機擠出之擠出物接著以例如導入於水中等之方法冷卻而固化。
上述發泡成形體由於係使上述組成物發泡成形而得者,故係介電率低、呈現安定的電容(capacitance)、且輕量、尤其可獲得作為後述之包覆材之線徑、厚度等之大小穩定之形狀。
發泡成形體中之氣泡總容積可藉由例如調節上述擠出機中之氣體插入量等,或者藉由選擇溶解之氣體種類,依據用途適當調整。
上述發泡成形體可為自上述擠出機擠出時依據用途所成形之成形體之形態。上述成形方法只要是加熱熔融成形即無特別限制,列舉為例如擠出發泡成形、射出發泡成形、模具發泡成形等。
上述發泡成形體之形狀並無特別限制,可為例如發泡電線等之包覆材;線材等之纖絲狀;薄片狀;薄
膜狀;棒狀;管狀等各種形狀。上述發泡成形體可使用作為例如電絕緣材;隔熱材;隔音材;漂浮材等輕量構造材;避震等緩衝材等。且,上述發泡成形體可特別較好地使用作為發泡電線之包覆材。
所得發泡成形體係含有本發明之組成物之熔融固化體及氣泡者,上述氣泡較好係均一分布於熔融固化體中者。上述氣泡之平均泡徑並無限制,但較好為例如60μm以下。又,平均泡徑較好為0.1μm以上。
上述發泡成形體之發泡率並無特別限制但較好為20%以上。發泡率之上限並無特別限制,例如為80%。
本發明之電線的製造方法係包含將上述組成物包覆於芯線上而得電線之步驟者。藉由使用上述組成物,可形成具備具有微細、均一氣泡之包覆材的發泡電線。獲得上述電線之步驟較好係使上述組成物發泡成形者。
藉上述電線的製造方法所得之電線係由自上述組成物所形成之包覆材與芯線而成者。將上述組成物包覆於芯線上所得之電線亦為本發明之一。
上述包覆材由於係將上述組成物包覆於芯線上所得者,故具有微細且均一氣泡。且,介電率低、呈現安定的電容、輕量、且可獲得線徑、厚度等之大小穩定之形狀。
上述電線除了將上述組成物包覆於芯線上以外,可以與過去相同之方法作成,例如可使用擠出發泡成
形而製造。較佳之擠出成形條件可依據所使用之組成物組成或芯線之尺寸適當選擇。
將上述組成物包覆於芯線上之方法列舉為例如於熔融氟樹脂(熔融樹脂)中使用氣體,將本發明之組成物投入於設計供發泡操作用之螺旋擠出機,使用連續氣體射出法之方法等。上述氣體可使用與發泡成形體之製造方法中所用之氣體相同者。
所得包覆材係含有本發明之組成物的熔融固化體及氣泡者,較好係上述氣泡均一分布於熔融固化體中者。
上述氣泡之平均泡徑並無限制,但例如較好為60μm以下,更好為45μm以下,又更好為35μm以下,再更好為30μm以下,最好為25μm以下,又最好為23μm以下。藉由併用上述氮化硼與上述式(1)或(2)所示之磺酸或其鹽,可使氣泡之平均泡徑更容易地成為23μm以下。
此外,平均泡徑較好為0.1μm以上,更好為1μm以上。
該包覆材之構造係如上述,係起因於本發明之組成物中之氮化硼具有上述特定之平均粒子徑而得者。
上述平均泡徑係利用掃描型電子顯微鏡(SEM)拍攝包覆材剖面之影像,藉影像處理算出各泡之直徑,且取其平均而求出之值。
上述包覆材之發泡率較好為20%以上。更好
為30%以上,又更好為33%以上,再更好為35%以上。上限並無特別限制,例如為80%。發泡率之上限亦可為60%。
上述發泡率為((氟樹脂之比重-發泡體之比重)/氟樹脂之比重)×100求出之值。上述發泡率可藉由例如調節上述擠出機中之氣體插入量等,或者藉由選擇溶解之氣體種類,依據用途適當調整。
上述包覆材較好每3500m之火花數未達5個。更好未達3個,又更好為1個以下。上述火花數係利用Beta LaserMike Sparktester HFS1220,在1500V之電壓下測定所得之值。
芯線之材料可使用例如銅、鋁等金屬導體材料。芯線較好為直徑0.02~3mm者。芯線之直徑較好為0.04mm以上,更好為0.05mm以上,最好為0.1mm以上。芯線直徑更好為2mm以下。
上述電線較好為上述包覆材厚度為0.1~3.0mm者。包覆材之厚度亦較好為2.0mm以下。
芯線之具體例亦可使用例如AWG(美國金屬線規格)-46(直徑40微米之中心實心銅製金屬線)、AWG-26(直徑404微米之中心實心銅製金屬線)、AWG-24(直徑510微米之中心實心銅製金屬線)、AWG-22(直徑635微米之中心實心銅製金屬線)等。
上述發泡電線係由芯線及包覆芯線之包覆材所成者。上述發泡電線可使用作為連接電腦及其周邊設備
之纜線類,例如LAN用纜線等。
上述發泡電線亦可為在芯線與包覆材間插入非發泡層之2層構造(皮層-發泡體),或於外層包覆非發泡層之2層構造(發泡體-皮層),以及於皮層-發泡體之外層包覆非發泡層之3層構造(皮層-發泡體-皮層)。
上述電線之非發泡層並無特別限制,亦可為由TFE/HFP系共聚物、TFE/PAVE共聚物、TFE/乙烯系共聚物、偏氟化乙烯系聚合物、聚乙烯[PE]等聚烯烴樹脂、聚氯乙烯[PVC]等樹脂所成之樹脂層。
以下列舉實施例說明本發明,但本發明並非僅限於該實施例。
本說明書中之各種特性係藉以下方法測定。
(氮化硼之平均粒子徑及粒度分布)
將氮化硼之粉體約30mg投入於甲醇約20ml中後,以超音波洗淨機(電力100W)分散2分鐘,使用日機裝(股)製之Microtrack MT3300,以濕式法(透過,粒子折射率1.63)進行測定。平均粒子徑及粒度分布分別測定2次且取其平均。
粒度分布係將氮化硼之粉體集團之總體積作為100%求出累積曲線,由其累積曲線算出D84、D50及D16,且以(D84-D16)/D50表示之值作為粒度分布之指標。
D84、D50及D16表示累積曲線成為84%之點的粒子徑(μm)、成為50%之點的粒子徑(μm)、成為16%之點的粒子徑(μm)。又,粒度分布之累積係由小粒徑側進行。
本粒度分布之測定方法中,D50係作為累積平均徑(中心徑:Median徑)一般被利用作為評價粒度分布之參數之一者。
(熔點)
氟樹脂之熔點係使用RDC220(Seiko電子公司製),以升溫速度10℃/分鐘測定時之波峰所對應之溫度作為熔點。
(MFR)
氟樹脂之MFR係依據ASTM D-1238,使用KAYENESS熔融指數測定機(melt indexer)4000系列(安田精機公司製),以直徑2.1mm、長度8mm之模嘴,以372℃、5kg荷重測定時之值。
(平均泡徑)
拍攝電線剖面之SEM影像,以影像處理算出各泡之直徑,且予以平均求出平均泡徑。
(電容)
使用CAPAC 300 19C(Zumbach公司製)測定電容。
(火花數)
使用Beta LaserMike Sparktester HFS1220,以1500V之電壓測定每3500m之火花數。
(發泡率)
以((氟樹脂之比重-發泡體之比重)/氟樹脂之比重)×100求出。
實施例1~23及比較例1~3
準備平均粒子徑為22μm、19μm、15μm、13.5μm、13μm、8μm之未粉碎之氮化硼(以下亦稱為「BN」)。
且,使用噴射式研磨機粉碎平均粒子徑為19μm或22μm之未粉碎BN,獲得平均粒子徑8.5μm、13.5μm、14.5μm之粉碎BN。
測定該等未粉碎BN及粉碎BN之粒度分布。各實施例及比較例中使用之BN之粒度分布示於表1~4。
該等未粉碎BN或粉碎BN與經氟化處理之下述FEP顆粒係以成為FEP顆粒及BN之合計量之5重量%之方式進行摻合,以與國際公開第03/000792號相同之方法製備顆粒。
以使BN成為下述表1~4所示之含量之方式,藉熔融混練混合該等顆粒與經氟化處理之下述FEP顆粒,
製作顆粒(組成物)。
以與日本特表2011-514407號公報之實施例2所記載之方法相同之方法所得之FEP顆粒(A):TFE/HFP/PAVE共聚物,TFE/HFP/PAVE=87.5/11.5/1.0(重量比),熔點:255℃,熔融流動速率(MFR):23g/10分鐘,不安定末端基與-CF2H末端基合計之數為0個。
以與日本特表2011-514407號公報之實施例8所記載之方法相同之方法所得之FEP顆粒(B):TFE/HFP/PAVE共聚物,TFE/HFP/PAVE=87.7/11.3/1.0(重量比),熔點:255℃,熔融流動速率(MFR):36g/10分鐘,不安定末端基與-CF2H末端基合計之數為0個。
以與日本特表2010-539252號公報之實施例1所記載之方法相同之方法所得之FEP顆粒(C):TFE/HFP/PAVE共聚物,TFE/HFP/PAVE=87.8/11.2/1.0(重量比),熔點:255℃,熔融流動速率(MFR):35g/10分鐘,不安定末端基與-CF2H末端基合計之數為0個。
除了將分子量調節用之甲醇投入量變更為125LBS以外,餘以與日本特表2011-514407號公報之實施例8所記載之方法相同之方法所得之FEP顆粒(D):TFE/HFP/PAVE共聚物,TFE/HFP/PAVE=87.7/11.3/1.0(重量比),熔點:255℃、熔融流動速率(MFR):41g/10分鐘,不安定末端基與-CF2H末端基合計之數為0個。
於設定為表6所示之擠出機溫度之於熔融混練部中導入有氮氣作為發泡劑之發泡成形用擠出機中,供
給以上述方法所得之顆粒(組成物)並進行擠出發泡成形,且藉由包覆於銅線上獲得具有包覆材之電線。實施例10所得之電線之剖面照片示於圖1。
針對所得電線評價各特性之結果示於表1~4。
又,上述發泡成形用擠出機係由聖製作所公司製之擠出機及系統、Micodia公司製之氣體噴射噴嘴、以及Unitec公司製之十字頭(cross head)構成。且,擠出機之構成及條件係如下述表5所示,螺桿上具備使導入之氮均一分散之混練區。
本發明之組成物由於由上述構成所成,故可獲得具有微細且均一氣泡之包覆材,且因此特別適合作為用於形成發泡電線之包覆材之材料。
Claims (14)
- 一種組成物,其特徵為含有氟樹脂與平均粒子徑為10.5μm以上之氮化硼。
- 如請求項1之組成物,其中氮化硼的(D84-D16)/D50所示粒度分布為1.2以下。
- 一種組成物,其特徵為含有氟樹脂與(D84-D16)/D50所示粒度分布為1.2以下之氮化硼。
- 如請求項3之組成物,其中氮化硼之平均粒子徑為5.0μm以上。
- 如請求項1、2、3或4之組成物,其中氮化硼為經粉碎者。
- 如請求項1、2、3、4或5之組成物,其中氟樹脂為四氟乙烯/六氟丙烯系共聚物、四氟乙烯/全氟(烷基乙烯基醚)共聚物或四氟乙烯/乙烯系共聚物。
- 如請求項1、2、3、4、5或6之組成物,其中氟樹脂為經氟化處理之氟樹脂。
- 如請求項1、2、3、4、5、6或7之組成物,其中氮化硼之含有量對於氟樹脂與氮化硼之合計量而言為0.5質量%以上。
- 如請求項1、2、3、4、5、6、7或8之組成物,其中進一步含有磺酸或其鹽。
- 如請求項9之組成物,其中磺酸或其鹽為下述式(1)或下述式(2)所示磺酸或者此等鹽,式(1): F(CF2)nSO3H (1)(式中,n為4或5)式(2):F(CF2)nCH2CH2SO3H (2)(式中,n為4或5)。
- 一種發泡成形體,其特徵為由如請求項1、2、3、4、5、6、7、8、9或10之組成物所得者。
- 一種電線,其特徵為具備芯線、與由包覆前述芯線的如請求項1、2、3、4、5、6、7、8、9或10之組成物所得之包覆材。
- 一種發泡成形體之製造方法,其特徵為含有將如請求項1、2、3、4、5、6、7、8、9或10之組成物進行發泡成形之步驟。
- 一種電線之製造方法,其特徵為含有將如請求項1、2、3、4、5、6、7、8、9或10之組成物包覆芯線而得電線之步驟。
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Publication number | Priority date | Publication date | Assignee | Title |
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EP2949700B1 (en) | 2013-01-24 | 2018-04-18 | Daikin Industries, Ltd. | Composition, and method for producing foam molded material and electric wire |
WO2014115623A1 (ja) | 2013-01-24 | 2014-07-31 | ダイキン工業株式会社 | 組成物、並びに、発泡成形体及び電線の製造方法 |
JP6056041B1 (ja) * | 2015-08-20 | 2017-01-11 | 株式会社潤工社 | ケーブルコア及び伝送ケーブル |
EP3436519B1 (en) * | 2016-03-28 | 2022-12-14 | Dow Global Technologies LLC | Process for foaming polyolefin compositions using a fluororesin/boron nitride mixture as a nucleating agent |
DE102016012001A1 (de) | 2016-10-06 | 2018-04-12 | Karlsruher Institut für Technologie | Hochfluorierte nanostrukturierte Polymerschäume zur Herstellung superabweisender Oberflächen |
CN108376591A (zh) * | 2018-02-14 | 2018-08-07 | 深圳联颖通讯有限公司 | 一种利于制造的高频数据电缆及其制造方法 |
CN114026170A (zh) * | 2019-07-16 | 2022-02-08 | 大金工业株式会社 | 电路基板用树脂组合物、电路基板用成型体、电路基板用层积体和电路基板 |
KR20220113354A (ko) | 2019-12-06 | 2022-08-12 | 에이지씨 가부시키가이샤 | 분산액, 분산액의 제조 방법 및 성형물 |
EP4130146A4 (en) | 2020-03-25 | 2024-04-10 | Daikin Industries, Ltd. | ELECTRICAL WIRE FOR IN-VEHICLE NETWORK CABLE AND IN-VEHICLE NETWORK CABLE |
JP7277843B2 (ja) * | 2021-02-26 | 2023-05-19 | ダイキン工業株式会社 | 含フッ素共重合体 |
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Family Cites Families (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL258835A (zh) | 1959-12-18 | |||
JPS5911340A (ja) | 1982-07-12 | 1984-01-20 | Sumitomo Electric Ind Ltd | ふつ素樹脂発泡体の製造方法 |
US4716073A (en) | 1986-06-02 | 1987-12-29 | E. I. Du Pont De Nemours And Company | Thin wall high performance insulation on wire |
US4711811A (en) | 1986-10-22 | 1987-12-08 | E. I. Du Pont De Nemours And Company | Thin wall cover on foamed insulation on wire |
US4764538A (en) | 1987-12-16 | 1988-08-16 | E. I. Du Pont De Nemours And Company | Foam nucleation system for fluoropolymers |
EP0383340B1 (en) | 1989-02-17 | 1998-09-09 | E.I. Du Pont De Nemours And Company | Nucleating agents for thermoplastic resins |
US4877815A (en) | 1989-02-17 | 1989-10-31 | E. I. Du Pont De Nemours And Company | Nucleating agents for thermoplastic resins |
US5032621A (en) | 1989-02-17 | 1991-07-16 | E. I. Du Pont De Nemours And Company | Nucleating agents for thermoplastic resins |
US5180754A (en) | 1990-06-14 | 1993-01-19 | Mitsubishi Cable Industries, Ltd. | Polymer composition for foam molding |
JPH0689166A (ja) | 1992-09-08 | 1994-03-29 | Kobe Nippon Denki Software Kk | 部品処理記述展開方式 |
JPH07121999A (ja) | 1993-09-06 | 1995-05-12 | Sony Corp | 信号符号化装置、信号復号化装置、信号符号化方法および信号復号化方法 |
IT1271409B (it) * | 1993-09-13 | 1997-05-28 | Dow Corning | Composizioni utilizzabili come grassi a base di oli di polimeri fluorurati e nitruro di boro esagonale |
JP3508116B2 (ja) | 1994-06-30 | 2004-03-22 | ダイキン工業株式会社 | 樹脂発泡体用組成物及び樹脂発泡体、並びにこれらの製造方法 |
US5610203A (en) * | 1996-04-10 | 1997-03-11 | E. I. Du Pont De Nemours And Company | Foamable fluoropolymer composition |
US5712318A (en) | 1996-04-10 | 1998-01-27 | E. I. Du Pont De Nemours And Company | Two-part nucleating agent system |
US5688457A (en) * | 1996-04-10 | 1997-11-18 | E. I. Du Pont De Nemours And Company | High speed extrusion |
US5821273A (en) | 1996-05-22 | 1998-10-13 | E. I. Du Pont De Nemours And Company | Extrusion foaming of fluoropolymers |
US5726214A (en) | 1996-12-26 | 1998-03-10 | E. I. Du Pont De Nemours And Company | Self-foaming fluoropolymer composition |
JP2000344927A (ja) | 1999-06-03 | 2000-12-12 | Reiko Udagawa | 高発泡絶縁電線 |
US6395795B1 (en) | 2000-09-29 | 2002-05-28 | Ausimont Usa, Inc. | Titanium dioxide nucleating agent systems for foamable polymer compositions |
US7241826B2 (en) | 2001-06-26 | 2007-07-10 | Daikin Industries, Ltd. | Resin composition, process for production thereof, and foam-insulated electric wire |
JP2004155946A (ja) | 2002-11-07 | 2004-06-03 | Mitsubishi Rayon Co Ltd | 熱可塑性樹脂用改質剤及びこれを用いた熱可塑性樹脂組成物ならびに製品 |
US7122609B2 (en) | 2003-05-14 | 2006-10-17 | E. I. Du Pont De Nemours And Company | High melt flow fluoropolymer |
US7126056B2 (en) | 2003-05-14 | 2006-10-24 | E. I. Du Pont De Nemours And Company | High melt flow fluoropolymer |
CN101163739B (zh) | 2005-05-18 | 2010-12-29 | 大金工业株式会社 | 氟树脂组合物和电线 |
US20080161435A1 (en) | 2006-12-21 | 2008-07-03 | E. I. Du Pont De Nemours And Company | Extrusion of a Foamable Fluoropolymer |
US20080149899A1 (en) | 2006-12-21 | 2008-06-26 | E. I. Du Pont De Nemours And Company | Foamable Fluoropolymer Composition |
US20080153936A1 (en) | 2006-12-21 | 2008-06-26 | E. I. Du Pont De Nemours And Company | Foamed Fluoropolymer Article |
WO2009044753A1 (en) | 2007-10-03 | 2009-04-09 | Daikin Industries, Ltd. | Fluororesin composition and covered electric wire |
US9012580B2 (en) | 2008-02-15 | 2015-04-21 | Daikin Industries, Ltd. | Tetrafluoroethylene/hexafluoropropylene copolymer and the production method thereof, and electrical wire |
US8178592B2 (en) | 2009-05-15 | 2012-05-15 | E.I. Du Pont De Nemours And Company | Foamable fluoropolymer composition |
WO2011065016A1 (ja) | 2009-11-26 | 2011-06-03 | 日東電工株式会社 | Led実装用基板 |
EP2949700B1 (en) | 2013-01-24 | 2018-04-18 | Daikin Industries, Ltd. | Composition, and method for producing foam molded material and electric wire |
WO2014115623A1 (ja) | 2013-01-24 | 2014-07-31 | ダイキン工業株式会社 | 組成物、並びに、発泡成形体及び電線の製造方法 |
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