TW201431135A - 紫外線發光裝置 - Google Patents

紫外線發光裝置 Download PDF

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Publication number
TW201431135A
TW201431135A TW102139612A TW102139612A TW201431135A TW 201431135 A TW201431135 A TW 201431135A TW 102139612 A TW102139612 A TW 102139612A TW 102139612 A TW102139612 A TW 102139612A TW 201431135 A TW201431135 A TW 201431135A
Authority
TW
Taiwan
Prior art keywords
ultraviolet
light
emitting device
ultraviolet led
mounting substrate
Prior art date
Application number
TW102139612A
Other languages
English (en)
Chinese (zh)
Inventor
Hiroshi Fukshima
Shintaro Hayashi
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Publication of TW201431135A publication Critical patent/TW201431135A/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
TW102139612A 2013-01-29 2013-10-31 紫外線發光裝置 TW201431135A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013014311A JP2014146689A (ja) 2013-01-29 2013-01-29 紫外線発光装置

Publications (1)

Publication Number Publication Date
TW201431135A true TW201431135A (zh) 2014-08-01

Family

ID=51261586

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102139612A TW201431135A (zh) 2013-01-29 2013-10-31 紫外線發光裝置

Country Status (3)

Country Link
JP (1) JP2014146689A (ja)
TW (1) TW201431135A (ja)
WO (1) WO2014118835A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI587459B (zh) * 2014-09-16 2017-06-11 Toshiba Kk Semiconductor device

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6643755B2 (ja) * 2015-04-17 2020-02-12 国立研究開発法人情報通信研究機構 深紫外発光モジュール
JP2016213213A (ja) * 2015-04-28 2016-12-15 日機装株式会社 発光モジュール
JP2017073489A (ja) * 2015-10-08 2017-04-13 エヌイーシー ショット コンポーネンツ株式会社 メタル−ガラスリッドおよびそれを利用したｄｕｖ−ｌｅｄ装置
JP2017130588A (ja) * 2016-01-21 2017-07-27 旭化成株式会社 紫外線発光装置
KR20180020829A (ko) * 2016-08-19 2018-02-28 서울바이오시스 주식회사 자외선 발광 다이오드 패키지
US10330304B2 (en) 2016-09-16 2019-06-25 Heraeus Noblelight America Llc Heatsink including thick film layer for UV LED arrays, and methods of forming UV LED arrays
KR20190085950A (ko) 2016-11-22 2019-07-19 코쿠리츠켄큐카이하츠호진 죠호츠신켄큐키코 심자외광을 방사하는 반도체 발광 소자를 구비하는 발광 모듈
JP2019102631A (ja) * 2017-12-01 2019-06-24 スタンレー電気株式会社 半導体発光装置及び半導体発光装置の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005159262A (ja) * 2003-10-30 2005-06-16 Kyocera Corp 発光素子収納用パッケージおよび発光装置ならびに照明装置
JP2005203481A (ja) * 2004-01-14 2005-07-28 Nitto Kogaku Kk 紫外線照射装置
JP2006278889A (ja) * 2005-03-30 2006-10-12 Sharp Corp 半導体ランプおよび電子機器
JP2007042938A (ja) * 2005-08-04 2007-02-15 Nichia Chem Ind Ltd 光学装置
JP5243806B2 (ja) * 2008-01-28 2013-07-24 パナソニック株式会社 紫外光発光装置
JP5270991B2 (ja) * 2008-07-23 2013-08-21 パナソニック株式会社 発光装置および照明器具
JP2010062305A (ja) * 2008-09-03 2010-03-18 Hitachi Displays Ltd 照明装置、及び液晶表示装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI587459B (zh) * 2014-09-16 2017-06-11 Toshiba Kk Semiconductor device

Also Published As

Publication number Publication date
WO2014118835A1 (ja) 2014-08-07
JP2014146689A (ja) 2014-08-14

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