TW201420216A - 基板清洗裝置及基板清洗單元 - Google Patents

基板清洗裝置及基板清洗單元 Download PDF

Info

Publication number
TW201420216A
TW201420216A TW102128002A TW102128002A TW201420216A TW 201420216 A TW201420216 A TW 201420216A TW 102128002 A TW102128002 A TW 102128002A TW 102128002 A TW102128002 A TW 102128002A TW 201420216 A TW201420216 A TW 201420216A
Authority
TW
Taiwan
Prior art keywords
cleaning
substrate
base member
cleaning body
load detecting
Prior art date
Application number
TW102128002A
Other languages
English (en)
Chinese (zh)
Other versions
TWI559991B (enExample
Inventor
森公平
田中弘一
Original Assignee
東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京威力科創股份有限公司 filed Critical 東京威力科創股份有限公司
Publication of TW201420216A publication Critical patent/TW201420216A/zh
Application granted granted Critical
Publication of TWI559991B publication Critical patent/TWI559991B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/12—Brushes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
TW102128002A 2012-08-07 2013-08-05 基板清洗裝置及基板清洗單元 TW201420216A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012175266A JP5937456B2 (ja) 2012-08-07 2012-08-07 基板洗浄装置および基板洗浄ユニット

Publications (2)

Publication Number Publication Date
TW201420216A true TW201420216A (zh) 2014-06-01
TWI559991B TWI559991B (enExample) 2016-12-01

Family

ID=50065256

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102128002A TW201420216A (zh) 2012-08-07 2013-08-05 基板清洗裝置及基板清洗單元

Country Status (4)

Country Link
US (1) US9579695B2 (enExample)
JP (1) JP5937456B2 (enExample)
KR (1) KR101761444B1 (enExample)
TW (1) TW201420216A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016131186A (ja) * 2015-01-13 2016-07-21 株式会社ディスコ スピンナ洗浄装置
JP6941464B2 (ja) * 2017-04-07 2021-09-29 株式会社荏原製作所 基板洗浄装置及び基板処理装置
JP6758247B2 (ja) * 2017-05-10 2020-09-23 株式会社荏原製作所 洗浄装置および基板処理装置、洗浄装置のメンテナンス方法、並びにプログラム
CN107340128A (zh) * 2017-08-23 2017-11-10 长治清华机械厂 清洗刷头试验装置
CN109950170B (zh) * 2017-12-20 2023-04-04 弘塑科技股份有限公司 晶圆清洗设备及控制晶圆清洗设备的毛刷组的方法
KR102788872B1 (ko) 2020-05-21 2025-03-31 삼성전자주식회사 틸팅 가능한 롤 브러쉬를 갖는 기판 세정 장치

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3328426B2 (ja) * 1994-05-12 2002-09-24 東京エレクトロン株式会社 洗浄装置
JP3539787B2 (ja) 1995-03-09 2004-07-07 大日本スクリーン製造株式会社 回転式基板洗浄装置
KR0175278B1 (ko) * 1996-02-13 1999-04-01 김광호 웨이퍼 세정장치
JPH09326378A (ja) * 1996-06-05 1997-12-16 Sony Corp 基板洗浄装置および基板洗浄方法
DE19914347C2 (de) * 1998-03-30 2003-11-06 Tokyo Electron Ltd Waschvorrichtung und Waschverfahren
JP3953716B2 (ja) * 2000-08-01 2007-08-08 株式会社荏原製作所 基板洗浄装置
JP4994074B2 (ja) * 2006-04-20 2012-08-08 東京エレクトロン株式会社 基板洗浄装置，基板洗浄方法，基板処理装置
JP4829710B2 (ja) * 2006-07-26 2011-12-07 芝浦メカトロニクス株式会社 基板の処理装置
JP5413016B2 (ja) * 2008-07-31 2014-02-12 東京エレクトロン株式会社 基板の洗浄方法、基板の洗浄装置及び記憶媒体
EP2397824B1 (en) * 2009-02-10 2019-10-09 Shimadzu Corporation Sensor mechanism body and electronic balance using the same
JP5583503B2 (ja) * 2010-07-14 2014-09-03 東京エレクトロン株式会社 基板洗浄装置、およびこれを備える塗布現像装置

Also Published As

Publication number Publication date
US20140041696A1 (en) 2014-02-13
JP5937456B2 (ja) 2016-06-22
JP2014036055A (ja) 2014-02-24
TWI559991B (enExample) 2016-12-01
KR101761444B1 (ko) 2017-07-25
US9579695B2 (en) 2017-02-28
KR20140019755A (ko) 2014-02-17

Similar Documents

Publication Publication Date Title
TW201420216A (zh) 基板清洗裝置及基板清洗單元
US5636401A (en) Cleaning apparatus and cleaning method
US11380561B2 (en) Cleaning device, substrate processing apparatus, maintenance method of cleaning device, and computer-readable recording medium including maintenance program of cleaning device
CN106714987B (zh) 清洗半导体硅片的装置和方法
KR102238958B1 (ko) 하중 측정 장치 및 하중 측정 방법
JP2015220402A (ja) 基板洗浄装置および基板洗浄装置で実行される方法
JP2014223684A (ja) 研磨装置および研磨方法
JP2010040943A (ja) 基板洗浄装置及び基板洗浄方法
JP2002050602A (ja) 基板洗浄装置
JP2018181978A (ja) 基板洗浄装置及び基板処理装置
CN112735940A (zh) 一种可动态调整的晶圆清洗方法
US12002688B2 (en) Substrate cleaning device and substrate cleaning method
CN113964068A (zh) 一种动态调整刷洗摩擦力的晶圆清洗装置
JP6945318B2 (ja) 基板洗浄方法、基板洗浄装置およびプログラム記録媒体
TW201817505A (zh) 基板處理方法、基板處理裝置及記錄媒體
JP2012009692A (ja) ドレス方法、研磨方法および研磨装置
CN115621166A (zh) 刷洗装置、刷洗方法及半导体工艺设备
JPH10189512A (ja) 基板洗浄装置
JP2008006536A (ja) ウェーハの研削方法
JP2005169593A (ja) 研磨装置、研磨方法、この研磨方法を用いた半導体デバイスの製造方法及びこの半導体デバイスの製造方法により製造された半導体デバイス
CN213716850U (zh) 一种可动态调整的晶圆清洗装置
JP2025169032A (ja) 基板処理装置、及び基板処理方法
JP2024045835A (ja) ウェーハ洗浄装置
CN112582307A (zh) 可动态调整姿态的晶圆清洗方法