KR101761444B1 - 기판 세정 장치 및 기판 세정 유닛 - Google Patents

기판 세정 장치 및 기판 세정 유닛 Download PDF

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Publication number
KR101761444B1
KR101761444B1 KR1020130093103A KR20130093103A KR101761444B1 KR 101761444 B1 KR101761444 B1 KR 101761444B1 KR 1020130093103 A KR1020130093103 A KR 1020130093103A KR 20130093103 A KR20130093103 A KR 20130093103A KR 101761444 B1 KR101761444 B1 KR 101761444B1
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KR
South Korea
Prior art keywords
cleaning
base member
substrate
unit
load
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KR1020130093103A
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English (en)
Korean (ko)
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KR20140019755A (ko
Inventor
고헤이 모리
히로카즈 다나카
Original Assignee
도쿄엘렉트론가부시키가이샤
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Publication of KR20140019755A publication Critical patent/KR20140019755A/ko
Application granted granted Critical
Publication of KR101761444B1 publication Critical patent/KR101761444B1/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/12—Brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020130093103A 2012-08-07 2013-08-06 기판 세정 장치 및 기판 세정 유닛 Active KR101761444B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012175266A JP5937456B2 (ja) 2012-08-07 2012-08-07 基板洗浄装置および基板洗浄ユニット
JPJP-P-2012-175266 2012-08-07

Publications (2)

Publication Number Publication Date
KR20140019755A KR20140019755A (ko) 2014-02-17
KR101761444B1 true KR101761444B1 (ko) 2017-07-25

Family

ID=50065256

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130093103A Active KR101761444B1 (ko) 2012-08-07 2013-08-06 기판 세정 장치 및 기판 세정 유닛

Country Status (4)

Country Link
US (1) US9579695B2 (enExample)
JP (1) JP5937456B2 (enExample)
KR (1) KR101761444B1 (enExample)
TW (1) TW201420216A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016131186A (ja) * 2015-01-13 2016-07-21 株式会社ディスコ スピンナ洗浄装置
JP6941464B2 (ja) * 2017-04-07 2021-09-29 株式会社荏原製作所 基板洗浄装置及び基板処理装置
JP6758247B2 (ja) * 2017-05-10 2020-09-23 株式会社荏原製作所 洗浄装置および基板処理装置、洗浄装置のメンテナンス方法、並びにプログラム
CN107340128A (zh) * 2017-08-23 2017-11-10 长治清华机械厂 清洗刷头试验装置
CN109950170B (zh) * 2017-12-20 2023-04-04 弘塑科技股份有限公司 晶圆清洗设备及控制晶圆清洗设备的毛刷组的方法
KR102788872B1 (ko) 2020-05-21 2025-03-31 삼성전자주식회사 틸팅 가능한 롤 브러쉬를 갖는 기판 세정 장치

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002050602A (ja) * 2000-08-01 2002-02-15 Ebara Corp 基板洗浄装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3328426B2 (ja) * 1994-05-12 2002-09-24 東京エレクトロン株式会社 洗浄装置
JP3539787B2 (ja) 1995-03-09 2004-07-07 大日本スクリーン製造株式会社 回転式基板洗浄装置
KR0175278B1 (ko) * 1996-02-13 1999-04-01 김광호 웨이퍼 세정장치
JPH09326378A (ja) * 1996-06-05 1997-12-16 Sony Corp 基板洗浄装置および基板洗浄方法
KR100619383B1 (ko) * 1998-03-30 2006-09-06 동경 엘렉트론 주식회사 스크러브 세정장치 및 스크러브 세정방법
JP4994074B2 (ja) * 2006-04-20 2012-08-08 東京エレクトロン株式会社 基板洗浄装置，基板洗浄方法，基板処理装置
JP4829710B2 (ja) * 2006-07-26 2011-12-07 芝浦メカトロニクス株式会社 基板の処理装置
JP5413016B2 (ja) * 2008-07-31 2014-02-12 東京エレクトロン株式会社 基板の洗浄方法、基板の洗浄装置及び記憶媒体
EP2397824B1 (en) * 2009-02-10 2019-10-09 Shimadzu Corporation Sensor mechanism body and electronic balance using the same
JP5583503B2 (ja) * 2010-07-14 2014-09-03 東京エレクトロン株式会社 基板洗浄装置、およびこれを備える塗布現像装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002050602A (ja) * 2000-08-01 2002-02-15 Ebara Corp 基板洗浄装置

Also Published As

Publication number Publication date
KR20140019755A (ko) 2014-02-17
TW201420216A (zh) 2014-06-01
US9579695B2 (en) 2017-02-28
US20140041696A1 (en) 2014-02-13
JP5937456B2 (ja) 2016-06-22
TWI559991B (enExample) 2016-12-01
JP2014036055A (ja) 2014-02-24

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