TWI559991B - - Google Patents
Info
- Publication number
- TWI559991B TWI559991B TW102128002A TW102128002A TWI559991B TW I559991 B TWI559991 B TW I559991B TW 102128002 A TW102128002 A TW 102128002A TW 102128002 A TW102128002 A TW 102128002A TW I559991 B TWI559991 B TW I559991B
- Authority
- TW
- Taiwan
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/12—Brushes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012175266A JP5937456B2 (ja) | 2012-08-07 | 2012-08-07 | 基板洗浄装置および基板洗浄ユニット |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201420216A TW201420216A (zh) | 2014-06-01 |
| TWI559991B true TWI559991B (enExample) | 2016-12-01 |
Family
ID=50065256
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102128002A TW201420216A (zh) | 2012-08-07 | 2013-08-05 | 基板清洗裝置及基板清洗單元 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9579695B2 (enExample) |
| JP (1) | JP5937456B2 (enExample) |
| KR (1) | KR101761444B1 (enExample) |
| TW (1) | TW201420216A (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016131186A (ja) * | 2015-01-13 | 2016-07-21 | 株式会社ディスコ | スピンナ洗浄装置 |
| JP6941464B2 (ja) * | 2017-04-07 | 2021-09-29 | 株式会社荏原製作所 | 基板洗浄装置及び基板処理装置 |
| JP6758247B2 (ja) * | 2017-05-10 | 2020-09-23 | 株式会社荏原製作所 | 洗浄装置および基板処理装置、洗浄装置のメンテナンス方法、並びにプログラム |
| CN107340128A (zh) * | 2017-08-23 | 2017-11-10 | 长治清华机械厂 | 清洗刷头试验装置 |
| CN109950170B (zh) * | 2017-12-20 | 2023-04-04 | 弘塑科技股份有限公司 | 晶圆清洗设备及控制晶圆清洗设备的毛刷组的方法 |
| KR102788872B1 (ko) | 2020-05-21 | 2025-03-31 | 삼성전자주식회사 | 틸팅 가능한 롤 브러쉬를 갖는 기판 세정 장치 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09326378A (ja) * | 1996-06-05 | 1997-12-16 | Sony Corp | 基板洗浄装置および基板洗浄方法 |
| US5729856A (en) * | 1996-02-13 | 1998-03-24 | Samsung Electronics Co. Ltd. | Semiconductor wafer cleaning apparatus |
| JP2002050602A (ja) * | 2000-08-01 | 2002-02-15 | Ebara Corp | 基板洗浄装置 |
| TW200814222A (en) * | 2006-07-26 | 2008-03-16 | Shibaura Mechatronics Corp | Apparatus for processing substrate |
| CN101313389A (zh) * | 2006-04-20 | 2008-11-26 | 东京毅力科创株式会社 | 基板清洗装置、基板清洗方法、基板处理装置 |
| CN102099900A (zh) * | 2008-07-31 | 2011-06-15 | 东京毅力科创株式会社 | 基板清洗方法、基板清洗装置和存储介质 |
| TW201214537A (en) * | 2010-07-14 | 2012-04-01 | Tokyo Electron Ltd | Substrate cleaning apparatus, coating and developing apparatus having the same and substrate cleaning method |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3328426B2 (ja) * | 1994-05-12 | 2002-09-24 | 東京エレクトロン株式会社 | 洗浄装置 |
| JP3539787B2 (ja) | 1995-03-09 | 2004-07-07 | 大日本スクリーン製造株式会社 | 回転式基板洗浄装置 |
| DE19914347C2 (de) * | 1998-03-30 | 2003-11-06 | Tokyo Electron Ltd | Waschvorrichtung und Waschverfahren |
| EP2397824B1 (en) * | 2009-02-10 | 2019-10-09 | Shimadzu Corporation | Sensor mechanism body and electronic balance using the same |
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2012
- 2012-08-07 JP JP2012175266A patent/JP5937456B2/ja active Active
-
2013
- 2013-08-01 US US13/956,943 patent/US9579695B2/en active Active
- 2013-08-05 TW TW102128002A patent/TW201420216A/zh unknown
- 2013-08-06 KR KR1020130093103A patent/KR101761444B1/ko active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5729856A (en) * | 1996-02-13 | 1998-03-24 | Samsung Electronics Co. Ltd. | Semiconductor wafer cleaning apparatus |
| JPH09326378A (ja) * | 1996-06-05 | 1997-12-16 | Sony Corp | 基板洗浄装置および基板洗浄方法 |
| JP2002050602A (ja) * | 2000-08-01 | 2002-02-15 | Ebara Corp | 基板洗浄装置 |
| CN101313389A (zh) * | 2006-04-20 | 2008-11-26 | 东京毅力科创株式会社 | 基板清洗装置、基板清洗方法、基板处理装置 |
| TW200814222A (en) * | 2006-07-26 | 2008-03-16 | Shibaura Mechatronics Corp | Apparatus for processing substrate |
| CN102099900A (zh) * | 2008-07-31 | 2011-06-15 | 东京毅力科创株式会社 | 基板清洗方法、基板清洗装置和存储介质 |
| TW201214537A (en) * | 2010-07-14 | 2012-04-01 | Tokyo Electron Ltd | Substrate cleaning apparatus, coating and developing apparatus having the same and substrate cleaning method |
Also Published As
| Publication number | Publication date |
|---|---|
| US20140041696A1 (en) | 2014-02-13 |
| JP5937456B2 (ja) | 2016-06-22 |
| TW201420216A (zh) | 2014-06-01 |
| JP2014036055A (ja) | 2014-02-24 |
| KR101761444B1 (ko) | 2017-07-25 |
| US9579695B2 (en) | 2017-02-28 |
| KR20140019755A (ko) | 2014-02-17 |