TW201404901A - 有機層沉積設備、使用其製造有機發光顯示裝置之方法、以及以此方法製造之有機發光顯示裝置 - Google Patents

有機層沉積設備、使用其製造有機發光顯示裝置之方法、以及以此方法製造之有機發光顯示裝置 Download PDF

Info

Publication number
TW201404901A
TW201404901A TW102114045A TW102114045A TW201404901A TW 201404901 A TW201404901 A TW 201404901A TW 102114045 A TW102114045 A TW 102114045A TW 102114045 A TW102114045 A TW 102114045A TW 201404901 A TW201404901 A TW 201404901A
Authority
TW
Taiwan
Prior art keywords
deposition
organic layer
deposition source
unit
substrate
Prior art date
Application number
TW102114045A
Other languages
English (en)
Chinese (zh)
Inventor
崔永默
Original Assignee
三星顯示器有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三星顯示器有限公司 filed Critical 三星顯示器有限公司
Publication of TW201404901A publication Critical patent/TW201404901A/zh

Links

Classifications

    • H10P72/0456—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10P72/3204—
    • H10P72/3314—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
TW102114045A 2012-07-16 2013-04-19 有機層沉積設備、使用其製造有機發光顯示裝置之方法、以及以此方法製造之有機發光顯示裝置 TW201404901A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120077361A KR20140010303A (ko) 2012-07-16 2012-07-16 유기층 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 및 이에 따라 제조된 유기 발광 디스플레이 장치

Publications (1)

Publication Number Publication Date
TW201404901A true TW201404901A (zh) 2014-02-01

Family

ID=48613510

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102114045A TW201404901A (zh) 2012-07-16 2013-04-19 有機層沉積設備、使用其製造有機發光顯示裝置之方法、以及以此方法製造之有機發光顯示裝置

Country Status (6)

Country Link
US (1) US20140014921A1 (enExample)
EP (1) EP2688121A3 (enExample)
JP (1) JP2014019954A (enExample)
KR (1) KR20140010303A (enExample)
CN (1) CN103540896A (enExample)
TW (1) TW201404901A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI586019B (zh) * 2015-01-14 2017-06-01 史那精密股份有限公司 有機發光元件製造用群集型沉積裝置
US11732345B2 (en) 2020-06-04 2023-08-22 Applied Materials, Inc. Vapor deposition apparatus and method for coating a substrate in a vacuum chamber

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5328726B2 (ja) 2009-08-25 2013-10-30 三星ディスプレイ株式會社 薄膜蒸着装置及びこれを利用した有機発光ディスプレイ装置の製造方法
JP5677785B2 (ja) 2009-08-27 2015-02-25 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． 薄膜蒸着装置及びこれを利用した有機発光表示装置の製造方法
US8876975B2 (en) * 2009-10-19 2014-11-04 Samsung Display Co., Ltd. Thin film deposition apparatus
KR101084184B1 (ko) 2010-01-11 2011-11-17 삼성모바일디스플레이주식회사 박막 증착 장치
KR101193186B1 (ko) 2010-02-01 2012-10-19 삼성디스플레이 주식회사 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
KR101156441B1 (ko) 2010-03-11 2012-06-18 삼성모바일디스플레이주식회사 박막 증착 장치
US8894458B2 (en) 2010-04-28 2014-11-25 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
KR101223723B1 (ko) 2010-07-07 2013-01-18 삼성디스플레이 주식회사 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
KR101723506B1 (ko) 2010-10-22 2017-04-19 삼성디스플레이 주식회사 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
KR101738531B1 (ko) 2010-10-22 2017-05-23 삼성디스플레이 주식회사 유기 발광 디스플레이 장치의 제조 방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
KR20120045865A (ko) 2010-11-01 2012-05-09 삼성모바일디스플레이주식회사 유기층 증착 장치
KR20120065789A (ko) 2010-12-13 2012-06-21 삼성모바일디스플레이주식회사 유기층 증착 장치
KR101760897B1 (ko) 2011-01-12 2017-07-25 삼성디스플레이 주식회사 증착원 및 이를 구비하는 유기막 증착 장치
KR101840654B1 (ko) 2011-05-25 2018-03-22 삼성디스플레이 주식회사 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
KR101852517B1 (ko) 2011-05-25 2018-04-27 삼성디스플레이 주식회사 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
KR101857249B1 (ko) 2011-05-27 2018-05-14 삼성디스플레이 주식회사 패터닝 슬릿 시트 어셈블리, 유기막 증착 장치, 유기 발광 표시장치제조 방법 및 유기 발광 표시 장치
KR101826068B1 (ko) 2011-07-04 2018-02-07 삼성디스플레이 주식회사 유기층 증착 장치
KR101959975B1 (ko) * 2012-07-10 2019-07-16 삼성디스플레이 주식회사 유기층 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
CN103545460B (zh) * 2012-07-10 2017-04-12 三星显示有限公司 有机发光显示装置、有机发光显示设备及其制造方法
KR101938365B1 (ko) * 2012-07-31 2019-04-12 삼성디스플레이 주식회사 증착 장치 및 이를 이용한 증착량 측정 방법
KR102096049B1 (ko) * 2013-05-03 2020-04-02 삼성디스플레이 주식회사 증착장치, 이를 이용한 유기발광 디스플레이 장치 제조 방법 및 유기발광 디스플레이 장치
KR102369314B1 (ko) * 2015-06-16 2022-03-04 삼성디스플레이 주식회사 증착 장치
KR102376728B1 (ko) * 2015-07-07 2022-03-21 삼성디스플레이 주식회사 증착원, 이를 포함하는 증착 장치 및 증착 장치를 이용한 표시 장치의 제조 방법
KR102391346B1 (ko) 2015-08-04 2022-04-28 삼성디스플레이 주식회사 유기 발광 표시 장치, 유기층 증착 장치 및 이를 이용한 유기 발광 표시 장치의 제조방법
KR20170049716A (ko) * 2015-10-27 2017-05-11 삼성디스플레이 주식회사 유기 발광 표시 장치, 유기층 증착 장치 및 이를 이용한 유기 발광 표시 장치의 제조방법
CN105483633B (zh) * 2016-02-01 2017-12-08 京东方科技集团股份有限公司 一种磁控溅射装置
KR102152890B1 (ko) * 2016-05-18 2020-10-26 어플라이드 머티어리얼스, 인코포레이티드 증착 소스의 운송을 위한 장치 및 방법
EP3366804B1 (en) * 2017-02-22 2022-05-11 Satisloh AG Box coating apparatus for vacuum coating of substrates, in particular spectacle lenses
JP6620228B2 (ja) * 2017-03-17 2019-12-11 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 真空処理システムを動作させる方法
US10540339B2 (en) * 2017-05-19 2020-01-21 Microsoft Technology Licensing, Llc Matching a resource with a user for a predicted user need
JP2019534938A (ja) * 2017-09-26 2019-12-05 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 材料堆積装置、真空堆積システム、及び真空堆積を行う方法
WO2019064426A1 (ja) * 2017-09-28 2019-04-04 シャープ株式会社 蒸着源および蒸着装置並びに蒸着膜製造方法
KR102020768B1 (ko) * 2017-12-29 2019-09-11 주식회사 에스에프에이 기판 증착장치
KR102020767B1 (ko) * 2017-12-29 2019-09-11 주식회사 에스에프에이 기판 증착장치
WO2019187162A1 (ja) * 2018-03-30 2019-10-03 シャープ株式会社 表示デバイスの製造方法および蒸着装置
KR20200002242A (ko) * 2018-06-29 2020-01-08 캐논 톡키 가부시키가이샤 성막 장치, 유기 디바이스의 제조 장치, 및 유기 디바이스의 제조 방법
KR102641512B1 (ko) 2018-07-20 2024-02-28 삼성디스플레이 주식회사 표시 장치의 제조장치 및 표시 장치의 제조방법
JP6586216B1 (ja) * 2018-11-22 2019-10-02 長州産業株式会社 蒸着装置及び蒸着方法
KR102179271B1 (ko) * 2019-01-11 2020-11-16 캐논 톡키 가부시키가이샤 성막장치, 전자 디바이스 제조장치, 성막방법, 및 전자 디바이스 제조방법
KR102257008B1 (ko) * 2019-01-11 2021-05-26 캐논 톡키 가부시키가이샤 성막 장치, 성막 방법 및 전자 디바이스 제조방법
KR102700940B1 (ko) * 2019-02-19 2024-09-02 삼성디스플레이 주식회사 표시 장치의 제조장치 및 표시 장치의 제조방법
KR102282068B1 (ko) * 2019-12-26 2021-07-27 주식회사 에스에프에이 기판 증착장치
EP4094306A4 (en) 2020-01-22 2024-02-28 Applied Materials, Inc. INLINE MONITORING OF OLED LAYER THICKNESS AND DOPANT CONCENTRATION
US11889740B2 (en) * 2020-01-22 2024-01-30 Applied Materials, Inc. In-line monitoring of OLED layer thickness and dopant concentration
JP7509810B2 (ja) 2022-02-24 2024-07-02 キヤノントッキ株式会社 成膜装置
KR102765571B1 (ko) * 2024-06-14 2025-02-11 (주)펀솔루션테크놀러지 오픈 에어리어를 조절하는 기판 증착장치
KR102765576B1 (ko) * 2024-06-14 2025-02-11 (주)펀솔루션테크놀러지 듀얼 리니어 소스를 구비한 증착장치 및 이를 이용한 기판 증착방법

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3747558A (en) * 1972-11-03 1973-07-24 Us Air Force Cross-mounted mask changer with thickness monitoring
JP2002146516A (ja) * 2000-11-07 2002-05-22 Sony Corp 有機薄膜の蒸着方法
US20030010288A1 (en) * 2001-02-08 2003-01-16 Shunpei Yamazaki Film formation apparatus and film formation method
JP4315420B2 (ja) * 2003-04-18 2009-08-19 キヤノン株式会社 露光装置及び露光方法
JP2005126821A (ja) * 2003-09-30 2005-05-19 Fuji Photo Film Co Ltd 真空蒸着装置および真空蒸着の前処理方法
JP2006016660A (ja) * 2004-07-01 2006-01-19 Showa Shinku:Kk 有機薄膜形成装置および方法
EP1717339A2 (de) * 2005-04-20 2006-11-02 Applied Films GmbH & Co. KG Kontinuierliche Beschichtungsanlage
WO2007099929A1 (ja) * 2006-02-28 2007-09-07 Ulvac, Inc. 有機薄膜蒸着方法及び有機薄膜蒸着装置
KR101097311B1 (ko) * 2009-06-24 2011-12-21 삼성모바일디스플레이주식회사 유기 발광 디스플레이 장치 및 이를 제조하기 위한 유기막 증착 장치
JP5677785B2 (ja) * 2009-08-27 2015-02-25 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． 薄膜蒸着装置及びこれを利用した有機発光表示装置の製造方法
CN102482760B (zh) * 2009-09-15 2014-07-02 夏普株式会社 蒸镀方法和蒸镀装置
US8609442B2 (en) * 2010-10-29 2013-12-17 Sharp Kabushiki Kaisha Vapor deposition method, vapor deposition device and organic EL display device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI586019B (zh) * 2015-01-14 2017-06-01 史那精密股份有限公司 有機發光元件製造用群集型沉積裝置
US11732345B2 (en) 2020-06-04 2023-08-22 Applied Materials, Inc. Vapor deposition apparatus and method for coating a substrate in a vacuum chamber
TWI821677B (zh) * 2020-06-04 2023-11-11 美商應用材料股份有限公司 氣相沉積設備及在真空腔室中塗覆基板的方法

Also Published As

Publication number Publication date
EP2688121A3 (en) 2016-02-17
US20140014921A1 (en) 2014-01-16
EP2688121A2 (en) 2014-01-22
KR20140010303A (ko) 2014-01-24
JP2014019954A (ja) 2014-02-03
CN103540896A (zh) 2014-01-29

Similar Documents

Publication Publication Date Title
TW201404901A (zh) 有機層沉積設備、使用其製造有機發光顯示裝置之方法、以及以此方法製造之有機發光顯示裝置
TWI575088B (zh) 有機層沉積設備、利用該設備製造有機發光顯示裝置之方法及使用該方法製造之有機發光顯示裝置
US9570714B2 (en) Organic layer deposition assembly, organic layer deposition apparatus, organic light-emitting display apparatus and method of manufacturing the same
US9246135B2 (en) Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus using the same, and organic light-emitting display apparatus manufactured using the method
US9306191B2 (en) Organic light-emitting display apparatus and method of manufacturing the same
TWI586822B (zh) 使用有機層沉積設備製造有機發光顯示設備之方法及使用該方法製造之有機發光顯示設備
US9051636B2 (en) Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus using the same, and organic light-emitting display apparatus
TWI640641B (zh) 沉積設備、藉由使用其製造有機發光顯示裝置之方法、以及藉此方法所製造之有機發光顯示裝置
TWI594477B (zh) 有機層沈積設備、使用其製造有機發光顯示裝置之方法、以及使用該方法製造之有機發光顯示裝置
TW201403808A (zh) 製造有機發光顯示裝置之方法及使用該方法製造之有機發光顯示裝置
US20120103253A1 (en) Organic layer deposition apparatus
TWI651428B (zh) 有機層沉積設備與利用其製造有機發光顯示裝置之方法
TWI583806B (zh) 藉由使用有機層沉積設備製造有機發光顯示裝置之方法
US9040313B2 (en) Method of manufacturing organic light emitting display device using organic layer deposition apparatus
US9219255B2 (en) Organic layer deposition apparatus and method of manufacturing organic light-emitting display apparatus using the same
US20140329349A1 (en) Organic layer deposition apparatus, and method of manufacturing organic light-emitting display apparatus by using the same
TW201419515A (zh) 有機發光顯示裝置及其製造方法
KR20180038602A (ko) 증착 장치 및 이를 이용한 표시 장치의 제조 방법