TW201349950A - 電路板 - Google Patents
電路板 Download PDFInfo
- Publication number
- TW201349950A TW201349950A TW101118276A TW101118276A TW201349950A TW 201349950 A TW201349950 A TW 201349950A TW 101118276 A TW101118276 A TW 101118276A TW 101118276 A TW101118276 A TW 101118276A TW 201349950 A TW201349950 A TW 201349950A
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- signal
- wiring area
- layer
- green oil
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
一種電路板,包括一信號層與一綠油層,該電路板上設有一佈設信號線較密集之密集佈線區與一佈設信號線較稀疏之稀疏佈線區,至少一信號線佈設於該信號層上並穿過該密集佈線區與稀疏佈線區,該至少一信號線於該密集佈線區之線寬小在於該稀疏佈線區之線寬,該綠油層於該密集佈線區之厚度大在於該稀疏佈線區之厚度。
Description
本發明涉及一種電路板,尤指一種具有良好信號傳輸特性之電路板。
目前複雜晶片之引腳眾多,該等引腳藉由電路板上之信號線連接到電路板上之其他電子元件,電路板於該複雜晶片之安裝處通常密集地佈設了信號線,由於佈線空間之限制,該等信號線之線寬一般較小,且線間距亦較小而能密集佈設,從而導致了信號線之阻抗較大且傳輸之信號間之干擾亦較大,降低了信號之傳輸品質。
鑒於以上內容,有必要提供一種具有良好信號傳輸特性之電路板。
一種電路板,包括一信號層與一綠油層,該電路板上設有一佈設信號線較密集之密集佈線區與一佈設信號線較稀疏之稀疏佈線區,至少一信號線佈設於該信號層上並穿過該密集佈線區與稀疏佈線區,該至少一信號線於該密集佈線區之線寬小在於該稀疏佈線區之線寬,該綠油層於該密集佈線區之厚度大在於該稀疏佈線區之厚度。
相較於習知技術,上述電路板之綠油層於密集佈線區之厚度大在於稀疏佈線區之厚度,從而改善了信號於密集佈線區之傳輸品質。
請參閱圖1,本發明電路板10一較佳實施例包括一密集佈線區11與一稀疏佈線區12,兩信號線80穿過該密集佈線區11與該稀疏佈線區12,於一實施例中,該密集佈線區11處對應安裝了一複雜晶片。
請一併參閱圖1至圖3,該電路板10包括一接地層20、一絕緣層30、一信號層40與一綠油層50,該接地層20位於最下側,該絕緣層30位於接地層20上方,信號層40位於絕緣層30上方,綠油層50位於信號層40上方,兩信號線80位於信號層40。
於該密集佈線區11,兩信號線80之線寬分別為一第一寬度W1,兩信號線80之間之距離為一第一間距D1,綠油層50之厚度為第一厚度H1。
於該稀疏佈線區12,兩信號線80之線寬分別為一第二寬度W2,兩信號線80之間之距離為一第二間距D2,綠油層50之厚度為第二厚度H2。
由於密集佈線區11佈線密集,第一寬度W1小於第二寬度W2,第一間距D1小於第二間距D2,從而導致了兩信號線80於密集佈線區11之阻抗較大且其上信號相互干擾較強,兩信號線80於稀疏佈線區12之阻抗較小且其上信號相互干擾較弱,為改善密集佈線區11之信號品質,使綠油層50於密集佈線區11處之第一厚度H1大在於稀疏佈線區12處之第二厚度H2。
由於綠油層50於密集佈線區11較厚,從而降低了密集佈線區11之信號線80之阻抗,且信號於密集佈線區11傳輸時,較厚之綠油層50可阻止信號透過綠油層50洩露到外界而產生相互干擾,從而降低了信號間之干擾,因此密集佈線區11處較厚之綠油層50提高了信號之傳輸品質,使信號之傳輸能與稀疏佈線區12保持一致。
於本實施例中,該綠油層50亦可包括一絲印層,該絲印層上可印刷上注意事項,例如可於密集佈線區標注“刷兩遍綠油”,於稀疏佈線區標注“刷一遍綠油”,則於製作電路板時,藉由於密集佈線區多刷一遍綠油而增加其綠油層之厚度。
綜上所述,本發明係合乎發明專利申請條件,爰依法提出專利申請。惟,以上所述僅為本發明之較佳實施例,舉凡熟悉本案技藝之人士其所爰依本案之創作精神所作之等效修飾或變化,皆應涵蓋於以下之申請專利範圍內。
10...電路板
11...密集佈線區
12...稀疏佈線區
20...接地層
30...絕緣層
40...信號層
50...綠油層
80...信號線
W1...第一寬度
D1...第一間距
H1...第一厚度
W2...第二寬度
D2...第二間距
H2...第二厚度
圖1係本發明電路板之示意圖。
圖2係沿圖1中II-II處之剖視圖。
圖3係沿圖1中III-III處之剖視圖。
10...電路板
11...密集佈線區
12...稀疏佈線區
80...信號線
Claims (6)
- 一種電路板,包括一信號層與一綠油層,該電路板上設有一佈設信號線較密集之密集佈線區與一佈設信號線較稀疏之稀疏佈線區,至少一信號線佈設於該信號層上並穿過該密集佈線區與稀疏佈線區,該至少一信號線於該密集佈線區之線寬小在於該稀疏佈線區之線寬,該綠油層於該密集佈線區之厚度大在於該稀疏佈線區之厚度。
- 如申請專利範圍第1項所述之電路板,其中該至少一信號線包括兩信號線,該兩信號線之間之距離於該密集佈線區為一第一間距,於該稀疏佈線區為一第二距離,該第二距離大於該第一距離。
- 如申請專利範圍第1項所述之電路板,其中該信號層位於該綠油層之下方。
- 如申請專利範圍第3項所述之電路板,其中該電路板還包括一設定於該信號層下方之絕緣層。
- 如申請專利範圍第4項所述之電路板,其中該電路板還包括一設定於該絕緣層下方之接地層。
- 如申請專利範圍第1項所述之電路板,其中該綠油層包括一絲印層,該絲印層上印刷了製作該電路板之注意事項。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012101579563A CN103428985A (zh) | 2012-05-21 | 2012-05-21 | 电路板 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201349950A true TW201349950A (zh) | 2013-12-01 |
Family
ID=49580376
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101118276A TW201349950A (zh) | 2012-05-21 | 2012-05-23 | 電路板 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8981236B2 (zh) |
CN (1) | CN103428985A (zh) |
TW (1) | TW201349950A (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106550531A (zh) * | 2015-09-17 | 2017-03-29 | 鸿富锦精密工业(武汉)有限公司 | 电路板 |
CN109548268A (zh) * | 2018-11-01 | 2019-03-29 | 郑州云海信息技术有限公司 | 一种pcb阻抗控制方法、控制系统和一种pcb布线板 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7176383B2 (en) * | 2003-12-22 | 2007-02-13 | Endicott Interconnect Technologies, Inc. | Printed circuit board with low cross-talk noise |
JP4371065B2 (ja) * | 2005-03-03 | 2009-11-25 | 日本電気株式会社 | 伝送線路、通信装置及び配線形成方法 |
CN102333413A (zh) * | 2010-07-12 | 2012-01-25 | 鸿富锦精密工业(深圳)有限公司 | 印刷电路板 |
US20120160542A1 (en) * | 2010-12-22 | 2012-06-28 | Oluwafemi Olufemi B | Crosstalk reduction on microstrip routing |
JP5891585B2 (ja) * | 2011-01-24 | 2016-03-23 | 株式会社ソシオネクスト | 半導体装置及び配線基板 |
-
2012
- 2012-05-21 CN CN2012101579563A patent/CN103428985A/zh active Pending
- 2012-05-23 TW TW101118276A patent/TW201349950A/zh unknown
- 2012-12-29 US US13/730,874 patent/US8981236B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN103428985A (zh) | 2013-12-04 |
US20130306362A1 (en) | 2013-11-21 |
US8981236B2 (en) | 2015-03-17 |
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