CN103428985A - 电路板 - Google Patents

电路板 Download PDF

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Publication number
CN103428985A
CN103428985A CN2012101579563A CN201210157956A CN103428985A CN 103428985 A CN103428985 A CN 103428985A CN 2012101579563 A CN2012101579563 A CN 2012101579563A CN 201210157956 A CN201210157956 A CN 201210157956A CN 103428985 A CN103428985 A CN 103428985A
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CN
China
Prior art keywords
wiring region
circuit board
sparse
intensive
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012101579563A
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English (en)
Inventor
张锋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Wuhan Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Wuhan Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Wuhan Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Wuhan Co Ltd
Priority to CN2012101579563A priority Critical patent/CN103428985A/zh
Priority to TW101118276A priority patent/TW201349950A/zh
Priority to US13/730,874 priority patent/US8981236B2/en
Publication of CN103428985A publication Critical patent/CN103428985A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

一种电路板，包括一信号层和一绿油层，所述电路板上设有一布设信号线较密集的密集布线区和一布设信号线较稀疏的稀疏布线区，至少一信号线布设在所述信号层上并穿过所述密集布线区和稀疏布线区，所述至少一信号线在所述密集布线区的线宽小于在所述稀疏布线区的线宽，所述绿油层在所述密集布线区的厚度大于在所述稀疏布线区的厚度。

Description

电路板
技术领域
本发明涉及一种电路板，特别是指一种具有良好信号传输特性的电路板。
背景技术
目前复杂芯片的引脚众多，这些引脚通过电路板上的信号线连接到电路板上的其它电子元件，电路板在该复杂芯片的安装处通常布设了密集的信号线，由于布线空间的限制，这些信号线的线宽一般较小，且线间距也较小而能密集布设，从而导致了信号线的阻抗较大且传输的信号间的干扰也较大，降低了信号的传输品质。
发明内容
鉴于以上内容，有必要提供一种具有良好信号传输特性的电路板。
一种电路板，包括一信号层和一绿油层，所述电路板上设有一布设信号线较密集的密集布线区和一布设信号线较稀疏的稀疏布线区，至少一信号线布设在所述信号层上并穿过所述密集布线区和稀疏布线区，所述至少一信号线在所述密集布线区的线宽小于在所述稀疏布线区的线宽，所述绿油层在所述密集布线区的厚度大于在所述稀疏布线区的厚度。
相较于现有技术，上述电路板的绿油层在密集布线区的厚度大于在稀疏布线区的厚度，从而改善了信号在密集布线区的传输品质。
附图说明
图1是本发明电路板的示意图。
图2是沿图1中II-II处的剖视图。
图3是沿图1中III-III处的剖视图。
主要元件符号说明
电路板 10
密集布线区 11
稀疏布线区 12
接地层 20
绝缘层 30
信号层 40
绿油层 50
信号线 80
第一宽度 W1
第一间距 D1
第一厚度 H1
第二宽度 W2
第二间距 D2
第二厚度 H2
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
请参阅图1，本发明电路板10一较佳实施例包括一密集布线区11和一稀疏布线区12，两信号线80穿过该密集布线区11和该稀疏布线区12，在一实施例中，该密集布线区11处对应安装了一复杂芯片。
请一并参阅图1至图3，该电路板10包括一接地层20、一绝缘层30、一信号层40和一绿油层50，该接地层20位于最下侧，该绝缘层30位于接地层20上方，信号层40位于绝缘层30上方，绿油层50位于信号层40上方，两信号线80位于信号层40。
在该密集布线区11，两信号线80的线宽分别为一第一宽度W1，两信号线80之间的距离为一第一间距D1，绿油层50的厚度为第一厚度H1。
在该稀疏布线区12，两信号线80的线宽分别为一第二宽度W2，两信号线80之间的距离为一第二间距D2，绿油层50的厚度为第二厚度H2。
由于密集布线区11布线密集，第一宽度W1小于第二宽度W2，第一间距D1小于第二间距D2，从而导致了两信号线80在密集布线区11的阻抗较大且其上信号相互干扰较强，两信号线80在稀疏布线区12的阻抗较小且其上信号相互干扰较弱，为了改善密集布线区11的信号质量，使绿油层50在密集布线区11处的第一厚度H1大于在稀疏布线区12处的第二厚度H2。
由于绿油层50在密集布线区11较厚，从而降低了密集布线区11的信号线80的阻抗，且信号在密集布线区11传输时，较厚的绿油层50可阻止信号透过绿油层50泄露到外界而产生相互干扰，从而降低了信号间的干扰，因此密集布线区11处较厚的绿油层50提高了信号的传输质量，使信号的传输能与稀疏布线区12保持一致。
在本实施例中，该绿油层50也可包括一丝印层，该丝印层上可印刷上注意事项，例如可在密集布线区标注“刷两遍绿油”，在稀疏布线区标注“刷一遍绿油”，则在制作电路板时，通过在密集布线区多刷一遍绿油而增加其绿油层的厚度。

Claims (6)

1.一种电路板，包括一信号层和一绿油层，所述电路板上设有一布设信号线较密集的密集布线区和一布设信号线较稀疏的稀疏布线区，至少一信号线布设在所述信号层上并穿过所述密集布线区和稀疏布线区，所述至少一信号线在所述密集布线区的线宽小于在所述稀疏布线区的线宽，其特征在于：所述绿油层在所述密集布线区的厚度大于在所述稀疏布线区的厚度。
2.如权利要求1所述的电路板，其特征在于：所述至少一信号线包括两信号线，所述两信号线之间的距离在所述密集布线区为一第一间距，在所述稀疏布线区为一第二距离，所述第二距离大于所述第一距离。
3.如权利要求1所述的电路板，其特征在于：所述信号层位于所述绿油层的下方。
4.如权利要求3所述的电路板，其特征在于：所述电路板还包括一设置于所述信号层下方的绝缘层。
5.如权利要求4所述的电路板，其特征在于：所述电路板还包括一设置于所述绝缘层下方的接地层。
6.如权利要求1所述的电路板，其特征在于：所述绿油层包括一丝印层，所述丝印层上印刷了制作所述电路板的注意事项。
CN2012101579563A 2012-05-21 2012-05-21 电路板 Pending CN103428985A (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2012101579563A CN103428985A (zh) 2012-05-21 2012-05-21 电路板
TW101118276A TW201349950A (zh) 2012-05-21 2012-05-23 電路板
US13/730,874 US8981236B2 (en) 2012-05-21 2012-12-29 Printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012101579563A CN103428985A (zh) 2012-05-21 2012-05-21 电路板

Publications (1)

Publication Number Publication Date
CN103428985A true CN103428985A (zh) 2013-12-04

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US (1) US8981236B2 (zh)
CN (1) CN103428985A (zh)
TW (1) TW201349950A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106550531A (zh) * 2015-09-17 2017-03-29 鸿富锦精密工业(武汉)有限公司 电路板
CN109548268A (zh) * 2018-11-01 2019-03-29 郑州云海信息技术有限公司 一种pcb阻抗控制方法、控制系统和一种pcb布线板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1829414A (zh) * 2005-03-03 2006-09-06 日本电气株式会社 传输线及布线形成方法
US7530167B2 (en) * 2003-01-30 2009-05-12 Endicott Interconnect Technologies, Inc. Method of making a printed circuit board with low cross-talk noise
CN102333413A (zh) * 2010-07-12 2012-01-25 鸿富锦精密工业（深圳）有限公司 印刷电路板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120160542A1 (en) * 2010-12-22 2012-06-28 Oluwafemi Olufemi B Crosstalk reduction on microstrip routing
JP5891585B2 (ja) * 2011-01-24 2016-03-23 株式会社ソシオネクスト 半導体装置及び配線基板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7530167B2 (en) * 2003-01-30 2009-05-12 Endicott Interconnect Technologies, Inc. Method of making a printed circuit board with low cross-talk noise
CN1829414A (zh) * 2005-03-03 2006-09-06 日本电气株式会社 传输线及布线形成方法
CN102333413A (zh) * 2010-07-12 2012-01-25 鸿富锦精密工业（深圳）有限公司 印刷电路板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106550531A (zh) * 2015-09-17 2017-03-29 鸿富锦精密工业(武汉)有限公司 电路板
CN109548268A (zh) * 2018-11-01 2019-03-29 郑州云海信息技术有限公司 一种pcb阻抗控制方法、控制系统和一种pcb布线板

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Publication number Publication date
US20130306362A1 (en) 2013-11-21
TW201349950A (zh) 2013-12-01
US8981236B2 (en) 2015-03-17

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Application publication date: 20131204