CN106550531A - 电路板 - Google Patents

电路板 Download PDF

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Publication number
CN106550531A
CN106550531A CN201510592208.1A CN201510592208A CN106550531A CN 106550531 A CN106550531 A CN 106550531A CN 201510592208 A CN201510592208 A CN 201510592208A CN 106550531 A CN106550531 A CN 106550531A
Authority
CN
China
Prior art keywords
wiring region
circuit board
sparse
intensive
protective layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510592208.1A
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English (en)
Inventor
张锋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Wuhan Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Wuhan Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Wuhan Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Wuhan Co Ltd
Priority to CN201510592208.1A priority Critical patent/CN106550531A/zh
Priority to US14/879,858 priority patent/US20170086287A1/en
Publication of CN106550531A publication Critical patent/CN106550531A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

一种电路板，包括一信号层和一保护层，所述电路板上设有一布设信号线较密集的密集布线区和一布设信号线较稀疏的稀疏布线区，至少一信号线布设在所述信号层上并穿过所述密集布线区和稀疏布线区，所述至少一信号线在所述密集布线区的线宽小于在所述稀疏布线区的线宽，所述保护层在所述密集布线区的介电常数大于在所述稀疏布线区的介电常数。

Description

电路板
技术领域
本发明涉及一种电路板，特别是指一种具有良好信号传输特性的电路板。
背景技术
目前复杂芯片的引脚众多，这些引脚通过电路板上的信号线连接到电路板上的其它电子元件，电路板在该复杂芯片的安装处通常布设了密集的信号线，由于布线空间的限制，这些信号线的线宽一般较小，且线间距也较小而能密集布设，从而导致了信号线的阻抗较大且传输的信号间的干扰也较大，降低了信号的传输品质。
发明内容
鉴于以上内容，有必要提供一种具有良好信号传输特性的电路板。
一种电路板，包括一信号层和一保护层，所述电路板上设有一布设信号线较密集的密集布线区和一布设信号线较稀疏的稀疏布线区，至少一信号线布设在所述信号层上并穿过所述密集布线区和稀疏布线区，所述至少一信号线在所述密集布线区的线宽小于在所述稀疏布线区的线宽，所述保护层在所述密集布线区的介电常数大于在所述稀疏布线区的介电常数。
相较于现有技术，上述电路板的保护层在密集布线区的介电常数大于在稀疏布线区的介电常数，从而改善了信号在密集布线区的传输品质。
附图说明
图1是本发明电路板的示意图。
图2是沿图1中II-II处的剖视图。
图3是沿图1中III-III处的剖视图。
主要元件符号说明
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
请参阅图1，本发明电路板10一较佳实施例包括一密集布线区11和一稀疏布线区12，两信号线80穿过该密集布线区11和该稀疏布线区12，在一实施例中，该密集布线区11处对应安装了一复杂芯片。
请一并参阅图2至图3，该电路板10包括一接地层20、一绝缘层30、一信号层40和一保护层50，该接地层20位于最下侧，该绝缘层30位于接地层20上方，信号层40位于绝缘层30上方，保护层50位于信号层40上方，两信号线80位于信号层40。
在该密集布线区11，两信号线80的线宽均为一第一宽度W1，两信号线80之间的距离为一第一间距D1，保护层50的介电常数为第一介电常数H1。
在该稀疏布线区12，两信号线80的线宽均为一第二宽度W2，两信号线80之间的距离为一第二间距D2，保护层50的介电常数为第二介电常数H2。
由于密集布线区11布线密集，第一宽度W1小于第二宽度W2，第一间距D1小于第二间距D2，从而导致了两信号线80在密集布线区11的阻抗较大且其上信号相互干扰较强，两信号线80在稀疏布线区12的阻抗较小且其上信号相互干扰较弱，为了改善密集布线区11的信号质量，使保护层50在密集布线区11处的第一介电常数H1大于在稀疏布线区12处的第二介电常数H2。
由于保护层50在密集布线区11介电常数较大，从而降低了密集布线区11的信号线80的阻抗，且信号在密集布线区11传输时，介电常数较大的保护层50可阻止信号透过保护层50泄露到外界而产生相互干扰，从而降低了信号间的干扰，因此密集布线区11处介电常数较大的保护层50提高了信号的传输质量，使信号的传输性能与稀疏布线区12保持一致。
在其他实施方式中，所述电路板10可以应用于芯片封装。
在本实施例中，该保护层50在密集布线区11涂刷第一种类绿油，该保护层50在稀疏布线区12涂刷第二种类绿油，其中所述第一种类绿油的介电常数大于所述第二种类绿油的介电常数。在其他实施方式中，该保护层也可通过涂刷绿油或丝印的方式形成密集布线区11及稀疏布线区12上介电常数差异，以此提高信号传输质量。

Claims (5)

1.一种电路板，包括一信号层和一保护层，所述电路板上设有一布设信号线较密集的密集布线区和一布设信号线较稀疏的稀疏布线区，至少一信号线布设在所述信号层上并穿过所述密集布线区和稀疏布线区，所述至少一信号线在所述密集布线区的线宽小于在所述稀疏布线区的线宽，其特征在于：所述保护层在所述密集布线区的介电常数大于在所述稀疏布线区的介电常数。
2.如权利要求1所述的电路板，其特征在于：所述至少一信号线包括两信号线，所述两信号线之间的距离在所述密集布线区为一第一间距，在所述稀疏布线区为一第二距离，所述第二距离大于所述第一距离。
3.如权利要求1所述的电路板，其特征在于：所述信号层位于所述保护层的下方。
4.如权利要求3所述的电路板，其特征在于：所述电路板还包括一设置于所述信号层下方的绝缘层。
5.如权利要求4所述的电路板，其特征在于：所述电路板还包括一设置于所述绝缘层下方的接地层。
CN201510592208.1A 2015-09-17 2015-09-17 电路板 Pending CN106550531A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201510592208.1A CN106550531A (zh) 2015-09-17 2015-09-17 电路板
US14/879,858 US20170086287A1 (en) 2015-09-17 2015-10-09 Printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510592208.1A CN106550531A (zh) 2015-09-17 2015-09-17 电路板

Publications (1)

Publication Number Publication Date
CN106550531A true CN106550531A (zh) 2017-03-29

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US (1) US20170086287A1 (zh)
CN (1) CN106550531A (zh)

Cited By (1)

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CN113473702A (zh) * 2021-05-31 2021-10-01 浪潮电子信息产业股份有限公司 一种电子设备及其印刷电路板

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