TW201348671A - 熱管 - Google Patents
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- TW201348671A TW201348671A TW101118099A TW101118099A TW201348671A TW 201348671 A TW201348671 A TW 201348671A TW 101118099 A TW101118099 A TW 101118099A TW 101118099 A TW101118099 A TW 101118099A TW 201348671 A TW201348671 A TW 201348671A
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- heat pipe
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- evaporation
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- 238000001704 evaporation Methods 0.000 claims abstract description 48
- 239000012530 fluid Substances 0.000 claims abstract description 11
- 230000008020 evaporation Effects 0.000 claims description 44
- 238000009833 condensation Methods 0.000 claims description 39
- 230000005494 condensation Effects 0.000 claims description 39
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 229910001369 Brass Inorganic materials 0.000 claims description 2
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- 239000010951 brass Substances 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims description 2
- 230000007423 decrease Effects 0.000 abstract description 2
- 239000007788 liquid Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000003134 recirculating effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/06—Control arrangements therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/30—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being attachable to the element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
一種熱管,包括內部形成有收容空間之管體及設置於該收容空間中之毛細結構與工作流體。該管體包括蒸發段以及冷凝段。所述蒸發段與冷凝段之間還設置有一噴嘴,所述噴嘴具有分別與蒸發段與冷凝段相對之第一表面和第二表面。所述噴嘴上形成有貫通第一表面及第二表面之若干噴嘴孔,噴嘴孔之孔徑由蒸發段向冷凝段方向逐漸縮小。
Description
本發明涉及一種傳熱元件,特別涉及一種用於傳遞電子元件熱量之熱管。
熱管是一種利用液、汽相變化來達到快速傳遞熱量之元件。通常熱管之一端為蒸發端,另一端為冷凝端,當蒸發端遇熱時,工作流體迅速汽化,蒸汽往低溫之冷凝端傳遞,冷凝端透過散熱鰭片釋放熱量,汽化之工作流體恢復成液體,再透過熱管內壁之毛細結構流回蒸發端,不斷地迴圈進行熱傳作用。
但是,先前技術中之熱管存在如下缺陷:由於熱管內部之蒸汽與工作流體是以相反方向流動,使得工作流體藉由熱管內壁之毛細結構回流會受到蒸汽之阻礙,造成工作流體回流至蒸發端有供給不足之情況,從而讓蒸發端發生幹化現象,導致熱管導熱性能不佳,限制了熱管之熱傳量。另外,熱管內設有之毛細結構,會造成蒸汽通道縮小,從而蒸發端吸熱後汽化之蒸汽沿著蒸汽通道傳輸到冷凝端之速度會降低,導致熱管導熱性能不佳。
有鑒於此,有必要提供一種導熱性能較佳之熱管。
一種熱管,包括內部形成有收容空間之管體以及設置於該收容空間中之毛細結構與工作流體。該管體包括蒸發段以及冷凝段。所述蒸發段與冷凝段之間之管體中還設置有一噴嘴,所述噴嘴具有分別與蒸發段與冷凝段相對之第一表面和第二表面。所述噴嘴上形成有貫通所述第一表面及第二表面之若干噴嘴孔,所述噴嘴孔之孔徑由蒸發段向冷凝段方向逐漸縮小。
上述之熱管在管體中設置一具有多個噴嘴孔之噴嘴,噴嘴孔孔徑由蒸發段向冷凝段方向逐漸縮小,從而蒸汽流經各噴嘴孔之孔徑較小之出口處時速度會被加大,使得蒸汽流能更快速傳輸到冷凝端冷卻並釋放出熱量,能提高熱管之導熱性能。而且,噴嘴孔為減縮孔構造,可以使得蒸汽向周圍擴散之機會減小,可降低蒸汽流與管體內壁上之毛細結構間之相互干擾,使冷凝液體回流到蒸發端更為順暢,可達到降低熱阻及提升熱管最大熱傳能力之功效。
以下將結合附圖對本發明作進一步之詳細說明。
實施方式一
請參閱圖1,本發明第一實施方式提供之一種熱管10包括一密封之管體100、設置該管體100中之毛細結構200和噴嘴300。
所述管體100為一長管狀,其包括蒸發段110、冷凝段120以及連接該蒸發段110和冷凝段120之絕熱段130。所述管體100由導熱性能良好之材料如黃銅、銅合金等一體製成,其內部形成一收容空間140,該收容空間140內封入有工作流體(圖未示)。
所述毛細結構200為由銅、銀或鋁絲等金屬絲編織之編織網結構或由金屬粉末燒結形成之粉末燒結結構。所述毛細結構200設置在管體100之整個內壁上,其用於吸附並回流所述工作流體。
請接著參閱圖4,所述噴嘴300設置在蒸發段110與絕熱段130之間,將蒸發段110與絕熱段130及冷凝段120相互間隔。所述噴嘴300包括一本體310,該本體310包括分別與蒸發段110與冷凝段120相對之第一表面311以及第二表面312。所述本體310上還形成有貫通所述第一表面311及第二表面312之若干微小之噴嘴孔320。所述噴嘴孔320沿平行第一表面311及第二表面312之截面為圓形,其內表面為一光滑表面,便於蒸汽流通。所述噴嘴孔320為一減縮孔構造,其孔徑大小由蒸發段110向冷凝段120方向逐漸縮小,亦即,所述噴嘴孔320大孔徑一端朝向蒸發段110,小孔徑一端朝向冷凝段120。在本實施方式中,所述噴嘴300由導熱性良好之金屬材料製成,其設於蒸發段110與絕熱段130之邊界處。
所述熱管10在工作時,其蒸發段110受熱,蒸發段110處之工作流體汽化成蒸汽,該蒸汽藉由噴嘴300流向冷凝段120放熱。根據品質守恆定律,蒸汽進入所述噴嘴孔320之品質流率等於離開所述噴嘴孔320之品質流率,可寫成ρinVinAin=ρoutVoutAout,其中,ρ為蒸汽密度,A為噴嘴孔320之截面積,V為蒸汽在該截面之流速,由此可知,噴嘴孔320之截面積大處其流速小,截面積小處其流速大。所以蒸汽流經各噴嘴孔320之孔徑較小之出口處時速度被加大,各噴嘴孔320具有加速蒸汽向冷凝段120方向流動之作用。所以噴嘴300可以使蒸汽流更快速傳輸到冷凝段120冷卻並釋放出熱量,能提高熱管10之導熱性能。另外,所述噴嘴300之噴嘴孔320為一減縮孔構造,從而可以使得蒸汽向周圍擴散之機會減小,可降低蒸汽流與管體100內壁上之毛細結構200間之相互干擾,使冷凝液體回流到蒸發段110更為順暢,可達到降低熱阻及提升熱管10最大熱傳能力之功效。
另外,再根據能量守恆定律, q-w=hout-hin+(Vout 2-Vin 2)/2+g(zout-zin) (其中,q為熱傳量,w為噴嘴孔作功,h為焓值,V為流速,z為進出孔之高度),因噴嘴孔320沒有作功以及噴嘴孔320之進出孔之高度差不大,上述關係式可進一步簡化成q=hout-hin+(Vout 2-Vin 2)/2,從該式可以看出,當蒸汽流進噴嘴300時會產生熱損失,流至噴嘴孔320出口處時速度加大,且焓值降低,內能轉變為動能,噴嘴孔320出口處之蒸汽流之溫度會下降。所以噴嘴300可以快速地降低蒸汽溫度,以提升冷凝效率。
實施方式二
請參閱圖2,本發明第二實施方式提供之熱管20與第一實施方式中之熱管10之區別在於:熱管20之管體500不包括絕熱段,蒸發段510與冷凝段520直接連接,噴嘴300設置在蒸發段510與冷凝段520之間,在本實施方式中,所述噴嘴300設於蒸發段110與冷凝段520之邊界處。所述冷凝段520之管體表面還設置有散熱片530。
實施方式三
請參閱圖3,本發明第三實施方式提供之熱管30與第一實施方式中之熱管10之區別在於:熱管30之蒸發段610位於管體600之中間,而冷凝段620分別連接在所述蒸發段610之兩側,兩個噴嘴300分別設置在蒸發段610與兩側之冷凝段620之間,在本實施方式中,所述兩個噴嘴300分別設於蒸發段610與冷凝段620之兩個邊界處。所述冷凝段220之管體表面還設置有散熱片630。
相較於先前技術,本發明之熱管在管體中設置一具有多個噴嘴孔之噴嘴,噴嘴孔孔徑由蒸發段向冷凝段方向逐漸縮小,從而蒸汽流經各噴嘴孔之孔徑較小之出口處時速度會被加大,使得蒸汽流能更快速傳輸到冷凝端冷卻並釋放出熱量,能提高熱管之導熱性能。而且,噴嘴孔為減縮孔構造,可以使得蒸汽向周圍擴散之機會減小,可降低蒸汽流與管體內壁上之毛細結構間之相互干擾,使冷凝液體回流到蒸發端更為順暢,可達到降低熱阻及提升熱管最大熱傳能力之功效。
另外,本領域技術人員還可在本發明精神內做其他變化,當然,這些依據本發明精神所做之變化,都應包含在本發明所要求保護之範圍之內。
10、20、30...熱管
100、500、600...管體
200...毛細結構
300...噴嘴
110、510、610...蒸發段
120、520、620...冷凝段
130...絕熱段
140...收容空間
310...本體
320...噴嘴孔
311...第一表面
312...第二表面
530、630...散熱片
圖1為本發明第一實施方式中之熱管之截面圖。
圖2為本發明第二實施方式中之熱管之截面圖。
圖3為本發明第三實施方式中之熱管之截面圖。
圖4為圖1中之熱管之噴嘴之部分立體結構示意圖。
10...熱管
100...管體
200...毛細結構
300...噴嘴
110...蒸發段
120...冷凝段
130...絕熱段
140...收容空間
320...噴嘴孔
Claims (10)
- 一種熱管,包括內部形成有收容空間之管體以及設置於該收容空間中之毛細結構與工作流體,該管體包括蒸發段以及冷凝段,其改進在於:所述蒸發段與冷凝段之間之管體中還設置有一噴嘴,所述噴嘴具有分別與蒸發段與冷凝段相對之第一表面和第二表面,所述噴嘴上形成有貫通所述第一表面及第二表面之若干噴嘴孔,所述噴嘴孔之孔徑由蒸發段向冷凝段方向逐漸縮小。
- 如申請專利範圍第1項所述之熱管,其中:所述噴嘴孔沿平行第一表面及第二表面之截面為圓形。
- 如申請專利範圍第1項所述之熱管,其中:所述噴嘴孔之內表面為一光滑表面。
- 如申請專利範圍第1項所述之熱管,其中:所述噴嘴由金屬材料製成。
- 如申請專利範圍第1項所述之熱管,其中:所述管體還包括一連接所述蒸發段和冷凝段之絕熱段,所述噴嘴設置在蒸發段與絕熱段之間。
- 如申請專利範圍第5項所述之熱管,其中:所述噴嘴設置在蒸發段與絕熱段之邊界處。
- 如申請專利範圍第1項所述之熱管,其中:所述蒸發段位於所述管體之中間,而冷凝段分別連接在所述蒸發段之兩側,所述噴嘴設置在蒸發段與冷凝段之間。
- 如申請專利範圍第7項所述之熱管,其中:所述噴嘴設置在蒸發段與冷凝段之邊界處。
- 如申請專利範圍第1項所述之熱管,其中:所述管體由黃銅、銅合金一體製成。
- 如申請專利範圍第1項所述之熱管,其中:所述毛細結構設置在管體之整個內壁上。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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TW101118099A TW201348671A (zh) | 2012-05-22 | 2012-05-22 | 熱管 |
US13/532,809 US20130312938A1 (en) | 2012-05-22 | 2012-06-26 | Heat pipe with vaporized working fluid flow accelerator |
JP2013104842A JP5642836B2 (ja) | 2012-05-22 | 2013-05-17 | ヒートパイプ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW101118099A TW201348671A (zh) | 2012-05-22 | 2012-05-22 | 熱管 |
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TW201348671A true TW201348671A (zh) | 2013-12-01 |
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TW101118099A TW201348671A (zh) | 2012-05-22 | 2012-05-22 | 熱管 |
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US (1) | US20130312938A1 (zh) |
JP (1) | JP5642836B2 (zh) |
TW (1) | TW201348671A (zh) |
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TWI699506B (zh) * | 2019-04-10 | 2020-07-21 | 嘉龍國際股份有限公司 | 三維相變化遠端散熱模組 |
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CN106568342B (zh) * | 2015-10-13 | 2018-09-28 | 超众科技股份有限公司 | 平板热管的复合式结构及导热装置 |
US9689623B2 (en) * | 2015-11-05 | 2017-06-27 | Chaun-Choung Technology Corp. | Composite structure of flat heat pipe and heat conduction device thereof |
US20180170553A1 (en) * | 2016-12-20 | 2018-06-21 | Qualcomm Incorporated | Systems, methods, and apparatus for passive cooling of uavs |
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- 2012-06-26 US US13/532,809 patent/US20130312938A1/en not_active Abandoned
-
2013
- 2013-05-17 JP JP2013104842A patent/JP5642836B2/ja not_active Expired - Fee Related
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CN105737652A (zh) * | 2016-04-12 | 2016-07-06 | 张洪延 | 一种热量传输装置 |
TWI699506B (zh) * | 2019-04-10 | 2020-07-21 | 嘉龍國際股份有限公司 | 三維相變化遠端散熱模組 |
Also Published As
Publication number | Publication date |
---|---|
JP2013242135A (ja) | 2013-12-05 |
US20130312938A1 (en) | 2013-11-28 |
JP5642836B2 (ja) | 2014-12-17 |
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