TW201335666A - Method of fabricating a touch panel - Google Patents

Abstract

A method of fabricating a touch panel including the following steps is provided. A substrate having a sensing region and a periphery region is provided. A plurality of first sensing series and a plurality of second sensing series are formed at the sensing region, and a plurality of transmission lines are formed at the periphery region. The method of fabricating the first sensing series, the second sensing series and the transmission lines includes: a transparent conductive layer and a metal layer are patterned by performing a patterning process by a mask so as to form a patterned transparent conductive layer and a patterned metal layer. The patterned transparent conductive layer includes a plurality of first transparent bridge lines of the first sensing series and a plurality of transparent transmission lines located at the periphery region. The patterned metal layer includes a plurality of metal transmission lines located at the periphery region. The transparent transmission lines and the metal transmission lines are stacked to form the transmission lines.

Description

Touch panel manufacturing method

The present invention relates to a method of fabricating a touch panel, and more particularly to a method of fabricating a touch panel that reduces the number of reticle uses.

In recent years, various electronic products have been moving toward simple operation, small size, and large screen size. In particular, portable electronic products have stricter requirements on volume and screen size. Therefore, many electronic products integrate the touch panel with the display panel to omit the space required for the keyboard or the control buttons, thereby expanding the configurable area of the screen. Currently, touch panels can be roughly classified into resistive, capacitive, infrared, and ultrasonic touch panels. Among them, resistive touch panels and capacitive touch panels are the most common products.

In one of the capacitive touch panels, the sensing region in the touch panel includes sensing series in the X direction and the Y direction, and the sensing series is usually composed of a sensing pad and a bridge wire. In addition, these sensing series are often connected to the control circuit with metal transmission lines disposed outside the sensing region. In order to save the number of reticle use, it is common to make a bridge wire while making a metal transmission line. However, in the sensing area, the light that reflects the external environment due to the bridge wire is a metal material, which may cause a problem of poor visual quality.

In addition, since the metal film layer used to make the metal bridge wire has a thick film thickness, if the metal film layer is used to make the bridge wire, it is easy to cause the subsequent transparent bridge wire (crossing the transparent bridge wire above the metal bridge wire). The phenomenon of poor film formation (or climbing line breakage) occurs during the manufacturing process, which increases the probability of the electrostatic panel discharge (Electrostatic Discharge). When the electrostatic discharge occurs in the area where the bridge wires are staggered, the transmission signals in the X direction and the Y direction are short-circuited. Therefore, in order to reduce the visual quality and short circuit conditions, it is necessary to add a mask process to complete the fabrication of the metal bridge wiring by the transparent bridge wiring, thereby adding a mask process and increasing the manufacturing cost.

The present invention provides a method of manufacturing a touch panel that uses a transparent conductive material as a bridge wire, thereby contributing to providing a good visual quality and avoiding a situation in which a sense series in different directions is short-circuited.

The present invention provides a method of manufacturing a touch panel, which includes the following steps. First, a substrate is provided having a sensing region and a peripheral region located around the sensing region. And forming a plurality of first sensing series and a plurality of second sensing series in the sensing region and forming a plurality of transmission lines connected to the first sensing series and the second sensing series in the peripheral area The extending direction of the first sensing series and the extending direction of the second sensing series are mutually staggered, wherein the step of forming the first sensing series, the second sensing series and the transmission line comprises: sequentially forming on the substrate a transparent conductive layer and a metal layer; performing a patterning process to pattern the transparent conductive layer and the metal layer into a patterned transparent conductive layer and a patterned metal layer, wherein the patterned transparent conductive layer comprises the first sensing series The plurality of first transparent bridge wires and the plurality of transparent transmission lines located in the peripheral region, and the patterned metal layer comprises a plurality of metal transmission lines located in the peripheral region, wherein the transparent transmission lines and the metal transmission lines are stacked to form a transmission line. Further, a patterned insulating layer is formed, wherein the patterned insulating layer covers the first transparent bridge. Finally, a plurality of second transparent bridge wires of the second sensing series are formed on the patterned insulating layer.

In an embodiment of the present invention, the method for manufacturing the touch panel further includes: forming a plurality of first sensing pads, wherein the first sensing pads are serially connected by the first transparent bridge wires; The second sensing pad is formed by connecting the second transparent bridge wires in series.

In an embodiment of the invention, the step of performing the patterning process further comprises: causing the patterned transparent conductive layer to include the first sensing pad.

In an embodiment of the invention, the step of performing the patterning process further comprises: causing the patterned transparent conductive layer to include a second sensing pad.

In an embodiment of the invention, the first transparent pad is formed to form a first sensing pad.

In an embodiment of the invention, the second transparent pad is formed while forming the second transparent pad.

In an embodiment of the invention, the method for manufacturing the touch panel further includes forming a protective layer covering the first sensing series and the second sensing series.

In an embodiment of the invention, the patterning process is a mask process.

In an embodiment of the invention, the reticle used in the reticle process comprises a halftone reticle or a gray dimming hood.

Based on the above, the manufacturing method of the touch panel of the present invention uses a transparent conductive material to form a bridge wire, so that the touch panel can have a better visual quality. In addition, according to the manufacturing method of the touch panel of the present invention, a part of the transparent bridge wiring and the production of the transmission line at the periphery can be completed by using a mask process. Therefore, the manufacturing method of the touch panel of the present invention contributes to reducing the number of mask processes and reducing the manufacturing cost.

The above described features and advantages of the present invention will be more apparent from the following description.

In order to explain in detail the method of manufacturing the touch panel of the present invention, the general configuration of the touch panel will be described. FIG. 1 is a schematic diagram of a touch panel according to an embodiment of the invention. Referring to FIG. 1 , the touch panel TP basically includes a sensing area 100 and a peripheral area 200 , wherein the peripheral area 200 is located at the periphery of the sensing area 100 . The sensing area 100 has a plurality of first sensing series 110 and a plurality of second sensing series 120. There are a plurality of transmission lines 210 in the peripheral area 200. Each of the first sensing series 110 is composed of a plurality of first bridge wires 112 and a plurality of first sensing pads 114, and the first bridge wires 112 of the same first sensing series 110 will The first sensing pads 114 are connected in series. Similarly, each of the second sensing series 120 is composed of a plurality of second bridge lines 122 and a plurality of second sensing pads 124, and a second bridge line of the same second sensing series 120 These second sensing pads 124 are connected in series. The first bridge line 112 and the second bridge line 122 may assume a staggered configuration.

In detail, the extending direction of the first sensing series 110 and the extending direction of the second sensing series 120 are interdigitated. In other words, in this embodiment, the extending direction of the first sensing series 110 is, for example, the X direction, and the extending direction of the second sensing series 120 is, for example, the Y direction, and the X direction and the Y direction are interlaced with each other. However, the present invention is not limited thereto. In other embodiments, the extending direction of the first sensing series 110 may be, for example, the Y direction, and the extending direction of the second sensing series 120 is, for example, the X direction.

Three embodiments will be exemplified below to describe in detail the manufacturing methods of the first sensing series 110, the second sensing series 120, and the transmission line 210 described above. It is to be noted that, in order to succinctly explain the manufacturing method of the touch panel of the present invention, an enlarged schematic view of the area M in FIG. 1 will be described in the following drawings. Moreover, in the following drawings, only one transmission line 210, one first sensing series 110, and one second sensing series 120 will be described as a description. However, those skilled in the art can understand the manufacturing method of the touch panel of the present invention in accordance with the following description.

2A to 2J are schematic diagrams showing a manufacturing process of a touch panel according to a first embodiment of the present invention. It should be noted that in order to clearly illustrate the production process, the following drawings include both the upper view (top) of the touch panel and the cross-sectional view of the touch panel (bottom), and are also described in conjunction with the overall architecture of FIG. Referring to FIG. 2A, first, a transparent conductive layer 12 and a metal layer 14 are formed on the substrate 10. Next, a patterning process is performed on the transparent conductive layer 12 and the metal layer 14.

In this embodiment, the patterning process may include the following steps, but is not limited thereto. Forming a photoresist layer (not shown) on the substrate 10 on which the transparent conductive layer 12 and the metal layer 14 are formed, and then patterning the photoresist layer by a mask process, wherein the mask process is, for example, halftone light. The mask process or a gray dimmer process. Thus, a first photoresist 16 and a second photoresist 18a are formed on the metal layer 14, wherein the first photoresist 16 has a film thickness smaller than the second photoresist 18a, as shown in FIG. 2B, and the first light The resistor 16 is, for example, located in the sensing region 100 and the second photoresist 18a is located, for example, in the peripheral region 200.

Then, with the first photoresist 16 and the second photoresist 18a as masks, the exposed portion of the metal layer 14 is removed, as shown in FIG. 2C. Similarly, the exposed portion of the transparent conductive layer 12 is removed by using the first photoresist 16 and the second photoresist 18a as masks, as shown in FIG. 2D. The removal steps depicted in Figures 2C and 2D are accomplished, for example, by an etch process. After the etching process, the transparent conductive layer 12 and the metal layer 14 are patterned to leave only the portion shielded by the first photoresist 16 and the second photoresist 18a.

Then, the first photoresist 16 and a portion of the second photoresist 18a are removed to form a third photoresist 18b and a portion of the metal layer 14 is exposed, as shown in FIG. 2E. Here, the method of removing the first photoresist 16 and a part of the second photoresist 18a is, for example, an ashing method. And the third photoresist 18b is composed of, for example, a thinned second photoresist 18a. That is, the third photoresist 18b and the second photoresist 18a have the same profile in the upper view, but have different thicknesses in the cross-sectional view.

Then, the portion of the metal layer 14 that is originally exposed by the first photoresist 16 and then exposed is removed to make the exposed portion of the transparent conductive layer 12 form the first bridge 112 of the first sensing series 110 in FIG. As shown in Figure 2F. At this time, the third photoresist 18b remains in the peripheral region 200 of the substrate 10.

Then, the third photoresist 18b is removed, that is, the patterned metal layer and the patterned transparent conductive layer are completed, as shown in FIG. 2G. Referring again to FIG. 2G and referring to FIG. 1 simultaneously, the patterned metal layer includes a plurality of metal transmission lines 214 (only one is shown here). The patterned transparent conductive layer includes a plurality of first transparent bridge lines 112 of the first sensing series 110 (only one is shown here) and a plurality of transparent transmission lines 212 located in the peripheral area 200 (only one is shown here) ). Further, the transparent transmission line 212 is overlapped with the metal transmission line 214 to constitute the transmission line 210. Specifically, in the foregoing step, the pattern of the first photoresist 16 is the pattern of the first transparent bridge 112, and the pattern of the second photoresist 18a is the pattern of the transmission line 210. Moreover, in the embodiment, the material layers of two different materials can be patterned by a mask process to complete the fabrication of the transmission line 210 and the first transparent bridge line 112, thereby helping to reduce the manufacturing cost of the touch panel. .

Subsequently, referring to FIG. 2H, a patterned insulating layer 20 is formed and covers a portion of the first transparent bridge line 112 and the transmission line 210. In detail, the patterned insulating layer 20 can be patterned by a reticle process to have a plurality of openings exposing portions of the first transparent bridge lines 112 and portions of the metal transmission lines 214.

Referring to FIG. 2I , a second sensing series 120 and a plurality of first sensing pads 114 are formed on the patterned insulating layer 20 . In this embodiment, for example, a transparent conductive layer (not shown) is patterned by a mask process such that the second transparent bridge 122, the first sensing pad 114, and the second sensing pad 124 are simultaneously fabricated. The first transparent bridge line 112 is connected in series with the first sensing pad 114 through the opening of the patterned insulating layer 20 to form a first sensing series 110, and the second transparent bridge line 122 is directly connected to the second sensing pad 124. A second sensing series 120 is formed. In addition, the first sensing pad 114 located between the peripheral region 200 and the sensing region 100 extends into the peripheral region 200, for example, and is electrically connected to a portion of the metal transmission line 214 exposed by the patterned insulating layer 20, thereby The sensing signal can be transmitted to the transmission line 210.

Finally, please refer to FIG. 2J to form a protective layer 30. The protective layer 30 covers the first sensing series 110 and the second sensing series 120. So far, the production of the touch panel TP1 is completed. In this embodiment, the second transparent bridge wire 122, the first sensing pad 114, and the second sensing pad 124 are all made of a transparent conductive material. In addition, according to the fabrication flow of FIGS. 2A to 2G, the first transparent bridge wire 112 is also composed of a transparent conductive material. Therefore, the first sensing series 110 and the second sensing series 120 located in the sensing area 100 are all transparent members, which helps to improve the visual taste of the touch panel TP1.

Other embodiments are listed below for illustration. It is to be noted that the following embodiments use the same reference numerals and parts of the above-mentioned embodiments, and the same reference numerals are used to refer to the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted portions, reference may be made to the foregoing embodiments, and the following embodiments are not repeatedly described.

3A to 3J are schematic diagrams showing a manufacturing process of a touch panel according to a second embodiment of the present invention. It should be noted that in order to clearly illustrate the production process, the following drawings include both the upper view (top) of the touch panel and the cross-sectional view of the touch panel (bottom), and are also described in conjunction with the overall architecture of FIG. In this embodiment, the extending direction of the first sensing series 110 is, for example, the Y direction, and the extending direction of the second sensing series 120 is, for example, the X direction. Referring to FIG. 3A, first, a transparent conductive layer 12 and a metal layer 14 are formed on the substrate 10. Next, a patterning process is performed on the transparent conductive layer 12 and the metal layer 14.

In this embodiment, the patterning process may include the following steps, but is not limited thereto. Forming a photoresist layer (not shown) on the substrate 10 on which the transparent conductive layer 12 and the metal layer 14 are formed, and then patterning the photoresist layer by a mask process, wherein the mask process is, for example, halftone light. The mask process or a gray dimmer process. Thus, a first photoresist 16 and a second photoresist 18a are formed on the metal layer 14, wherein the first photoresist 16 has a film thickness smaller than the second photoresist 18a, as shown in FIG. 3B, and the first light The resistor 16 is, for example, located in the sensing region 100 and the second photoresist 18a is located, for example, in the peripheral region 200.

Then, with the first photoresist 16 and the second photoresist 18a as masks, the exposed portion of the metal layer 14 is removed and the transparent conductive layer 12 is exposed, as shown in FIG. 3C. Similarly, the exposed portion of the transparent conductive layer 12 is removed by using the first photoresist 16 and the second photoresist 18a as masks, as shown in FIG. 3D. The removal steps depicted in Figures 3C and 3D are accomplished, for example, by an etch process. After the etching process, the transparent conductive layer 12 and the metal layer 14 are patterned to leave only the portion shielded by the first photoresist 16 and the second photoresist 18a.

Then, the first photoresist 16 and a portion of the second photoresist 18a are removed to form a third photoresist 18b and expose a portion of the metal layer 14 that was originally shielded by the first photoresist 16, as shown in FIG. 3E. Here, the method of removing the first photoresist 16 and a part of the second photoresist 18a is, for example, an ashing method. And the third photoresist 18b is composed of, for example, a thinned second photoresist 18a. That is, the third photoresist 18b and the second photoresist 18a have the same profile in the upper view, but have different thicknesses in the cross-sectional view.

Then, the portion of the metal layer 14 that is originally exposed by the first photoresist 16 and then exposed is removed to expose the exposed portion of the transparent conductive layer 12 to form the first sensing series 110 and the second sensing string in FIG. The second sensing pad 124 of column 120 is shown in Figure 3F. At this time, the third photoresist 18b remains in the peripheral region 200 of the substrate 10.

Then, the third photoresist 18b is removed, that is, the patterned metal layer and the patterned transparent conductive layer are completed, as shown in FIG. 3G. Referring again to FIG. 3G and referring to FIG. 1 simultaneously, the patterned metal layer includes a plurality of metal transmission lines 214 (only one is shown here). The patterned transparent conductive layer includes a first sensing series 110, a second sensing pad 124 of the second sensing series 120, and a transparent transmission line 212 located in the peripheral region 200. In other words, in this embodiment, for example, the first transparent bridge 112, the first sensing pad 114, and the second sensing pad 124 are simultaneously fabricated, wherein the first transparent bridge 112 is directly connected to the first sensing pad 114 to be the first The series 110 is sensed. Further, the transparent transmission line 212 is overlapped with the metal transmission line 214 to constitute the transmission line 210. Specifically, the pattern of the first photoresist 16 in the foregoing step is the pattern of the first sensing series 110 and the second sensing pad 124. Moreover, in the embodiment, a material layer of two different materials can be patterned by a mask process to complete the fabrication of the transmission line 210, the first sensing series 110, and the second sensing pad 124, thereby contributing to Reduce the production cost of the touch panel.

Subsequently, referring to FIG. 3H, a patterned insulating layer 20 is formed and covers the first transparent bridge line 112 and the transmission line 210. In detail, the patterned insulating layer 20 can have a plurality of openings exposing a portion of the second sensing pads 124 by patterning a mask process.

Referring to FIG. 31, a plurality of second transparent bridge lines 122 of the second sensing series 120 are formed on the patterned insulating layer 20. So far, the second transparent bridge wire 122 is connected in series with the second sensing pad 124 through the opening of the patterned insulating layer 20 to form the second sensing series 120. In addition, since the second sensing pad 124 located between the peripheral area 200 and the sensing area 100 and the transparent transmission line 212 of the peripheral area 200 are continuous lines, the sensing signal of the second sensing series 120 can thereby Transfer to the transmission line 210.

Finally, please refer to FIG. 3J to form a protective layer 30. The protective layer 30 covers the first sensing series 110 and the second sensing series 120. So far, the production of the touch panel TP2 is completed. Similar to the embodiment of FIG. 2G, in the embodiment, the first sensing series 110 and the second sensing series 120 are all transparent members, which helps to improve the visual taste of the touch panel TP2.

4A to 4J are schematic diagrams showing a manufacturing process of a touch panel according to a third embodiment of the present invention. It should be noted that in order to clearly illustrate the production process, the following drawings include both the upper view (top) of the touch panel and the cross-sectional view of the touch panel (bottom), and are also described in conjunction with the overall architecture of FIG. In this embodiment, the extending direction of the first sensing series 110 is, for example, the X direction, and the extending direction of the second sensing series 120 is, for example, the Y direction. Referring to FIG. 4A, first, a transparent conductive layer 12 and a metal layer 14 are formed on the substrate 10. Next, a patterning process is performed on the transparent conductive layer 12 and the metal layer 14.

In this embodiment, the patterning process may include the following steps, but is not limited thereto. Forming a photoresist layer (not shown) on the substrate 10 on which the transparent conductive layer 12 and the metal layer 14 are formed, and then patterning the photoresist layer by a mask process, wherein the mask process is, for example, halftone light. The mask process or a gray dimmer process. Thus, a first photoresist 16 and a second photoresist 18a are formed on the metal layer 14, wherein the thickness of the first photoresist 16 is smaller than the second photoresist 18a, as shown in FIG. 4B, and the first light The resistor 16 is, for example, located in the sensing region 100 and the second photoresist 18a is located, for example, in the peripheral region 200.

Then, with the first photoresist 16 and the second photoresist 18a as masks, the exposed portion of the metal layer 14 is removed and the transparent conductive layer 12 is exposed, as shown in FIG. 4C. Similarly, the exposed portion of the transparent conductive layer 12 is removed by using the first photoresist 16 and the second photoresist 18a as a mask, as shown in FIG. 4D. The removal steps depicted in Figures 4C and 4D are accomplished, for example, by an etch process. After the etching process, the transparent conductive layer 12 and the metal layer 14 are patterned to leave only the portion shielded by the first photoresist 16 and the second photoresist 18a.

Then, the first photoresist 16 and a portion of the second photoresist 18a are removed to form a third photoresist 18b and a portion of the metal layer 14 is exposed, as shown in FIG. 4E. Here, the method of removing the first photoresist 16 and a part of the second photoresist 18a is, for example, an ashing method. And the third photoresist 18b is composed of, for example, a thinned second photoresist 18a. That is, the third photoresist 18b and the second photoresist 18a have the same profile in the upper view, but have different thicknesses in the cross-sectional view.

Then, a portion of the metal layer 14 that is originally exposed by the first photoresist 16 and then exposed is removed to expose a portion of the transparent conductive layer 12, which constitutes the first sensing series 110 in FIG. 1, as shown in FIG. 4F. Show. At this time, the third photoresist 18b remains in the peripheral region 200 of the substrate 10.

Then, the third photoresist 18b is removed, that is, the patterned metal layer and the patterned transparent conductive layer are completed, as shown in FIG. 4G. Referring again to FIG. 4G and referring to FIG. 1 simultaneously, the patterned metal layer includes a plurality of metal transmission lines 214 (only one is shown here). The patterned transparent conductive layer includes a first sensing series 110 and a plurality of transparent transmission lines 212 (only one is shown here) in the peripheral region 200. In other words, the present embodiment is, for example, such that the first transparent bridge line 112 and the first sensing pad 114 are simultaneously fabricated, wherein the first transparent bridge line 112 and the first sensing pad 114 are directly connected into the first sensing series 110. Further, the transparent transmission line 212 is overlapped with the metal transmission line 214 to constitute the transmission line 210. Specifically, the pattern of the first photoresist 16 in the foregoing step is the pattern of the first sensing series 110. Moreover, in the embodiment, the material layers of two different materials can be patterned by a mask process to complete the fabrication of the transmission line 210 and the first sensing series 110, thereby helping to reduce the manufacturing cost of the touch panel. . .

Subsequently, referring to FIG. 4H, a patterned insulating layer 20 is formed and covers the first transparent bridge 112. In detail, the patterned insulating layer 20 can be patterned to cover only the first transparent bridge line 112 by a mask process.

Referring to FIG. 4I, a plurality of second transparent bridge wires 122 of the second sensing series 120 are formed on the patterned insulating layer 20. Moreover, a plurality of second sensing pads 124 are formed on the substrate 10 while forming the second transparent bridge wires 122. The second transparent bridge wires 122 and the second sensing pads 124 are simultaneously fabricated and directly connected to the first The second sensing series 120. In addition, since the first sensing pad 114 located between the peripheral area 200 and the sensing area 100 and the transparent transmission line 212 of the peripheral area 200 are continuous lines, the sensing signal of the first sensing series 110 can thereby Transfer to the transmission line 210.

Finally, please refer to FIG. 4J to form a protective layer 30. The protective layer 30 covers the first sensing series 110 and the second sensing series 120. So far, the production of the touch panel TP3 is completed. Similar to the embodiment of FIG. 2G, in the embodiment, the first sensing series 110 and the second sensing series 120 are all transparent members, which helps to improve the visual taste of the touch panel TP3.

In summary, the manufacturing method of the touch panel of the present invention uses a transparent conductive material to form a bridge wire, so that the touch panel can have a better visual quality. In addition, according to the manufacturing method of the touch panel of the present invention, a part of the transparent bridge wiring and the transmission line at the periphery can be completed by only one mask process, and the mask process is, for example, a halftone mask process or gray. Dimmer process. Therefore, the manufacturing method of the touch panel of the present invention contributes to reducing the number of mask processes and reducing the manufacturing cost.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

TP, TP1, TP2, TP3. . . Touch panel

10. . . Substrate

12. . . Transparent conductive layer

14. . . Metal layer

16. . . First photoresist

18a. . . Second photoresist

18b. . . Third photoresist

20. . . Patterned insulation

30. . . The protective layer

100. . . Sensing area

110. . . First sensing series

112. . . First transparent bridge wiring

114. . . First sensing pad

120. . . Second sensing series

122. . . Second transparent bridge wiring

124. . . Second sensing pad

200. . . Surrounding area

210. . . Transmission line

212. . . Transparent transmission line

214. . . Metal transmission line

X. . . X direction

Y. . . Y direction

M. . . region

FIG. 1 is a schematic diagram of a touch panel according to an embodiment of the invention.

2A to 2J are schematic diagrams showing a manufacturing process of a touch panel according to a first embodiment of the present invention.

3A to 3J are schematic diagrams showing a manufacturing process of a touch panel according to a second embodiment of the present invention.

4A to 4J are schematic diagrams showing a manufacturing process of a touch panel according to a third embodiment of the present invention.

10. . . Substrate

20. . . Patterned insulation

100. . . Sensing area

110. . . First sensing series

112. . . First transparent bridge wiring

114. . . First sensing pad

120. . . Second sensing series

122. . . Second transparent bridge wiring

124. . . Second sensing pad

200. . . Surrounding area

210. . . Transmission line

212. . . Transparent transmission line

214. . . Metal transmission line

Claims (9)

A method for manufacturing a touch panel includes the following steps: providing a substrate having a sensing area and a peripheral area around the sensing area; forming a plurality of first sensing series in the sensing area and a plurality of second sensing series and a plurality of transmission lines connected to the first sensing series and the second sensing series in the peripheral area, and extending directions of the first sensing series And extending the direction of the second sensing series, wherein the forming the first sensing series, the second sensing series, and the transmission lines comprises: forming a sequence on the substrate a transparent conductive layer and a metal layer; performing a patterning process to pattern the transparent conductive layer and the metal layer into a patterned transparent conductive layer and a patterned metal layer, the patterned transparent conductive layer including the first sense Detecting a plurality of first transparent bridge wires and a plurality of transparent transmission lines located in the peripheral region, and the patterned metal layer includes a plurality of metal transmission lines located in the peripheral region, wherein the transparent transmission lines and the metal transmission lines are stacked Construct The plurality of second transparent bridges are formed on the patterned insulating layer to form the second transparent bridge line. The method of manufacturing the touch panel of claim 1, further comprising: forming a plurality of first sensing pads, and the first sensing pads are connected to the first transparent bridge wires a first sensing series; and a plurality of second sensing pads are formed, and the second sensing pads are connected to the second sensing series by the second transparent bridge wires. The method of manufacturing the touch panel of claim 2, wherein the step of performing the patterning process further comprises: causing the patterned transparent conductive layer to include the first sensing pads. The method of manufacturing the touch panel of claim 2, wherein the step of performing the patterning process further comprises: causing the patterned transparent conductive layer to include the second sensing pads. The method of manufacturing the touch panel of claim 2, wherein the second transparent bridge lines are formed while the first sensing pads are formed. The method of manufacturing the touch panel of claim 2, wherein the second transparent pads are formed while the second sensing pads are formed. The method of manufacturing the touch panel of claim 1, further comprising forming a protective layer covering the first sensing series and the second sensing series. The method of manufacturing a touch panel according to claim 1, wherein the patterning process is a mask process. The method of manufacturing a touch panel according to claim 8, wherein the mask used in the mask process comprises a halftone mask or a gray dimming cover.