CN101699378B - Touch panel and manufacturing method thereof - Google Patents
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- CN101699378B CN101699378B CN2009101903989A CN200910190398A CN101699378B CN 101699378 B CN101699378 B CN 101699378B CN 2009101903989 A CN2009101903989 A CN 2009101903989A CN 200910190398 A CN200910190398 A CN 200910190398A CN 101699378 B CN101699378 B CN 101699378B
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- 239000000758 substrate Substances 0.000 claims abstract description 30
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- 238000000034 method Methods 0.000 claims description 29
- 239000011810 insulating material Substances 0.000 claims description 18
- 230000008569 process Effects 0.000 claims description 14
- 238000005530 etching Methods 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 8
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- 239000010410 layer Substances 0.000 description 37
- 238000002834 transmittance Methods 0.000 description 10
- 238000013461 design Methods 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
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- 235000012239 silicon dioxide Nutrition 0.000 description 3
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
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- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
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- 229910045601 alloy Inorganic materials 0.000 description 1
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Abstract
The invention provides a touch panel, which comprises a substrate, a plurality of sensing pads, a plurality of first bridge connectors, a plurality of second bridge connectors, a plurality of first insulation patterns and a plurality of second insulation patterns. The sensing pads are arranged on the substrate. The first bridge connectors are electrically connected in series with a part of sensing pads to form a plurality of first sensing series, and extend along a first direction. The second bridge connectors are electrically connected in series with other sensing pads to form a plurality of second sensing series. The first bridge connectors are positioned between the second bridge connectors and the substrate, and each second bridge connector extends along a second direction, wherein the first direction is not parallel with the second direction. The first insulation patterns are arranged between the first bridge connectors and the second bridge connectors and expose the sensing pads. The second insulation patterns cover the second bridge connectors and expose the sensing pads.
Description
[ technical field ] A method for producing a semiconductor device
The present invention relates to a touch panel, and more particularly, to a touch panel with good light transmittance.
[ background of the invention ]
With the rapid development of electronic technology and the popularization of wireless communication and network, the touch panel is often used as a human-machine interface between a human and an intelligent device to perform control. The common touch panels include resistive touch panels and capacitive touch panels.
In the capacitive touch panel, a plurality of sensing pads are disposed on a substrate, and a capacitive effect between the sensing pads is changed when a touch operation occurs. Therefore, the capacitive touch panel can sense a touch position by such a capacitive effect.
In order to protect the devices in the capacitive touch panel, chinese patent publication CN101334702 discloses a technique of disposing a whole scratch resistant layer and an anti-reflection layer on a substrate and covering all the sensing pads. In addition, the chinese patent publication CN101441545 also discloses a technique for covering all the sensing pads with a whole protection layer.
For example, fig. 5 is a schematic cross-sectional view illustrating a conventional touch panel. Referring to fig. 5, the touch panel 10 includes a substrate 11, a plurality of sensing pads 12, a plurality of first bridging lines 13, a plurality of second bridging lines 14, a plurality of insulation patterns 15, and an insulation layer 16. The sensing pads 12 are disposed on the substrate 11, the first bridging lines 13 are connected in series with the sensing pads 12, and the second bridging lines 14 are also connected in series with a portion of the sensing pads 12 not shown in the figure in a direction perpendicular to the plane of the figure. Generally, an insulation pattern 15 is disposed between the first bridging line 13 and the second bridging line 14 to prevent the two from being shorted together. In addition, the insulating layer 16 completely covers all of the sensing pads 12, the insulating patterns 15 and the second bridge lines 14. The insulating layer 16 may be a protective layer, a scratch resistant layer, or an anti-reflective layer.
With the current product design trend, the touch panel 10 is attached to or integrated with a display panel to form a touch display device with both display and touch functions. In order to ensure good display quality, the light penetration of the touch panel 10 is a critical design parameter of the touch panel. However, the configuration of the insulating layer 16 reduces the light transmittance of the touch panel 10, which is not favorable for the display quality of the touch display device. Thus, good protection and good display characteristics appear to be compromised in these prior designs.
[ summary of the invention ]
The invention provides a touch panel, which has good light penetration, and the bridging circuit of the bridging part with the highest protrusion of the touch panel is well protected.
The invention further provides a manufacturing method of the touch panel, which removes the insulating layer on the sensing pad while patterning the insulating layer, so that the touch panel has good optical characteristics.
The invention provides a touch panel, which includes a substrate. The substrate is provided with a plurality of first sensing series arranged along a first direction and a plurality of second sensing series arranged along a second direction. Each first sensing serial comprises a plurality of first sensing pads and a plurality of first bridging lines. Each first bridging line extends along the first direction and is electrically connected with two adjacent first sensing pads in series, and a first insulating pattern is arranged between the adjacent first sensing pads to cover the first bridging lines. Each second sensing serial comprises a plurality of second sensing pads and a plurality of second bridging lines. Each second bridging line extends along the second direction and is electrically connected in series with two adjacent second sensing pads, wherein each second bridging line is arranged on the upper surface of the first insulating pattern and is staggered with each first bridging line, and a second insulating pattern is arranged between the adjacent second sensing pads to cover the second bridging lines and expose the second sensing pads and the first sensing pads.
In an embodiment of the invention, the first direction is perpendicular to the second direction.
In an embodiment of the invention, the sensing pad is made of a transparent conductive material.
In an embodiment of the invention, the first insulating pattern covers the first bridging line and exposes two ends of the first bridging line.
In an embodiment of the invention, the coverage of the second insulating pattern is only above the first insulating pattern.
In an embodiment of the invention, the second insulating pattern covers the entire first insulating pattern and further extends to an area above the first bridging line.
The invention further provides a manufacturing method of the touch panel. First, a plurality of first bridging lines are formed on a substrate, and each first bridging line extends along a first direction. Then, a plurality of first insulation patterns are formed, wherein the first insulation patterns respectively cover the first bridging lines and expose two ends of each first bridging line. And finally, forming a plurality of sensing pads and a plurality of second bridging lines, wherein each second bridging line extends along a second direction. Some sensing pads directly contact two ends of the first bridging lines to form a plurality of first sensing series, and other sensing pads are connected by the second bridging lines to form a plurality of second sensing series. Then, an insulating material layer is formed on the substrate, and the insulating material layer covers the second bridging lines and the sensing pads. And patterning the insulating material layer by using a photomask as a mask to form a plurality of second insulating patterns, wherein the second insulating patterns respectively cover the second bridging lines and expose the sensing pads.
In an embodiment of the invention, the method of forming the first bridging line includes forming a metal layer on the substrate and performing a developing etching process to pattern the metal layer to form the first bridging line.
In an embodiment of the invention, the method of forming the sensing pad and the second bridge line includes forming a transparent conductive layer on the substrate and patterning the transparent conductive layer by a developing and etching process. The transparent conductive layer covers the first insulation patterns, and the second bridging lines are respectively positioned on the first insulation patterns.
In an embodiment of the invention, the method of forming the second insulating pattern includes performing a developing etching process using the mask as a mask to remove a portion of the insulating material layer on the sensing pad to form the second insulating pattern.
In an embodiment of the invention, the method of forming the first insulating pattern includes forming a material layer on the substrate, and performing a developing etching process to remove a portion of the material layer to form the first insulating pattern. The material layer covers the first bridging lines. The first insulating patterns are respectively positioned on the first bridging lines and expose two ends of each first bridging line.
Based on the above, in the touch panel manufacturing method of the invention, the sensing pad and the position thereof are exposed while the insulating layer is patterned, so that the position of the sensing pad has good light transmittance. In addition, the insulation pattern provides proper protection for the bridging line, so that the first sensing series and the first sensing series have good signal transmission quality. Therefore, the touch panel of the invention has good optical quality and electrical quality.
In order to make the aforementioned and other features and advantages of the invention more comprehensible, embodiments accompanied with figures are described in detail below.
[ description of the drawings ]
Fig. 1 is a schematic partial top view illustrating a touch panel according to an embodiment of the invention.
Fig. 2 is a schematic cross-sectional view of the cross-section line a-a' of fig. 1.
Fig. 3 is a schematic partial cross-sectional view illustrating a touch panel according to another embodiment of the invention.
FIG. 4 shows a sensing pad according to another embodiment of the present invention.
Fig. 5 is a schematic cross-sectional view illustrating a conventional touch panel.
[ detailed description ] embodiments
Fig. 1 is a partial top view schematically illustrating a touch panel according to an embodiment of the invention, and fig. 2 is a cross-sectional view of a cross-section line a-a' of fig. 1. Referring to fig. 1 and 2, the touch panel 100 includes a substrate 110, a plurality of sensing pads 120, a plurality of first bridge lines 130, a plurality of second bridge lines 140, a plurality of first insulating patterns 150, and a plurality of second insulating patterns 160.
The sensing pad 120 is disposed on the substrate 110. The first bridge lines 130 are electrically connected in series with part of the sensing pads 120 to form a plurality of first sensing series 170, and each of the first bridge lines 130 extends along a first direction D1. Each of the second bridge threads 140 extends along a second direction D2, wherein the first direction D1 is not parallel to the second direction D2. For example, the first direction D1 is perpendicular to the second direction D2, and the second bridge lines 140 are electrically connected in series with other sensing pads 120 to form a plurality of second sensing series 180. The first bridge connector 130 is located between the second bridge connector 140 and the substrate 110. The first insulation pattern 150 is disposed between the first sensing series 170 and the second sensing series 180. The second insulation pattern 160 covers the second bridge line 140 and exposes the sensing pad 120. It should be noted that the sensing pads 120 in the first sensing series 170 are, for example, first sensing pads, and the sensing pads 120 in the second sensing series 180 are, for example, second sensing pads. In the present embodiment, the first sensing pad and the second sensing pad are both represented by the sensing pad 120.
To achieve the above structure, the touch panel 100 may be manufactured by, for example, forming a plurality of first bridging lines 130 on the substrate 100. The method of forming the first bridge line 130 includes forming a metal layer (not shown) on the substrate 100 and performing a developing and etching process to pattern the metal layer (not shown) to form the first bridge line 130. The first bridge line 130 is made of metal. For example, the material of the first bridge line 130 includes aluminum, molybdenum, neodymium, chromium, or an alloy thereof.
Since the first sensing series 170 and the second sensing series 180 of the present embodiment partially overlap at the intersection of the first bridging lines 130 and the second bridging lines 140. In the present embodiment, a plurality of first insulation patterns 150 are formed to maintain the electrical property of the first sensing series 170 and the second sensing series 180 independently. The first insulating patterns 150 are respectively located on the first bridge lines 130, and the first insulating patterns 150 expose two ends of each of the first bridge lines 130. The method of forming the first insulation pattern 150 includes forming an insulating material layer (not shown) on the substrate 100, and performing a developing etching process to remove a portion of the material layer (not shown) to form the first insulation pattern 150. It should be noted that the material layer (not shown) may completely cover the first bridge lines 130 before the material layer is patterned. However, after the development etching process, the first insulating patterns 150 are respectively located on the first bridge lines 130 and expose both ends of each of the first bridge lines 130. In one embodiment, the height of the first insulation pattern 150 is, for example, 2.5 μm.
Then, a plurality of sensing pads 120 and a plurality of second bridge lines 140 are formed. As shown in fig. 2, a portion of the sensing pads 120 directly contact the two exposed ends of the first bridging lines 130 to form a plurality of first sensing series 170. The other sensing pads 120 are connected by the second bridge lines 140 to form a plurality of second sensing series 180.
Specifically, the method of forming the sensing pads 120 and the second bridge lines 140 includes forming a transparent conductive layer (not shown) on the substrate 100 and patterning the transparent conductive layer (not shown) by a developing and etching process. The transparent conductive layer (not shown) completely covers the first insulating pattern 150 before the patterning. In addition, the second bridge lines 140 of the present embodiment may be formed in the same step as the sensing pads 120, that is, the second bridge lines 140 and the sensing pads 120 are the same film layer. Under such a process, each of the second sensing strings 180 may be integrally formed.
It should be noted that the smaller the line widths of the first bridging line 130 and the second bridging line 140, the smaller the capacitive coupling effect between the two lines, which is helpful to improve the sensing sensitivity of the touch panel 100. Therefore, under the condition that the impedance value is allowable, the line width of the second bridging line 140 can be appropriately reduced to improve the quality of the touch panel 100.
The sensing pad 120 is located over a large area of the substrate 110. Therefore, the optical properties of the touch panel 100 are substantially determined by the position of the sensing pad 120. Specifically, the sensing pads 120 and the second bridge lines 140 are made of a transparent conductive material, such as ito or izo. Since the sensing pad 120 is made of a transparent material, it has a good light transmission property.
However, the height of the first insulation pattern 150 is about 2.5 μm, which is much more protruded than the sensing pad 120, so the second bridge line 140 is the most protruded conductor element in the touch panel 100. When the touch panel 100 is touched or collided by an external object, the second bridge wires 140 are easily damaged. Therefore, in order to protect the second bridge lines 140, a plurality of second insulating patterns 160 are formed to cover the second bridge lines 140 and expose the sensing pads 120, respectively.
In detail, the method of forming the second insulating pattern 160 includes forming an insulating material layer (not shown) on the substrate 100, and performing a developing etching process using a mask (not shown) as a mask to remove a portion of the insulating material layer (not shown) on the sensing pad 120. In practice, an insulating material layer (not shown) covers the second bridge lines 140 and the sensing pads 120 before patterning. In order to take the optical characteristics of the touch panel 100 into consideration, the sensing pad 120 is exposed when the second insulating pattern 160 is formed, so as to prevent the configuration of the insulating material from adversely affecting the light transmittance of the touch panel 100.
Generally, the first insulating pattern 150 and the second insulating pattern 160 are made of silicon dioxide, silicon nitride or organic insulating material. Of these, silicon dioxide is the highest cost, silicon nitride is the next lowest, and organic insulating materials are the lowest. Therefore, in order to reduce the manufacturing cost, an organic insulating material is often selected as the second insulating pattern 160 to provide a protective effect. However, silicon dioxide has the highest light transmittance and silicon nitride has the lowest light transmittance, and organic insulating materials have the lowest light transmittance, in terms of the physical properties of these materials. Therefore, the second insulating pattern 160 made of an organic insulating material may have an adverse effect on the light transmittance of the touch panel 100.
In the present embodiment, the second insulation pattern 160 does not cover the sensing pad 120. That is, most of the area of the touch panel 100 is not affected by the second insulating pattern 160. Therefore, when the touch panel 100 is applied to a touch display device, the light transmittance of the touch display device is not negatively affected by the second insulating pattern 160 on the touch panel 100. The touch panel 100 of the present embodiment can thus provide good optical properties to make the touch display device have an ideal display effect.
It should be noted that the first bridging line 130 is made of metal, and the position of the first bridging line is an area with poor light transmission property. The second bridge connectors 140 of the present embodiment are located on the first bridge connectors 130. Therefore, the second insulating patterns 160 protecting the second bridge lines 140 may be made of a material with poor optical transmittance without affecting the overall optical characteristics of the touch panel 100.
Fig. 3 is a schematic partial cross-sectional view illustrating a touch panel according to another embodiment of the invention. Referring to fig. 3, the touch panel 200 is substantially similar to the touch panel 100 in structural design. That is, the touch panel 200 also includes the substrate 110, the sensing pad 120, the first bridging line 130, the second bridging line 140, and other elements. However, the second insulating pattern 260 of the present embodiment further covers the first bridge line 130. That is, the second insulation pattern 260 covers the entire first insulation pattern 150 and further extends to the region above the first bridge line 130 to protect the connection between the sensing pad 120 and the first insulation pattern 150. As a result, the touch panel 200 has better quality.
It should be noted that the sensing pad design of the present invention is not limited to the diamond shape shown in fig. 1. FIG. 4 shows a sensing pad according to another embodiment of the present invention. For example, FIG. 4 illustrates a hexagonal pattern of sensor pads 320. It should be noted that the second insulating pattern 360 in fig. 4 is disposed at the crossing of the first bridging lines 330 and the second bridging lines 340 and exposes the sensing pads 320. However, in other embodiments, the sensing pad may be designed in various shapes such as a pentagon, an octagon, a circle, or an ellipse according to different design requirements. Regardless of the design of the sensing pad, the technology of exposing the sensing pad by the second insulating pattern of the present invention is helpful to improve the light transmission property of the touch panel.
In summary, under the design of the invention, the second bridging lines and the first bridging lines can be protected by the second insulating patterns, so that the touch panel has good signal transmission quality. Meanwhile, the position of the sensing pad has good light penetration, so that the touch panel has ideal optical characteristics. In addition, the material of the insulating pattern can be selected from cheaper types, which is helpful for reducing the manufacturing cost of the touch panel. Therefore, the touch panel of the invention at least has the advantages of high quality, good physical properties and low manufacturing cost.
Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
In the above embodiments, the present invention has been described only by way of example, but various modifications may be made by those skilled in the art without departing from the spirit and scope of the invention after reading the present patent application.
Claims (11)
1. A touch panel, comprising:
a substrate having a plurality of first sensing series arranged along a first direction and a plurality of second sensing series arranged along a second direction; wherein,
each of the first sensing serials comprises:
a plurality of first sensing pads; and
the first bridging lines extend along the first direction and are electrically connected in series with two adjacent first sensing pads, and a first insulating pattern is arranged between the adjacent first sensing pads and covers the first bridging lines;
each of the second sensing series comprises:
a plurality of second sensing pads; and
and a plurality of second bridging lines, each second bridging line extending along the second direction and electrically connected in series with two adjacent second sensing pads, wherein each second bridging line is arranged on the first insulating pattern and staggered with each first bridging line, and a second insulating pattern is arranged between the adjacent second sensing pads to cover the second bridging lines and expose the plurality of second sensing pads and the plurality of first sensing pads.
2. The touch panel of claim 1, wherein: the first direction is orthogonal to the second direction.
3. The touch panel of claim 1, wherein: the sensing pads are made of a transparent conductive material.
4. The touch panel of claim 1, wherein: the first insulating patterns cover the first bridging lines and expose two ends of the first bridging lines.
5. The touch panel of claim 1, wherein: the plurality of second insulation patterns cover only the plurality of first insulation patterns.
6. The touch panel of claim 1, wherein: the second insulating patterns cover the whole first insulating patterns and further extend to the upper area of the first bridging lines.
7. A method for manufacturing a touch panel is characterized by comprising the following steps:
forming a plurality of first bridging lines on a substrate, wherein each first bridging line extends along a first direction;
forming a plurality of first insulation patterns, wherein the first insulation patterns cover the first bridging lines respectively and expose two ends of each first bridging line;
forming a plurality of sensing pads and a plurality of second bridging lines, wherein each second bridging line extends along a second direction, part of the sensing pads directly contact two ends of the first bridging lines to form a plurality of first sensing series, and the other sensing pads are connected by the second bridging lines to form a plurality of second sensing series;
forming an insulating material layer on the substrate, wherein the insulating material layer covers the second bridging lines and the sensing pads; and
and patterning the insulating material layer by using a photomask as a mask to form a plurality of second insulating patterns, respectively covering the plurality of second bridging lines and exposing the plurality of sensing pads.
8. The method for manufacturing a touch panel according to claim 7, wherein the step of forming the first bridge lines comprises:
forming a metal layer on the substrate; and
a developing etching process is performed to pattern the metal layer to form the plurality of first bridging lines.
9. The method of claim 7, wherein the step of forming the first insulating patterns comprises:
forming a material layer on the substrate, wherein the material layer covers the plurality of first bridging lines; and
and performing a developing etching process to remove a part of the material layer to form a plurality of first insulating patterns, wherein the plurality of first insulating patterns are respectively positioned on the plurality of first bridging lines and expose two ends of each first bridging line.
10. The method of claim 7, wherein the forming the sensing pads and the second bridge lines comprises:
forming a transparent conductive layer on the substrate, wherein the transparent conductive layer covers the first insulation patterns; and
and patterning the transparent conductive layer by a developing and etching process to form a plurality of sensing pads and a plurality of second bridging lines, wherein the plurality of second bridging lines are respectively positioned on the plurality of first insulating patterns.
11. The method of claim 7, wherein the step of forming the second insulating patterns comprises performing a developing and etching process to remove portions of the insulating material layer on the sensing pads to form the second insulating patterns.
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Families Citing this family (11)
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KR101314779B1 (en) * | 2010-08-18 | 2013-10-08 | 엘지디스플레이 주식회사 | Electrostatic capacity type touch screen panel and method of manufacturing the same |
CN102446012B (en) * | 2010-09-30 | 2015-04-08 | 联胜(中国)科技有限公司 | Touch panel structure and touch display panel |
CN102360258B (en) * | 2011-09-30 | 2014-06-18 | 汕头超声显示器(二厂)有限公司 | Monolithic capacitive touch screen and production method thereof |
CN103207710B (en) * | 2012-01-11 | 2016-05-04 | 宜昌南玻显示器件有限公司 | Capacitive touch screen and preparation method thereof |
TWI475285B (en) * | 2012-02-23 | 2015-03-01 | Chunghwa Picture Tubes Ltd | Method of fabricating a touch panel |
CN102646000B (en) * | 2012-03-02 | 2015-09-09 | 华映光电股份有限公司 | The manufacture method of contact panel |
CN102760018B (en) * | 2012-06-18 | 2015-10-28 | 汕头超声显示器(二厂)有限公司 | The monolithic capacitive touch screen of Touch-control error prevention |
CN102707859B (en) * | 2012-06-18 | 2015-10-28 | 汕头超声显示器(二厂)有限公司 | A kind of monolithic capacitive touch screen of Touch-control error prevention and manufacture method thereof |
TWI553534B (en) * | 2014-10-09 | 2016-10-11 | 友達光電股份有限公司 | Capacitive touch panel, method of fabricating capacitive touch panel and touch display device |
CN105988647B (en) * | 2015-02-05 | 2019-01-22 | 汕头超声显示器技术有限公司 | A kind of less capacitance touch screen manufacturing method of processing procedure |
TWI701584B (en) * | 2019-04-25 | 2020-08-11 | 緯創資通股份有限公司 | Touch panel |
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