KR20120069226A - Touch screen panel and fabricating method thereof - Google Patents

Abstract

PURPOSE: A touch screen panel and manufacturing method thereof are provided to simplify processes and to reduce manufacturing costs by reducing the number of mask processes. CONSTITUTION: First sensing patterns are arranged on a board according to a first direction. First connecting patterns connect the sensing patterns. Second sensing patterns(22a) are arranged on the board according to a second direction. A first insulation film is formed between the first sensing patterns and the second sensing patterns and includes a first contact hole which exposes a section of the second sensing patterns. Second connecting patterns(22b) connects the second sensing patterns through a first contact hole. Position detecting lines(30) are connected with the first sensing patterns and the second sensing patterns.

Description

Touch screen panel and its manufacturing method {Touch Screen Panel and Fabricating Method

The present invention relates to a touch screen panel and a method for manufacturing the same, and more particularly to a touch screen panel and a method for manufacturing the same that can reduce the number of mask processes.

The touch screen panel is an input device that allows a user to input a command by selecting an instruction displayed on a screen of a video display device or the like as a human hand or an object.

To this end, the touch screen panel is provided on the front face of the image display device to convert a contact position in direct contact with a human hand or an object into an electrical signal. Accordingly, the instruction content selected at the contact position is received as an input signal.

Such a touch screen panel can be replaced with a separate input device connected to the image display device such as a keyboard and a mouse, and the use range thereof is gradually expanding.

As a method of implementing a touch screen panel, a resistive film method, a light sensing method, and a capacitive method are known.

Among the capacitive touch screen panels, when a human hand or an object comes into contact with each other, the touch sensing panel converts a contact position into an electrical signal by detecting a change in capacitance formed by a conductive sensing pattern around another sensing pattern or a ground electrode. do.

To this end, the capacitive touch screen panel includes a plurality of first sensing patterns formed to be connected in a first direction, a plurality of second sensing patterns formed to be connected in a second direction, and respective sensing patterns. By having a connected position detection line, the coordinates of the contact position are grasped.

However, in this case, since each sensing pattern and the position detection line are formed by different processes, a separate mask is required. Accordingly, there is a problem that the process is complicated and manufacturing efficiency is lowered.

SUMMARY OF THE INVENTION An object of the present invention devised to solve the above problems is to provide a touch screen panel and a method of manufacturing the same, which can simplify the process by reducing the number of mask processes.

According to a feature of the present invention for achieving the above object, the touch screen panel of the present invention, connecting the first sensing patterns and a plurality of first sensing patterns arranged in a first direction on a substrate; A plurality of first connection patterns, a plurality of second sensing patterns arranged along a second direction on the substrate, and formed on the first sensing patterns and the second sensing patterns; A first insulating layer including a first contact hole exposing a region, second connection patterns connecting second sensing patterns through the first contact hole, and a protective layer formed on the second connection patterns, respectively; Include.

In addition, position detection lines connected to first sensing patterns connected by the first connection patterns and second sensing patterns connected by the second connection patterns, and pads connected to the position detection line, respectively. It further includes patterns.

In addition, the position detection lines and the pad patterns are located inside the first insulating layer, and the first insulating layer further includes a second contact hole exposing the pad patterns.

In addition, the position detection lines and the pad patterns are formed of the same material.

The apparatus may further include a connection layer formed on the pad patterns.

The method may further include a residual layer formed of the same material as the first sensing patterns, the first connection patterns, and the second sensing patterns, and positioned under the position detection lines and the pad patterns.

In the method of manufacturing a touch screen panel of the present invention, (a) sequentially forming a transparent electrode film and a first conductive film on one surface of a substrate, and (b) using the first mask as a halftone mask, A plurality of first sensing patterns connected in a first direction by first connection patterns from the transparent electrode film and along a second direction crossing the first direction by patterning a first conductive film together Forming second sensing patterns and forming a plurality of position detection lines from the first conductive film, (c) forming a first insulating film on the first sensing patterns and the second sensing patterns, ( d) patterning the first insulating layer using a second mask to expose one region of each of the second sensing patterns; (e) sequentially forming a second conductive layer and a second insulating layer on the first insulating layer; And (f) third mask And patterning the second conductive film and the second insulating film together to form second connection patterns connecting the second sensing patterns exposed through the first insulating film from the second conductive film, and from the second insulating film. Forming protective layers on the second connection patterns.

In addition, in the step (b), (b-1) forming a photoresist film on the first conductive film, and (b-2) patterning the photoresist film by using the first mask, thereby forming a first height and Forming photoresist patterns having a second height lower than the first height, (b-3) removing the transparent electrode film and the first conductive film existing in the remaining regions except the lower side of each photoresist pattern; (b-4) removing the photoresist patterns having the second height, (b-5) removing the first conductive layer existing in the remaining regions except the lower side of each photoresist pattern; and (b-6 ) Removing photoresist patterns remaining on the first conductive layer.

In the step (d), (d-1) forming a photoresist film on the first insulating film, and (d-2) patterning the photoresist film using the second mask to have a predetermined interval. Forming photoresist patterns, (d-3) removing the first insulating layer existing in the remaining regions except for the lower side of the photoresist patterns, thereby exposing a first contact hole exposing one region of each of the second sensing patterns. And forming (d-4) removing the photoresist patterns remaining on the first insulating layer.

In addition, in the step (f), (f-1) forming a photoresist film on the second insulating film, and (f-2) patterning the photoresist film using the third mask to have a predetermined interval. Forming photoresist patterns, (f-3) removing the second conductive film and the second insulating film existing in the remaining regions except the lower side of the photoresist patterns, and (f-4) on the second insulating film. Removing the remaining photoresist patterns.

In addition, the step (f-3) may include: (f-3a) first removing the second insulating film present in the remaining regions except for the lower side of the photoresist patterns; and (f-3b) removing the second photoresist patterns. And secondly removing the second conductive film present in the remaining region except the lower side.

The position detection lines may be electrically connected to first sensing patterns connected by the first connection patterns and second sensing patterns connected by the second connection patterns, respectively.

In the step (b), the pad patterns may be further formed from the first conductive layer to be connected to the position detection lines.

In the step (d), the first insulating layer is patterned using a second mask to expose one region of each of the second sensing patterns and one region of the pad patterns.

In the step (d), (d-1) forming a photoresist film on the first insulating film, and (d-2) patterning the photoresist film using the second mask to have a predetermined interval. Forming photoresist patterns, (d-3) a first contact hole exposing a region of each of the second sensing patterns by removing the first insulating layer existing in the remaining regions except for the lower side of the photoresist patterns; Forming a second contact hole exposing a region of the pad patterns; and (d-4) removing photoresist patterns remaining on the first insulating layer.

Also, in the step (f), a connection layer may be further formed on the pad patterns from the second conductive layer by using a third mask, which is a halftone mask.

In addition, in step (f), (f-1) forming a photoresist film on the second insulating film, and (f-2) patterning the photoresist film by using the third mask to form a third height and the Forming photoresist patterns having a fourth height lower than the third height, (f-3) removing the second conductive film and the second insulating film existing in the remaining areas except the lower side of the photoresist patterns, ( f-4) removing the photoresist patterns having the fourth height; (f-5) removing the second insulating layer existing in the remaining regions except the lower side of each photoresist pattern; and (f-6) Removing photoresist patterns remaining on the second insulating layer.

According to the present invention as described above, it is possible to provide a touch screen panel and a manufacturing method thereof that can simplify the process by reducing the number of mask processes.

1 is a view showing a touch screen panel according to a first embodiment of the present invention.
2 is a plan view illustrating main parts of the first sensing patterns and the second sensing patterns according to the first embodiment of the present invention.
3 is a cross-sectional view of a touch screen panel according to a first embodiment of the present invention.
4A to 4G are cross-sectional views illustrating a method of manufacturing the touch screen panel illustrated in FIG. 3 based on a first mask.
5A through 5D are diagrams illustrating a method of manufacturing the touch screen panel illustrated in FIG. 3, based on a second mask.
6A through 6E are diagrams illustrating a method of manufacturing the touch screen panel illustrated in FIG. 3, based on a third mask.
7 is a cross-sectional view of a touch screen panel according to a second embodiment of the present invention.
8A to 8G illustrate a method of manufacturing the touch screen panel illustrated in FIG. 7 based on a third mask that is a halftone mask.

Specific details of other embodiments are included in the detailed description and the drawings.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments described below, but may be embodied in various forms. In the following description, it is assumed that a part is connected to another part, But also includes a case in which other elements are electrically connected to each other in the middle thereof. In the drawings, parts not relating to the present invention are omitted for clarity of description, and like parts are denoted by the same reference numerals throughout the specification.

Hereinafter, the present invention will be described with reference to the accompanying drawings.

1 is a view showing a touch screen panel according to a first embodiment of the present invention, FIG. 2 is a plan view of main parts showing first sensing patterns and second sensing patterns according to a first embodiment of the present invention, and FIG. 3. Is a cross-sectional view of a touch screen panel according to a first embodiment of the present invention. In particular, FIG. 3 is a cross-sectional view of the sensing patterns 21a and 22a and the connection patterns 21b and 22b based on the line II ′ shown in FIG. 2, and other position detection lines 30. ) And a cross-sectional view of the pad patterns 40.

1 to 3, a touch screen panel according to a first embodiment of the present invention may include a substrate 10, first sensing patterns 21a, second sensing patterns 22a, and first connection patterns. 21b, second connection patterns 22b, position detection lines 30, and pad patterns 40.

The substrate 10 may include an active region in which the sensing patterns 21a and 22a and the connection patterns 21b and 22b are located, and an inactive region in which the position detection lines 30 and the pad patterns 40 are positioned (the active region). A transparent substrate formed of an outer region of the region, for example, may be made of an insulating material such as glass, plastic, silicon, or synthetic resin, and may be a flexible film.

A plurality of first sensing patterns 21a are arranged along a first direction (for example, the Y-axis direction), and are connected to each other by the first connection patterns 21b.

The second sensing patterns 22a are arranged at predetermined intervals so as not to overlap the first sensing patterns 21a along a second direction (for example, the X-axis direction), and the second connection patterns 22b. ) Are interconnected.

The first connection patterns 21b and the second connection patterns 22b are interposed between the first insulating layer 140 to maintain an insulating state.

The first insulating layer 140 is formed on the first sensing patterns 21a and the second sensing patterns 22a and exposes a first contact hole ch1 exposing a region of the second sensing patterns 22a. Is formed.

The second connection patterns 22b connect the second sensing patterns 22a which are adjacent to each other through the first contact hole ch1.

In addition, when the first insulating layer 140 is entirely formed as shown in FIG. 3, the position detection lines 30 and the pad patterns 40 are positioned inside the first insulating layer 140, and the pad pattern is disposed on the first insulating layer 140. A second contact hole ch2 exposing the fields 40 to the outside is formed.

At this time, the protective layer 50 is formed on the upper side of the second connection patterns 22b, respectively, and serves to protect the second connection patterns 22b.

The first sensing patterns 21a, the second sensing patterns 22a, and the first connection patterns 21b may be formed of a transparent conductive material such as indium tin oxide (ITO), and the second connection patterns The 22b may be formed of the above transparent conductive material, but is preferably formed of a metal.

The position detection lines 30 are connected to the first sensing patterns 21a, which are connected in units of columns by the first connection patterns 21b, and are connected in units of rows by the second connection patterns 22b. Also connected to the second sensing patterns 22a.

The position detection lines 30 are disposed outside the touch screen panel to avoid an active area in which an image is displayed, and molybdenum (Mo), silver (Ag), titanium (Ti), copper (Cu), and aluminum ( Ti) and molybdenum / aluminum / molybdenum (Mo / Al / Mo).

The pad patterns 40 may be connected to the position detection lines 30, respectively, and may be connected to a flexible printed circuit board (FPCB) on which a touch driving circuit or the like is mounted.

The pad patterns 40 may be formed together in the same process using the same material as the position detection lines 30.

In addition, a residual layer 70 is present below the position detection lines 30 and the pad patterns 40, and the residual layer 70 is formed of the first sensing patterns 21a and the second sensing patterns ( 22a and the transparent electrode layer 110 (see FIG. 4a) forming the first connection patterns 21b may be hidden from the position detection lines 30 and the pad patterns 40 in the process of etching. Therefore, the first sensing patterns 21a, the second sensing patterns 22a, and the first connection patterns 21b may be formed of the same material and positioned on the same layer.

4A to 4G are cross-sectional views illustrating a method of manufacturing the touch screen panel illustrated in FIG. 3 based on a first mask, and FIGS. 5A to 5D illustrate a method of manufacturing the touch screen panel illustrated in FIG. 6A to 6E are diagrams illustrating a method of manufacturing the touch screen panel illustrated in FIG. 3, based on a third mask.

The method of manufacturing the touch screen panel according to the first embodiment of the present invention will be described in detail below with reference to FIGS. 4A to 6E. First, the first mask M1 will be described with reference to FIGS. Take a look.

Referring to FIG. 4A, first, the transparent electrode film 110 and the first conductive film 120 are sequentially formed on one surface of the substrate 10.

Next, the transparent electrode layer 110 and the first conductive layer 120 are patterned together using a first mask M1, which is a halftone mask, to form a plurality of first sensing patterns from the transparent electrode layer 110. 21a), first connection patterns 21b and second sensing patterns 22a are formed, and a plurality of position detection lines 30 are formed from the first conductive layer 120.

The halftone mask is generally composed of a light transmitting part, a light blocking part which completely blocks the light, and a semi-transmitting part which adjusts the transmittance to transmit a part of the light. By using this, a pattern layer having a different height for each position can be formed. .

In detail, the photoresist film 130 is formed on the first conductive film 120 as illustrated in FIG. 4B, and then exposed and developed through the first mask M1, which is a halftone mask. The photoresist layer 130 is patterned to form photoresist patterns 131 and 132 having different heights as illustrated in FIG. 4C.

The first photoresist patterns 131 having the first height h1 are positioned in the region where the position detection lines 30 and the pad patterns 40 are to be formed, and have a second lower than the first height h2. The second photoresist patterns 132 having a height h2 are positioned in regions where the first sensing patterns 21a, the first connection patterns 21b, and the second sensing patterns 22a are to be formed.

Then, the transparent electrode film 110 and the first conductive film 120 existing in the remaining regions except for the lower sides of the photoresist patterns 131 and 132 are removed as shown in FIG. 4D through an etching process.

For example, first, a portion of the first conductive layer 120 exposed between the photoresist patterns 131 and 132 is first removed through an etching process, and then the first conductive layer 120 is secondly removed. The transparent electrode film 110 exposed through the portion may be etched and removed.

Next, as shown in FIG. 4E, the second photoresist patterns 132 having the second height h2 are removed through a subsequent ashing process. In this case, an upper portion of the first photoresist patterns 131 having the first height h1 is also removed to lower the height. Accordingly, the first conductive layer 120 existing under the second photoresist patterns 132 is exposed.

Thereafter, as illustrated in FIG. 4F, the first conductive layer 120 existing in the remaining regions except for the lower side of the remaining first photoresist patterns 131 after the second photoresist patterns 132 are removed is etched. Removed through the process. Accordingly, the first sensing patterns 21a, the first connection patterns 21b, and the second sensing patterns 22a positioned in the active region are completely formed.

Next, as shown in FIG. 4G, as the first photoresist patterns 131 remaining on the first conductive layer 120 are removed, the position detection lines 30 and the pad patterns 40 may be removed. This is formed completely.

In addition, a portion of the transparent electrode film 110 remains below the position detection lines 30 and the pad patterns 40. The remaining transparent electrode film 110 is defined as a residual film layer 70.

Next, a manufacturing method of the touch screen panel according to the first embodiment of the present invention will be described with reference to FIGS. 5A to 5D.

First, referring to FIG. 5A, first sensing patterns 21a, first connection patterns 21b, second sensing patterns 22a, position detection lines 30, and pad patterns 40 are formed. The first insulating layer 140 is formed on the substrate 10. For example, the first insulating layer 140 may be formed on the entire surface of the substrate 10. Accordingly, the first sensing patterns 21a, the first connection patterns 21b, and the second sensing pattern may be formed. Fields 22a, position detection lines 30, and pad patterns 40 may be positioned inside the first insulating layer 140.

Thereafter, the first insulating layer is patterned using a second mask M2 to expose one region of each of the second sensing patterns 22a.

In detail, as shown in FIG. 5A, the photoresist film 150 is formed on the first insulating layer 140, and then the exposure and development processes are performed through the second mask M2 to thereby form the photoresist. The resist film 150 is patterned to form photoresist patterns 134 having a predetermined interval as shown in FIG. 5B.

The region removed from the photoresist film 150 may be a region in which a first contact hole ch1 is formed to expose a region of the second sensing patterns 22a and a region of the pad patterns 40 may be exposed. The second contact hole ch2 is formed.

Next, referring to FIG. 5C, one region of the second sensing patterns 22a is removed by removing the first insulating layer 140 existing in the remaining regions except the lower side of the photoresist patterns 134 by an etching process. A second contact hole ch2 exposing the first contact hole ch1 and one region of the pad patterns 40 is formed. The etching process is performed by etching the first insulating layer 140 exposed between the photoresist patterns 134 until one region of the second sensing patterns 22a and one region of the pad patterns 40 are exposed. Can be achieved.

Thereafter, as shown in FIG. 5D, the photoresist patterns 134 remaining on the first insulating layer 140 are removed.

Next, a method of manufacturing a touch screen panel according to a first embodiment of the present invention will be described with reference to FIGS. 6A to 6E.

First, referring to FIG. 6A, a second conductive layer 160 and a second insulating layer 170 are sequentially formed on the first insulating layer 140 on which the contact holes ch1 and ch2 are formed. The second conductive layer 160 is inserted into the contact holes ch1 and ch2 to contact the second sensing patterns 22a and the pad patterns 40.

Thereafter, the second conductive layer 160 and the second insulating layer 170 are patterned together using a third mask M3 to expose the second conductive layer 160 from the second conductive layer 160 through the first insulating layer 140. Forming second connection patterns 22b connecting the second sensing patterns 22a and being disposed on the second connection patterns 22b from the second insulating layer 170. 50).

In detail, the photoresist layer 180 is formed on the second insulating layer 170 as shown in FIG. 6B, and then the exposure and development processes are performed through the third mask M3. The resist film 180 is patterned to form photoresist patterns 136 having a predetermined interval as shown in FIG. 6C.

The photoresist patterns 136 are positioned in regions where the second connection patterns 22b and the protective layer 50 are to be formed.

Referring to FIG. 6D, the second conductive layer 160 and the second insulating layer 170 existing in the remaining regions except the lower side of the photoresist patterns 136 are removed by an etching process.

For example, first, a portion of the second insulating layer 170 exposed between each photoresist pattern 136 is first removed through an etching process, and then secondly exposed through a portion from which the second insulating layer 170 is removed. The second conductive film 160 may be removed through an etching process.

Accordingly, the second conductive layer 160 is separately formed and formed of second connection patterns 22b connecting the second sensing patterns 22a through the first contact hole ch1, and the second insulating layer 160. 170 is separated and formed as a protective layer 50 formed on each of the second connection patterns 22b, and the pad patterns 40 are exposed to the outside through the second contact hole ch2. Can be.

Thereafter, as shown in FIG. 6E, the photoresist patterns 136 remaining on the second insulating layer 170 are removed to complete the touch screen panel according to the first embodiment of the present invention.

Therefore, by using the halftone mask as the first mask M1, the first sensing patterns 21a, the first connection patterns 21b, the second sensing patterns 22a, and the position detection lines are used as one mask. 30 and the pad patterns 40 may be formed, and the second connection patterns 22b and the protective layer 50 may be formed from the second conductive layer 160 and the second insulating layer 170. By using only three masks M3, the overall number of masks can be reduced to simplify the process.

7 is a cross-sectional view of a touch screen panel according to a second embodiment of the present invention, and FIGS. 8A to 8G are diagrams illustrating a method of manufacturing the touch screen panel shown in FIG. 7 based on a third mask, which is a halftone mask.

In the touch screen panel according to the second embodiment of the present invention, the connection layer 60 formed on the pad patterns 40 exposed through the second contact hole ch2 in the first embodiment described above is further added. Included. Therefore, other configurations are the same as those in the first embodiment and will be omitted below.

The connection layer 60 is formed to prevent corrosion of the pad patterns 40, and is particularly useful when the pad patterns 40 are made of molybdenum (Mo) -based metal.

In addition, the connection layer 60 is preferably formed together in the same process with the same material as the second connection patterns 22b in the second embodiment of the present invention, which will be described below with reference to FIGS. 8A to 8G. do. However, since only the halftone mask is used as the third mask M3 as compared with the first embodiment, the first mask M1 and the second mask M2 processes are the same as in the first embodiment, and thus are omitted. Only the third mask M3 process will be described below.

First, referring to FIG. 8A, a second conductive layer 160 and a second insulating layer 170 are sequentially formed on the first insulating layer 140 on which the contact holes ch1 and ch2 are formed. The second conductive layer 160 is inserted into the contact holes ch1 and ch2 to contact the second sensing patterns 22a and the pad patterns 40.

Thereafter, the second conductive film 160 and the second insulating film 170 are patterned together by using a third mask M3, which is a halftone mask, to form the first insulating film 140 from the second conductive film 160. Second connection patterns 22b connecting the second sensing patterns 22a and the connection layer 60 on the pad patterns 40 are formed, and the second insulating layer A protective layer 50 is formed on the second connection patterns 22b from 170.

In detail, the photoresist layer 180 is formed on the second insulating layer 170 as shown in FIG. 8B, and then the exposure and development processes are performed through the third mask M3, which is a halftone mask. The photoresist film 180 is patterned to form photoresist patterns 138 and 139 having different heights as shown in FIG. 8C.

The third photoresist patterns 138 having the third height h3 are positioned in the region where the second connection patterns 22b and the protective layer 50 are to be formed, and are lower than the third height h3. The fourth photoresist patterns 139 having the height h4 are positioned in the region where the connection layer 60 is to be formed.

As illustrated in 8d, the second conductive layer 160 and the second insulating layer 170 existing in the remaining regions except for the lower side of the photoresist patterns 138 and 139 are removed by an etching process.

For example, first, a portion of the second insulating layer 170 exposed between the photoresist patterns 138 and 139 is first removed through an etching process, and then a portion where the second insulating layer 170 is secondly removed is removed. A portion of the second conductive film 160 exposed through the etching process may be removed.

Thereafter, the fourth photoresist patterns 139 having the fourth height h4 are removed through a subsequent ashing process as shown in FIG. 8E. In this case, an upper portion of the third photoresist patterns 138 having the third height h3 is also removed to lower the height. Accordingly, the second insulating layer 170 existing under the fourth photoresist patterns 139 is exposed.

As shown in 8f, the second insulating layer 170 existing in the remaining regions except the lower side of the remaining third photoresist patterns 138 after the fourth photoresist patterns 139 is removed is etched through the etching process. Remove Accordingly, the connection layer 60 positioned on the pad patterns 40 is finally completed.

Thereafter, as shown in FIG. 8G, the third photoresist patterns 138 remaining on the second insulating layer 170 are removed, so that the second connection patterns 22b and the protective layer 50 are completed. do.

Therefore, by using the halftone mask as the third mask M3, the connection layer 60 which prevents corrosion of the pad patterns 40 may be formed simultaneously with the second connection patterns 22b.

It will be understood by those skilled in the art that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. The scope of the present invention is indicated by the scope of the following claims rather than the detailed description, and all changes or modifications derived from the meaning and scope of the claims and the equivalent concept are included in the scope of the present invention. Should be interpreted.

10: substrate 21a: first sensing patterns
21b: first connection patterns 22a: second sensing patterns
22b: second connection patterns 30: position detection line
40: pad patterns 50: protective layer
60: connection layer

Claims (17)

A plurality of first sensing patterns connecting the first sensing patterns and a plurality of first sensing patterns arranged in a first direction on a substrate;
A plurality of second sensing patterns arranged on the substrate in a second direction;
A first insulating layer formed on the first sensing patterns and the second sensing patterns and including a first contact hole exposing a region of the second sensing patterns;
Second connection patterns connecting second sensing patterns through the first contact hole; And
Protective layers formed on the second connection patterns, respectively; Touch screen panel comprising a. The method of claim 1,
Position detection lines connected to first sensing patterns connected by the first connection patterns and second sensing patterns connected by the second connection patterns, respectively; And
Pad patterns connected to the position detection line; Touch screen panel further including. The method of claim 2,
The position detection lines and the pad patterns are located inside the first insulating layer,
And the first insulating layer further comprises a second contact hole exposing the pad patterns. The method of claim 2,
And the position detection lines and the pad patterns are formed of the same material. The method of claim 3, wherein
A connection layer formed on the pad patterns; Touch screen panel further including. The method of claim 3, wherein
A residual layer formed of the same material as the first sensing patterns, the first connection patterns, and the second sensing patterns, and positioned under the position detection lines and the pad patterns; Touch screen panel further including. (a) sequentially forming a transparent electrode film and a first conductive film on one surface of the substrate;
(b) a plurality of first sensing patterns connected together in a first direction by first connection patterns from the transparent electrode film by patterning the transparent electrode film and the first conductive film together using a first mask, which is a halftone mask; And a plurality of second sensing patterns arranged along a second direction crossing the first direction, and forming a plurality of position detection lines from the first conductive film;
(c) forming a first insulating layer on the first sensing patterns and the second sensing patterns;
(d) patterning the first insulating layer using a second mask to expose one region of each of the second sensing patterns;
(e) sequentially forming a second conductive film and a second insulating film on the first insulating film; And
(f) patterning the second conductive layer and the second insulating layer together using a third mask to form second connection patterns connecting the second sensing patterns exposed from the second conductive layer through the first insulating layer; Forming protective layers on the second connection patterns from the second insulating layer; Method of manufacturing a touch screen panel comprising a. The method of claim 7, wherein step (b),
(b-1) forming a photoresist film on the first conductive film;
(b-2) patterning the photoresist film using the first mask to form photoresist patterns having a first height and a second height lower than the first height;
(b-3) removing the transparent electrode film and the first conductive film existing in the remaining areas except the lower side of each photoresist pattern;
(b-4) removing the photoresist patterns having the second height;
(b-5) removing the first conductive film present in the remaining regions except for the lower side of each photoresist pattern; And
(b-6) removing the photoresist patterns remaining on the first conductive film; Method of manufacturing a touch screen panel comprising a. The method of claim 7, wherein step (d),
(d-1) forming a photoresist film on the first insulating film;
(d-2) patterning the photoresist film using the second mask to form photoresist patterns having a predetermined interval;
(d-3) forming a first contact hole exposing one region of each of the second sensing patterns by removing the first insulating layer existing in the remaining regions except for the lower side of the photoresist patterns; And
(d-4) removing the photoresist patterns remaining on the first insulating film; Method of manufacturing a touch screen panel comprising a. The method of claim 7, wherein step (f),
(f-1) forming a photoresist film on the second insulating film;
(f-2) patterning the photoresist film using the third mask to form photoresist patterns having a predetermined interval;
(f-3) removing the second conductive film and the second insulating film existing in the remaining areas except the lower side of the photoresist patterns; And
(f-4) removing the photoresist patterns remaining on the second insulating film; Method of manufacturing a touch screen panel comprising a. The method of claim 10, wherein the step (f-3),
(f-3a) first removing the second insulating film present in the remaining regions except for the lower sides of the photoresist patterns; And
(f-3b) secondarily removing the second conductive film present in the remaining regions except for the lower sides of the photoresist patterns; Method of manufacturing a touch screen panel comprising a. The method of claim 7, wherein the position detection lines,
The method of claim 1, wherein the first sensing patterns connected by the first connection patterns and the second sensing patterns connected by the second connection patterns are electrically connected to each other. The method of claim 7, wherein step (b),
And forming pad patterns connected to the position detection lines from the first conductive layer. The method of claim 13, wherein step (d)
The first insulating layer is patterned using a second mask to expose one region of each of the second sensing patterns and one region of the pad patterns. The method of claim 14, wherein step (d)
(d-1) forming a photoresist film on the first insulating film;
(d-2) patterning the photoresist film using the second mask to form photoresist patterns having a predetermined interval;
(d-3) exposing the first contact hole and one region of the pad patterns to expose one region of each of the second sensing patterns by removing the first insulating layer existing in the remaining regions except for the lower side of the photoresist patterns. Forming a second contact hole; And
(d-4) removing the photoresist patterns remaining on the first insulating film; Method of manufacturing a touch screen panel comprising a. The method of claim 15, wherein step (f),
And forming a connection layer on the pad patterns from the second conductive layer by using a third mask, which is a halftone mask. The method of claim 16, wherein step (f) comprises:
(f-1) forming a photoresist film on the second insulating film;
(f-2) patterning the photoresist film using the third mask to form photoresist patterns having a third height and a fourth height lower than the third height;
(f-3) removing the second conductive film and the second insulating film existing in the remaining areas except the lower side of the photoresist patterns;
(f-4) removing the photoresist patterns having the fourth height;
(f-5) removing the second insulating film existing in the remaining regions except the lower side of each photoresist pattern; And
(f-6) removing the photoresist patterns remaining on the second insulating film; Method of manufacturing a touch screen panel comprising a.

Images