TWI519849B - Seamless capacitance touch panel - Google Patents

Description

Seamless capacitive touch panel

The present invention relates to a capacitive touch panel, and more particularly to a seamless capacitive touch panel.

In recent years, touch screens have gained market recognition due to the adoption of touch phones, so many manufacturers have joined the development and design of touch screens. Among them, the capacitive touch device has become a next-generation product that can replace the current mainstream resistive touch screen due to its good tolerance and better touch experience. However, due to the high cost of capacitive touch devices, it has become the main reason why it has not been widely used in consumer products.

Please refer to FIG. 1 . FIG. 1 is a schematic diagram of a sensing pad of a prior art Projective Capacitance Touch Sensor (PCT) device. The projected capacitive touch device utilizes two layers of sensing pads to facilitate the scanning operation of the circuit, and mainly includes a substrate (not shown), for example, a glass substrate, and a cover layer disposed on the glass plate (not shown) A Y-axis sensing pad layer 12 is disposed on the upper surface of the glass plate, and the Y-axis sensing pad layer 12 is provided with a plurality of Y-axis sensing pads at regular intervals (y1, y2, y3, y4... ). An X-axis sensing pad layer 11 is disposed on the lower surface of the glass plate to be orthogonal to the Y-axis sensing pad and a plurality of X-axis sensing pads (x1, x2, x3, x4...) are disposed at regular intervals. . When the finger touches or approaches the cover layer, the capacitance of the X-axis sensing pad and the Y-axis sensing pad at the touch position changes, and the detection of the detection circuit can detect the X-axis coordinate data and the Y-axis coordinate data. . In the double-layer capacitive touch device, an X-axis sensing pad and a Y-axis sensing pad are respectively disposed on the upper and lower surfaces of the glass plate, or a single insulating layer is used on one side surface of the glass plate. Two transparent conductive layers.

Please refer to FIG. 2, which is a cross-sectional view of a prior art capacitive touch panel. The capacitive touch panel includes a transparent substrate 21 and a transparent cover 25, wherein a lower transparent conductive layer 22, an insulating layer 23, and an upper transparent conductive layer 24 are sequentially formed on the surface of the transparent substrate 21. Then, the transparent cover 25 is bonded to the transparent substrate 21 by the optical adhesive 26, that is, the assembly of the capacitive touch panel is completed. As shown in FIG. 1 , the capacitive touch panel has an X-axis sensing pad and a Y-axis sensing pad. The X-axis sensing pad is formed under the transparent conductive layer 22 , and the Y-axis sensing pad is above the transparent conductive layer 24 . However, since the X-axis sensing pad and the Y-axis sensing pad are formed on different transparent conductive layers, when there is an error in the alignment of the X-axis sensing pad and the Y-axis sensing pad, X is visible on the transparent substrate 21. The thin lines formed by the joints of the shaft sensing pads and the Y-axis sensing pads affect the picture quality of the touch screen.

Accordingly, it is an object of the present invention to provide a seamless capacitive touch panel.

The invention provides a capacitive touch panel comprising a substrate, a pattern layer, a first sensing pad and a second sensing pad. The pattern layer is formed on the substrate. The first sensing pad is formed on the pattern layer, and the second sensing pad is formed on the substrate, and the second sensing pad and the first sensing pad are separated by the pattern layer without being electrically conductive to each other.

The invention further provides a capacitive touch panel comprising a substrate, a first pattern layer, a first sensing pad, a second pattern layer and a second sensing pad. The first pattern layer is formed on a first side of the substrate. The first sensing pad is formed on the first side of the substrate and the first pattern layer, and the first sensing pad formed on the substrate and the first sensing pad formed on the first pattern layer are first The pattern layers are separated. The second pattern layer is formed on the second side of the substrate. The second sensing pad is formed on the second side of the substrate and the second pattern layer, and the second sensing pad formed on the substrate and the second sensing pad formed on the second pattern layer are the second The pattern layers are separated.

Please refer to FIGS. 3 to 6 , and FIGS. 3 to 6 illustrate a first embodiment of the capacitive touch panel of the present invention. The capacitive touch device of the present invention comprises an X-axis sensing pad and a Y-axis sensing pad. The structure of the capacitive touch device can be referred to FIG. 1 . The capacitive touch panel of the present invention mainly uses the pattern layer to separate the sensing pads, so that no joints are generated between the sensing pads, and the picture quality of the touch screen is improved.

As shown in FIG. 3, first, a photoresist layer is applied to the substrate 31, and the substrate used for the substrate 31 may be various flexible substrates, or a rigid substrate such as a glass substrate, a plastic substrate or a quartz substrate. Wait. In addition, the touch panel of the present invention can also be integrated with the display panel to produce a touch display panel. For example, the substrate 31 of the touch panel is used as an auxiliary substrate, and is attached to a display panel after the touch panel is completed. In addition, the touch panel may share the same substrate 31 with the display panel, that is, the substrate 31 of the touch panel is a substrate of the display panel, such as a color filter glass substrate. After the touch panel is completed, the glass substrate and other components are assembled into a touch display panel. After the photoresist layer is coated on the substrate 31, the photoresist layer is subjected to a photolithography process using a first mask to form the photoresist layer to form the pattern layer 32 of the X-axis sensing pad. The step of patterning includes forming a photoresist layer on the substrate 31 in advance, and then exposing the photoresist layer by using a gray scale mask, a halftone mask, or a phase shift mask, and the photoresist layer is The pattern layer 32 of the X-axis sensing pad is left after the development process due to the developing density and the difference in the photosensitive depth generated during exposure. The pattern layer 32 of the X-axis sensing pad has a height difference from the substrate 31, and in the preferred embodiment, the photoresist layer will have an undercut at the edge of the pattern layer 32 of the X-axis sensing pad after the development process ( Undercut), forming a corner 33 of less than 90 degrees.

As shown in FIG. 4, a transparent conductive layer is deposited on the substrate 31 by a process such as uneven surface coating, sputtering, evaporation, chemical vapor deposition, screen printing or liner printing, and is transparent. The conductive layer may be composed of various transparent conductive materials, such as indium tin oxide (ITO), antimony tin oxide (ATO), indium zinc oxide (IZO), aluminum zinc oxide (AZO), zinc gallium oxide (GZO), indium magnesium oxide. (MIO) or one of a group of metal oxides selected from the group consisting of titanium, zinc, zirconium, hafnium, indium, tin, aluminum, and antimony, and utilizing various thin film technologies such as physical vapor deposition or Chemical vapor deposition is formed. Due to the difference in height between the pattern layer 32 of the X-axis sensing pad and the substrate 31 and the undercut, the pattern layer 32 of the X-axis sensing pad will cause the transparent conductive layer formed on the pattern layer 32 and the transparent conductive formed on the substrate 31. The layers are separated such that the transparent conductive layer deposited on the pattern layer 32 will form the X-axis sensing pads 41. On the other hand, the transparent conductive layer formed on the substrate 31 also needs to be disconnected in the X-axis direction to form the Y-axis sensing pad 42. Therefore, the transparent conductive layer formed on the substrate 31 is subjected to a lithography process and an etching process to form the Y-axis sensing pad 42 by the second photomask, and the Y-axis sensing pad 42 is formed by the pattern layer 32 in the Y-axis direction. Undercutting, the X-axis sensing pad 41 is naturally separated from the Y-axis sensing pad 42.

As shown in FIG. 5, an insulating layer 51 is formed on the X-axis sensing pad 41 and the Y-axis sensing pad 42. The X-axis sensing pads 41 and the Y-axis sensing pads 42 are separated by the pattern layer 32 without being electrically conductive to each other, but the Y-axis sensing pads 42 at both ends of the pattern layer 32 are also spaced apart. Therefore, the Y-axis sensing pad 42 at both ends of the pattern layer 32 needs to use a third mask to perform a lithography process and an etching process to form a through hole 52 in the insulating layer 51. The through hole 52 can be used to electrically connect the pattern layer 32. The Y-axis sensing pad 42 at the end.

As shown in FIG. 6, a conductive layer 61 is formed on the insulating layer 51 to electrically connect the Y-axis sensing pads 42 at both ends of the pattern layer 32. Thereafter, a protective layer 62 is formed on the substrate 31. The conductive layer 61 can be a metal conductive layer. Since the area of the conductive layer 61 disposed between the Y-axis sensing pads 42 is small, the use of the opaque metal material does not affect the transmittance of the touch screen, and the metal is used. The low resistance can compensate for the influence of the serial interface of the Y-axis sensing pad 42 and the conductive layer 61 to obtain a better electrical conductivity. The step of forming the conductive layer 61 is performed by a lithography process and an etching process using a fourth mask to form the conductive layer 61 of the Y-axis sensing pad 42 at both ends of the bridge pattern layer 32.

FIG. 6 shows a structure of a capacitive touch panel according to a first embodiment of the present invention. The capacitive touch panel 60 includes a substrate 31, a pattern layer 32, an X-axis sensing pad 41, a Y-axis sensing pad 42, and insulation. Layer 51, conductive layer 61 and protective layer 62. The X-axis sensing pad 41 of the capacitive touch panel of the present invention is formed on the pattern layer 32, and the X-axis sensing pad 41 and the Y-axis sensing pad 42 are orthogonal, and the X-axis sensing pad 41 is used by the pattern layer 32. The Y-axis sensing pads 42 are spaced apart from each other without conduction, such that no seam is produced between the X-axis sensing pads 41 and the Y-axis sensing pads 42.

Please refer to FIG. 7. FIG. 7 is a cross-sectional view of a capacitive touch panel according to a second embodiment of the present invention. The capacitive touch panel 70 includes a substrate 71, a conductive layer 72, a pattern layer 73, and an X-axis sensing pad. 74. Y-axis sensing pad 75 and protective layer 76. In the second embodiment, the conductive layer 72 connecting the Y-axis sensing pads 75 is formed on the substrate 71, so that the conductive layer 72 is located under the pattern layer 73, so that the process of the insulating layer and the through holes can be omitted. Similarly, the X-axis sensing pad 74 is formed on the pattern layer 72, and the X-axis sensing pad 74 and the Y-axis sensing pad 75 are orthogonal, and an undercut is formed due to the edge of the pattern layer 72, forming a corner of less than 90 degrees. 77, so the pattern layer 72 will separate the X-axis sensing pads 74 from the Y-axis sensing pads 75 without being electrically conductive to each other, such that no seams are produced between the X-axis sensing pads 74 and the Y-axis sensing pads 75.

Please refer to FIG. 8. FIG. 8 is a cross-sectional view showing a capacitive touch panel according to a third embodiment of the present invention. The capacitive touch panel 80 includes a substrate 81, an X-axis pattern layer 82, an X-axis sensing pad 83, a Y-axis pattern layer 84, a Y-axis sensing pad 85, and a protective layer 86. In the third embodiment, the X-axis sensing pad 83 and the Y-axis sensing pad 85 are respectively formed on two sides of the substrate 81, and the X-axis sensing pad 83 and the Y-axis sensing pad 85 are orthogonal. Since the edge of the pattern layer 82 is undercut, a corner 87 of less than 90 degrees is formed, so that the X-axis sensing pad 83 formed on the X-axis pattern layer 82 and the X-axis sensing pad 83 formed on the substrate 81 are Separated, such that no seams are produced between the X-axis sensing pads 83. Similarly, the Y-axis sensing pad 85 formed on the Y-axis pattern layer 84 is spaced apart from the Y-axis sensing pad 85 formed on the substrate 81, so that no seam is produced between the Y-axis sensing pads 85. In addition, the number of the X-axis sensing pads 83 and the Y-axis sensing pads 85 of the capacitive touch panel 80 is twice that of the capacitive touch panel 70, so the capacitive touch panel 80 has a higher resolution.

In summary, the capacitive touch panel of the present invention uses the pattern layer to separate the sensing pads, so that no joints are generated between the sensing pads, and the picture quality of the touch screen is improved. The capacitive touch panel can be provided on the same side of the substrate or on both sides of the substrate. When the sensing layer of the capacitive touch panel is disposed on the same side of the substrate, since the X-axis sensing pad is formed on the pattern layer, the pattern layer will separate the X-axis sensing pad from the Y-axis sensing pad without They are electrically conductive to each other, so that no seam is produced between the X-axis sensing pad and the Y-axis sensing pad. When the sensing layer of the capacitive touch panel is disposed on two sides of the substrate, the X-axis sensing pad and the Y-axis sensing pad are respectively separated by the X-axis pattern layer and the Y-axis pattern layer, so the X-axis sensing pad The Y-axis sensing pads are seamlessly produced, and the number of the X-axis sensing pads and the Y-axis sensing pads is doubled, so that the capacitive touch panel has higher resolution.

The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.

11. . . X-axis sensing pad

12. . . Y-axis sensing pad

twenty one. . . Transparent substrate

twenty two. . . Lower transparent conductive layer

twenty three. . . Insulation

twenty four. . . Transparent conductive layer

25. . . Transparent cover plate

26. . . Optical glue

31, 71, 81. . . Substrate

32, 73. . . Pattern layer

41, 74, 83‧‧‧X-axis sensing pads

42, 75, 85‧‧‧Y-axis sensing pads

51‧‧‧Insulation

52‧‧‧through holes

61, 72‧‧‧ conductive layer

62, 76, 86‧‧ ‧ protective layer

82‧‧‧X-axis pattern layer

84‧‧‧Y-axis pattern layer

FIG. 1 is a schematic diagram of a sensing pad of a prior art projected capacitive touch device.

Figure 2 is a cross-sectional view of a prior art capacitive touch panel.

3 to 6 illustrate a first embodiment of the capacitive touch panel of the present invention.

Figure 7 is a cross-sectional view showing a capacitive touch panel of a second embodiment of the present invention.

Figure 8 is a cross-sectional view showing a capacitive touch panel according to a third embodiment of the present invention.

31. . . Substrate

32. . . Pattern layer

41. . . X-axis sensing pad

42. . . Y-axis sensing pad

51. . . Insulation

61. . . Conductive layer

62. . . The protective layer

Claims (15)

A capacitive touch panel includes: a substrate; a pattern layer formed on the substrate; a first sensing pad formed on the pattern layer to form a height difference with respect to the substrate pad; and a first a second sensing pad is formed on the substrate, wherein the second sensing pad is separated from the first sensing pad by the height difference of the pattern layer without being electrically conductive to each other, and the pattern layer and the first layer The sensing pads are laterally adjacent without covering the second sensing pad. The capacitive touch panel of claim 1, wherein the pattern layer is formed using a photoresist. The capacitive touch panel of claim 1, wherein the edge of the pattern layer has an undercut. The capacitive touch panel of claim 1, wherein the first sensing pad and the second sensing pad are formed of a transparent conductive material comprising indium tin oxide (ITO) and antimony tin oxide. (ATO), indium zinc oxide (IZO), aluminum zinc oxide (AZO), zinc gallium oxide (GZO), indium magnesium oxide (MIO) or selected from the group consisting of titanium, zinc, zirconium, hafnium, indium, tin, aluminum, and antimony One of the group of metal oxides formed by the group. The capacitive touch panel of claim 1, further comprising: an insulating layer formed on the first sensing pad and the second sensing pad; and a conductive layer formed on the insulating layer A through-hole is formed on the insulating layer to electrically connect the second sensing pads separated by the pattern layer. The capacitive touch panel of claim 1, further comprising: a conductive layer formed under the pattern layer for electrically connecting the second sensing pads separated by the pattern layer. The capacitive touch panel of claim 1, wherein the first sensing pad and the second sensing pad are orthogonal. A capacitive touch panel includes: a substrate; a first pattern layer formed on an upper side of the substrate to form a height difference with respect to the substrate pad; a first sensing pad formed on the substrate first And a first patterning layer formed on the substrate, and a first sensing pad formed on the first pattern layer is separated by the first pattern layer having the height difference of the height of the height, and The first pattern layer is laterally adjacent without covering the first sensing pad; a second pattern layer is formed on the lower side of the substrate to form a height difference with respect to the substrate pad; a second sensing pad is formed on the second side of the substrate and the second pattern layer, wherein the second sensing pad formed on the substrate and the second sensing pad formed on the second pattern layer are The second pattern layer of the height difference is spaced apart, and the second pattern layer is laterally adjacent without covering the second sensing pad. The capacitive touch panel of claim 8, wherein the first pattern layer and the second pattern layer are formed by photoresist. The capacitive touch panel of claim 8, wherein the first pattern layer and the edge of the second pattern layer have undercuts. The capacitive touch panel of claim 8, wherein the first sensing pad and the second sensing pad are formed of a transparent conductive material, and the transparent conductive material comprises indium tin oxide (ITO) and antimony tin oxide. (ATO), indium zinc oxide (IZO), aluminum zinc oxide (AZO), zinc gallium oxide (GZO), indium magnesium oxide (MIO) or selected from the group consisting of titanium, zinc, zirconium, hafnium, indium, tin, aluminum, and antimony One of the group of metal oxides formed by the group. The capacitive touch panel of claim 8, wherein the first sensing pad and the second sensing pad are orthogonal. A method for manufacturing a capacitive touch panel, comprising: forming a first pattern layer having a height on a substrate; forming a first sensing pad on the first layer, such that the first sensing pad is Pattern layer Raising the height; forming a second pattern layer on the non-pattern layer on a substrate, the second pattern layer being laterally adjacent to the pattern layer but not covered by the pattern layer; and by the pattern layer pad Increasing the height to form a lateral height difference between the first sensing pad and the second sensing pad, so that the second sensing side pad is laterally adjacent to the first sensing pad, and The pattern layers of the frame are spaced apart from each other without being electrically conductive. The method of claim 13, further comprising: forming an insulating layer on the first sensing pad and the second sensing pad; and forming a conductive layer on the insulating layer, by forming on the insulating layer The through hole electrically connects the second sensing pads separated by the pattern layer. The method of claim 13, further comprising: forming a conductive layer under the pattern layer for electrically connecting the second sensing pads separated by the pattern layer.