JP5375692B2 - Manufacturing method of touch panel sensor - Google Patents

Description

  The present invention relates to a method for manufacturing a touch panel sensor.

  Today, touch panel devices are widely used as input means. The touch panel device includes a touch panel sensor, a control circuit that detects a contact position on the touch panel sensor, wiring, and an FPC (flexible printed circuit board). In many cases, the touch panel device is used together with the display device as an input means for various devices including a display device such as a liquid crystal display or a plasma display (for example, a ticket vending machine, an ATM device, a mobile phone, a game machine). ing. In such a device, the touch panel sensor is disposed on the display surface of the display device, thereby enabling extremely direct input to the display device. The area | region which faces the display area of a display apparatus among touch panel sensors is transparent, and this transparent area | region of a touch panel sensor comprises the active area which can detect a contact position (approach position).

  Touch panel devices are classified into various types based on the principle of detecting a contact position (approach position) on a touch panel sensor. In recent years, capacitive touch panel devices have attracted attention because they are optically bright, have good design properties, have a simple structure, and are superior in function. In a capacitively coupled touch panel device, when an external conductor (typically a finger) whose position is to be detected contacts (approaches) the touch panel sensor via a dielectric, a new strange capacitance is generated. The position of the object on the touch panel sensor is detected based on the change in capacitance caused by this strange capacity. The capacitive coupling method includes a surface type and a projection type. The projection type is attracting attention because it is suitable for multi-touch recognition (multi-point recognition) (for example, Patent Document 1).

  The projected capacitive coupling type touch panel sensor is formed in a dielectric, a sensor electrode formed in the above active area of the dielectric, and an inactive area (so-called frame region) outside the active area of the dielectric. And an extracted wiring. The extraction wiring transmits a signal from the sensor electrode to a control circuit provided outside the touch panel sensor, and is generally formed of a metal material having high conductivity (for example, Patent Document 2).

  In the projected capacitive coupling type touch panel sensor, as described above, the position of the object on the touch panel sensor is detected based on the change in the electrostatic capacitance due to the strange capacitance. In this case, in order to increase the position detection accuracy, it is necessary to precisely adjust the resistance values of the sensor electrode and the lead-out wiring that constitute the touch panel sensor. For example, in Patent Document 2, a resistance adjustment unit is provided for adjusting the resistance value of the extraction wiring according to the location.

Special table 2007-533044 gazette JP 2008-83899 A

  By the way, in recent years, it is required to reduce the frame area for the purpose of improving the design and the purpose of expanding the display area of the display device. However, in the touch panel sensor described in Patent Document 2, the resistance value of the extraction wiring is adjusted by meandering the extraction wiring provided in the frame region. For this reason, the area occupied by the extraction wiring is larger than when the extraction wiring extends straight. Therefore, in the touch panel sensor described in Patent Document 2, the request for adjusting the resistance value of the extraction wiring and the request for reducing the area of the frame region cannot be realized simultaneously.

  An object of this invention is to provide the manufacturing method of the touch panel sensor which can solve such a subject effectively.

  The manufacturing method of the 1st touchscreen sensor by this invention is a transparent base film, the 1st transparent conductive layer provided on the surface of the one side of the said base film, and the other side of the said base film A step of preparing a laminate having a second transparent conductive layer provided on the surface and a coated conductive layer provided on the first transparent conductive layer and having a light shielding property and conductivity; and the coated conductive A first photosensitive layer having a predetermined pattern is formed on the layer by exposure and development, and a second photosensitive layer having a pattern different from the first photosensitive layer is exposed and developed on the second transparent conductive layer. Forming by processing, etching the coated conductive layer using the first photosensitive layer as a mask, patterning the coated conductive layer, and the first using the first photosensitive layer and the coated conductive layer as a mask. Etching the bright conductive layer, etching the second transparent conductive layer using the second photosensitive layer as a mask, and patterning the first transparent conductive layer and the second transparent conductive layer; and the coated conductive layer Forming a third photosensitive layer disposed only on a portion of the substrate by exposure and development, and etching the coated conductive layer using the third photosensitive layer as a mask to cover a portion other than the portion of the coated conductive layer. Removing the conductive layer, thereby forming a first extraction conductor electrically connected to the patterned first transparent conductive layer; and patterning on the other side surface of the base film Forming a second extraction conductor that is electrically connected to the second transparent conductive layer, wherein the second extraction conductor is formed by a screen printing method. It is a manufacturing method for a touch panel sensor according to symptoms.

  In the first method for manufacturing a touch panel sensor according to the present invention, the third photosensitive layer may be formed by partially applying the first photosensitive layer on the patterned conductive conductive layer using an exposure mask having a predetermined opening. It may be formed by exposure and development. Alternatively, the third photosensitive layer is formed by removing the first photosensitive layer on the patterned coated conductive layer, and then forming a further photosensitive layer on the surface on one side of the base film, It may be formed by partially exposing the photosensitive layer using an exposure mask having a plurality of openings.

  In the first touch panel sensor manufacturing method according to the present invention, in the step of forming the third photosensitive layer by exposure and development, when viewed from the normal direction of the touch panel, the opening of the exposure mask is the base. You may overlap with the part in which the said 2nd extraction conductor should be formed among the surfaces of the other side of a material film.

  In the first touch panel sensor manufacturing method according to the present invention, the second extraction conductor may be formed on a part of a second transparent conductive layer provided on the other surface of the base film. .

  In the first touch panel sensor manufacturing method according to the present invention, the second extraction conductor may be formed so as to cover a part of the second transparent conductive layer provided on the other surface of the base film. Good.

  In the first touch panel sensor manufacturing method according to the present invention, the second extraction conductor may be directly formed on the surface on the other side of the base film.

  A second touch panel sensor manufacturing method according to the present invention manufactures a touch panel sensor including a rectangular active area corresponding to a region where a touch position can be detected, and a rectangular frame-shaped inactive area surrounding the active area. In the method, a transparent base film is prepared, and a conductive transparent film extending in the x direction on the surface on one side of the base film and serving as the active area. Forming a first transparent conductor made of a material, and a transparent material having conductivity on the other side of the base film and extending in the y direction to a region to be the active area And forming the second transparent conductor on the surface on one side of the base film, which is to be an inactive area. Forming a first extraction conductor electrically connected to a body by a photolithography method, and forming the second extraction conductor in a region on the other side surface of the base film to be an inactive area. Forming a second extraction conductor electrically connected to the transparent conductor by a screen printing method, wherein the inactive area having a rectangular frame shape is a pair of first frame wiring areas facing in the y direction. And a pair of opposing second frame wiring regions extending in the x direction orthogonal to the y direction, wherein the first extraction conductor is located at the boundary between the first frame wiring region and the active area. Electrically connected to the transparent conductor, and the second take-out conductor is electrically connected to the second transparent conductor at a boundary between the second frame wiring region and the active area. The first extraction conductor is a method for producing a touch panel sensor, characterized in that it is formed to reach the first through the frame wiring region and the second frame wiring region.

  In the manufacturing method of the 2nd touchscreen sensor by this invention, the transparent base film, the 1st transparent conductive layer provided on the surface of one side of the said base film, and the other side of the said base film A laminate having a second transparent conductive layer provided on the surface and a coated conductive layer provided on the first transparent conductive layer and having a light shielding property and conductivity may be prepared. In this case, the first transparent conductor, the second transparent conductor, and the first extraction conductor are patterned by patterning the first transparent conductive layer, the second transparent conductive layer, and the covering conductive layer by a photolithography method. Are formed respectively. Preferably, when patterning the first transparent conductive layer, the second transparent conductive layer, and the coated conductive layer by a photolithography method, a first photosensitive layer having a predetermined pattern is exposed and developed on the coated conductive layer. A second photosensitive layer having a pattern different from that of the first photosensitive layer is formed on the second transparent conductive layer by exposure and development processes.

  In the first and second touch panel sensor manufacturing methods according to the present invention, preferably, the second extraction conductor has a metal paste on the other side surface of the base film more than the first extraction conductor. It is formed by screen printing with a large thickness.

  In the first and second touch panel sensor manufacturing methods according to the present invention, preferably, the second extraction conductor is screen-printed with a metal paste having a thickness of 5 to 20 μm on the other surface of the base film. It is formed by doing.

  According to the first touch panel sensor manufacturing method of the present invention, the first extraction conductor provided on one side of the base film masks the coated conductive layer and the photosensitive layer formed on the coated conductive layer. It is formed by etching. On the other hand, the second extraction conductor provided on the other side of the base film is formed by a screen printing method. Thus, by forming the first extraction conductor and the second extraction conductor using different methods, the difference in resistance value between the first extraction conductor and the second extraction conductor can be easily adjusted. can do.

  According to the second touch panel sensor manufacturing method of the present invention, the first transparent conductor is electrically connected at the boundary between the first frame wiring region and the active area, and the first touch panel sensor passes through the first frame wiring region. A first extraction conductor reaching the two-frame wiring region is formed by a photolithography method. In this case, the area required for the first frame wiring region can be reduced by using the photolithography method. On the other hand, a second extraction conductor that is electrically connected to the second transparent conductor at the boundary between the second frame wiring region and the active area is formed by a screen printing method. In this case, the formation cost of the second extraction conductor is reduced by using the screen printing method for forming the second extraction conductor arranged only in the second frame wiring region, compared to the case of using the photolithography method. be able to.

FIG. 1 is a diagram for explaining an embodiment according to the present invention, and schematically shows a touch panel device together with a display device. 2 is a cross-sectional view showing the touch panel sensor of the touch panel device of FIG. 1 together with a display device. The cross section shown in FIG. 2 generally corresponds to the cross section taken along the line II-II in FIG. FIG. 3 is a plan view showing a touch panel sensor of the touch panel device. 4A is a cross-sectional view taken along line IVA-IVA in FIG. 4B is a cross-sectional view taken along line IVB-IVB in FIG. 4C is a cross-sectional view taken along line IVC-IVC in FIG. FIGS. 5A and 5B are diagrams illustrating specific examples of the base film included in the touch panel sensor. 6A (a) and 6 (b) are diagrams for explaining a method of manufacturing the touch panel sensor of FIG. 6B (a) and 6 (b) are diagrams for explaining a method of manufacturing the touch panel sensor of FIG. 6C (a) and 6 (b) are diagrams for explaining a method of manufacturing the touch panel sensor of FIG. 6D (a) and 6 (b) are diagrams for explaining a method of manufacturing the touch panel sensor of FIG. 6E (a) and 6 (b) are views for explaining a method of manufacturing the touch panel sensor of FIG. 6F (a) and 6 (b) are diagrams for explaining a method of manufacturing the touch panel sensor of FIG. 6G (a) and 6 (b) are diagrams for explaining a method of manufacturing the touch panel sensor of FIG. 6H (a) and 6 (b) are diagrams for explaining a method of manufacturing the touch panel sensor of FIG. 6I (a) and 6 (b) are diagrams for explaining a method of manufacturing the touch panel sensor of FIG. 6J (a) and 6 (b) are diagrams for explaining a method of manufacturing the touch panel sensor of FIG. FIG. 7 is a flowchart for explaining a method of manufacturing the touch panel sensor of FIG. 8A (a) and 8 (b) are diagrams for explaining a method of manufacturing a touch panel sensor in the comparative embodiment. FIGS. 8B (a) and 8 (b) are diagrams for explaining a method of manufacturing a touch panel sensor in the comparative embodiment. FIGS. 8C (a) and 8 (b) are diagrams for explaining a method of manufacturing a touch panel sensor in the comparative embodiment. 8D (a) and 8 (b) are diagrams for explaining a method of manufacturing a touch panel sensor in the comparative embodiment. FIGS. 8E (a) and 8 (b) are diagrams for explaining a method of manufacturing a touch panel sensor in a comparative embodiment. FIG. 8F (a) (b) is a figure for demonstrating the method to manufacture a touch-panel sensor in the comparison form. FIGS. 8G (a) and 8 (b) are diagrams for explaining a method of manufacturing a touch panel sensor in a comparative embodiment. FIGS. 8H (a) and 8 (b) are diagrams for explaining a method of manufacturing a touch panel sensor in the comparative embodiment. FIGS. 8I (a) and 8 (b) are diagrams for explaining a method of manufacturing a touch panel sensor in the comparative embodiment. FIG. 9 is a plan view showing a second extraction conductor in a comparative form. FIGS. 10A and 10B are views showing a modification of the second extraction conductor and the second extraction terminal portion. FIGS. 11A and 11B are diagrams showing a modification of the touch panel sensor.

  Embodiments of the present invention will be described below with reference to the drawings.

  In the drawings attached to the present specification, for the sake of illustration and ease of understanding, the scale, the vertical / horizontal dimension ratio, and the like are appropriately changed and exaggerated from those of the actual ones.

  Further, in the present case, the terms “sheet”, “film”, and “plate” are not distinguished from each other based only on the difference in names. Therefore, for example, a “sheet” is a concept that includes members and portions that can also be called films, plates, and the like.

Touch Panel Device First, the entire touch panel device 20 will be described with reference to FIGS. 1 and 2. The touch panel device 20 shown in FIGS. 1 and 2 is configured as a projected capacitive coupling method, and is configured to be able to detect the contact position of an external conductor (for example, a human finger) to the touch panel device 20. Yes. In addition, when the detection sensitivity of the capacitively coupled touch panel device 20 is excellent, it is possible to detect which region of the touch panel device the external conductor is approaching just by approaching the external conductor. Can do. Accordingly, the “contact position” used here is a concept including an approach position that is not actually in contact but can be detected.

  As shown in FIGS. 1 and 2, the touch panel device 20 constitutes an input / output device 10 by being used in combination with a display device (for example, a liquid crystal display device) 15. The illustrated display device 15 is configured as a flat panel display. The display device 15 includes a display panel 16 having a display surface 16 a and a display control unit 17 connected to the display panel 16. The display panel 16 includes a display area A1 that can display an image, and a non-display area (also referred to as a frame area) A2 that is disposed outside the display area A1 so as to surround the display area A1. . The display control unit 17 processes information regarding the video to be displayed, and drives the display panel 16 based on the video information. The display panel 16 displays a predetermined image on the display surface 16a based on a control signal from the display control unit 17. That is, the display device 15 plays a role as an output device that outputs information such as characters and drawings as video.

  As shown in FIG. 1, the touch panel device 20 includes a touch panel sensor 30 disposed on the display surface 16 a of the display device 15 and a detection control board (not shown) connected to the touch panel sensor 30. 25. Of these, the touch panel sensor 30 is bonded to the display surface 16 a of the display device 15 via an adhesive layer 19 as shown in FIG. 2. As described above, the touch panel device 20 is configured as a projected capacitively coupled touch panel device, and plays a role as an input device for inputting information. The detection control board of the detection control unit 25 is formed of, for example, a flexible printed circuit board on which a detection circuit described later is formed. The flexible printed circuit board includes a first extraction terminal unit and a second extraction terminal unit described later of the touch panel sensor 30. Connected to the extraction terminal.

  Further, as shown in FIG. 2, the touch panel device 20 further includes a protective cover 12 having translucency that functions as a dielectric on the viewer side of the touch panel sensor 30, that is, the side opposite to the display device 15. Have. The protective cover 12 is bonded onto the touch panel sensor 30 via the adhesive layer 14. The protective cover 12 functions as an input surface (touch surface, contact surface) to the touch panel device 20. That is, information can be input from the outside to the touch panel device 20 by bringing a conductor such as a human finger 5 into contact with the protective cover 12. The protective cover 12 forms the most observer side of the input / output device 10, and also functions as a cover for protecting the touch panel device 20 and the display device 15 from the outside in the input / output device 10.

  In addition, as the adhesive layers 14 and 19 described above, layers made of materials having various adhesive properties can be used. In the present specification, “adhesion (layer)” is used as a concept including adhesion (layer).

  The detection control unit 25 of the touch panel device 20 is connected to the touch panel sensor 30 as described above, and the information input via the protective cover 12 is processed by the detection control unit 25. Specifically, the detection control unit 25 can specify the contact position of the conductor 5 with the protective cover 12 when the conductor (typically a human finger) 5 is in contact with the protective cover 12. The circuit (detection circuit) comprised in this is included. Further, the detection control unit 25 may be connected to the display control unit 17 of the display device 15. In this case, the detection control unit 25 can transmit the processed input information to the display control unit 17. At this time, the display control unit 17 can create video information based on the input information and display a video corresponding to the input information on the display panel 16.

  Note that the terms “capacitive coupling” and “projection type” capacitive coupling are used in the present case as having the same meaning as used in the technical field of touch panels. The “capacitive coupling” method is also referred to as “capacitance” method or “capacitance coupling” method in the technical field of touch panels. It is treated as a term synonymous with the “capacitive coupling” method. A typical capacitively coupled touch panel device includes a conductor layer, and an external conductor (typically a human finger) comes into contact with the touch panel, whereby the external conductor and the conductor layer of the touch panel device are contacted. A capacitor (capacitance) is formed between the two. Based on the change in the electrical state accompanying the formation of the capacitor, the position coordinates of the position where the external conductor is in contact with the touch panel are specified. The “projection type” capacitive coupling method is also referred to as “projection type” capacitive coupling method in the technical field of touch panel, and in this case, the term is synonymous with this “projection type” capacitive coupling method. handle. The “projection type” capacitive coupling method is typically a method of detecting a position where an external conductor is in contact using sensor electrodes arranged in a lattice pattern. Contrast with “type” capacitive coupling scheme.

Touch Panel Sensor Next, the touch panel sensor 30 will be described in detail with reference to FIGS. 2 to 4C. As shown in FIG. 2, the touch panel sensor 30 includes a base film 32 and a first transparent conductor 40 provided in a predetermined pattern on a surface 32 a on one side (observer side) of the base film 32. And a second transparent conductor 45 provided in a predetermined pattern on the surface 32b on the other side (the display device 15 side) of the base film 32. In FIG. 3, components provided on the other side of the base film 32, such as the second transparent conductor 45, are indicated by dotted lines for convenience.

  Among these, the base film 32 functions as a dielectric in the touch panel sensor 30. As shown in FIG. 3, the base film 32 includes a rectangular active area Aa1 corresponding to a region where the touch position can be detected, and a rectangular frame-shaped inactive area Aa2 surrounding the active area Aa1. . Among these, the active area Aa1 occupies an area facing the display area A1 of the display device 15 as shown in FIG. 1, while the inactive area Aa2 is an area facing the non-display area A2 of the display device 15. Is formed. As shown in FIG. 3, the rectangular frame-shaped inactive area Aa2 includes a pair of first frame wiring areas 30a facing each other extending in the y direction and a pair of second frame wiring areas 30b facing each other extending in the x direction orthogonal to the y direction. It consists of.

  As described above, the base film 32 is provided with the first transparent conductor 40 and the second transparent conductor 45, and among these, the first transparent conductor 40 provided in the active area Aa1 of the base film 32 and The second transparent conductor 45 forms a first sensor electrode 36a and a second sensor electrode 37a that can form capacitive coupling with the outer conductor 5 (see FIG. 3). As will be described later, each of the base film 32, the first transparent conductor 40, and the second transparent conductor 45 has a light-transmitting property, so that the observer can display on the display device 15 through these. Can be observed.

  Further, as shown in FIG. 3, in the inactive area Aa2 of the base film 32, the first extraction wiring 36b electrically connected to the first sensor electrode 36a and the second sensor electrode 37a are electrically connected. The second extraction wiring 37b thus formed is formed. Among these, as shown in FIG. 3, the first extraction wiring 36b is electrically connected to the first transparent conductor 40 at the boundary between the first frame wiring area 30a and the active area Aa1, and the first frame wiring area. A first extraction conductor 43 extending through 30a to the second frame wiring region 30b, and a first extraction terminal portion 44 provided in the second frame wiring region 30b and connected to the first extraction conductor 43. Contains. Further, as shown in FIG. 3, the second extraction wiring 37b includes a second extraction conductor 48 electrically connected to the second transparent conductor 45 at the boundary between the second frame wiring region 30b and the active area Aa1. And a second extraction terminal portion 49 provided in the second frame wiring region 30 b and connected to the second extraction conductor 48.

  As shown in FIGS. 4A to 4C to be described later, the first conductive conductor 43 and the first extraction terminal portion 44, and a first surface 32a on one side of the base film 32 are made of a transparent conductive layer. One transparent extraction conductor may be interposed. The 1st transparent extraction conductor consists of a transparent conductor formed with the 1st transparent conductor 40 so that it may demonstrate in the manufacturing method of the touch panel sensor 30 mentioned later. Similarly, a second transparent extraction conductor made of a transparent conductive layer is interposed between the second extraction conductor 48 and the second extraction terminal portion 49 and the surface 32b on the other side of the base film 32. Also good.

  Next, each element constituting the touch panel sensor 30 will be described in detail.

Sensor Electrode First, the first sensor electrode 36a and the second sensor electrode 37a will be described in detail. As described above, the first sensor electrode 36a and the second sensor electrode 37a are respectively configured by the first transparent conductor 40 and the second transparent conductor 45 provided in the active area Aa1. The first transparent conductor 40 and the second transparent conductor 45 are made of a transparent material having conductivity. Among these, the 1st transparent conductor 40 is provided on the surface 32a of the one side of the base film 32, and is extended substantially parallel to the x direction, as shown in FIG. The second transparent conductor 45 is provided on the surface 32b on the other side of the base film 32 and extends substantially parallel to the y direction orthogonal to the x direction as shown in FIG.

  As shown in FIG. 3, the first transparent conductor 40 includes a line portion 41a extending linearly and a bulging portion 41b bulging from the line portion 41a. Here, the bulging portion 41 b is a portion that bulges from the line portion 41 a along the film surface of the base film 32. Similarly, the 2nd transparent conductor 45 has the line part 46a extended linearly, and the bulging part 46b bulged from the line part 46a.

  As shown in FIG. 3, the first transparent conductor 40 and the second transparent conductor 45 are arranged in different patterns. Specifically, as shown in FIG. 3, the bulging portion 41 b of the first transparent conductor 40 and the bulging portion 46 b of the second transparent conductor 45 are in the normal direction of the film surface of the base film 32. Are arranged so as not to overlap each other when observed from above. In this way, either the first transparent conductor 40 or the second transparent conductor 45 is disposed over almost the entire active area Aa1 of the base film 32.

  As the material of the first transparent conductor 40 and the second transparent conductor 45, a material having transparency and required conductivity is used. Examples of such materials include indium tin oxide (ITO), zinc oxide, indium oxide, antimony-added tin oxide, fluorine-added tin oxide, aluminum-added zinc oxide, potassium-added zinc oxide, silicon-added zinc oxide, and zinc oxide-oxide Examples thereof include metal oxides such as tin-based, indium oxide-tin oxide-based, and zinc oxide-indium oxide-magnesium oxide-based, and two or more of these metal oxides may be combined.

Referring to extraction wirings then 4A to 4C, a first extraction wiring 36b electrically connected to the first sensor electrode 36a, the second extraction wirings 36b electrically connected to the second sensor electrode 37a And will be described in detail.

(First extraction wiring)
As described above, the first extraction wiring 36b is electrically connected to the first transparent conductor 40 in the first frame wiring region 30a and passes through the first frame wiring region 30a to the second frame wiring region 30b. And a first extraction terminal portion 44 provided in the second frame wiring region 30 b and connected to the first extraction conductor 43. First, the first extraction conductor 43 in the first frame wiring region 30a will be described.

  As shown in FIGS. 3 and 4A, in the first frame wiring region 30a, a plurality of first extraction conductors 43 extend along the y direction. Moreover, as shown in FIG. 4A, between each 1st extraction conductor 43 and the surface 32a of the one side of the base film 32, as mentioned above, the 1st transparent extraction conductor 42 which consists of a transparent conductive layer is mentioned. Is intervened.

As will be described later, the first extraction conductor 43 and the first transparent extraction conductor 42 are formed by patterning the covering conductive layer and the first transparent conductive layer by a so-called photolithography method. Therefore, as compared with the case of forming the first extraction conductor 43 and the first transparent takeoff conductor 42 by using a screen printing method, it is possible to reduce the width s ₁ of the first extraction conductor 43, also The interval s ₂ between the first extraction conductors 43 can be reduced. Further, the distance s ₃ from the first extraction conductor 43 to the end of the base film 32 can be reduced. For example, in the present embodiment, the width s ₁ of the first extraction conductor 43 is 30 μm, the interval s ₂ between the first extraction conductors 43 is 30 μm, and the base film 32 is separated from the first transparent extraction conductor 42. The distance s ₃ to the end is 100 μm. Thus, by forming the plurality of first extraction conductors 43 and first transparent extraction conductors 42 extending in the y direction in the first frame wiring area 30a by photolithography, the first frame wiring area 30a is secured. The width of the region to be reduced can be narrowed, and thus the frame region of the display device can be reduced in area. As a result, the display area of the display device can be enlarged.

  Next, the 1st extraction conductor 43 and the 1st extraction terminal part 44 in the 2nd frame wiring area | region 30b are demonstrated. As shown in FIG. 3, the first extraction conductor 43 passes through the first frame wiring region 30a to the second frame wiring region 30b, and is connected to the first extraction terminal portion 44 in the second frame wiring region 30b. Yes. The 1st extraction terminal part 44 is a terminal part for transmitting the signal from the 1st transparent conductor 40 to the flexible printed circuit board of the detection control part 25, and as shown to FIG. 3 and FIG. It is formed to have a width wider than the body 43. The first extraction terminal portion 44 is formed of the same material as the first extraction conductor 43 at the same time as the first extraction conductor 43, as will be described later. As shown in FIG. 4C, a first transparent extraction conductor 42 made of a transparent conductive layer may be interposed between each first extraction terminal portion 44 and the surface 32 a on one side of the base film 32. .

  The first extraction conductor 43 and the first extraction terminal portion 44 are arranged in the inactive area Aa2 as described above. For this reason, the 1st extraction conductor 43 and the 1st extraction terminal part 44 do not need to be formed from the material which has translucency, and can be formed from the material which has high electroconductivity. In the present embodiment, the first extraction conductor 43 and the first extraction terminal portion 44 are formed of a metal material having a higher conductivity (electrical conductivity) than the material forming the first transparent conductor 40. Yes. Specifically, it is made of a metal material that has a light shielding property and has a much higher conductivity than a transparent conductor such as ITO, such as aluminum, molybdenum, silver, chromium, copper, or an alloy thereof. ing. The thickness of the first extraction conductor 43 and the first extraction terminal portion 44 formed by photolithography is, for example, in the range of 0.1 to 2 μm.

(Second extraction wiring)
Next, the second extraction wiring 37b will be described. As described above, the second extraction wiring 37b is provided in the second frame wiring region 30b and the second extraction conductor 48 electrically connected to the second transparent conductor 45 in the second frame wiring region 30b. , And a second extraction terminal portion 49 connected to the second extraction conductor 48. Among these, as shown in FIG. 4B, the second extraction conductor 48 is connected to the second transparent conductor 45 in the vicinity of the boundary between the active area Aa1 and the inactive area Aa2, and the base film in the inactive area Aa2. It is formed directly on the surface 32b on the other side of 32.

  As shown in FIG. 3, the second extraction conductor 48 is connected to the second extraction terminal portion 49 in the second frame wiring region 30b. The 2nd extraction terminal part 49 is a terminal part for transmitting the signal from the 2nd transparent conductor 45 to the flexible printed circuit board of the detection control part 25, and as shown to FIG. 3 and FIG. It is formed to have a width wider than that of the body 48.

  Further, as shown in FIG. 4C, the metal pins 39 inserted from the surface 32 a on one side of the base film 32 are electrically connected to the second extraction terminal portion 49. The metal pin 39 is made of, for example, aluminum. Although not shown, the flexible printed circuit board of the detection control unit 25 is connected to these metal pins 39 from one side of the base film 32. As a result, the signal from the second transparent conductor 45 is transmitted to the flexible printed circuit board via the second extraction terminal portion 49 and the metal pin 39. By inserting the metal pin 39 into the base film 32 in this way, both the signal from the first transparent conductor 40 and the signal from the second transparent conductor 45 are taken out from one side of the base film 32. Can do.

As will be described later, the second extraction conductor 48 and the second extraction terminal portion 49 are formed using a screen printing method. Therefore, as compared with the case of forming the second extraction conductor 48 and the second lead terminal 49 by photolithography, it is possible to increase the thickness t ₁ of the second extraction conductor 48 and the second lead terminal 49 it can. For example, in the present embodiment, the thickness t ₁ of the second extraction conductor 48 and the second extraction terminal portion 49 is larger than the thickness of the first extraction conductor 43 and the first extraction terminal portion 44 described above. For example, it is in the range of 5 to 20 μm. Thus, the metal pin 39 and the second extraction terminal portion 49 can be connected with a sufficiently low resistance value.
As described above, the second frame wiring region 30b in which the second extraction conductor 48 is provided is a region where signals from the transparent conductors 40 and 45 are taken out by the flexible printed circuit board of the detection control unit 25, and has a small area. This is an area that is not particularly required. For this reason, the width s ₄ of the second extraction conductor 48 and the interval s ₅ between the second extraction conductors 48 are the same as the width s _{1 of} the first extraction conductor 43 formed by photolithography and each of the first extraction conductors 48. Each interval may be wider than the interval s ₂ between the extraction conductors 43. For example, the width s ₄ of the second extraction conductor 48 is in the range of 70 to 300 μm, and the interval s ₅ between the second extraction conductors 48 is in the range of 70 to 300 μm.

  The second extraction conductor 48 and the second extraction terminal portion 49 are arranged in the inactive area Aa2 as described above. For this reason, the 2nd extraction conductor 48 and the 2nd extraction terminal part 49 do not need to be formed from the material which has translucency, and is formed from the material which has high electroconductivity. In the present embodiment, the second extraction conductor 48 and the second extraction terminal portion 49 are formed from a conductive paste having a higher conductivity (electrical conductivity) than the material forming the second transparent conductor 45. ing. Specifically, it is formed from a conductive paste having a much higher conductivity than a transparent conductor such as ITO, for example, a metal paste such as aluminum, molybdenum, silver, chromium, copper, or an alloy thereof.

  The second extraction conductor 48 and the second extraction terminal portion 49 are formed by a method different from that of the first extraction conductor 43 and the first extraction terminal portion 44 described above. For this reason, the material forming the second extraction conductor 48 and the second extraction terminal portion 49 need not be the same as the material forming the first extraction conductor 43 and the first extraction terminal portion 44. A material is appropriately selected according to the pattern length of the bodies 43 and 48.

  Next, the base film 32 will be described in detail with reference to FIGS. In this Embodiment, the base film 32 is comprised from several layers so that it may mention later. Here, each layer of the base film 32 is integrally formed by sputtering or the like without using bonding via an adhesive layer.

  Fig.5 (a) is a figure which shows the cross section of the base film 32 in active area Aa1. In the example shown in FIG. 5A, the base film 32 includes a film body 33 made of resin (for example, PET), and an index matching film 34 formed on one or both surfaces of the film body 33. Have. The index matching film 34 includes a plurality of high refractive index films 34a and low refractive index films 34b arranged alternately. According to this index matching film 34, even if the refractive index of the film body 33 of the base film 32 and the transparent conductors 40 and 45 are greatly different, the transparent conductors 40 and 45 on the base film 32 are provided. It is possible to prevent the light reflectance from greatly differing between the provided area and the non-provided area.

  In the example shown in FIG. 5B, the base film 32 includes a film main body 33 made of resin (for example, PET) and a low refractive index film 35 formed on one or both surfaces of the film main body 33. And have. According to the low refractive index film 35, the transparent conductors 40, 45 on the base film 32 are formed even if the film body 33 of the base film 32 and the transparent conductors 40, 45 are greatly different in refractive index. It is possible to prevent the spectral characteristics of the transmittance from greatly differing between the provided region and the non-provided region, thereby realizing a uniform transmittance in each wavelength region. It becomes possible.

Method for Manufacturing Touch Panel Sensor Next, a method for manufacturing the touch panel sensor 30 configured as described above according to the flowchart shown in FIG. 7 will be described with reference to FIGS. 6A to 6J. 6A to 6J, (a) is a plan view showing a case where the touch panel sensor being manufactured is viewed from one side of the base film 32. (B) has shown the touch panel sensor under preparation in the cross section along the VI-VI line in (a). 6A to 6J, the structure of the transparent conductive layers 40 and 45 and the like are appropriately simplified as compared with the touch panel sensor 30 shown in FIG. 3 for convenience.

(Preparation of laminate)
First, as shown in FIG. 7 and FIG. 6A, a laminate (also referred to as blanks) 50 as a base material for manufacturing the touch panel sensor 30 is prepared (step S1). By performing processing (processing) such as film formation and patterning on the laminated body 50, the touch panel sensor 30 is obtained as described later.

  As shown to Fig.6 (a), the laminated body 50 prepared in this Embodiment is the 1st transparent laminated | stacked on the surface 32a of the transparent base film 32 and the one side of the base film 32. The conductive layer 52a, the second transparent conductive layer 52b that is laminated on the surface 32b on the other side of the base film 32, and the translucent layer, and the first transparent conductive layer 52a are laminated to provide light shielding properties and conductivity. And a covered conductive layer 54a.

  As described above, a resin film such as a PET film is used as the base film 32. Further, as shown in FIGS. 5A and 5B, a film body 33 made of resin such as PET, and an index matching film 34 formed on one or both surfaces of the film body 33, , May be used.

  As will be described later, the first transparent conductive layer 52a and the second transparent conductive layer 52b are layers that are patterned to become the first transparent conductor 40 and the second transparent conductor 45, respectively. The first transparent conductive layer 52a and the second transparent conductive layer 52b are formed of a material having translucency and conductivity. For example, the first transparent conductive layer 52a and the second transparent conductive layer 52b are made of ITO films formed on the surfaces 32a and 32b of the base film 32 by sputtering.

  The coated conductive layer 54 a is a layer that is patterned to become the first extraction conductor 43 or the first extraction terminal portion 44, as will be described later. Therefore, the covering conductive layer 54a is formed of a material having higher conductivity than the material forming the first transparent conductive layer 52a.

  The coated conductive layer 54a is a layer having a property of not transmitting exposure light used in an exposure process described later. In the present embodiment, the coated conductive layer 54a is a layer that has not only a light-shielding property against exposure light but also a light-shielding property against light in other wavelength ranges, more specifically, visible light, ultraviolet light, infrared light that can be included in natural light. It is formed as a layer having a light-shielding property against the like. By using such a layer as the covering conductive layer 54a, it is possible to more reliably block exposure light.

  As a material for forming such a coated conductive layer 54a, aluminum, molybdenum, silver, chromium, copper, or an alloy thereof is used in consideration of cost and ease of processing. The coated conductive layer 54a made of such a metal is formed on the first transparent conductive layer 52a by, for example, sputtering.

  The form of the laminate 50 prepared when the touch panel sensor 30 is manufactured is not particularly limited, and a sheet-like laminate 50 may be prepared, or an elongated web-like laminate 50 such as a roll. The laminated body 50 wound up by may be prepared.

(Formation of photosensitive layer)
Next, as shown in FIGS. 7 and 6B, a light-dissolving type first photosensitive layer 56 a is formed on the surface 50 a on one side of the stacked body 50, and the surface 50 b on the other side of the stacked body 50 is formed. A light-dissolving type second photosensitive layer 56b is formed on (Step S2). The first photosensitive layer 56a and the second photosensitive layer 56b have photosensitivity to light in a specific wavelength range, for example, ultraviolet rays. The photosensitive layers 56a and 56b are formed, for example, by coating a photosensitive material on the surface of the laminate 50 using a coater.

(Exposure of photosensitive layer)
Thereafter, as shown in FIGS. 7 and 6C, the first photosensitive layer 56a and the second photosensitive layer 56b are simultaneously exposed (step S3). Specifically, first, as shown in FIGS. 6C (a) and 6 (b), the first mask 58a is disposed on the first photosensitive layer 56a, and the second mask 58b is disposed on the second photosensitive layer 56b. . The first mask 58a includes a light shielding portion 59a that shields exposure light in a pattern corresponding to the first sensor electrode 36a and the first extraction wiring 36b to be formed, and an opening 59b. The second mask 58b includes a light shielding portion 60a that shields exposure light in a pattern corresponding to the second sensor electrode 37a to be formed, and an opening 60b. The pattern of the first mask 58a and the pattern of the second mask 58b are different from each other.

  Next, as shown in FIG. 6C (b), in this state, exposure light (for example, ultraviolet rays) corresponding to the photosensitive characteristics of the first photosensitive layer 56a and the second photosensitive layer 56b is passed through the masks 58a and 58b. The photosensitive layers 56a and 56b are irradiated. As a result, the first photosensitive layer 56a and the second photosensitive layer 56b are simultaneously exposed in different patterns.

  Here, as described above, the laminated body 50 includes the covering conductive layer 54a that shields the exposure light. Therefore, the exposure light transmitted through the first mask 58a and the first photosensitive layer 56a is shielded by the coated conductive layer 54a, and the exposure light transmitted through the second mask 58b and the second photosensitive layer 56b is also shielded by the coated conductive layer 54a. Shaded. Therefore, the exposure light transmitted through the first mask 58a and the first photosensitive layer 56a does not reach the second photosensitive layer 56b. Similarly, the exposure light transmitted through the second mask 58b and the second photosensitive layer 56b is the first. It does not reach one photosensitive layer 56a. Thus, the first photosensitive layer 56a and the second photosensitive layer 56b can be simultaneously exposed with a desired pattern with high accuracy.

(Development of photosensitive layer)
Next, as shown in FIGS. 7 and 6D, the exposed first photosensitive layer 56a and the second photosensitive layer 56b are developed (step S4). Specifically, a developer corresponding to the first photosensitive layer 56a and the second photosensitive layer 56b is prepared, and the first photosensitive layer 56a and the second photosensitive layer 56b are developed using this developer. Thereby, as shown to FIG. 6D (a) (b), the part irradiated with exposure light among the 1st photosensitive layer 56a and the 2nd photosensitive layer 56b is removed.

(Patterning of light-shielding conductive layer and transparent conductive layer)
Thereafter, as shown in FIGS. 7 and 6E, the coated conductive layer 54a and the first transparent conductive layer 52a are etched using the patterned first photosensitive layer 56a as a mask, and the patterned second photosensitive layer 56b is used as a mask. The second transparent conductive layer 52b is etched (step S5). Thereby, the covering conductive layer 54a and the transparent conductive layers 52a and 52b are patterned.

  In this case, first, the coated conductive layer 54a is etched using the patterned first photosensitive layer 56a as a mask. As a result, the coated conductive layer 54a is patterned in substantially the same pattern as the first photosensitive layer 56a. Here, when the covering conductive layer 54a is made of aluminum or molybdenum, for example, phosphoric acid acetic acid (water) in which phosphoric acid, nitric acid, acetic acid, and water are mixed at a ratio of 5: 5: 5: 1 is an etching solution. Used as Further, when the coated conductive layer 54a is made of silver or a silver alloy, for example, phosphoric acid acetic acid (water) in which phosphoric acid, nitric acid, acetic acid, and water are mixed at a ratio of 4: 1: 4: 4 is an etching solution. Used as Further, when the coated conductive layer 54a is made of chromium, for example, an etching solution in which cerium ammonium nitrate, perchloric acid, and water are mixed at a ratio of 17: 4: 70 is used.

  Next, the first transparent conductive layer 52a is etched using the patterned first photosensitive layer 56a and the covered conductive layer 54a as a mask, and the second transparent conductive layer 52b is etched using the patterned second photosensitive layer 56b as a mask. . In this case, for example, a solution containing ferric chloride is used as the etching solution. By such etching, as shown in FIGS. 6E (a) and 6 (b), it corresponds to the first sensor electrode 36a and the first extraction wiring 36b to be formed on the surface 32a on one side of the base film 32. The covered conductive layer 54a and the first transparent conductive layer 52a having the above pattern are formed. 6E (a) and 6 (b), the second transparent conductive layer 52b having a pattern corresponding to the second sensor electrode 37a to be formed on the other surface 32b of the base film 32. Is formed.

(exposure)
Next, as shown in FIGS. 7 and 6F, the patterned first photosensitive layer 56a and second photosensitive layer 56b are further exposed (step S6, so-called second exposure). This exposure is performed in order to remove the photosensitive layers 56a and 56b located in the region that will later become the active area Aa1 from the patterned photosensitive layers 56a and 56b.

  Specifically, first, as shown in FIGS. 6F (a) and 6 (b), a third mask 62a is disposed on the patterned first photosensitive layer 56a. The third mask 62a should be formed with a light shielding portion 63a for preventing exposure light from being irradiated to the first photosensitive layer 56a located in the region where the first extraction wiring 36b is to be formed, and the first sensor electrode 36a. And an opening 63b that transmits the exposure light so that the first photosensitive layer 56a located in the region is irradiated with the exposure light.

  Next, as shown in FIG. 6F (b), in this state, exposure light (for example, ultraviolet rays) corresponding to the photosensitive characteristics of the first photosensitive layer 56a is irradiated to the photosensitive layer 56a through the mask 62a. As a result, the first photosensitive layer 56a is further exposed.

(Development of photosensitive layer)
Next, as shown in FIGS. 7 and 6G, the exposed first photosensitive layer 56a is developed (step S7). Thereby, the portion irradiated with the exposure light in the first photosensitive layer 56a is removed. As a result, as shown in FIGS. 6G (a) and 6 (b), the first photosensitive layer 56a remains only on the coated conductive layer 54a corresponding to the first extraction wiring 36b to be formed in the coated conductive layer 54a. It is. In the following, the first photosensitive layer 56a provided on the coated conductive layer 54a corresponding to the first extraction wiring 36b to be formed is referred to as a third photosensitive layer 56c.

(Patterning of light-shielding conductive layer)
Thereafter, as shown in FIGS. 7 and 6H, the coated conductive layer 54a is etched using the patterned third photosensitive layer 56c as a mask (step S8). As a result, as shown in FIG. 6H (b), the covered conductive layer 54a located in the region where the first sensor electrode 36a is to be formed (the region that should become the active area Aa1) is removed, thereby the first sensor electrode 36a is removed. A first transparent conductor 40 made of the transparent conductive layer 52a is formed.
In the process, the etching solution has erosion with respect to the coated conductive layer 54a and does not have erosion with respect to the transparent conductive layers 52a and 52b, or erodes with respect to the transparent conductive layers 52a and 52b. Etching solution with weak properties is used. This is because the pattern of the transparent conductive layers 52a and 52b exposed by removing the covering conductive layer 54a is not impaired. That is, the etching solution used in this step is selected so that a desired layer (covered conductive layer 54a) can be selectively etched. As a specific example, the above-mentioned phosphoric acid acetic acid (water) or cerium nitrate-based etching solution has an etching property with respect to the coated conductive layer 54a made of a predetermined metal, but is applied to the transparent conductive layers 52a and 52b made of ITO or the like. On the other hand, since it has no etching property, it can be suitably used in this step.

(Removal of photosensitive layer)
Next, the third photosensitive layer 56c remaining on the covering conductive layer 54a and the second photosensitive layer 56b remaining on the second transparent conductive layer 52b are removed (step S9). As a result, as shown in FIGS. 7 and 6I, the first extraction conductor 43 and the first extraction terminal portion 44 made of the coated conductive layer 54a are formed, and the second transparent conductive layer made of the second transparent conductive layer 52b is formed. A body 45 is formed. As shown in FIG. 6I (a), the first extraction conductor 43 is electrically connected to the first transparent conductor 40, and the first extraction terminal portion 44 is electrically connected to the first extraction conductor 43. It is connected to the. As shown in FIG. 6I (a), the first transparent conductive layer 52a is interposed between the first extraction conductor 43 and the first extraction terminal portion 44 and the surface 32a on one side of the base film 32. The first transparent extraction conductor 42 is interposed.

  Thereafter, as shown in FIGS. 7 and 6J, the patterned second transparent conductive layer 52b (that is, the second transparent conductor 45) is electrically connected on the surface 32b on the other side of the base film 32. The second extraction conductor 48 and the second extraction terminal portion 49 electrically connected to the second extraction conductor 48 are formed by screen printing (step S10). In this case, the specific method of the screen printing method is not particularly limited, and a well-known screen printing method is used. For example, first, using a screen plate (not shown) having discharge holes formed in a pattern corresponding to the second extraction conductor 48 and the second extraction terminal portion 49, aluminum, molybdenum, silver, chromium, copper, or these A conductive paste containing a metal material such as an alloy is applied on the other surface 32 b of the base film 32. Next, baking is performed at a temperature of 150 ° C. or less, for example, 120 ° C. for 1 hour. In this way, the second extraction conductor 48 and the second extraction terminal portion 49 are formed.

  In this way, as shown in FIG. 6J, the touch panel 30 including the sensor electrodes 36a and 37a and the extraction wirings 36b and 37b is manufactured.

Thus, according to the present embodiment, the first extraction conductor 43 and the first extraction terminal portion 44 formed on the surface 32a on one side of the base film 32 are formed by a photolithography method, A second extraction conductor 48 and a second extraction terminal portion 49 formed on the surface 32b on the other side of the base film 32 are formed by a screen printing method. That is, the second extraction conductor 48 and the second extraction terminal portion 49, and the first extraction conductor 43 and the first extraction terminal portion 44 are formed by different methods.
For this reason, compared with the case where all the extraction conductors 43 and 48 and the extraction terminal portions 44 and 49 are formed by the same method, the width, thickness, material, etc. of the extraction conductors 43 and 48 and the extraction terminal portions 44 and 49 are changed. It can be set more freely. Thereby, the resistance values of the extraction conductors 43 and 48 and the extraction terminal portions 44 and 49 can be adjusted with a high degree of freedom.
Further, the second extraction conductor 48 and the second extraction terminal portion 49 can be formed at a lower cost than when the extraction conductors 43 and 48 and the extraction terminal portions 44 and 49 are all formed by photolithography. . Thereby, the manufacturing cost of the touch panel 30 can be reduced.

  Further, according to the present embodiment, the first frame wiring region 30a is electrically connected to the first transparent conductor 40, and the second frame wiring region 30b is electrically connected to the first extraction terminal portion 44. The first extraction conductor 43 is formed by photolithography, while the second extraction conductor 48 extending between the second transparent conductor 45 and the second extraction terminal portion 49 in the second frame wiring region 30b is a screen. It is formed by a printing method. In the present embodiment, the first frame wiring region 30a is a region where a reduction in area is required, while the second frame wiring region 30b receives signals from the transparent conductors 40 and 45 as the detection control unit 25. This area is taken out by the flexible printed circuit board, and is not particularly required to reduce the area. According to the present embodiment, a reduction in the area of the first frame wiring region 30a is realized by forming the first extraction conductor 43 extending along the first frame wiring region 30a by photolithography. Further, by forming the second extraction conductor 48 that is disposed only in the second frame wiring region 30b where a reduction in area is not particularly required by the screen printing method, the formation cost of the second extraction conductor 48 is reduced. Has been. As described above, according to the present embodiment, by appropriately selecting a method of forming the extraction conductors 43 and 48 according to a region where a reduction in area is required, the frame wiring region can be reduced in area and cost. Can be realized simultaneously.

According to the present embodiment, the metal pin 39 inserted from the surface 32a on one side of the base film 32 is inserted into the second extraction terminal portion 49 formed by the screen printing method together with the second extraction conductor 48. Electrically connected. A flexible printed circuit board (not shown) of the detection control unit 25 is connected to the metal pin 39 from one side of the base film 32. For this reason, both the signal from the first transparent conductor 40 and the signal from the second transparent conductor 45 can be taken out from one side of the base film 32. Accordingly, use of a plurality of flexible printed circuit boards and a specially-shaped flexible printed circuit board that can be connected to both the surface 32a on one side and the surface 32b on the other side of the base film 32 (see, for example, US2008 / 0158181). The signals from the first transparent conductor 40 and the second transparent conductor 45 can be taken out. That is, signals from the first transparent conductor 40 and the second transparent conductor 45 can be taken out with a simpler structure.
Moreover, the 2nd extraction terminal part 49 is formed using the screen printing method. Therefore, as compared with the case of forming the second lead terminal 49 by photolithography, increasing the thickness t ₁ of the second lead terminal 49. The thickness t ₁ of the second extraction terminal portion 49 is larger than the thicknesses of the first extraction conductor 43 and the first extraction terminal portion 44 described above, for example, in the range of 5 to 20 μm. Thus, the metal pin 39 and the second extraction terminal portion 49 can be connected with a sufficiently low resistance value.

  Further, according to the present embodiment, as described above, the coated conductive layer 54a having a light shielding property is interposed between the first photosensitive layer 56a and the second photosensitive layer 56b. For this reason, the exposure light transmitted through the first mask 58a and the first photosensitive layer 56a does not reach the second photosensitive layer 56b, and similarly, the exposure light transmitted through the second mask 58b and the second photosensitive layer 56b. It does not reach the first photosensitive layer 56a. Accordingly, it is possible to provide the transparent conductive layers 52a and 52b on both surfaces of one base film 32, respectively, and pattern these transparent conductive layers 52a and 52b by photolithography. Therefore, the first transparent conductor 40 and the second transparent conductor 45 can be easily and accurately positioned relative to each other as compared with the case where the touch panel sensor is formed by bonding two films.

  In addition, according to the present embodiment, the first extraction conductor 43 and the first extraction conductor 43 and the first extraction conductor 43a are used from the light shielding layer (covered conductive layer) 54a used to avoid the mutual influence of the exposure light patterns as described above. An extraction terminal portion 44 is produced. According to such a method, it is possible to reduce the material cost required for manufacturing the touch panel sensor 30. Furthermore, the production efficiency of the touch panel sensor 30 can be improved extremely effectively, and the production cost of the touch panel sensor 30 can be reduced accordingly.

  Further, according to the present embodiment, the first extraction wiring 36 b includes not only the first extraction conductor 43 and the first extraction terminal portion 44 but also the first transparent extraction conductor 42. For this reason, compared with the case where the 1st extraction wiring 36b is comprised only by the 1st extraction conductor 43 and the 1st extraction terminal part 44, the resistance value of the 1st extraction wiring 36b can be made small. Thereby, the width of the first extraction conductor 43 can be further reduced, and thereby the area of the first frame wiring region 30a can be further reduced.

  Further, according to the present embodiment, the second extraction conductor 48 and the second extraction terminal portion 49 are formed directly on the surface 32b on the other side of the base film 32 by screen printing. In general, the metal constituting the second extraction conductor 48 and the second extraction terminal portion 49 adheres more strongly to the base film 32 made of PET or the like than to the transparent conductive layer made of ITO or the like. . For this reason, compared with the case where a transparent conductive layer is interposed between the second extraction conductor 48 and the second extraction terminal portion 49 and the surface 32 b on the other side of the base film 32, the second extraction conductor 48. And the 2nd extraction terminal part 49 can be formed on the base film 32 more firmly.

Comparison Mode Next, with reference to FIGS. 8A to 8I and FIG. 9, the effect of the present embodiment will be described in comparison with the comparison mode. 8A to 8I and FIG. 9 are different only in that the second extraction conductor 148 formed on the surface 32b on the other side of the base film 32 is formed by a photolithography method. Other configurations are substantially the same as those of the touch panel sensor 30 in the present embodiment shown in FIGS. 1 to 7. In the comparison forms shown in FIGS. 8A to 8I and FIG. 9, the same parts as those of the present embodiment shown in FIGS.

  First, as shown in FIG. 8A, a laminate 150 is prepared. The laminated body 150 is substantially the same as the laminated body 50 shown in FIG. 6A except that a second covered conductive layer 54b is further formed on the second transparent conductive layer 52b.

  Next, as shown in FIG. 8B, photosensitive layers 56a and 56b are formed on the laminate 150, and then the photosensitive layers 56a and 56b are exposed through masks 58a and 158b as shown in FIG. 8C. In the exposure process shown in FIG. 8C, the second mask 158b is different from the second mask 158b only in that the light shielding portion 60b is provided at a position corresponding to the second extraction wiring 37b to be formed. This is substantially the same as the exposure step in the present embodiment shown in 6C.

  Next, as shown in FIG. 8D, the exposed first photosensitive layer 56a and second photosensitive layer 56b are developed, and then, as shown in FIG. 8E, the coated conductive layers 54a, 54b and the transparent conductive layers 52a and 52b are etched. Thus, the covering conductive layers 54a and 54b and the transparent conductive layers 52a and 52b are patterned so as to have patterns corresponding to the sensor electrodes 36a and 37a and the extraction wirings 36b and 37b to be formed.

  Next, as shown in FIG. 8F, the patterned first photosensitive layer 56a and second photosensitive layer 56b are further exposed (so-called second exposure). In this case, as shown in FIGS. 8A and 8B, the opening 63b of the third mask 62a for exposing the first photosensitive layer 56a when viewed from the normal direction of the touch panel is the second photosensitive. The layer 56b partially overlaps the second photosensitive layer 56b formed in the portion where the second extraction conductor 148 of the second extraction wiring 37b is to be formed. Therefore, the edge of the second photosensitive layer 56b formed in the portion where the second extraction conductive material 148 is to be formed is exposed by the exposure light passing through the opening 63b of the third mask 62a.

  Next, as shown in FIG. 8G, the exposed first photosensitive layer 56a and second photosensitive layer 56b are developed. In this case, the end portion of the second photosensitive layer 56b formed in the portion where the second extraction conductor 148 is to be formed is exposed as described above. Therefore, as shown in FIG. Then, the end portion of the second photosensitive layer 56b formed in the portion where the second extraction conductor 148 is to be formed is removed. As a result, as shown in FIG. 8G (b), the width of the second photosensitive layer 56b remaining on the second coated conductive layer 54b is smaller than the width of the second coated conductive layer 54b.

  Thereafter, as shown in FIG. 8H, the coated conductive layers 54a and 54b are etched using the remaining photosensitive layers 56a and 56b as a mask. As a result, as shown in FIG. 8H (b), the covered conductive layers 54a and 54b located in the regions where the sensor electrodes 36a and 36b are to be formed are removed. At the same time, as shown in FIG. 8H (b), the portion of the second covered conductive layer 54b formed in the portion where the second extraction conductor 148 is to be formed (not covered with the second photosensitive layer 56b) The end portion of the second covered conductive layer 54b) is removed.

  Next, the remaining photosensitive layers 56a and 56b are removed. In this way, as shown in FIG. 8I, the touch panel sensor 130 including the transparent conductors 40 and 45, the extraction conductors 43 and 148, and the extraction terminal portions 44 and 49 is manufactured.

  FIG. 9 is an enlarged view showing the vicinity of the second extraction conductor 148 and the second extraction terminal portion 49 in the touch panel sensor 130 manufactured according to the comparative embodiment. As described above, in the comparative embodiment, the extraction conductors 43 and 148 provided on both surfaces of the base film 32 are both formed by the photolithography method. Further, in the second exposure step, when viewed from the normal direction of the touch panel, the opening 63b of the third mask 62a for exposing the first photosensitive layer 56a is the second extraction wiring 37b of the second photosensitive layer 56b. The second extraction conductor 148 partially overlaps the second photosensitive layer 56b formed in the portion where the second extraction conductor 148 is to be formed. For this reason, as described above, the end portion of the second photosensitive layer 56b formed in the portion where the second extraction conductor 148 is to be formed is exposed and removed. As a result, as shown in FIG. 9, the width of the portion of the second extraction conductor 148 that overlaps the opening 63 b of the third mask 62 a is smaller than the width of the other second extraction conductor 148. It has been.

  As described above, according to the comparative mode, the second extraction conductor 148 formed on the surface 32b on the other side of the base film 32 due to the second exposure on the one side of the base film 32. The width is smaller. For this reason, the resistance value of the second extraction conductor 148 is smaller than expected. On the other hand, in order to increase the position detection accuracy in the touch panel sensor 130, it is necessary to precisely adjust the resistance values of the sensor electrode and the extraction wiring that constitute the touch panel sensor 130 as described above. Therefore, when the resistance value of the second extraction conductor 148 is deviated from the assumed value as in the comparative embodiment, it means that it is difficult to adjust the resistance value of the extraction wiring.

  On the other hand, according to the present embodiment, the first extraction conductor 43 and the first extraction terminal portion 44 formed on the surface 32a on one side of the base film 32 are formed by the photolithography method. The second extraction conductor 48 and the second extraction terminal portion 49 formed on the surface 32b on the other side of the base film 32 are formed by a screen printing method. For this reason, due to the second exposure on one side of the base film 32, the width of the second extraction conductor 48 formed on the surface 32b on the other side of the base film 32 is not reduced. . This makes it possible to precisely adjust the resistance values of the sensor electrode and the lead-out wiring, and thereby the position detection accuracy in the touch panel sensor 30 can be sufficiently increased.

Method for Manufacturing Input / Output Device Next, the input / output device 10 is manufactured using the touch panel sensor 30 obtained as described above. In this case, first, in the touch panel sensor 30, a hole (not shown) penetrating the base film 32 and the second extraction terminal portion 49 is formed. Next, as shown in FIG. 4C, metal pins 39 are inserted into these holes. Thereafter, the first extraction terminal portion 44 and the metal pin 39 are connected to the flexible printed board of the detection control unit 25 on the surface 32 a on one side of the base film 32. With such a simple structure, a signal from the first transparent conductor 40 and a signal from the second transparent conductor 45 are transmitted to the detection control unit 25.
After that, the touch panel sensor 30 is joined to the display device 15 via the adhesive layer 19, and the protective cover 12 is joined to the touch panel sensor 30 via the adhesive layer 15, whereby the input / output shown in FIG. 1 and FIG. Device 10 is obtained.

In this case, as described above, the second extraction terminal portion 49 is formed using a screen printing method. Therefore, as compared with the case of forming the second lead terminal 49 by photolithography, increasing the thickness t ₁ of the second lead terminal 49. For example, the thickness t ₁ of the second extraction terminal portion 49 can be set in the range of ₅ to 20 μm. As a result, the metal pin 39 and the second extraction terminal portion 49 can be connected with a sufficiently low resistance value.

In the present embodiment, first, the transparent base film 32, the first transparent conductive layer 52a laminated on the surface 32a on one side of the base film 32, and the other side of the base film 32 are provided. An example in which a laminated body 50 having a second transparent conductive layer 52b laminated on the surface 32b and a coated conductive layer 54a laminated on the first transparent conductive layer 52a and having light shielding properties and conductivity is prepared. Indicated. However, the present invention is not limited to this.
For example, first, the transparent base film 32 is prepared, and then the first transparent conductive layer 52a is provided on the surface 32a on one side of the base film 32, and then the first transparent film is formed using a photolithography method. The first transparent conductor 40 is formed by patterning the conductive layer 52a. Next, the second transparent conductive layer 52b is provided on the surface 32b on the other side of the base film 32, and then photolithography is performed. Alternatively, the second transparent conductive layer 45 may be formed by patterning the second transparent conductive layer 52b.
Alternatively, first, the transparent base film 32, the first transparent conductive layer 52a stacked on the surface 32a on one side of the base film 32, and the surface 32b on the other side of the base film 32 are stacked. The transparent conductors 40 and 45 may be formed by preparing a laminated body 50 having the second transparent conductive layer 52b and then patterning the transparent conductive layers 52a and 52b using a photolithography method. . In this case, in the step of exposing the photosensitive layer provided on the transparent conductive layers 52a and 52b, light having a short wavelength region with low transparency, for example, light in the far ultraviolet region is used. Thereby, it is possible to prevent the exposure light irradiated to the photosensitive layer on one side of the base film 32 from reaching the photosensitive layer on the other side of the base film 32.
Also in these cases, the first extraction conductor 43 electrically connected to the first transparent conductor 40 is formed by the photolithography method, while the first extraction conductor 43 electrically connected to the second transparent conductor 45 is used. The two extraction conductors 48 are formed by a screen printing method. The first extraction conductor 43 may be formed before the first transparent conductor 40 is formed, or the first extraction conductor 43 is formed after the first transparent conductor 40 is formed. Also good.

  Moreover, in this Embodiment, the 2nd extraction conductor 48 and the 2nd extraction terminal part 49 showed the example directly formed on the surface 32b of the other side of the base film 32. However, the present invention is not limited to this, and the second transparent extraction conductive layer made of a transparent conductive layer is provided between the second extraction conductor 48 and the second extraction terminal portion 49 and the surface 32b on the other side of the base film 32. The body 47 may be interposed. In this case, as shown in FIG. 10A, the second extraction conductor 48 and the second extraction terminal portion 49 may be formed on the second transparent extraction conductor 47, or FIG. As shown in FIG. 2, the second extraction conductor 48 and the second extraction terminal portion 49 may be formed so as to cover the second transparent extraction conductor 47.

  Further, in the present embodiment, an example is shown in which the wiring made of metal such as the second extraction conductor 48 and the second extraction terminal portion 49 is formed only in the inactive area Aa2. However, the present invention is not limited to this, and a metal wiring 66 may be provided also in the active area Aa1 as shown in FIG. Such metal wiring 66 is provided for noise countermeasures, and the pattern of the metal wiring 66 is appropriately designed according to the assumed noise.

  Such metal wiring 66 is formed by the screen printing method simultaneously with the second extraction conductor 48 and the second extraction terminal portion 49. For this reason, the width of the metal wiring 66 is not reduced due to the second exposure on one side of the base film 32.

Further, consider the case where the metal wiring 66 is formed according to the comparative embodiment shown in FIGS. 8A to 8I. In this case, in the first exposure step shown in FIG. 8C, the exposure is performed so that the second photosensitive layer 56b remains in the portion where the metal wiring 66 is to be formed. Thereafter, in the second exposure step shown in FIG. 8F, exposure is performed such that the second photosensitive layer 56b remaining in the active area Aa1 other than the portion where the metal wiring 66 is to be formed is removed.
Here, if there is a positional deviation between the arrangement of the mask 158b at the first exposure and the arrangement of the mask 62b at the second exposure (second exposure), the positional deviation is caused by the second exposure and development processing. The corresponding part of the second photosensitive layer 56b is exposed and removed. For this reason, the width of the metal wiring 66 to be formed becomes smaller than expected by an amount corresponding to the positional deviation.
On the other hand, according to the present embodiment, the metal wiring 66 is formed by the screen printing method simultaneously with the second extraction conductor 48 and the second extraction terminal portion 49. For this reason, the width of the formed metal wiring 66 does not become smaller than expected. As a result, the width of the metal wiring 66 can be precisely adjusted, which makes it possible to take an optimum noise countermeasure.

  In the second exposure in the present embodiment, the third photosensitive layer 56c provided on the coated conductive layer 54a corresponding to the first extraction wiring 36b to be formed remains after the first exposure. An example is shown in which 56a is partially exposed further. However, the present invention is not limited to this. After removing the remaining first photosensitive layer 56a, a new photosensitive layer is provided on the surface 32a on one side of the base film, and this is exposed in a predetermined pattern. Thus, the third photosensitive layer 56c may be formed.

  In the present embodiment, an example in which the first photosensitive layer 56a and the second photosensitive layer 56b are photodissolvable photosensitive layers has been described. However, the present invention is not limited to this, and a photocurable photosensitive layer may be used as the first photosensitive layer 56a and the second photosensitive layer 56b. In this case, as the exposure mask, a mask in which the light shielding portion 59a and the opening 59b of the first mask 58a are inverted, and a mask in which the light shielding portion 60a and the opening 60b of the second mask 58b are inverted. Is used. In this case, after removing the remaining first photosensitive layer 56a, the third photosensitive layer 56c is newly provided with a photosensitive layer on the surface 32a on one side of the base film, and is exposed in a predetermined pattern. Is formed.

DESCRIPTION OF SYMBOLS 10 Input / output device 15 Display device 20 Touch panel device 30 Touch panel sensor 30a 1st frame wiring area 30b 2nd frame wiring area 32 Base film 32a surface (surface of one side)
32b surface (surface on the other side)
33 Film body 34 Index matching film 34a High refractive index film 34b Low refractive index film 35 Low refractive index film 36a First sensor electrode 36b First extraction wiring 37a Second sensor electrode 37b Second extraction wiring 39 Metal pin 40 First transparent conductive Body 41a line portion 41b bulging portion 42 first transparent extraction conductor 43 first extraction conductor 44 first extraction terminal portion 45 second transparent conductor 46a line portion 46b bulging portion 47 second transparent extraction conductor 48 second Extraction conductor 49 Second extraction terminal portion 50 Laminated body (blanks)
52a First transparent conductive layer 52b Second transparent conductive layer 54a Covered conductive layer 54b Second cover conductive layer 56a First photosensitive layer 56b Second photosensitive layer 56c Third photosensitive layer 58a First mask 58b Second mask 59a First mask Light shielding portion 59b First mask opening portion 60a Second mask light shielding portion 60b Second mask opening portion 62a Third mask 63a Third mask light shielding portion 63b Third mask opening portion 66 Metal wiring

Claims (11)

In a method of manufacturing a touch panel sensor,
A transparent base film, a first transparent conductive layer provided on one side of the base film, and a second transparent conductive layer provided on the other side of the base film; A step of preparing a laminate having a light-shielding property and a conductive conductive layer provided on the first transparent conductive layer;
A first photosensitive layer having a predetermined pattern is formed on the coated conductive layer by exposure and development, and a second photosensitive layer having a pattern different from the first photosensitive layer is formed on the second transparent conductive layer. Forming by exposure and development processing;
Etching the coated conductive layer using the first photosensitive layer as a mask and patterning the coated conductive layer;
Etching the first transparent conductive layer using the first photosensitive layer and the coated conductive layer as a mask, etching the second transparent conductive layer using the second photosensitive layer as a mask, and the first transparent conductive layer and Patterning the second transparent conductive layer;
Forming a third photosensitive layer disposed only on a portion of the coated conductive layer by exposure and development; and
The coated conductive layer is etched using the third photosensitive layer as a mask to remove the coated conductive layer other than the portion of the coated conductive layer, and thereby electrically connected to the patterned first transparent conductive layer. Forming a first extracted conductor,
Forming a second extraction conductor electrically connected to the patterned second transparent conductive layer on the other side surface of the base film, and
The method of manufacturing a touch panel sensor, wherein the second extraction conductor is formed by a screen printing method. The third photosensitive layer is formed by partially exposing and developing the first photosensitive layer on the patterned conductive coating layer using an exposure mask having a predetermined opening. The manufacturing method of the touch panel sensor of Claim 1. The third photosensitive layer is formed by removing the first photosensitive layer on the patterned coated conductive layer and then forming a further photosensitive layer on the one side surface of the base film, and then opening a predetermined opening. The touch panel sensor manufacturing method according to claim 1, wherein the photosensitive layer is partially exposed and developed using an exposure mask having a portion. In the step of forming the third photosensitive layer by exposure and development, when viewed from the normal direction of the touch panel, the opening of the exposure mask is the second take-out of the surface on the other side of the base film. The method for manufacturing a touch panel sensor according to claim 2, wherein the conductor is partially overlapped with a portion where the conductor is to be formed. The said 2nd extraction conductor is formed on a part of 2nd transparent conductive layer provided on the surface of the other side of the said base film. The Claim 1 thru | or 4 characterized by the above-mentioned. Manufacturing method of touch panel sensor. The said 2nd extraction conductor is formed so that a part of 2nd transparent conductive layer provided on the surface of the other side of the said base film may be covered. The manufacturing method of the touch-panel sensor of description. The method for manufacturing a touch panel sensor according to any one of claims 1 to 4, wherein the second extraction conductor is formed directly on the other surface of the base film. In a method of manufacturing a touch panel sensor including a rectangular active area corresponding to a region where a touch position can be detected, and a rectangular frame-shaped inactive area surrounding the active area,
Preparing a transparent base film;
Forming a first transparent conductor made of a transparent material extending in the x direction on the surface on one side of the base film and serving as the active area;
Forming a second transparent conductor made of a transparent material extending in the y direction on the surface of the other side of the base film and serving as the active area;
Forming a first extraction conductor electrically connected to the first transparent conductor on a surface on one side of the base film and to be an inactive area by a photolithography method; When,
A step of forming a second extraction conductor electrically connected to the second transparent conductor by a screen printing method on a region on the other side of the base film and to be an inactive area. And comprising
The rectangular frame-shaped inactive area includes a pair of opposing first frame wiring areas extending in the y direction and a pair of opposing second frame wiring areas extending in the x direction orthogonal to the y direction.
The first extraction conductor is electrically connected to the first transparent conductor at a boundary between the first frame wiring region and the active area;
The second extraction conductor is electrically connected to the second transparent conductor at a boundary between the second frame wiring region and the active area;
The method of manufacturing a touch panel sensor, wherein the first extraction conductor is formed so as to reach the second frame wiring region through the first frame wiring region. In the step of preparing the base film, a transparent base film, a first transparent conductive layer provided on a surface on one side of the base film, and a surface on the other side of the base film A laminated body having a second transparent conductive layer provided on and a coated conductive layer provided on the first transparent conductive layer and having a light shielding property and conductivity, is prepared,
The first transparent conductor, the second transparent conductor, and the first extraction conductor are formed by patterning the first transparent conductive layer, the second transparent conductive layer, and the covering conductive layer by a photolithography method, respectively. And
When patterning the first transparent conductive layer, the second transparent conductive layer, and the coated conductive layer by a photolithography method, a first photosensitive layer having a predetermined pattern is formed on the coated conductive layer by exposure and development processing. The touch panel sensor according to claim 8, wherein a second photosensitive layer having a pattern different from the first photosensitive layer is formed on the second transparent conductive layer by exposure and development processes. Method. The said 2nd extraction conductor is formed by screen-printing a metal paste on the surface of the other side of the said base film with a larger thickness than the said 1st extraction conductor. The manufacturing method of the touch-panel sensor in any one of thru | or 9. The touch panel sensor according to claim 10, wherein the second extraction conductor is formed by screen-printing a metal paste with a thickness of 5 to 20 μm on a surface on the other side of the base film. Manufacturing method.

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