五、新型說明： 【新型所屬之技術領域】 本揭露係關於一種觸控面板，特別係關於一種使用高 硬度之金屬化合物覆蓋金屬線之觸控面板，俾便避免金屬 線之氧化問題並避免金屬線之刮傷問題。 【先前技術】 _觸控面板已被廣泛應用於家庭用品、通訊裝置及電子 資訊裝置等領域。通常觸控面板之應用係作為個人數位助 理（PDA)、電子產品及遊戲機等輸人介面。目前觸控面板和 顯示幕之整合趨勢可允許使用者以手指或接觸筆選取面板 上顯示之代表圖像（icon)，如此可使個人數位助理、電子產 品及遊戲機執行喜好之功能。此.種觸控面板亦應用於公共 資訊查詢系統’可以提供公，有效率之操作系統。 、 傳統觸控面板包含一透明基板，該透明基板具有複數 個感測區域所構成之一表面，該等分佈之感測區域係用於 感測使用者以手指或接觸筆觸摸所造成之訊號，以進行輸 入或控制。該感測區域係由透明導電薄膜所構成，例如： 氧化銦錫（ITO)，使用者可以觸摸顯示於顯示幕上特定位置 之對應透明導電薄膜，即可有效操作該裝置。 為能有效偵測使用者以手指或接觸筆觸摸面板之正確 位置，有很多種觸控面板之技術被發展出來。圖丨例示習知 之觸控面板200，圖2係沿圖1中線1_1之剖面圖。該觸控面 板200包含一透明基板2〇1、一第一透明導電層2〇3、一絕緣 層209及一第二透明導電層211。該第一透明導電層203係以 光學姓刻製程被圖案化及形成於該透明基板2〇1上，其包含 複數個第一單元205及連接沿縱向對齊排列第一單元205之 複數個第一導線207。該絕緣層209覆蓋該第一透明導電層 203及該基板2(H。圖案化之第二透明導電層211係形成於該 絕緣層209上，且包含複數個第二電極單元2丨3及連接沿橫 向對齊排列第二單元213之複數個第二導線2156 該觸控面板200另有複數個金屬線217，設於絕緣層209 之一側，藉由該複數個金屬線217使得該第二單元213之各 橫向連接得以轉向該複數個該金屬線217之匯流端《«該第一 透明導電層203和該第二透明導電層211係覆蓋於該基板 201上，且該絕緣層209係覆蓋於該基板2〇1上整個面積。 然而，該金屬線217易於與空氣中之氧氣反應而發生氧 化’因而增加電阻；為了避免該金屬線217之氧化問題，習 知技術必須在該金屬線217之表面塗佈一保護層（未顯示於 圖中），將該金屬線217與空氣隔離並避免刮傷^然而，該 保護層除了增加製造成本之外’亦會吸政光.線，因而造成 光穿透率變差。因此，市場上需要一種觸控面板能克服上 述習知觸控面板所具有之缺點。 【新型内容】. 本揭露提供一種使用高硬度之金屬化合物覆蓋金屬線 之觸控面板，俾便避免金屬線之氧化問題並避免金屬線之 刮傷問題。 ， 本揭露之一實施例提供一種觸控面板，包含：一透明 基板，包含一感測區域及一外圍區域；複數個透明橋接線 ’局部覆蓋該感測區域；一絕緣層，局部覆蓋該透明橋接 線；複數個金屬線’局部覆蓋該外圍區域；以及一透明導 電層’至少覆蓋該透明橋接旅及該金屬線，該透明導電層 包含複數個第一單元、複數個第二單元及複數個連接線， 該複數個第一單元及該複數個第二單元係交錯佈置，該連 接線連接兩相鄰之該第二單元，該透明橋接線連接兩相鄰 之該第一單元，該複數個金屬線係連接於鄰近該外圍區域 之該第一單元或該第二單元。 本揭露之另一實施例提供一種解控面板，包含：一透 明基板，包含一感測區域及一外圍區域；一金屬層，包含 複數個局部覆蓋該感測區域之第一金屬線以及複數個局部 覆蓋該外圍區域之第二金屬線；一絕緣層，局部覆蓋該第 一金屬線；以及一透明導電層，局部覆蓋該第一金屬線及 該第二金屬線，該透明導電層包含複數個第一單元、複數 個第二單元及複數個連接線，該複數個第一單元及該複數 個第一單兀係父錯佈置，該連接線連接兩相鄰之該第二單 元，該第一金屬線連接兩相鄰之該第一單元，該複數個第 二金屬線係連接於鄰近該外圍區域之該第一單元或該第二 wS — 早兀。 上文已相當廣泛地概述本揭露之技術特徵及優點、俾 使下文之本揭露詳細描述得.以獲得較佳瞭解。構成本揭露 之申明專利圍標的之其它技術特徵及優點將描述於下文 M422111 ^冑所屬技術領域中具有通常知識者應瞭解，可相當 易利用下文揭不之概念與特定實施例可作為修改或設 計其它結構或製㈣實現與本揭露㈣之目的。本揭露所 屬技術領域中具有通常知識者亦應瞭解，這類等效建構益 法脫離後附之中請專利範圍所界定之本揭露的精神和範圍 【實施方式】 圖3至圖6係俯視圖，例示本揭露—實施例之觸控面板 10之製備方法。參考圖3,首先提供―透明基板n，其包含 一感測區域13及-外圍區域15。在本揭露之一實施例中， 該透明基板11之材料係玻璃或透明高分子板材，例如：聚 碳酸醋㈣及聚氯乙婦（PVC)e之後，形成複數個透明橋接 線17,其局部覆蓋該感測區域13。在本揭露之一實施例中 ，該複數個透明橋接線17係以一光學蝕刻製程所形成，其 材料係氧化銦錫（ιτο)、氧化銘辞（AZ0)或氧化銦鋅（ιζ〇)。- 該光學㈣製程包含魏、塗敷m烤、硬烤、顯 影、烘烤和其他步驟。 參考圖4,形成一絕緣層18,其包含複數個絕緣區域^ ’各局部覆蓋該透明橋接線17。在本揭露之一實施例中， 該複數個絕緣區域19係以一光學蝕刻製程所形成，且分別 局部覆蓋該複數個橋接線17 ’該光學蝕刻製程包含賤鑛、 塗敷、曝光、軟烤、硬烤、顯影、烘烤和其他步驟。在本 圖7係沿圖6中線2-2之剖面圖，圖8係沿圖6中線3-3之剖 面圖的一實施例。參考圖7’該透明橋接線17及該複數個第 一連接線33係被該絕緣區域19所相互隔絕》參考圖8，該透 明導電層30覆蓋該複數個金屬線21。本揭露使用該透明導 電層30之第二連接線37覆蓋該金屬線21，而該透明導電層 •30係金屬化合物’不易氧化；此外，該透明導.電層之硬 度高於該金屬線21之硬度，不易被刮傷。 圖9係沿圖6中線3-3之剖面圖的另一實施例。相較於圖 8之實施例將該金屬線21直接形成於該透明基板I!上；圖9 之實施例係將該透明橋接線17直接形成於該透明基板 ’再將該金屬線21直接形成於該透明橋接線17上。特而言 之，圖8及圖9之實施例均使用該透明導電層3〇之第二連接 線37覆蓋該金屬線21，而該透明導電層3〇係金屬化合物， 不易氧化’此外’透明導電層3〇之硬度高於該金屬線21之 硬度，不易被刮傷。 圖10係沿圖6中線3-3之剖面圖的再一實施例。相較於 圖8之實施例將該金屬線21直接形成於該透明基板丨丨上；圖 10之實施例係將該透明橋接線17直接形成於該透明基板i i 上並以該絕緣層18之絕緣區域19覆蓋該透明橋接線17，再 將該金屬線21直接形成於該絕緣區域19上。特而言之圖8 及圖ίο之實施例均使用該透明導電層3〇之第二連接線37覆 蓋該金屬線21 ’而該透明導電層3〇係金屬化合物，不易氧 化，此外，透B月導電層3 〇之硬度高於該金屬線2丨之硬度， M422111 不易被刮傷。 習知之金屬線因易於與空氣中之氧氣反應而發生氧化 • 現象，必須在該金屬線之表面塗佈一保護層；相對地，本 _ 揭露使用該透明導電層30覆蓋該複數個金屬線21可省略去 習知技藝必須在金屬線之表面塗佈一保護層，卻仍可避免 '' 金屬線氧化及刮傷問.題。 圖11至圖14係俯視圖’例示本揭露另一實施例之觸控 • 面板60之製備方法。參考圖11，首先提供一透明基板61， 其包含一感測區域63及一外圍區域65 ^在本揭露之一實施 例中，該透明基板61之材料係玻璃或透明高分子板材，例 如：聚碳酸醋(PC)及聚氯乙烯（PVC)。之後，形成複數個局 部覆蓋該感測區域6 3之透明橋接線6 7。在本揭露之一實施 例中，該複數個透明橋接線67係以一光學蝕刻製程所形成 ，其材料係氧化銦錫（ITO)、氧化鋁鋅（AZ〇)或氧化銦鋅 (助）。該光學㈣製程包含減鑛、塗敷、曝光、軟烤、硬 I 烤、顯影、烘烤和其他步驟。 參考圖12，形成複數個局部覆蓋該外圍區域65之金屬 線69。在本揭露之—實施例中，該複數個金屬線的係以一 光學餘刻製程所形成。該光學㈣製程包含賤鑛、塗敷、 曝光、軟烤、硬烤、顯影、烘烤和其他步驟。 參考圖13，形成-絕緣層7〇，包含複數個第一絕緣區 朗及帛二絕緣㈣73m隸域71局部覆蓋該透 月橋接線67，該第二絕緣區域73局部覆蓋該金屬線。在 -10- 本揭露之一實施例中，該絕緣層70係以一光學蝕刻製程所 形成，且各橋接線67之相對的兩端部則未被該絕緣層7〇覆 蓋，該絕緣層70之材料係一透明高分子材料，例如：光阻 材料。 參考圖14,形成一透明導電層80,至少覆蓋該透明橋 接線67及該金屬線21，該透明導電層80包含複數個第一單 元81、複數個第二單元85、複數個第一連接線83及複數個 第一連接線87 ,該複數個第一單元81及該複數個第二單元 85係父錯佈置，該第一連接線83連接兩相鄰之該第二單元 85，該透明橋接線67連接兩相鄰之該第一單元81，該複數 個金屬線69係連接於鄰近該外圍區域65之該第一單元“或 該第二單元85，該複數個第二連接線87覆蓋該複數個金屬 線69。 在本揭露之一實施例中，各該橋接線67係銜接兩相鄰 第一單元81間最短之路徑。在本揭露之一實施例中，該透 明導電層80之材料係金屬化合物，例氧化銦錫（IT〇)、氧化 鋁鋅（ΑΖΟ)或氧化銦辞（ΙΖΟ)β該光學蝕刻製程包含濺鍍、 塗敷、曝光、軟烤、硬烤、顯影、烘烤和其他步驟。 圖15係沿圖14中線4-4之剖面圖，圖16係沿圖14中線55 之剖面圖。參考圖1 5，該透明橋接線67及該複數個第一連 接線83係被該第一絕緣區域71所相互隔絕。參考圖丨6，在 本揭露之一實施例中，該透明導電層8〇之複數個第二連接 線87覆蓋該複數個金屬線69。本揭露使用該透明導電層8〇 M422111 之第二連接線87覆蓋該金屬線69，而該透明導電層80係金 屬化合物’不易氧化；此外，且該透明導電層8〇之硬度高 於該金屬線69之硬度，不易被到傷。 圖17係沿圖14中線5-5之剖面圖的另一實施例。相較於 圖16之實施例將該金屬線69直接形成於該透明基板61上並 以該絕緣層70之絕緣區域73覆蓋該金屬線69之後，再將該 透明導電層80之複數個第二連接線87形成於該絕緣區域73 上；圖17之實施例係將該金屬線69形成於該透明基板61上 之後’即直接將該透明導電層80之複數個第二連接線87形 成於該金屬線69上。 圖18係沿圖14中線5-5之剖面圖的另一實施例。相較於 圖16之實施例將該金屬線69直接形成於該透明基板61上並 以該絕緣層70之絕緣區域73覆蓋該金屬線69之後，再將該 透明導電層80之複數個第二連接線87·形成於該絕緣區域73 上；圖18之實施例係將該透明橋接線67形成於該透明基板 61上’並將該金屬線69形成於該透明橋接線67上，再將該 透明導電層80之複數個第二連接線87形成於該金屬線69上 〇 圖19係沿圖14中線5-5之剖面圖的另一實施例。相較於 圖16之實施例將該金屬線69直接形成於該透明基板61上並 以該絕緣層70之絕緣區域73.覆蓋該金屬線69之後，.再將該 遗明導電層80之複數個第二連接線87形成於該絕緣區域73 上；圖19之實施例係將該透明橋接線67形成於該透明基板 -12- 域121及第二絕緣區域123，該第一絕緣區域121局部覆蓋該 第一金屬線107 ’該第二絕緣區域123局部覆蓋該第二金屬 線109。在本揭露之一實施例中，該絕緣層12〇係以一光學 蝕刻製程所形成，且各第一金屬線1〇7之相對的兩端部則未 被該絕緣層120覆蓋，該絕緣層12〇之材料係一透明高分子 材料，例如：光阻材料。 參考圖22,形成一透明導電層13〇，至少覆蓋該第一金 屬線107及該第二金屬線1〇9。在本揭露之一實施例中該 透明導電層130包含複數個第一單元131、複數個第二單元 135、複數個第一連接線133及複數個第一連接線137，該複 數個第一單元131及該複數個第二單元135係交錯佈置，該 第一連接線133連接兩相鄰之該第二單元135，該第—金屬 線1〇7線連接兩相鄰之該第—單元131，該複數個第二金屬 線109係連接於鄰近該外圍'區域1〇5之該第一單元i3i或該 第二單元135，該複數個第二連接線137覆蓋該複數個金屬 線 109。 在本揭露之-實施财，各該第__金屬線1()7係銜接兩 相鄰第-單元131間最短之路徑。在本揭露之一實施例中， 該透明導電層13〇之材料係金屬化合物，例氧化銦錫（ιτ〇) 、氧化料（ΑΖΟ)或氧化銦鋅（ΙΖ0)。該光學钱刻製程包含 賤鑛、塗敷、曝光、軟烤、硬烤、顯影、供烤和其他步驟 圖23(係沿圖22中線之剖 面圖，圖24係沿圖22中線7-7 之剖面圖。參考圖23,該第一金屬線l〇7及該第一連接線133 係被該第—絕緣區域121所相互隔絕。參考圖24，該透明導 電層130之第二連接線137覆蓋該複數個金屬線1〇9。本揭露 使用該透明導電層π〇之第二連接線137覆蓋該金屬線ι〇6 ’而該透明導電層130係金屬化合物，不易氧化；此外，該 透明導電層130之硬度高於該金屬線1〇9之硬度，不易被刮 傷。 圖25係沿圖22 _線7-7之剖面圖的另一實施例。相較於 圖24之實施例將該金屬線1〇9直接形成於該透明基板1〇1上 並以該絕緣層120之絕緣區域123覆蓋該金屬線1〇9,再將該 透明導電層130之複數個第二連接線137形成於該絕緣區域 123上；圖25之實施例將該金屬線109形成於該透明基板1〇1 上後，即直接將該透明導電層130之複數個第二連接線137 形成於該金屬線109上。 習知之金屬線因易於與空氣中之氧氣反應而發生氧化 現象，必須在該金屬線之奉面塗佈一保護層；相對地，本 揭露使用該透明導電層130覆蓋該複數個金屬線1〇9可省略 去習知技藝必須在金屬線之表面塗佈—保護層，卻仍可避 免金屬線氧化及刮傷問題。 本揭露之技術内容及技術特點已揭示如上，然而本揭 露所屬技術領域中具有通常知識者應瞭解，在不背離後附 申請專利範圍所界定之本揭露精神和範圍内，本揭露之教 示及揭示可作種種之替換及修飾。例如，上文揭示之許多 •15- 製程可以不同之方法實施或以其它製程予以取代，或者採 用上述二種方式之組合。 此外’本案之權利範圍並不侷限於上文揭示之特定實 施例的製程、機台、製造、物質之成份、裝置、方法或步 驟。本揭露所屬技術領域中具有通f知識者應暸解，基於 本揭露教示及揭示製程、機台、製造、物質之成份、裝置 方法或步驟’無論現在已存在或日後開發者，其與本案 實施例揭示者係以實質相同的方式執行實質相同的功能， 而達到實質相同的結果，亦可使詩本揭露。目此，以下 之申凊專利範圍係用以涵蓋用以此類製程、機台、製造' 物質之成份、裝置、方法或步驟。 【圖式簡單說明】 圖1例示習知之觸控面板； 圖2係沿圖1中線1 _ 1之剖面圖； 圖3至圖6係俯視圖’例示本揭露一實施例之觸控面板 之製備方法； 圖7係沿圖6中線2_2之剖面圖之一實施例； 圖8係沿圖6中線3-3之剖面圖之一實施例； 圖9係沿圖6中線3-3之剖面圖之另一實施例； 圖10係沿圖6中線3-3之剖面圖之再一實施例； 圖U至圖14係俯視圖，例示本揭露另一實施例之觸控 面板之製備方法； 圖15係沿圖14中線4-4之剖面圖之—實施例； M422111 110 金屬層 121 第一絕緣區域 123 苐二絕緣區域 130 透明導電層 131 第一單元 133 第一連接線 135 第二單元 137 第二連接線V. New description: [New technical field] The disclosure relates to a touch panel, in particular to a touch panel covering a metal wire with a metal compound having a high hardness, thereby avoiding oxidation of the metal wire and avoiding metal The problem of scratching the line. [Prior Art] _ Touch panels have been widely used in household appliances, communication devices, and electronic information devices. Typically, touch panel applications are used as input interfaces for personal digital assistants (PDAs), electronics, and game consoles. Currently, the integration trend of the touch panel and the display screen allows the user to select a representative icon (icon) displayed on the panel with a finger or a touch pen, so that the personal digital assistant, the electronic product, and the game machine can perform the favorite function. This type of touch panel is also used in public information inquiry systems to provide a public and efficient operating system. The conventional touch panel includes a transparent substrate having a surface formed by a plurality of sensing regions for sensing a signal caused by a user touching with a finger or a touch pen. For input or control. The sensing area is composed of a transparent conductive film, such as indium tin oxide (ITO), and the user can operate the device by touching a corresponding transparent conductive film displayed at a specific position on the display screen. In order to effectively detect the correct position of the user touching the panel with a finger or a touch pen, a variety of touch panel technologies have been developed. Figure 2 illustrates a conventional touch panel 200, and Figure 2 is a cross-sectional view taken along line 1_1 of Figure 1. The touch panel 200 includes a transparent substrate 2, a first transparent conductive layer 2〇3, an insulating layer 209, and a second transparent conductive layer 211. The first transparent conductive layer 203 is patterned and formed on the transparent substrate 2〇1 by an optical surname process, and includes a plurality of first cells 205 and a plurality of first connecting the first cells 205 in the longitudinal direction. Wire 207. The insulating layer 209 covers the first transparent conductive layer 203 and the substrate 2 (H. The patterned second transparent conductive layer 211 is formed on the insulating layer 209 and includes a plurality of second electrode units 2丨3 and connections Aligning a plurality of second wires 2156 of the second unit 213 in the lateral direction. The touch panel 200 has a plurality of metal wires 217 disposed on one side of the insulating layer 209, and the second unit is made by the plurality of metal wires 217. Each of the lateral connections of 213 is turned to the confluent end of the plurality of metal lines 217. The first transparent conductive layer 203 and the second transparent conductive layer 211 are covered on the substrate 201, and the insulating layer 209 is covered by the insulating layer 209. The entire area of the substrate 2〇1. However, the metal line 217 is susceptible to oxidation with oxygen in the air to cause oxidation, thereby increasing resistance; in order to avoid oxidation of the metal line 217, conventional techniques must be in the metal line 217 The surface is coated with a protective layer (not shown) to isolate the metal wire 217 from the air and to avoid scratching. However, in addition to increasing the manufacturing cost, the protective layer will also absorb the light, thereby causing light to pass through. Transmittance Therefore, there is a need in the market for a touch panel that overcomes the shortcomings of the conventional touch panel described above. [New content] The present disclosure provides a touch panel that covers a metal wire with a metal compound of high hardness, thereby avoiding it. The problem of the oxidation of the metal wire and the problem of scratching the metal wire. One embodiment of the present disclosure provides a touch panel comprising: a transparent substrate, including a sensing area and a peripheral area; a plurality of transparent bridge wires Covering the sensing region; an insulating layer partially covering the transparent bridge wire; a plurality of metal wires 'partially covering the peripheral region; and a transparent conductive layer' covering at least the transparent bridge bridging and the metal wire, the transparent conductive layer comprising a plurality of first units, a plurality of second units, and a plurality of connecting lines, wherein the plurality of first units and the plurality of second units are staggered, the connecting line connecting two adjacent second units, the transparent bridging Connecting the two adjacent first units, the plurality of metal lines being connected to the first unit or the second adjacent to the peripheral area Another embodiment of the present disclosure provides a demodulation panel comprising: a transparent substrate including a sensing region and a peripheral region; a metal layer including a plurality of first metal lines partially covering the sensing region and a plurality of second metal lines partially covering the peripheral region; an insulating layer partially covering the first metal line; and a transparent conductive layer partially covering the first metal line and the second metal line, the transparent conductive layer comprising a plurality of first units, a plurality of second units, and a plurality of connecting lines, wherein the plurality of first units and the plurality of first unitary units are arranged in a wrong manner, and the connecting line connects two adjacent second units, The first metal line connects the two adjacent first units, and the plurality of second metal lines are connected to the first unit or the second wS adjacent to the peripheral area. The technical features and advantages of the present disclosure have been broadly described above, and the following disclosure is described in detail to obtain a better understanding. Other technical features and advantages of the claimed patent enclosures of the present disclosure will be described in the following description of the general teachings of the present disclosure. It is to be understood that the following concepts and specific embodiments can be used as a modification or design. Other structures or systems (4) are achieved with the purpose of (4). It is to be understood by those of ordinary skill in the art that the present invention is not limited by the spirit and scope of the disclosure as defined in the appended claims. FIG. 3 to FIG. A method of fabricating the touch panel 10 of the present disclosure is illustrated. Referring to Figure 3, a "transparent substrate n" is provided, which includes a sensing region 13 and a peripheral region 15. In an embodiment of the present disclosure, the material of the transparent substrate 11 is a glass or a transparent polymer plate, for example, polycarbonate (4) and polyvinyl chloride (PVC) e, forming a plurality of transparent bridge wires 17, which are partially The sensing area 13 is covered. In one embodiment of the present disclosure, the plurality of transparent bridge wires 17 are formed by an optical etching process, and the material is indium tin oxide (ITO), oxidized inscription (AZ0) or indium zinc oxide (ITO). - The optical (4) process consists of Wei, coated m-bake, hard-baked, developed, baked and other steps. Referring to Figure 4, an insulating layer 18 is formed which includes a plurality of insulating regions each partially covering the transparent bridge wires 17. In an embodiment of the present disclosure, the plurality of insulating regions 19 are formed by an optical etching process, and partially cover the plurality of bridge wires 17' respectively. The optical etching process includes tantalum ore, coating, exposure, and soft baking. , hard baking, developing, baking and other steps. 7 is a cross-sectional view taken along line 2-2 of FIG. 6, and FIG. 8 is an embodiment of a cross-sectional view taken along line 3-3 of FIG. Referring to Fig. 7', the transparent bridge line 17 and the plurality of first connecting lines 33 are isolated from each other by the insulating region 19. Referring to Fig. 8, the transparent conductive layer 30 covers the plurality of metal lines 21. The present disclosure covers the metal line 21 by using the second connecting line 37 of the transparent conductive layer 30, and the transparent conductive layer 30 metal compound 'is not easily oxidized; moreover, the transparent conductive layer has a higher hardness than the metal line 21 Hardness, not easy to be scratched. Figure 9 is another embodiment of the cross-sectional view taken along line 3-3 of Figure 6. Compared with the embodiment of FIG. 8, the metal line 21 is directly formed on the transparent substrate I!; in the embodiment of FIG. 9, the transparent bridge line 17 is directly formed on the transparent substrate' and the metal line 21 is directly formed. On the transparent bridge wire 17. In particular, the embodiments of FIGS. 8 and 9 cover the metal line 21 by using the second connecting line 37 of the transparent conductive layer 3, and the transparent conductive layer 3 is a metal compound, which is not easily oxidized. The hardness of the conductive layer 3〇 is higher than the hardness of the metal wire 21, and is not easily scratched. Figure 10 is a further embodiment of a cross-sectional view taken along line 3-3 of Figure 6. The metal line 21 is directly formed on the transparent substrate 相 compared to the embodiment of FIG. 8; in the embodiment of FIG. 10, the transparent bridge line 17 is directly formed on the transparent substrate ii and the insulating layer 18 is The insulating region 19 covers the transparent bridge line 17, and the metal line 21 is formed directly on the insulating region 19. In particular, in the embodiment of FIG. 8 and FIG. ί, the second conductive line 3 of the transparent conductive layer 3 is used to cover the metal line 21', and the transparent conductive layer 3 is a metal compound, which is not easily oxidized. The hardness of the monthly conductive layer 3 is higher than the hardness of the metal wire 2, and the M422111 is not easily scratched. Conventional metal wires are oxidized due to their tendency to react with oxygen in the air, and a protective layer must be applied to the surface of the metal wire; in contrast, the present invention discloses the use of the transparent conductive layer 30 to cover the plurality of metal wires 21 It can be omitted to apply a protective layer on the surface of the metal wire, but still avoid the problem of ''metal wire oxidation and scratching'. 11 to FIG. 14 are plan views illustrating a method of fabricating the touch panel 60 according to another embodiment of the present disclosure. Referring to FIG. 11, a transparent substrate 61 is provided, which includes a sensing region 63 and a peripheral region 65. In one embodiment of the present disclosure, the material of the transparent substrate 61 is a glass or transparent polymer sheet, for example, a poly Carbonic acid vinegar (PC) and polyvinyl chloride (PVC). Thereafter, a plurality of transparent bridge wires 6 that partially cover the sensing region 63 are formed. In one embodiment of the present disclosure, the plurality of transparent bridge wires 67 are formed by an optical etching process, and the material thereof is indium tin oxide (ITO), aluminum zinc oxide (AZ〇), or indium zinc oxide (auxiliary). The optical (four) process includes mineral reduction, coating, exposure, soft baking, hard baking, development, baking, and other steps. Referring to Figure 12, a plurality of metal lines 69 partially covering the peripheral region 65 are formed. In an embodiment of the present disclosure, the plurality of metal lines are formed by an optical remnant process. The optical (four) process includes tantalum ore, coating, exposure, soft baking, hard baking, development, baking, and other steps. Referring to Fig. 13, a formation-insulating layer 7A is formed which includes a plurality of first insulating regions and a second insulating region. The 73m domain 71 partially covers the moon-crossing wiring 67, and the second insulating region 73 partially covers the metal wires. In an embodiment of the present disclosure, the insulating layer 70 is formed by an optical etching process, and opposite ends of the bridge wires 67 are not covered by the insulating layer 7, the insulating layer 70. The material is a transparent polymer material such as a photoresist material. Referring to FIG. 14, a transparent conductive layer 80 is formed to cover at least the transparent bridge line 67 and the metal line 21. The transparent conductive layer 80 includes a plurality of first units 81, a plurality of second units 85, and a plurality of first connecting lines. 83 and a plurality of first connecting lines 87, the plurality of first units 81 and the plurality of second units 85 are arranged in a wrong manner, the first connecting line 83 is connected to two adjacent second units 85, the transparent bridging The line 67 connects the two adjacent first units 81, and the plurality of metal lines 69 are connected to the first unit "or the second unit 85" adjacent to the peripheral area 65, and the plurality of second connecting lines 87 cover the A plurality of metal wires 69. In one embodiment of the present disclosure, each of the bridge wires 67 is connected to the shortest path between two adjacent first cells 81. In one embodiment of the present disclosure, the material of the transparent conductive layer 80 Metal compound, such as indium tin oxide (IT〇), aluminum oxide zinc (ΑΖΟ) or indium oxide (ΙΖΟ) β. The optical etching process includes sputtering, coating, exposure, soft baking, hard baking, development, baking And other steps. Figure 15 is a cross-sectional view taken along line 4-4 of Figure 14. 16 is a cross-sectional view taken along line 55 of Fig. 14. Referring to Fig. 15, the transparent bridge line 67 and the plurality of first connecting lines 83 are isolated from each other by the first insulating region 71. Referring to Fig. 6, in the present In one embodiment, a plurality of second connecting lines 87 of the transparent conductive layer 8 覆盖 cover the plurality of metal lines 69. The second connecting line 87 of the transparent conductive layer 8 〇 M422111 covers the metal line 69. The transparent conductive layer 80 is a metal compound that is not easily oxidized; moreover, the hardness of the transparent conductive layer 8 is higher than the hardness of the metal wire 69, and is not easily damaged. FIG. 17 is along the line 5-5 of FIG. Another embodiment of the cross-sectional view. The metal line 69 is directly formed on the transparent substrate 61 and the metal line 69 is covered by the insulating region 73 of the insulating layer 70, as compared with the embodiment of FIG. A plurality of second connecting lines 87 of the transparent conductive layer 80 are formed on the insulating region 73; in the embodiment of FIG. 17, after the metal lines 69 are formed on the transparent substrate 61, the plurality of transparent conductive layers 80 are directly formed. A second connection line 87 is formed on the metal line 69. Figure 18 Another embodiment of the cross-sectional view along line 5-5 of Figure 14. The metal line 69 is formed directly on the transparent substrate 61 and covered with an insulating region 73 of the insulating layer 70 as compared to the embodiment of Figure 16. After the metal line 69, a plurality of second connecting lines 87· of the transparent conductive layer 80 are formed on the insulating region 73. The embodiment of FIG. 18 forms the transparent bridge line 67 on the transparent substrate 61. The metal line 69 is formed on the transparent bridge line 67, and a plurality of second connecting lines 87 of the transparent conductive layer 80 are formed on the metal line 69. FIG. 19 is a section along line 5-5 of FIG. Another embodiment of the figure. Compared with the embodiment of FIG. 16, the metal line 69 is directly formed on the transparent substrate 61 and covered with the insulating region 73 of the insulating layer 70. After the metal line 69 is covered, the plural of the conductive layer 80 is further The second connecting line 87 is formed on the insulating region 73. The embodiment of FIG. 19 forms the transparent bridge line 67 on the transparent substrate -12-domain 121 and the second insulating region 123. The first insulating region 121 is partially Covering the first metal line 107', the second insulating region 123 partially covers the second metal line 109. In an embodiment of the present disclosure, the insulating layer 12 is formed by an optical etching process, and opposite ends of the first metal lines 1〇7 are not covered by the insulating layer 120. The material of 12〇 is a transparent polymer material, such as a photoresist material. Referring to Fig. 22, a transparent conductive layer 13 is formed to cover at least the first metal line 107 and the second metal line 1〇9. In one embodiment of the disclosure, the transparent conductive layer 130 includes a plurality of first units 131, a plurality of second units 135, a plurality of first connecting lines 133, and a plurality of first connecting lines 137, the plurality of first units And the plurality of second units 135 are staggered, the first connecting line 133 is connected to the two adjacent second units 135, and the first metal line 1〇7 is connected to the two adjacent units 131. The plurality of second metal lines 109 are connected to the first unit i3i or the second unit 135 adjacent to the peripheral 'area' 1-5, and the plurality of second connecting lines 137 cover the plurality of metal lines 109. In the present disclosure, each of the first __metal lines 1() 7 is connected to the shortest path between two adjacent first-units 131. In an embodiment of the present disclosure, the material of the transparent conductive layer 13 is a metal compound, such as indium tin oxide (ITO), an oxidized material (ΑΖΟ) or indium zinc oxide (ΙΖ0). The optical engraving process comprises bismuth ore, coating, exposure, soft roasting, hard roasting, development, roasting, and other steps. Figure 23 is a cross-sectional view taken along line 22 of Figure 22, and Figure 24 is along line 7 of Figure 22. Referring to Figure 23, the first metal line 101 and the first connection line 133 are isolated from each other by the first insulating region 121. Referring to Figure 24, the second connecting line of the transparent conductive layer 130 137 covering the plurality of metal wires 1〇9. The disclosure discloses that the transparent conductive layer 130 is a metal compound and is not easily oxidized by using the second connection line 137 of the transparent conductive layer π〇; The hardness of the transparent conductive layer 130 is higher than the hardness of the metal wire 1〇9, and is not easily scratched. Fig. 25 is another embodiment of the cross-sectional view taken along line 22-7 of Fig. 22. Compared with the embodiment of Fig. 24. The metal line 1〇9 is directly formed on the transparent substrate 1〇1, and the metal line 1〇9 is covered by the insulating region 123 of the insulating layer 120, and the plurality of second connecting lines 137 of the transparent conductive layer 130 are further formed. Formed on the insulating region 123; the embodiment of FIG. 25 forms the metal line 109 on the transparent substrate 1〇1, A plurality of second connecting wires 137 of the transparent conductive layer 130 are directly formed on the metal wires 109. Conventional metal wires are oxidized by being easily reacted with oxygen in the air, and must be coated on the surface of the metal wires. A protective layer; in contrast, the present disclosure uses the transparent conductive layer 130 to cover the plurality of metal lines 1 〇 9 to omit the prior art that the protective layer must be coated on the surface of the metal line, but the metal line oxidation can still be avoided. Scratch problem. The technical content and technical features of the present disclosure have been disclosed as above, but it is to be understood by those skilled in the art that the present disclosure should be understood that the disclosure is within the spirit and scope of the disclosure as defined by the appended claims. The teachings and disclosures can be variously substituted and modified. For example, many of the above-described processes can be implemented in different ways or by other processes, or a combination of the above two methods. It is not limited to the processes, machines, manufactures, compositions, devices, methods or steps of the specific embodiments disclosed above. It should be understood by those skilled in the art that the present disclosure and embodiments of the present invention are disclosed, based on the teachings of the present disclosure and the disclosure of the process, the machine, the manufacture, the composition of the substance, the method of the device, or the step of the present invention. By performing substantially the same function in substantially the same way, and achieving substantially the same result, the poem can be disclosed. Therefore, the following claims are for covering such processes, machines, and manufacturing. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 illustrates a conventional touch panel; FIG. 2 is a cross-sectional view taken along line 1 _ 1 of FIG. 1; FIG. 3 to FIG. 6 are top views 'exemplary A method for fabricating a touch panel according to an embodiment; FIG. 7 is an embodiment of a cross-sectional view taken along line 2-2 of FIG. 6; FIG. 8 is an embodiment of a cross-sectional view taken along line 3-3 of FIG. 9 is another embodiment of a cross-sectional view taken along line 3-3 of FIG. 6; FIG. 10 is a further embodiment of a cross-sectional view taken along line 3-3 of FIG. 6; and FIGS. U to 14 are top views illustrating the present disclosure. A method for preparing a touch panel according to another embodiment; FIG. 15 is along FIG. 4 center line 4-4 sectional view - embodiment; M422111 110 metal layer 121 first insulating region 123 second insulating region 130 transparent conductive layer 131 first unit 133 first connecting line 135 second unit 137 second connecting line