TWI478256B - Touch panel and manufacturing method thereof - Google Patents

Description

Touch panel and manufacturing method thereof

The present invention relates to a panel and a method of fabricating the same, and more particularly to a touch panel and a method of fabricating the same.

In recent years, touch technology has been widely used in various multimedia electronic products, especially mobile products such as mobile phones, e-books, and tablet computers. The use of touch technology as an input method can effectively replace the input method of the existing keyboard or mouse. In addition to convenience, and because of the intuitive operation, touch input technology has become a very popular human-machine interface and multimedia interaction.

In general, touch panels are mainly classified into resistive and capacitive. Taking a capacitive touch panel as an example, a conventional capacitive touch panel includes a substrate, a double-layer conductive layer, and a plurality of fan-out traces electrically connected between the two-layer conductive layer and the conductive layer. A plurality of pads electrically connected by the fan-out wires. The substrate has a peripheral line area located in the touch area and surrounding the touch area. The conductive layer and the insulating layer between the two layers of the conductive layer are located on the touch area of the substrate, and the fan-out traces and the pads are located in the peripheral line region of the substrate.

The fan-out traces are mostly made of conductive metal, but they are easily oxidized. Therefore, in order to avoid the oxidation of the fan-out trace and affect the touch quality, another insulation layer needs to be covered on the fan-out trace. In other words, the current technology requires two procedures to make the insulation layer in the touch area and the surrounding line area. In this way, the material of the process and the waste of time are caused.

In addition, in the current peripheral line area, the connection with the pins of the wafer is The pad area is made by fan-out traces surrounding the conductive layer. Because the fan-out traces and the thickness of the conductive layer are different, the surface of the pad region is uneven, so the downward pressure when the wafer is bonded to the touch panel is likely to cause damage to the film layer under the pad region, thereby making the pins of the wafer Poor reliability and affect the touch quality of the touch panel.

The invention provides a touch panel with good touch quality.

The invention provides a method for manufacturing a touch panel, which can produce a touch panel with good touch quality.

The invention provides a method for manufacturing a touch panel, which comprises the following steps. Forming a first conductive layer on a substrate, the first conductive layer includes a plurality of first sensing electrodes electrically insulated from each other and a plurality of first pads on one side of the first sensing electrodes. A plurality of fan-out wires are formed on the substrate, and each of the fan-out wires is electrically connected to one of the first pads, and each of the first sensing electrodes is electrically connected to one of the fan-out wires, and part of the fan-out wires are not connected. Electrically connected to the first sensing electrode. An insulating layer is formed on the substrate to cover a portion of the first sensing electrode and the fan-out trace, and the insulating layer exposes a portion of the fan-out trace that is not electrically connected to the first sensing electrode. Forming a second conductive layer on the substrate, the second conductive layer includes a plurality of second sensing electrodes interleaved with the first sensing electrodes and electrically insulated from each other, and a plurality of second pads covering the first pads, wherein The first sensing electrode is electrically insulated from the second sensing electrode, and each of the fan-out wires that are not electrically connected to the first sensing electrode is electrically connected to one of the second sensing electrodes.

In an embodiment of the invention, the foregoing insulating layer comprises a plurality of islands a pattern and a peripheral pattern, wherein each of the island patterns is located at an intersection of each of the first sensing electrodes and each of the second sensing electrodes, and the peripheral pattern covers the fan-out trace, and the peripheral pattern is not electrically connected to the first sensing electrode Part of the fan exit line.

In an embodiment of the present invention, each of the first sensing electrodes includes a plurality of first sensing pads and a plurality of first bridges, each first bridge connecting two adjacent first sensing pads, and Each of the first bridging portions extending to the peripheral region is electrically connected to one of the fan-out traces, and each of the island-shaped patterns respectively covers one of the first bridging portions, and the peripheral pattern covers at least the region where the fan-out trace is connected to the first bridging portion. .

In an embodiment of the present invention, each of the foregoing second sensing electrodes includes a plurality of second sensing pads and a plurality of second bridge portions, each of the second bridge portions connecting adjacent two second sensing pads, each of The first bridge portion is respectively interlaced with each of the second bridge portions, and each of the island patterns is located at an intersection of each of the first bridge portions and each of the second bridge portions, and the peripheral pattern exposes the fan-out trace and is electrically connected to the second bridge portion. Each of the fan-out regions that are not electrically connected to the first bridge portion is electrically connected to one of the second bridge portions extending to the peripheral region.

In one embodiment of the present invention, the method for fabricating the touch panel further includes forming a black matrix on the substrate to define a touch region and a peripheral region on the substrate before forming the first conductive layer, wherein The peripheral area is covered by the black matrix, and the touch area is not covered by the black matrix.

In an embodiment of the invention, each of the first sensing electrodes and each of the second sensing electrodes respectively extend from the touch area to the peripheral area to cover a portion of the black matrix.

In an embodiment of the invention, each of the fan-out traces covers one of the first sensing electrodes extending to the peripheral region, and the second sensing electrode extending to the peripheral region covers the electrical connection with the first sensing electrode. One of the connections is fanned out.

In an embodiment of the invention, the insulating layer includes a plurality of island patterns in the touch area and a peripheral pattern in the peripheral area, and the island patterns are located at each of the first sensing electrodes and each of the second patterns. The sensing electrodes are staggered, and the peripheral pattern covers the fan-out traces, and the peripheral pattern exposes a partial region of the fan-out trace that is not electrically connected to the first sensing electrode.

In an embodiment of the present invention, each of the first sensing electrodes includes a plurality of first sensing pads and a plurality of first bridges, each first bridge connecting two adjacent first sensing pads, and Each of the first bridging portions extending to the peripheral region is electrically connected to one of the fan-out traces, and each of the island-shaped patterns respectively covers one of the first bridging portions, and the peripheral pattern covers at least the fan-out trace and the first bridging portion.

In an embodiment of the present invention, each of the foregoing second sensing electrodes includes a plurality of second sensing pads and a plurality of second bridge portions, each of the second bridge portions connecting adjacent two second sensing pads, each of The first bridge portions are respectively interlaced with the second bridge portions, and the island patterns are respectively located at the intersection of the first bridge portions and the second bridge portions, and the fan-out lines that are not electrically connected to the first bridge portion are respectively respectively And electrically connecting to one of the second bridge portions extending to the peripheral region, and the peripheral pattern at least exposing the second bridge portions.

The present invention further provides a touch panel fabricated by the above-described manufacturing method.

Based on the above, the present invention changes the design of the insulating layer, and integrates the insulating layer located in the peripheral region and the touch region into a mask process, thereby reducing the number of masks required for the insulating layer when the touch panel is fabricated, thereby reducing the touch. The control panel is a waste of materials and time in the process. In addition, by changing the arrangement between the fan-out traces and the first conductive layer and the second conductive layer, the surface of the pad region adapted to be bonded to the pins of the wafer is provided, thereby improving the reliability of the pins of the wafer and The touch quality of the touch panel.

The above described features and advantages of the present invention will be more apparent from the following description.

FIG. 1 is a flow chart of manufacturing a touch panel according to an embodiment of the invention. Referring to FIG. 1, the manufacturing method of the touch panel of this embodiment includes the following steps. A first conductive layer is formed on a substrate (step S100). A plurality of fan-out traces are formed on the substrate (step S200). An insulating layer is formed on the substrate (step S300). A second conductive layer is formed on the substrate (step S400).

The manufacturing process of the touch panel according to an embodiment of the present invention will be described in detail below with reference to FIG. 2 to FIG. 6 . 2 to FIG. 6 are schematic top views of a manufacturing process of a touch panel according to an embodiment of the invention. Referring to FIG. 2, in addition to the above steps S100, S200, S300, and S400, the method for fabricating the touch panel of the present embodiment may optionally include disposing a black matrix 120 on the substrate 110 to define a touch area A1. And a peripheral area A2, wherein the peripheral area A2 is covered by the black matrix 120, and the touch area A1 is not covered by the black matrix 120. The substrate 110 can be a transparent substrate, and the material thereof is, for example, Glass, quartz, organic polymers or other suitable materials. The material of the black matrix 120 is, for example, a resin, a metal oxide, or other suitable material having a good light-shielding effect and low reflection characteristics.

3 to FIG. 6 respectively illustrate a method of fabricating each of the layers of steps S100 to S400 of FIG. 1. It should be noted that, in order to clearly illustrate the relative arrangement between the film layers formed in each step and the film layers, an enlarged view of the four regions of the touch panel and a cross-sectional view thereof are provided below, wherein the foregoing four regions include The area A located in the touch area A1, the area B located at the boundary between the touch area A1 and the peripheral area A2, and the area C located in the peripheral area A2, and the area B and the area C are located on different sides of the touch panel.

3A to 3D are enlarged views of the regions A, B, C, and D in FIG. 3, respectively, and FIGS. 3A' to 3D' are taken along the line A-A' and B-B in FIG. 3A to FIG. 3D, respectively. Schematic diagram of ', C-C', D-D'.

Referring to FIG. 3, a first conductive layer 130 is formed on the substrate 110. The first conductive layer 130 includes a plurality of first sensing electrodes 132 electrically insulated from each other and a plurality of first electrodes on one side of the first sensing electrodes 132. A pad 134. The material of the first conductive layer 130 is preferably a transparent conductive material. The transparent conductive material is, for example, a metal oxide such as indium tin oxide, indium zinc oxide, aluminum tin oxide, aluminum zinc oxide, indium antimony zinc oxide, or other suitable oxide, or at least two of the above Stack layers.

In addition, the plurality of first pads 134 located on one side of the first sensing electrodes 132 are located, for example, in the peripheral area A2, and each of the first pads 134 is, for example, arranged along a first direction X and along a second direction Y. extend. The first sensing electrodes 132 are, for example, arranged in the second direction Y and are in the first direction X by the touch area A1 extends to the peripheral area A2. In the present embodiment, the first direction X is, for example, perpendicular to the second direction Y.

Referring to FIG. 3A to FIG. 3D and FIG. 3A′ to FIG. 3D′ , the first sensing electrode 132 of the embodiment includes a plurality of first sensing pads P1 and a plurality of first bridging portions B1 , wherein each first bridging portion B1 connects adjacent two first sensing pads P1. In addition, each of the first sensing electrodes 132 has a first bridge portion B1 connected to only one first sensing pad P1, and the first bridge portion B1 extends toward the peripheral region A2 to cover a portion of the black matrix 120.

Referring to FIG. 4, a plurality of fan-out traces 140 are formed on the substrate 110. Specifically, a plurality of fan-out traces 140 are formed in the peripheral region A2 of the substrate 110. Each of the fan-out wires 140 is electrically connected to one of the first pads 134, and each of the first sensing electrodes 132 is electrically connected to one of the fan-out wires 140, and a portion of the fan-out wires 140 are not connected to the first sensing. The electrode 132 is electrically connected. In addition, the material of the fan-out wire 140 may be a metal or metal laminate such as aluminum or copper which is electrically conductive or a single metal material layer.

4A to 4C are enlarged schematic views of regions B, C, and D in FIG. 4, respectively, and FIGS. 4A' to 4C' are taken along lines B-B' and C-C' in FIGS. 4A to 4C, respectively. Schematic diagram of the D-D'. Referring to FIG. 4A to FIG. 4C and FIG. 4A′ to FIG. 4C′ , each of the first bridging portions B1 extending to the peripheral area A2 is electrically connected to one of the fan-out traces 140 , and each of the fan-out traces 140 respectively A first pad 134 is electrically connected. In this embodiment, the method for electrically connecting the fan-out traces 140 to the first bridge portion B1 or the first pads 134 is directly overlapped on the first bridge portion B1 or the first pads 134, for example. In other words, the first bridge portion B1 is electrically connected to the fanout trace 140. A portion of the area will be located between the fanout trace 140 and the black matrix 120 (as shown in Figure 4A'). Similarly, a portion of the first pad 134 electrically connected to the fanout trace 140 will be located between the fanout trace 140 and the black matrix 120 (as shown in FIG. 4C').

Referring to FIG. 5, an insulating layer 150 is formed on the substrate 110 to cover a portion of the first sensing electrode 132 and the fan-out trace 140, and the insulating layer 150 exposes a fan that is not electrically connected to the first sensing electrode 132. A partial area of line 140. In addition, the material of the insulating layer 150 is, for example, an inorganic material, an organic material, or a combination thereof, wherein the inorganic material is, for example, tantalum oxide, tantalum nitride, lanthanum oxynitride, lanthanum aluminum oxide, or a stacked layer of at least two of the above materials. Of course, the present embodiment is not limited thereto, and any material that can provide insulating properties can be selectively applied to the present embodiment to fabricate the insulating layer 150.

The insulating layer 150 of the present embodiment includes a plurality of island patterns 152 and a peripheral pattern 154, wherein each of the island patterns 152 is located in the touch area A1, and the peripheral pattern 154 is located in the peripheral area A2. Specifically, the island patterns 152 are located on the first sensing electrodes 132, and the peripheral patterns 154 cover the fan-out traces 140, and the peripheral patterns 140 expose the fan-out traces that are not electrically connected to the first sensing electrodes 132. Part of the 140 area.

5A to 5D are enlarged schematic views of regions A, B, C, and D in FIG. 5, respectively, and FIGS. 5A' to 5D' are respectively taken along lines A-A' and B-B in FIGS. 5A to 5D, respectively. Schematic diagram of ', C-C', D-D'. Referring to FIG. 5A and FIG. 5A', each of the island patterns 152 covers one of the first bridge portions B1. Referring to Figures 5B and 5B', the peripheral pattern 154 covers at least the area where the fan-out trace 140 is connected to the first bridge portion B1. In this embodiment, The peripheral pattern 154 is, for example, sufficient to cover the sidewall of the fan-out trace 140 and is in contact with the first bridge portion B1. Referring to FIG. 5C, FIG. 5C', FIG. 5D, FIG. 5D', the peripheral pattern 154 exposes at least a portion of the fan-out trace 140 that is not overlapped with the first bridge portion B1 and the first interface reserved for the wafer overlap. Part of the pad.

Referring to FIG. 6, a second conductive layer 160 is formed on the substrate 110. The second conductive layer 160 includes a plurality of second sensing electrodes 162 and a plurality of second pads 164. Each of the second pads 164 covers, for example, each of the first pads 134, and each of the second sensing electrodes 162 is, for example, arranged in the first direction X and extends from the touch area A1 to the peripheral area A2 in the second direction Y. In addition, the material of the second conductive layer 160 is preferably a transparent conductive material. The transparent conductive material is, for example, a metal oxide such as indium tin oxide, indium zinc oxide, aluminum tin oxide, aluminum zinc oxide, indium antimony zinc oxide, or other suitable oxide, or at least two of the above Stack layers.

The second sensing electrode 162 of the embodiment is interleaved with each of the first sensing electrodes 132 and electrically insulated from each other. In this embodiment, the first sensing electrodes 132 are electrically insulated from the second sensing electrodes 162 , for example, by the island patterns 152 located at the first sensing electrodes 132 and the second sensing electrodes 162 . Interlaced to achieve the effect of electrical insulation between the two. In addition, each of the fan-out wires 140 that are not electrically connected to the first sensing electrode 132 are electrically connected to one of the second sensing electrodes 162 respectively. After the second conductive layer 160 is formed, the touch panel 100 of the present embodiment is initially completed. Of course, in order to prevent the components of the touch panel 100 from being damaged by the external environment and human factors, other protection devices (such as a cover) may be additionally disposed.

6A and 6C are enlarged views of the regions A, C, and D in FIG. 6, respectively, and FIGS. 6A' and 6C' are taken along the line A-A', C-C' in FIG. 6A and FIG. 6C, respectively. Schematic diagram of the D-D'. Referring to FIG. 6A and FIG. 6A ′, the second sensing electrode 162 of the embodiment includes a plurality of second sensing pads P2 and a plurality of second bridge portions B2 , wherein each second bridge portion B2 is connected to two adjacent nodes. Two sensing pads P2. Further, each of the first bridge portions B1 is interlaced with each of the second bridge portions B2, and each of the island patterns 152 is located at an intersection of each of the first bridge portions B1 and each of the second bridge portions B2. Referring to FIG. 6B and FIG. 6B′, each fan-out trace 140 that is not electrically connected to the first bridge portion B1 is electrically connected to one of the second bridge portions B2 extending to the peripheral region A2, and the peripheral pattern 154 is exposed at least. The second bridges B2 are formed. In other words, the second bridging portion B2 of the embodiment may cover the fan-out traces 140 exposed by the peripheral pattern 154, and the sidewalls of the second bridging portion B2 may not be connected to the sidewalls of the peripheral pattern 154, but the invention is not limited thereto. . In other embodiments, the sidewalls of the second bridge B2 can be substantially connected to the sidewalls of the perimeter pattern 154. Referring to FIGS. 6C and 6C', the plurality of second pads 164 covering the first pads 134 have, for example, substantially the same contour as the first pads 134. In addition, the area of the second pad 164 is greater than the area of the first pad 134, for example, but the invention is not limited thereto. In other embodiments, the area of the second pad 164 may also be substantially the same as the area of the first pad 134.

Compared with the prior art, the insulating layer in the touch area and the peripheral area is separately formed by two mask processes, which causes waste of materials and time in the process. In this embodiment, the insulating layer located in the peripheral area and the touch area can be disposed. Integrated into a mask process, thereby reducing the insulating layer 150 when the touch panel 100 is fabricated The number of masks required, thus reducing the material and time waste of the touch panel 100 in the process. In addition, in this embodiment, a pad region in which the first pad 134 and the second pad 16 are overlapped with each other is formed in the peripheral region A2 to provide a flat and suitable pin joint with the wafer (refer to FIG. 6C or FIG. 6C). 'The area pointed by arrow 10'. In this way, when the touch panel and the wafer are bonded, the pad region can withstand a large bonding pressure, thereby improving the bonding process yield, the reliability of the chip pins, and the touch quality of the touch panel.

In summary, the present invention is used in a touch mask process to form the first sensing electrode and the second sensing electrode after forming the first conductive layer and before forming the second conductive layer. An island pattern of insulation and a peripheral pattern for protecting the fan-out traces of the peripheral area. Therefore, the embodiment can reduce the number of masks for making the insulating layer, thereby reducing the material and time of the process. In addition, by forming a pad region formed by overlapping the first pad and the second pad in the peripheral region, a relatively flat and suitable pin connection to the wafer is provided. In this way, when the touch panel is bonded to the wafer, the pad region can withstand a large bonding pressure, thereby improving the bonding process yield, the reliability of the chip pins, and the touch quality of the touch panel.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

100‧‧‧ touch panel

110‧‧‧Substrate

120‧‧‧Black matrix

130‧‧‧First conductive layer

132‧‧‧First sensing electrode

134‧‧‧first mat

140‧‧‧fan out

150‧‧‧Insulation

152‧‧‧ island pattern

154‧‧‧ surrounding patterns

160‧‧‧Second conductive layer

162‧‧‧Second sensing electrode

164‧‧‧second mat

10‧‧‧ arrow

A1‧‧‧ touch area

A2‧‧‧ surrounding area

X‧‧‧ first direction

Y‧‧‧second direction

P1‧‧‧First sensing pad

P2‧‧‧Second sensing pad

B1‧‧‧First Bridge

B2‧‧‧Second Bridge

A, B, C, D‧‧‧ areas

A-A’, B-B’, C-C’, D-D’‧‧‧

FIG. 1 is a flow chart of manufacturing a touch panel according to an embodiment of the invention.

2 to FIG. 6 are schematic top views of a manufacturing process of a touch panel according to an embodiment of the invention.

3A to 3D are enlarged schematic views of regions A, B, C, and D in Fig. 3, respectively.

3A' to 3D' are schematic cross-sectional views taken along lines A-A', B-B', C-C', and D-D' in Figs. 3A to 3D, respectively.

4A to 4C are enlarged schematic views of regions B, C, and D in Fig. 4, respectively.

4A' to 4C' are schematic cross-sectional views taken along lines B-B', C-C', and D-D' in Figs. 4A to 4C, respectively.

5A to 5D are enlarged schematic views of regions A, B, C, and D in Fig. 5, respectively.

5A' to 5D' are schematic cross-sectional views taken along lines A-A', B-B', C-C', and D-D' in Figs. 5A to 5D, respectively.

6A and 6C are enlarged schematic views of regions A, C, and D in Fig. 6, respectively.

6A' and 6C' are schematic cross-sectional views taken along lines A-A', C-C', and D-D' in Figs. 6A and 6C, respectively.

100‧‧‧ touch panel

120‧‧‧Black matrix

132‧‧‧First sensing electrode

140‧‧‧fan out

152‧‧‧ island pattern

154‧‧‧ surrounding patterns

160‧‧‧Second conductive layer

162‧‧‧Second sensing electrode

164‧‧‧second mat

A1‧‧‧ touch area

A2‧‧‧ surrounding area

X‧‧‧ first direction

Y‧‧‧second direction

A, B, C, D‧‧‧ areas

Claims (20)

A method for fabricating a touch panel, comprising: forming a first conductive layer on a substrate, the first conductive layer comprising a plurality of first sensing electrodes electrically insulated from each other and one of the first sensing electrodes a plurality of first pads on the side; a plurality of fan-out traces are formed on the substrate, and each of the fan-out traces is electrically connected to one of the first pads, and each of the first sensing electrodes is fanned out The wires are electrically connected, and some of the fan-out wires are not electrically connected to the first sensing electrodes; an insulating layer is formed on the substrate to cover a portion of the first sensing electrodes and the fans And a plurality of regions of the fan-out traces that are not electrically connected to the first sensing electrodes; and a second conductive layer is formed on the substrate, the second conductive layer includes a plurality of second sensing electrodes staggered and electrically insulated from each other, and a plurality of second pads covering the first pads, wherein the first sensing electrodes and the second The sensing electrode is electrically insulated and is not electrically connected to the first sensing Each of the fan is electrically connected to the home line, respectively wherein a second electrode is electrically connected to the sensing. The method of manufacturing the touch panel of claim 1, wherein the substrate defines a touch area and a peripheral area, the insulating layer includes a plurality of island patterns located in the touch area and located at the periphery a peripheral pattern in the area, each of the island patterns is located at an intersection of each of the first sensing electrodes and each of the second sensing electrodes, and the peripheral pattern covers the fan-out traces, and the peripheral pattern is exposed The first sensing electrodes are electrically connected Some of these fan-out traces. The method of manufacturing the touch panel of claim 2, wherein each of the first sensing electrodes comprises a plurality of first sensing pads and a plurality of first bridge portions, each of the first bridge portions being adjacent to each other Two first sensing pads, and each of the first bridge portions extending to the peripheral region is electrically connected to one of the fan-out traces, and each of the island-shaped patterns respectively covers one of the first bridge portions, and the peripheral pattern At least covering the area where the fan-out traces are connected to the first bridges. The method of manufacturing the touch panel of claim 3, wherein each of the second sensing electrodes comprises a plurality of second sensing pads and a plurality of second bridges, each of the second bridges being adjacent to each other Each of the first bridge portions is interlaced with each of the second bridge portions, and each of the island patterns is located at an intersection of each of the first bridge portions and each of the second bridge portions. The peripheral pattern exposes the area where the fan-out wires are electrically connected to the second bridge portions, and each of the fan-out traces that are not electrically connected to the first bridge portions respectively extend to one of the peripheral regions The second bridge is electrically connected. The method of manufacturing the touch panel of claim 1, further comprising: forming a black matrix on the substrate to define a touch area and a substrate on the substrate before forming the first conductive layer a peripheral area, wherein the peripheral area is covered by the black matrix, and the touch area is not covered by the black matrix. The method of manufacturing the touch panel of claim 5, wherein each of the first sensing electrodes and each of the second sensing electrodes are respectively The touch area extends to the peripheral area to cover a portion of the black matrix. The method of manufacturing the touch panel of claim 6, wherein each of the fan-out traces covers a first sensing electrode extending to the peripheral region and extending to the second sensing electrode of the peripheral region Covering one of the fanout traces that are not electrically connected to the first sensing electrodes. The method of manufacturing the touch panel of claim 7, wherein the insulating layer comprises a plurality of island patterns in the touch area and a peripheral pattern in the peripheral area, each of the island patterns Each of the first sensing electrodes is interlaced with each of the second sensing electrodes, and the peripheral pattern covers the fan-out traces, and the peripheral pattern exposes the electrical connection that is not electrically connected to the first sensing electrodes. Some areas of the fanout route. The method of manufacturing the touch panel of claim 8, wherein each of the first sensing electrodes comprises a plurality of first sensing pads and a plurality of first bridge portions, each of the first bridge portions being adjacent to each other Two first sensing pads, and each of the first bridge portions extending to the peripheral region is electrically connected to one of the fan-out traces, and each of the island-shaped patterns respectively covers one of the first bridge portions, and the peripheral pattern At least the fan-out traces and the first bridges are covered. The method of manufacturing the touch panel of claim 9, wherein each of the second sensing electrodes comprises a plurality of second sensing pads and a plurality of second bridges, each of the second bridges being adjacent to each other Each of the first bridge portions is interlaced with each of the second bridge portions, and each of the island patterns is located at an intersection of each of the first bridge portions and each of the second bridge portions. Each of the fan-out traces electrically connected to the first bridge portions respectively One of the second bridge portions extending to the peripheral region is electrically connected, and the peripheral pattern exposes at least the second bridge portions. A touch panel includes: a substrate; a first conductive layer disposed on the substrate, the first conductive layer includes a plurality of first sensing electrodes electrically insulated from each other and located at the first sensing electrodes a plurality of first pads on one side; a plurality of fan-out traces disposed on the substrate, each of the fan-out traces being electrically connected to one of the first pads, and each of the first sensing electrodes and one of the first sensing electrodes The fan-out wires are electrically connected, and some of the fan-out wires are not electrically connected to the first sensing electrodes; an insulating layer is disposed on the substrate, and the first sensing portions of the insulating layer cover portions An electrode and the fan-out traces, wherein the insulating layer exposes a portion of the fan-out traces that are not electrically connected to the first sensing electrodes; and a second conductive layer disposed on the substrate The second conductive layer includes a plurality of second sensing electrodes interleaved with the first sensing electrodes and electrically insulated from each other, and a plurality of second pads covering the first pads, wherein the first sensing The electrode is electrically insulated from the second sensing electrodes, and is not The first sector of each sensing electrode electrically connected to the home line, respectively wherein a second electrode is electrically connected to the sensing. The touch panel of claim 11, wherein the substrate defines a touch area and a peripheral area, the insulating layer includes a plurality of island patterns located in the touch area and located in the peripheral area Peripheral map Each of the island-shaped patterns is located at an intersection of each of the first sensing electrodes and each of the second sensing electrodes, and the peripheral pattern covers the fan-out traces, and the peripheral pattern exposes the first senses A portion of the fan-out traces electrically connected to the electrodes. The touch panel of claim 12, wherein each of the first sensing electrodes comprises a plurality of first sensing pads and a plurality of first bridges, each of the first bridges connecting adjacent two a sensing pad, and each of the first bridge portions extending to the peripheral region is electrically connected to one of the fan-out traces, and each of the island-shaped patterns respectively covers one of the first bridge portions, and the perimeter pattern covers at least one of the first bridge portions The areas where the fan-out traces are connected to the first bridges. The touch panel of claim 13, wherein each of the second sensing electrodes comprises a plurality of second sensing pads and a plurality of second bridges, each of the second bridges connecting adjacent two Each of the first bridge portions is interlaced with each of the second bridge portions, and each of the island patterns is respectively located at an intersection of each of the first bridge portions and each of the second bridge portions, and the peripheral pattern is exposed. Outgoing wires that are electrically connected to the second bridge portions, and the fan-out traces that are not electrically connected to the first bridge portions are respectively connected to one of the second bridges extending to the peripheral region Electrical connection. The touch panel of claim 11, further comprising: a black matrix disposed on the substrate to define a touch area and a peripheral area on the substrate, wherein the peripheral area is black The matrix is covered, and the touch area is not covered by the black matrix. The touch panel of claim 15, wherein each of the first sensing electrodes and each of the second sensing electrodes extend from the touch area to the peripheral area to cover a portion of the black matrix. The touch panel of claim 16, wherein each of the fan-out traces covers one of the first sensing electrodes extending to the peripheral region, and the second sensing electrode extending to the peripheral region is not covered One of the first sensing electrodes is electrically connected to the fanout. The touch panel of claim 17, wherein the insulating layer comprises a plurality of island patterns in the touch area and a peripheral pattern in the peripheral area, each of the island patterns being located The first sensing electrode is interlaced with each of the second sensing electrodes, and the peripheral pattern covers the fan-out traces, and the peripheral pattern exposes the fan-outs that are not electrically connected to the first sensing electrodes. Part of the line. The touch panel of claim 18, wherein each of the first sensing electrodes comprises a plurality of first sensing pads and a plurality of first bridges, each of the first bridges connecting adjacent two a sensing pad, and each of the first bridge portions extending to the peripheral region is electrically connected to one of the fan-out traces, and each of the island-shaped patterns respectively covers one of the first bridge portions, and the peripheral pattern covers at least the Some fanouts and the first bridges. The touch panel of claim 19, wherein each of the second sensing electrodes comprises a plurality of second sensing pads and a plurality of second bridges, each of the second bridges connecting adjacent two a second sensing pad, each of the first bridging portions being interlaced with each of the second bridging portions, and each of the island-shaped patterns is located at an intersection of each of the first bridging portions and each of the second bridging portions, not Each of the fan-out traces electrically connected to the first bridge portions is electrically connected to one of the second bridge portions extending to the peripheral region, and the peripheral pattern at least exposes the second bridge portions.