TW201334112A - Holding device - Google Patents
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- TW201334112A TW201334112A TW101139254A TW101139254A TW201334112A TW 201334112 A TW201334112 A TW 201334112A TW 101139254 A TW101139254 A TW 101139254A TW 101139254 A TW101139254 A TW 101139254A TW 201334112 A TW201334112 A TW 201334112A
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Abstract
Description
本發明係關於例如保持晶圓等的基板之保持裝置。 The present invention relates to a holding device for a substrate such as a wafer.
近年來，要求著IC卡、行動電話等電子機器的薄型化、小型化、輕量化等。為了滿足這些要求，對於被組入的半導體晶片也必須使用薄型的半導體晶片。因此，成為半導體晶片的基礎的半導體晶圓的厚度(膜厚)在現狀下為125μm~150μm，但在次世代之晶片用途一般認為必須為25μm~50μm。亦即，為了得到前述膜厚的半導體晶圓，半導體晶圓的薄板化步驟是必要而不可欠缺的。 In recent years, electronic devices such as IC cards and mobile phones have been required to be thinner, smaller, and lighter. In order to meet these requirements, a thin semiconductor wafer must also be used for the semiconductor wafer to be incorporated. Therefore, the thickness (film thickness) of the semiconductor wafer which is the basis of the semiconductor wafer is 125 μm to 150 μm in the current state, but it is generally considered to be 25 μm to 50 μm in the next generation wafer use. That is, in order to obtain the semiconductor wafer having the above film thickness, the thinning step of the semiconductor wafer is necessary and indispensable.
半導體晶圓的薄板化步驟係以下述方式進行的。首先，以覆蓋半導體晶圓的電路形成面的方式，把保護半導體晶圓之用的支撐片(support plate)，透過雙面具有黏接層的膠帶或者黏接劑來貼附。接著，將此反轉，使半導體晶圓的背面藉由磨機(grinder)研削進行薄板化。接著，把薄板化的半導體晶片的背面，固定於被保持在切片架的切片膠帶上。進而，在此狀態剝離覆蓋半導體晶圓的電路形成面之支持板後，藉由切片裝置分割為各晶片。 The thinning step of the semiconductor wafer is performed in the following manner. First, a support plate for protecting a semiconductor wafer is attached to a support tape for protecting a semiconductor wafer through a tape or an adhesive having an adhesive layer on both sides. Next, this is reversed, and the back surface of the semiconductor wafer is thinned by grinding by a grinder. Next, the back surface of the thinned semiconductor wafer was fixed to the dicing tape held by the dicing frame. Further, after the support plate covering the circuit formation surface of the semiconductor wafer is peeled off in this state, it is divided into wafers by a slicing device.
如前所述進行薄板化的場合，剝離支持板之後，於半導體晶圓的電路形成面上會殘存著黏接劑等。因此，必須要除去附著的黏接劑等，使半導體晶圓之電路形成面成為清淨的面。總之，在把半導體晶圓固定於切片膠帶上的狀 態，剝離覆蓋半導體晶圓的電路形成面之支持板後，藉由切片裝置分割為各晶片之前，必須要對半導體晶圓的表面進行洗淨處理。 When thinning is performed as described above, after the support sheet is peeled off, an adhesive or the like remains on the circuit formation surface of the semiconductor wafer. Therefore, it is necessary to remove the adhered adhesive or the like so that the circuit forming surface of the semiconductor wafer becomes a clean surface. In short, the semiconductor wafer is fixed on the slice tape. In the state, after the support plate covering the circuit formation surface of the semiconductor wafer is peeled off, the surface of the semiconductor wafer must be cleaned before being divided into wafers by the dicing apparatus.
進行此洗淨處理時，或者在其之前的剝離支持板時，會有把半導體晶圓載置於保持台等而固定的場合。 When the cleaning process is performed, or when the support plate is peeled off before, the semiconductor wafer may be placed on a holding table or the like and fixed.
作為保持半導體晶圓的保持裝置，已有專利文獻1~3被發表出來。 Patent Documents 1 to 3 have been published as holding devices for holding semiconductor wafers.
專利文獻1所記載的基板處理裝置，係為了不使半導體晶圓破損而由支持板剝離之用者。 The substrate processing apparatus described in Patent Document 1 is intended to be peeled off from the support sheet without damaging the semiconductor wafer.
於專利文獻2，記載著具備由晶圓剝離保護膠帶時，為了把環狀框固定於其位置而按壓之按壓構件的剝離裝置。 Patent Document 2 describes a peeling device that includes a pressing member that is pressed to fix the annular frame to its position when the protective tape is peeled off from the wafer.
於專利文獻3，記載著使膠帶黏著之複數枚晶圓旋轉時按壓的按壓手段之旋轉器(spinner)洗淨裝置。 Patent Document 3 describes a spinner cleaning device that presses a pressing means for pressing a plurality of wafers to which a tape is attached.
[專利文獻1]日本特開2009-59776號公報(2009年3月19日公開) [Patent Document 1] Japanese Laid-Open Patent Publication No. 2009-59776 (published on March 19, 2009)
[專利文獻2]日本特開2003-59862號公報(2003年2月28日公開) [Patent Document 2] Japanese Laid-Open Patent Publication No. 2003-59862 (published on Feb. 28, 2003)
[專利文獻3]日本特開2006-128359號公報(2006年5月18日公開) [Patent Document 3] Japanese Laid-Open Patent Publication No. 2006-128359 (published on May 18, 2006)
使用溶劑洗淨晶圓時，溶劑浸入切片膠帶與切片框之界面的話，切片膠帶與切片框之黏著性會降低。如此，在切片膠帶與切片框之黏著性降低的狀態下使晶圓旋轉的話，由於旋轉時的離心力而會有使切片框由切片膠帶脫離的可能性。 When the wafer is washed with a solvent, if the solvent is immersed in the interface between the dicing tape and the dicing frame, the adhesion between the dicing tape and the dicing frame is lowered. As described above, when the wafer is rotated in a state where the adhesion between the dicing tape and the dicing frame is lowered, there is a possibility that the dicing frame is detached from the dicing tape due to the centrifugal force during the rotation.
在專利文獻1~3，並沒有記載著溶劑的浸入導致切片膠帶與切片框之黏著性降低，此外也沒有揭示出解決該問題的技術。亦即，在切片膠帶與切片框之黏著性降低的狀態下使晶圓旋轉的話，會有使切片框由切片膠帶脫離的可能性。 In Patent Documents 1 to 3, there is no description that the adhesion of the film to the dicing frame is lowered by the intrusion of the solvent, and the technique for solving the problem is not disclosed. In other words, if the wafer is rotated while the adhesiveness between the dicing tape and the dicing frame is lowered, the dicing frame may be detached from the dicing tape.
本發明係有鑑於前述問題點而完成之發明，目的在於提供使晶圓旋轉時，可以防止切片框由切片膠帶脫離之保持裝置。 The present invention has been made in view of the above problems, and an object thereof is to provide a holding device capable of preventing a dicing frame from being detached from a dicing tape when the wafer is rotated.
為了解決前述課題，相關於本發明之保持裝置，特徵係於外周具備框部同時於單面保持被接著有基板的支撐膜的保持裝置，具備：中介著前述支撐膜保持前述基板，能夠以垂直於前述基板的面方向之直線作為旋轉軸而旋轉的保持部，設於前述保持部，於前述保持部保持前述基板時，位於比前述框部更靠外側，具備藉由使前述保持部旋轉所產生的離心力來握持前述框部的擺錘之握持部，於前 述保持部保持前述基板時，由比前述框部更靠外側的位置往與前述基板的面方向不同的方向突出的方式設置之保護部。 In order to solve the above-described problems, the holding device according to the present invention is characterized in that the holding device includes a frame portion on the outer circumference and a support film on which the substrate is supported on one surface, and the substrate is supported by the support film. A holding portion that rotates as a rotation axis on a straight line in the surface direction of the substrate is provided in the holding portion, and is located outside the frame portion when the holding portion holds the substrate, and is provided to rotate the holding portion The centrifugal force generated to hold the grip of the pendulum of the frame portion, in front When the holding portion holds the substrate, the protective portion is provided so as to protrude from a position outside the frame portion in a direction different from the surface direction of the substrate.
根據本發明的話，即使切片膠帶與切片框之黏著性降低，也可以發揮防止在使晶圓旋轉時，切片框由切片膠帶脫離之效果。 According to the present invention, even if the adhesion between the dicing tape and the dicing frame is lowered, the effect of preventing the dicing frame from being detached from the dicing tape when the wafer is rotated can be exhibited.
以下，針對本發明之實施型態進行詳細說明。 Hereinafter, the embodiment of the present invention will be described in detail.
參照圖1~4說明相關於本發明的保持裝置之一實施型態。圖1係顯示相關於本發明之一實施型態之保持裝置的構造的概略之部分俯視圖，圖2係顯示相關於本發明之一實施型態之保持裝置的構造的概略之部分剖面圖。圖3係顯示使晶圓在旋轉狀態之相關於本發明之一實施型態之保持裝置的構造的概略之部分俯視圖，圖4係顯示使晶圓在旋轉狀態之相關於本發明之一實施型態之保持裝置的構造的概略之部分剖面圖。圖2係於圖1所示的A-A’線切斷保持裝置10的剖面圖，圖4係於圖3所示的B-B’線切斷保持裝置10的剖面圖。 An embodiment of the holding device relating to the present invention will be described with reference to Figs. Fig. 1 is a partial plan view showing a schematic configuration of a holding device according to an embodiment of the present invention, and Fig. 2 is a partial cross-sectional view showing the configuration of a holding device according to an embodiment of the present invention. 3 is a partial plan view showing the configuration of a holding device relating to an embodiment of the present invention in a state in which the wafer is in a rotating state, and FIG. 4 is a view showing an embodiment of the present invention in which the wafer is in a rotated state. A schematic partial cross-sectional view of the structure of the holding device. Fig. 2 is a cross-sectional view of the A-A' wire cutting and holding device 10 shown in Fig. 1, and Fig. 4 is a cross-sectional view of the B-B' wire cutting and holding device 10 shown in Fig. 3.
保持裝置10，具備保持台(保持部)13、擺錘11、 及保護銷(保護部)12，於外周具備切片框(框部)22同時於單面保持被接著著晶圓(基板)(未圖示)的切片膠帶(支撐膜)21。 The holding device 10 includes a holding table (holding portion) 13 and a pendulum 11, The protective pin (protecting portion) 12 is provided with a dicing frame (frame portion) 22 on the outer circumference and a dicing tape (support film) 21 on which a wafer (substrate) (not shown) is attached on one surface.
保持台13，如圖2所示，透過切片膠帶21保持晶圓20。接著，保持台13，能夠以垂直於晶圓20的面方向之直線為旋轉軸進行旋轉。保持台13，亦可具備旋轉驅動部。此外，保持台13，亦可具備藉由吸附切片膠帶21，而保持晶圓20的抽吸部14。保持台13之載置晶圓20之面以圓形狀為佳。 The holding table 13 holds the wafer 20 through the dicing tape 21 as shown in FIG. Next, the holding stage 13 is rotatable about a straight line perpendicular to the surface direction of the wafer 20 as a rotation axis. The holding table 13 may be provided with a rotation driving unit. Further, the holding table 13 may be provided with the suction portion 14 that holds the wafer 20 by adsorbing the slicing tape 21. It is preferable that the surface of the holding stage 13 on which the wafer 20 is placed has a circular shape.
抽吸部14，由切片膠帶21被接著之側的面來抽吸晶圓20。作為抽吸機構只要設置從前習知的抽吸機構即可。例如，設置抽吸吸著面上的氣體之用的抽吸孔(未圖示)亦可。接著，此抽吸孔，被連接於真空泵等減壓手段，藉由配置晶圓20，使抽吸手段動作，晶圓20與吸著面之間成為減壓的狀態，可以藉此進行吸附。抽吸孔，可以在板狀構件的特定位置形成孔來設置，例如，抽吸孔亦可以是貫通板件之貫通孔。此外，使用多孔質的材質來形成亦可。作為多孔質材質，例如可以例示聚丙烯、碳、鋁、陶瓷等。藉此，可以把晶圓20固定於保持台13上。又，抽吸部14之載置晶圓20之面以圓形狀為佳。 The suction portion 14 sucks the wafer 20 from the surface on the side where the slicing tape 21 is next. As the suction mechanism, it is only necessary to provide a conventional suction mechanism. For example, a suction hole (not shown) for sucking the gas on the suction surface may be provided. Then, the suction hole is connected to a decompression means such as a vacuum pump, and the suction means is operated by arranging the wafer 20, and the pressure between the wafer 20 and the absorbing surface is reduced, whereby adsorption can be performed. The suction hole may be provided at a specific position of the plate member, and for example, the suction hole may be a through hole penetrating the plate member. Further, it may be formed using a porous material. Examples of the porous material include polypropylene, carbon, aluminum, ceramics, and the like. Thereby, the wafer 20 can be fixed to the holding table 13. Further, the surface on which the wafer 20 is placed on the suction portion 14 is preferably a circular shape.
切片膠帶21，中介著接著劑貼附於晶圓的保持台13側之面。晶圓20之背向於切片膠帶21貼附的面之面上，被貼附支撐板24。 The dicing tape 21 is attached to the surface of the wafer holding side of the wafer 13 by an adhesive. The surface of the wafer 20 facing away from the surface to which the dicing tape 21 is attached is attached to the support plate 24.
例如，在本實施型態，首先晶圓20供應給薄化製程 。具體而言，於晶圓20的單面塗布接著劑形成接著劑層23之後被接著於支撐板24。接著，研磨與被接著支撐板24之面相反側的面使晶圓20薄化。又，支撐板24，是在薄化晶圓20的步驟發揮支撐作用之構件。支撐板24，例如係以其膜厚為500~1000μm的玻璃來形成。其次，在晶圓20之與被接著支撐板24的面相反側之面被接著切片膠帶21而載設於保持台13上。 For example, in this embodiment, first, the wafer 20 is supplied to the thinning process. . Specifically, after the one-side application of the adhesive on the wafer 20 to form the adhesive layer 23 is followed by the support plate 24. Next, the surface of the wafer 20 is thinned by polishing the surface on the side opposite to the surface on which the support plate 24 is attached. Further, the support plate 24 is a member that plays a supporting role in the step of thinning the wafer 20. The support plate 24 is formed, for example, of glass having a film thickness of 500 to 1000 μm. Next, the surface of the wafer 20 opposite to the surface on which the support plate 24 is attached is placed on the holding table 13 with the tape 21 attached thereto.
切片膠帶21，於外周具備切片框22。作為切片膠帶21，基底膜使用PVC(聚氯乙烯)或聚烯烴、聚丙烯等樹脂膜。此外，切片膠帶21，填補在被剝離支撐板24後之晶圓20的強度，發揮使得操作變得容易的作用。 The dicing tape 21 is provided with a dicing frame 22 on the outer circumference. As the dicing tape 21, a resin film such as PVC (polyvinyl chloride) or polyolefin or polypropylene is used as the base film. Further, the dicing tape 21 fills the strength of the wafer 20 after being peeled off the support plate 24, and functions to facilitate the operation.
其次，藉由從支撐板24上供給溶劑，溶解構成接著劑層23的接著劑除去該接著劑層23，可以拆下支撐板24。又，支撐板24被形成垂直於面方向的貫通孔，使由上面供給的溶劑到達接著劑層23。此外，此時於晶圓20上接著劑未完全被除去而殘存。又，於保持台13上亦可在除去支撐板24之後再載置。 Next, the support plate 24 can be removed by supplying a solvent from the support plate 24 and dissolving the adhesive constituting the adhesive layer 23 to remove the adhesive layer 23. Further, the support plate 24 is formed with a through hole perpendicular to the surface direction, so that the solvent supplied from the upper surface reaches the adhesive layer 23. Further, at this time, the adhesive on the wafer 20 is not completely removed and remains. Further, the holding table 13 may be placed after the support plate 24 is removed.
剝離支撐板24後，為了除去殘存於晶圓20上的接著劑，使保持晶圓20的保持台13旋轉，同時對晶圓20供給溶劑。使保持裝置10旋轉時，藉由其離心力使擺錘11傾倒向切片框22方向，擺錘11的上側握持著切片框22。 After the support plate 24 is peeled off, in order to remove the adhesive remaining on the wafer 20, the holding stage 13 holding the wafer 20 is rotated, and the solvent is supplied to the wafer 20. When the holding device 10 is rotated, the pendulum 11 is tilted in the direction of the slicing frame 22 by the centrifugal force thereof, and the slicing frame 22 is held by the upper side of the pendulum 11 .
保持台13亦可具有的旋轉驅動部，係使被載置於保持台13的晶圓20與保持台13一起旋轉之用的。旋轉驅 動部，以垂直於晶圓20的面方向之直線為旋轉軸使晶圓20旋轉的方式被構成。晶圓20，以其中心成為前述旋轉軸的方式被載置於保持台13上。藉此，保持裝置10可以使晶圓20旋轉。根據旋轉驅動部之晶圓20的轉速，只要因應用途而適當設定即可，例如，可以為500min-1以上、3000min-1以下。 The rotation driving unit that the holding table 13 can have is used to rotate the wafer 20 placed on the holding table 13 together with the holding table 13. The rotation driving unit is configured to rotate the wafer 20 with a straight line perpendicular to the surface direction of the wafer 20 as a rotation axis. The wafer 20 is placed on the holding table 13 so that its center becomes the aforementioned rotating shaft. Thereby, the holding device 10 can rotate the wafer 20. The rotational speed of the wafer rotation driving unit 20, in response to long use can appropriately set, for example, it may be 500min -1 or more, 3000min -1 or less.
擺錘11，設於保持台13的外周，於保持台13保持晶圓時，位於比切片框22更外側。接著，如圖3及4所示，藉由使保持台13旋轉產生的離心力，擺錘11傾斜往切片框22，以切片框22夾入擺錘11的上側與保持台13之間的方式來握持。擺錘11，作為切片框22的握持部而發揮功能。 The pendulum 11 is provided on the outer circumference of the holding table 13 and is located outside the slicing frame 22 when the holding stage 13 holds the wafer. Next, as shown in FIGS. 3 and 4, the pendulum 11 is inclined to the dicing frame 22 by the centrifugal force generated by the rotation of the holding table 13, and the dicing frame 22 is sandwiched between the upper side of the oscillating weight 11 and the holding table 13. Hold. The pendulum 11 functions as a grip portion of the slicing frame 22.
擺錘11，藉由軸撐部11a而被軸撐著。接著，擺錘11，其比軸撐部11a更下側(以保持台13為中心在晶圓20被保持之側的相反側)比起比軸撐部11a更上側(以保持台13為中心在晶圓20被保持之側)重量變得更重，而能夠以軸撐部11a為中心進行旋轉。此外，軸撐部11a，於擺錘11保持台13之沿著晶圓20(切片膠帶21)載置面的方向之位置，成為比中心更偏保持台13側。藉此，如圖4之箭頭所示，藉由保持台13的旋轉產生的離心力，使擺錘11之比軸撐部11a更為上側傾斜往切片框22側(內側)，擺錘11之比軸撐部11a更為下側傾斜往切片框22的相反側(外側)。 The pendulum 11 is axially supported by the shaft portion 11a. Next, the pendulum 11 is lower than the support portion 13a (on the side opposite to the side on which the wafer 20 is held by the holding table 13), and is higher than the support portion 13a (centered on the holding table 13) On the side where the wafer 20 is held, the weight becomes heavier, and the rotation can be performed centering on the support portion 11a. Further, the support portion 11a is positioned closer to the holding table 13 than the center in the direction in which the pendulum 11 holding table 13 is placed along the wafer 20 (sliced tape 21) mounting surface. Thereby, as shown by the arrow in FIG. 4, by the centrifugal force generated by the rotation of the holding table 13, the ratio of the pendulum 11 to the side of the slice frame 22 (inside) is inclined to the upper side of the support portion 11a. The support portion 11a is inclined further downward to the opposite side (outer side) of the slice frame 22.
擺錘11，為了握持切片框22確實把晶圓保持於保持 台13上，以至少設置4個為佳，分別之擺錘11，於切片框22的外周設為等間隔為更佳。 The pendulum 11 does hold the wafer in order to hold the slice frame 22 It is preferable that at least four are provided on the stage 13, and the pendulums 11 are respectively provided at equal intervals on the outer circumference of the slicing frame 22.
如此，使保持台13旋轉時，藉由擺錘11握持切片框22，但是在此時，被供給至晶圓20的溶劑會浸入切片膠帶21與切片框22之界面，而使切片膠帶21與切片框22之黏著性降低。接著，在切片膠帶21與切片框22之黏著性降低的狀態下，使保持裝置10旋轉的話，會有切片框22由切片膠帶21脫離之虞。 As described above, when the holding table 13 is rotated, the dicing frame 22 is held by the pendulum 11, but at this time, the solvent supplied to the wafer 20 is immersed in the interface between the dicing tape 21 and the dicing frame 22, and the dicing tape 21 is made. The adhesion to the dicing frame 22 is lowered. Then, when the holding device 10 is rotated in a state where the adhesiveness of the dicing tape 21 and the dicing frame 22 is lowered, the dicing frame 22 is detached from the dicing tape 21.
為了防止此情形，保持裝置10具備保護銷12。保護銷12，係於保持台13保持晶圓20時，從比切片框22更外側的位置往與沿著晶圓20的面之面方向不同的方向突出的方式設置。亦即，保護銷12，以突出於垂直保持台13的晶圓20載置面(切片膠帶21載置面)方向的方式設置亦可。藉由設置保護銷12，即使在切片膠帶21與切片框22之黏著性降低的狀態使保持裝置10旋轉，也因切片框22接觸於保護銷12，切片框22不會由切片膠帶21脫離。 In order to prevent this, the holding device 10 is provided with the protective pin 12. When the holding stage 13 holds the wafer 20, the protective pin 12 is provided so as to protrude from a position outside the dicing frame 22 in a direction different from the surface direction of the surface of the wafer 20. In other words, the protective pin 12 may be provided so as to protrude from the mounting surface of the wafer 20 on the vertical holding stage 13 (the surface on which the sliced tape 21 is placed). By providing the protective pin 12, even if the holding device 10 is rotated in a state where the adhesiveness of the dicing tape 21 and the dicing frame 22 is lowered, the dicing frame 22 is not detached from the dicing tape 21 because the dicing frame 22 is in contact with the protective pin 12.
保護銷12，以防止切片框22從任何位置脫離的方式，至少設置4個為佳，分別的保護銷12，於切片框22的外周設為等間隔為更佳。 It is preferable that at least four of the protection pins 12 are provided so as to prevent the dicing frame 22 from being detached from any position, and the respective protective pins 12 are preferably equally spaced on the outer circumference of the dicing frame 22.
保護銷12，在晶圓20被保持於保持台13時，最好是設於對應於設在切片框22的直線狀切取的部分之位置，亦即設在朝向切取部的位置。於切片框22，如圖5所示，設有切片框22的外周之一部分被切取為直線狀的切 取部22a~22d。圖5係顯示切片框之一例之圖。亦即，保護銷12，只要不是設在切片框22的彎曲的部分，而是設在對應於直線的切取部22a~22d的位置即可。藉此，即使切片膠帶21與切片框22之黏著性降低的狀態下使保持裝置10旋轉，也可以使切片框22與保護銷12適切地接觸，防止切片框22由切片膠帶21脫離。 When the wafer 20 is held by the holding table 13, the protective pin 12 is preferably provided at a position corresponding to a portion cut in a straight line formed in the slicing frame 22, that is, at a position facing the cutting portion. In the slicing frame 22, as shown in FIG. 5, a portion of the outer circumference of the slicing frame 22 is cut into a straight line. The portions 22a to 22d are taken. Fig. 5 is a view showing an example of a slicing frame. In other words, the protective pin 12 may be provided at a position corresponding to the straight cut portions 22a to 22d instead of the curved portion of the slicing frame 22. Thereby, even if the holding device 10 is rotated in a state where the adhesiveness of the dicing tape 21 and the dicing frame 22 is lowered, the dicing frame 22 can be brought into proper contact with the protective pin 12, and the dicing frame 22 can be prevented from being detached from the dicing tape 21.
此外，保護銷12與擺錘11，以鄰接設置為佳。進而如圖1及圖3所示，把由被設置保護銷12的台所延伸之軸作為擺錘11的軸撐部11a而設置擺錘11亦可。如此，藉由使保護銷12與擺錘11一體形成，裝置的構成變得單純，裝置的製造及組裝變得容易。此外，保護銷12，如圖1及圖3所示，亦可以2個12夾住擺錘11的方式設置。 Further, it is preferable that the protection pin 12 and the pendulum 11 are disposed adjacent to each other. Further, as shown in FIGS. 1 and 3, the pendulum 11 may be provided as a shaft portion 11a of the pendulum 11 by a shaft extending from a stage on which the guard pin 12 is provided. As described above, by integrally forming the protective pin 12 and the pendulum 11, the configuration of the device is simplified, and the manufacture and assembly of the device are facilitated. Further, as shown in FIGS. 1 and 3, the protective pin 12 may be provided in such a manner that two pendulums 11 are sandwiched between the two.
保護銷12，於保持台13保持晶圓時，設於由切片框22離開0.2~5mm的位置為佳。藉此，切片框22接著於切片膠帶21時，保護銷12不會接觸於切片框22，但在切片膠帶21與切片框22之黏著性降低的狀態下使保持裝置10旋轉時，保護銷12接觸於切片框22，可以更為確實地防止切片框22由切片膠帶21脫離。 The protective pin 12 is preferably provided at a position away from the dicing frame 22 by 0.2 to 5 mm when the holding stage 13 holds the wafer. Thereby, when the dicing frame 22 is next to the dicing tape 21, the protective pin 12 does not contact the dicing frame 22, but when the holding device 10 is rotated in a state where the adhesiveness of the dicing tape 21 and the dicing frame 22 is lowered, the protective pin 12 is protected. Contact with the dicing frame 22 can more reliably prevent the dicing frame 22 from being detached from the dicing tape 21.
此外，保護銷12，以藉由金屬或樹脂材料形成為佳。形成保護銷12的金屬材料，例如可以舉出鋁、不銹鋼、鈦等。形成保護銷12的樹脂材料，例如可以舉出聚甲醛(polyoxymethylene)(POM)、聚四氟乙烯(PTFE)、四氟乙烯．全氟代烷基乙烯基醚共聚合物(PFA)、聚 丙烯(PP)、聚乙烯(PE)、聚苯硫醚(PPS)、聚醚醚酮(PEEK)等。 Further, the protective pin 12 is preferably formed of a metal or a resin material. Examples of the metal material forming the protective pin 12 include aluminum, stainless steel, titanium, and the like. The resin material forming the protective pin 12 may, for example, be polyoxymethylene (POM), polytetrafluoroethylene (PTFE) or tetrafluoroethylene. Perfluoroalkyl vinyl ether copolymer (PFA), poly Propylene (PP), polyethylene (PE), polyphenylene sulfide (PPS), polyetheretherketone (PEEK), and the like.
藉由這樣的材料來形成保護銷12，可以賦予防止切片框22由切片膠帶21脫離所必要的剛性，而且重量輕，所以可防止裝置的重量化。 By forming the protective pin 12 by such a material, it is possible to impart rigidity necessary for preventing the dicing frame 22 from being detached from the dicing tape 21, and the weight is light, so that the weight of the apparatus can be prevented.
保護銷12，以先端部變細的圓柱狀等柱形狀為佳，但其形狀沒有特別限定。此外，保護銷12的高度沒有特別限定，只要大於切片框22的厚度即可，例如可以是由切片框22的上面起0.5~5mm的高度。此外，保護銷12的直徑只要是可以得到必要的剛性之直徑即可，沒有特別限定。 The protective pin 12 is preferably a cylindrical columnar shape in which the tip end portion is tapered, but the shape thereof is not particularly limited. Further, the height of the protection pin 12 is not particularly limited as long as it is larger than the thickness of the dicing frame 22, and may be, for example, a height of 0.5 to 5 mm from the upper surface of the dicing frame 22. Further, the diameter of the protective pin 12 is not particularly limited as long as it is a diameter that can obtain the necessary rigidity.
本發明，例如可利用於薄板化晶圓之表面處理等。 The present invention can be used, for example, for surface treatment of a thinned wafer.
10‧‧‧保持裝置 10‧‧‧ Keeping device
11‧‧‧擺錘 11‧‧‧ pendulum
11a‧‧‧軸撐部 11a‧‧‧Axle support
12‧‧‧保護銷(保護部) 12‧‧‧Protection pin (Protection Department)
13‧‧‧保持台(保持部) 13‧‧‧ Keeping station (holding department)
14‧‧‧抽吸部 14‧‧‧Sucking Department
20‧‧‧晶圓(基板) 20‧‧‧ Wafer (substrate)
21‧‧‧切片膠帶 21‧‧‧Slice tape
22‧‧‧切片框 22‧‧‧Slice frame
22a~22d‧‧‧切取部 22a~22d‧‧‧cutting department
23‧‧‧接著劑層 23‧‧‧ adhesive layer
24‧‧‧支撐板 24‧‧‧Support board
圖1係顯示相關於本發明之一實施型態之保持裝置的構造的概略之部分俯視圖。 Fig. 1 is a partial plan view showing the outline of a configuration of a holding device relating to an embodiment of the present invention.
圖2係顯示相關於本發明之一實施型態之保持裝置的構造的概略之部分剖面圖。 Fig. 2 is a partial cross-sectional view showing the configuration of a holding device relating to an embodiment of the present invention.
圖3係使晶圓旋轉的狀態之相關於本發明的一實施型態之保持裝置的構造概略之部分俯視圖。 Fig. 3 is a partial plan view showing a schematic configuration of a holding device according to an embodiment of the present invention in a state in which a wafer is rotated.
圖4係使晶圓旋轉的狀態之相關於本發明的一實施型態之保持裝置的構造概略之部分剖面圖。 Fig. 4 is a partial cross-sectional view showing the structure of a holding device according to an embodiment of the present invention in a state in which the wafer is rotated.
圖5係顯示切片框之一例之圖。 Fig. 5 is a view showing an example of a slicing frame.
10‧‧‧保持裝置 10‧‧‧ Keeping device
11‧‧‧擺錘 11‧‧‧ pendulum
12‧‧‧保護銷(保護部) 12‧‧‧Protection pin (Protection Department)
21‧‧‧切片膠帶 21‧‧‧Slice tape
22‧‧‧切片框 22‧‧‧Slice frame
24‧‧‧支撐板 24‧‧‧Support board
Claims (7)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011270678A JP6043060B2 (en) | 2011-12-09 | 2011-12-09 | Holding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201334112A true TW201334112A (en) | 2013-08-16 |
| TWI552257B TWI552257B (en) | 2016-10-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101139254A TWI552257B (en) | 2011-12-09 | 2012-10-24 | Keep the device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6043060B2 (en) |
| TW (1) | TWI552257B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4555351B2 (en) | 2008-01-30 | 2010-09-29 | 株式会社神戸製鋼所 | Kneading degree adjusting device, extruder, and continuous kneader |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW452917B (en) * | 1999-10-29 | 2001-09-01 | Winbond Electronics Corp | Holder |
| US6612014B1 (en) * | 2000-07-12 | 2003-09-02 | Applied Materials, Inc. | Dual post centrifugal wafer clip for spin rinse dry unit |
| JP4939376B2 (en) * | 2007-11-13 | 2012-05-23 | 株式会社Ｓｏｋｕｄｏ | Substrate processing equipment |
| JP5384904B2 (en) * | 2008-10-16 | 2014-01-08 | 株式会社ディスコ | Cleaning device |
-
2011
- 2011-12-09 JP JP2011270678A patent/JP6043060B2/en active Active
-
2012
- 2012-10-24 TW TW101139254A patent/TWI552257B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| JP6043060B2 (en) | 2016-12-14 |
| TWI552257B (en) | 2016-10-01 |
| JP2013122977A (en) | 2013-06-20 |
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