TW201333364A - 固態發光元件 - Google Patents
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Abstract
一種固態發光元件,包括一階梯型槽體、多個發光晶片與一封裝膠體。階梯型槽體包括一底座部與一環形階梯形結構。環形階梯形結構具有多層環形階面以及多個連結這些環形階面的環形豎面,且環形階梯形結構連接於底座部。底座部具有一底面,而環形階梯結構圍繞並高出於底面。這些發光晶片分別裝設在這些環形階面與底面上。封裝膠體填滿階梯形槽體,並包覆這些發光晶片。
Description
本發明有關於一種發光元件,且特別是有關於一種固態發光元件。
現今固態發光元件大多採用發光二極體晶片(Light-Emitting Diode Chip,LED Chip)來作為發光源,而發光二極體晶片具有省電與低電壓驅動等優點,因此固態發光元件已普遍應用於燈具、交通號誌燈以及液晶顯示器(Liquid Crystal Display,LCD)等。
一般而言,目前一些固態發光元件通常包括一塊板材與多個發光二極體晶片,其中板材例如是電路板或金屬板,並具有一平面,而這些發光二極體晶片裝設(mounted)在板材的平面上。換句話說,在現有的固態發光元件中,多個發光二極體晶片都是裝設在板材的同一平面上。這種排布方式不便於外層發光二極體與內層發光二極體所發出的光線集中,從而降低了固態發光元件的光指向性。
本發明提出一種固態發光元件,其包括多個發光晶片所裝設的階梯型槽體,以使這些發光晶片裝設在不同水平高度(level)的平面上。
本發明提出一種固態發光元件,包括一階梯型槽體、多個發光晶片與一封裝膠體。階梯型槽體包括一底座部與
一環形階梯形結構。環形階梯形結構具有多層環形階面以及多個連結這些環形階面之環形豎面,且環形階梯形結構連接配置於底座部上方。底座部具有一底面,而環形階梯結構圍繞並高出於底面。這些發光晶片分別裝設在這些環形階面與底面上,其中位在底面上的發光晶片與其相鄰層之環形階面上的發光晶片電性連接,而位在其中一層環形階面上的發光晶片與位在其相鄰層之環形階面上的發光晶片電性連接。封裝膠體填滿階梯形槽體,並包覆這些發光晶片。
基於上述,在本發明的固態發光元件中,這些發光晶片分別裝設在這些環形階面與底面上,從而能裝設在不同水平高度的平面上。
為使能更進一步瞭解本發明的特徵及技術內容,請參閱以下詳細說明與圖式,但是此等說明與所附圖式僅用來說明本發明,而非對本發明的權利範圍作任何的限制。
圖1A是本發明第一實施例之固態發光元件的俯視示意圖。請參閱圖1A,本實施例的固態發光元件100可應用於顯示器與照明裝置(illumination device),其中顯示器例如是液晶顯示器或投影機,而照明裝置例如是檯燈、美術燈、小夜燈、安全門燈或緊急出口燈等燈具。此外,照明裝置也可為狀態顯示燈。舉例而言,照明裝置可以是烤箱的溫度顯示燈或音響的狀態顯示燈等家電產品的指示燈,
或者是手機或電腦的電源顯示燈等電子設備的指示燈。
圖1B是圖1A中沿著線1a-1a剖面所繪示的剖面示意圖。請參閱圖1A與圖1B,固態發光元件100包括一階梯型槽體110、多個發光晶片120以及一封裝膠體130。階梯型槽體110包括一環形階梯結構112以及一底座部114,其中環形階梯結構112配置(disposed)於底座部114上,並且連接底座部114。這些發光晶片120裝設於環形階梯結構112,而封裝膠體130填滿階梯型槽體110,並且包覆這些發光晶片120。
階梯型槽體110的材料為金屬,例如鋁或銅,而製造階梯型槽體110的方法包括化學加工或機械加工,其中化學加工例如是化學蝕刻,而機械加工例如是沖壓或銑床。以沖壓為例,製造階梯型槽體110的方法可以是對金屬板材,例如銅箔,施予一次或一次以上的沖壓程序,以在金屬板材上進行模具壓印,從而形成環形階梯結構112與底座部114。
底座部114具有一底面114a,而環形階梯結構112具有多層環形階面112a以及多個連結這些環形階面112a的環形豎面112b,其中這些發光晶片120分別裝設在這些環形階面112a上與底面114a上。環形階梯結構112圍繞並高出於底面114a,而環形豎面112b連接在相鄰二層環形階面112a之間。此外,最外層環形階面112a相對於底面114a的高度H1,自最外層向最內層,相對於底面114a的高度
遞減,而最外層的環形階面112a可不設置任何發光晶片120。
在本實施例中,這些環形豎面112b的寬度W1可彼此相等,而這些環形階面112a的寬度W2也可彼此相等。然而,在其他實施例中,至少二個環形豎面112b的寬度W1可不相等,而至少二個環形階面112a的寬度W2可不相等,即其中一面環形豎面112b的寬度W1與另一面環形豎面112b的寬度W1不相等,其中一面環形階面112a的寬度W2與另一面環形階面112a的寬度W2不相等。因此,本實施例並不限定這些環形豎面112b的寬度W1要彼此相等,以及這些環形階面112a的寬度W2要彼此相等。
發光晶片120可以是一可發光的半導體元件,其例如是發光二極體,而這些發光晶片120可採用打線接合(wire bonding)的方式裝設在底面114a上與環形階面112a上。也就是說,固態發光元件100可更包括多條電性連接發光晶片120的鍵合導線160。藉由這些鍵合導線160,位在底面114a上的發光晶片120電性連接於其相鄰層之環形階面112a上的發光晶片120,而位在其中一層環形階面112a上的發光晶片120與位在其相鄰層之環形階面112a上的發光晶片120電性連接。
固態發光元件100可以更包括多層絕緣層140與多層線路層150。絕緣層140配置於環形階面112a上與底面114a上,而這些線路層150分別配置於這些絕緣層140上。線
路層150可以作為在這些發光晶片120之間傳遞電流的元件,而在本實施例中,各個發光晶片120電性連接其中一層線路層150。
在各層環形階面112a中,絕緣層140位在線路層150與階梯型槽體110之間,以至於絕緣層140將線路層150與階梯型槽體110隔開。雖然階梯型槽體110的材料為金屬,但由於絕緣層140將線路層150與階梯型槽體110隔開,因此線路層150不電性接觸階梯型槽體110,即線路層150與環形階梯結構112電性絕緣。如此,電性連接線路層150的發光晶片120也與環形階梯結構112電性絕緣。
在本實施例中,位在最外層環形階面112a上的線路層150可經由鍵合導線160而連接相鄰層環形階面112a上的發光晶片120。同理,位在其中一層環形階面112a上的發光晶片120與其相鄰層之環形階面112a上的發光晶片120兩者也可以透過鍵合導線160而連接。此外,其中二個發光晶片120可以彼此串聯或並聯。
封裝膠體130可由多層封裝膠材132所組成,而這些封裝膠材132可以逐層填滿階梯型槽體110,其中每一層的封裝膠材132覆蓋至少一層環形豎面112b以及至少一層環形階面112a,又最外層之封裝膠材132可以凸出於最外層的環形階面112a。
承上述,封裝膠材132可為熱固性樹脂,且這些封裝膠材132可以分別具有不同的折射率及/或分別添加不同的
螢光粉。也就是說,其中一層封裝膠材132的折射率不同於另一封裝膠材132的折射率,或是其中一層封裝膠材132內的螢光粉不同於另一層封裝膠材132內的螢光粉。因此,可依每一層封裝膠材132的折射率差異或摻混不同種類的螢光粉來產生出多樣化的燈光效果。
圖2是本發明第二實施例之固態發光元件的剖面示意圖。請參閱圖2,第二實施例的固態發光元件200與第一實施例的固態發光元件100二者結構相似。例如,固態發光元件200也包括多個發光晶片120、一階梯形槽體210以及一封裝膠體230,其中這些發光晶片120裝設於階梯形槽體210,而封裝膠體230填滿階梯形槽體210,並且包覆這些發光晶片120。
承上述,階梯形槽體210也包括一環形階梯結構212以及一連接環形階梯結構212的底座部214,而與第一實施例相同的是,環形階梯結構212具有多層環形階面212a以及多個連結這些環形階面212a的環形豎面212b,其中這些發光晶片120也是分別裝設在這些環形階面212a上與底面214a上,而且是以打線接合的方式裝設在這些環形階面212a上與底面214b上。所以,固態發光元件200也包括多條電性連接發光晶片120的鍵合導線160。
不過,第二實施例與第一實施例之間仍存有一些差異。詳細而言,階梯形槽體210是由非金屬材料所構成,例如塑膠或陶瓷,其中此非金屬材料為絕緣體,所以階梯
形槽體210具有絕緣性而不會導電。因此,這些發光晶片120不會經由階梯形槽體210而發生短路,即階梯形槽體210與發光晶片120兩者之間電性絕緣。相較於第一實施例,固態發光元件200不一定要包括絕緣層140,且發光晶片120可直接裝設在環形階面212a與底面214a上。
此外,固態發光元件200也可包括線路層150,而在本實施例中,線路層150可以只設置於最外層的環形階面212a,而不設置於底面214a或其他環形階面212a。雖然發光晶片120可不設置於最外層的環形階面212a,但利用鍵合導線160,發光晶片120能電性連接線路層150,如圖2所示。不過,圖2中的線路層150僅供舉例說明,而本實施例不限制線路層150的數量與配置。
有別於第一實施例的固態發光元件100,封裝膠體230是由單一層封裝膠材所組成,其中此封裝膠材可以是第一實施例中的封裝膠材132。此外,固態發光元件200可更包括多層反光層170,而這些反光層170分別覆蓋於這些環形豎面212b,其中反光層170可由反光材料所形成的膜層(film),而此反光材料例如是玻璃微珠、顏料(特別是白色顏料)、高分子材料的複合物或金屬薄膜。這些反光層170能反射並聚集發光晶片120所發出的光線,從而增加固態發光元件200的亮度。
綜上所述,在本發明中,由於多個發光晶片裝設在階梯型槽體的多個環形階面上與底面上,因此這些發光晶片
能分別裝設在這些環形階面與底面上,從而能裝設在不同水平高度的平面上。另外,藉由階梯型槽體,這些處於不同水平高度的發光晶片所發出的光線能被集中,從而增加固態發光元件的光指向性。
以上所述僅為本發明的實施例,其並非用以限定本發明的專利保護範圍。任何熟習相像技藝者,在不脫離本發明的精神與範圍內,所作的更動及潤飾的等效替換,仍為本發明的專利保護範圍內。
100、200‧‧‧固態發光元件
110、210‧‧‧階梯型槽體
112、212‧‧‧環形階梯結構
112a、212a‧‧‧環形階面
112b、212b‧‧‧環形豎面
114、214‧‧‧底座部
114a、214a‧‧‧底面
120‧‧‧發光晶片
130、230‧‧‧封裝膠體
132‧‧‧封裝膠材
140‧‧‧絕緣層
150‧‧‧線路層
160‧‧‧鍵合導線
170‧‧‧反光層
H1‧‧‧高度
W1、W2‧‧‧寬度
圖1A是本發明第一實施例之固態發光元件的俯視示意圖。
圖1B是圖1A沿著線1a-1a剖面所繪示的剖面示意圖。
圖2是本發明第二實施例之固態發光元件的剖面示意圖。
100‧‧‧固態發光元件
110‧‧‧階梯型槽體
112‧‧‧環形階梯結構
112a‧‧‧環形階面
112b‧‧‧環形豎面
114‧‧‧底座部
120‧‧‧發光晶片
Claims (12)
- 一種固態發光元件,包括:一階梯型槽體,包括:一底座部,具有一底面;以及一環形階梯結構,具有多層環形階面以及多個連結該些環型階面的環形豎面,該環形階梯結構連接配置於該底座部上方,且該環形階梯結構圍繞並高出於該底面;多個發光晶片,分別裝設在該些環形階面上與該底面上,其中位在該底面上的該發光晶片電性連接與其相鄰層之環形階面上的發光晶片,而位在其中一層環形階面上的發光晶片與位在其相鄰層之環形階面上的發光晶片電性連接;以及一封裝膠體,填滿該階梯型槽體,並包覆該些發光晶片。
- 如申請專利範圍第1項所述之固態發光元件,其中該些環形階面相對於該底面的高度,自最外層朝向該底面而遞減。
- 如申請專利範圍第2項所述之固態發光元件,其中該封裝膠體由一層以上的封裝膠材所構成。
- 如申請專利範圍第3項所述之固態發光元件,其中每一層該封裝膠材覆蓋至少一環形豎面以及至少一層環形階面。
- 如申請專利範圍第4項所述之固態發光元件,其中 該封裝膠材至少兩層的折射率不同或該封裝膠材至少兩層的螢光粉不同。
- 如申請專利範圍第1項所述之固態發光元件,其中該階梯型槽體的材料為非金屬。
- 如申請專利範圍第1項所述之固態發光元件,其中該階梯型槽體的材料為金屬。
- 如申請專利範圍第7項所述之固態發光元件,更包括多個絕緣層,該些絕緣層分別配置在該底面上以及該些環形階面上,該些發光晶片裝設在該些絕緣層上。
- 如申請專利範圍第8項所述之固態發光元件,更包括多個線路層,該些線路層分別配置在該些絕緣層上,並且與該階梯型槽體電性絕緣,其中各該發光晶片電性連接其中一線路層。
- 如申請專利範圍第1~9項中任意一項所述之固態發光元件,更包括多個反光層,該些反光層分別覆蓋該些環形豎面。
- 如申請專利範圍第1~9項中任意一項所述之固態發光元件,其中該些發光晶片是以打線接合的方式裝設在該些環形階面上與該底面上。
- 如申請專利範圍第1~9項中任意一項所述之固態發光元件,其中該最外層的環形階面不設置發光晶片。
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JP6076796B2 (ja) * | 2013-03-28 | 2017-02-08 | シチズン電子株式会社 | 半導体発光装置 |
CN103904196A (zh) * | 2014-03-18 | 2014-07-02 | 深圳市光之谷新材料科技有限公司 | 一种发光二极管基座及使用其的光源 |
CN104538388A (zh) * | 2014-12-11 | 2015-04-22 | 佛山市国星光电股份有限公司 | 色温可调的led光源的封装方法 |
JP6823893B2 (ja) | 2014-12-19 | 2021-02-03 | グロ アーベーGlo Ab | バックプレーン上に発光ダイオードアレイを生成する方法 |
CN104810461B (zh) * | 2015-03-03 | 2017-11-07 | 深圳市华星光电技术有限公司 | 发光元件封装件及显示器 |
JP2017103381A (ja) * | 2015-12-03 | 2017-06-08 | シチズン電子株式会社 | 発光装置 |
JP6915983B2 (ja) * | 2015-12-25 | 2021-08-11 | シチズン電子株式会社 | 発光装置および調色装置 |
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