CN103904196A - 一种发光二极管基座及使用其的光源 - Google Patents
一种发光二极管基座及使用其的光源 Download PDFInfo
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Abstract
本发明提出一种发光二极管(light emitting diode,LED)基座,所述LED基座包括设置区,所述设置区包括挡光面及底面。所述底面用于放置LED芯片,其中,所述挡光面与所述LED芯片位于所述底面的同一侧,以调整所述LED芯片的发光角度。本发明还提供一种光源,包括如上所述的LED基座。本发明的LED基座及光源挡光面与LED芯片位于底面的同一侧,以调整LED芯片的发光角度,且根据挡光面与底面的夹角可调整LED芯片的发光角度,消除了光线刺眼的困扰,且灵活性高。
Description
技术领域
本发明是关于发光二极管技术领域,且特别是关于一种发光二极管基座及使用其的光源。
背景技术
发光二极管(light emitting diode,LED)由于其节能、安全、使用寿命长等特点而被广泛的应用。
现有的光源的发光角度接近360度,且发光角度固定,容易刺眼,灵活性低。
因此,有必要提供改进的技术方案以克服现有技术中存在的以上技术问题。
发明内容
本发明的目的是提供一种调整发光二极管(light emitting diode,LED)芯片发光角度,消除光线刺眼的困扰,且灵活性高的LED基座。
本发明提出一种LED基座,所述LED基座包括多个设置区,所述每个设置区包括挡光面及底面,所述底面用于放置LED芯片。其中,所述挡光面与所述LED芯片位于所述底面的同一侧,以调整所述LED芯片的发光角度。
本发明还提供一种光源,所述光源包括LED基座,所述LED基座包括多个设置区,所述每个设置区包括挡光面及底面,所述底面用于放置LED芯片,所述挡光面与所述LED芯片位于所述底面的同一侧,以调整所述LED芯片的发光角度。
本发明的有益效果是,本发明的LED基座及光源的挡光面与LED芯片位于底面的同一侧,以调整LED芯片的发光角度,且根据挡光面与底面的夹角可调整LED芯片的发光角度,消除了光线刺眼的困扰,且灵活性高。
上述说明仅是本发明技术方案的概述,为了能够更清楚了解本发明的技术手端,而可依照说明书的内容予以实施,并且为了让本发明的上述和其它目的、特征和优点能够更明显易懂,以下特举实施例,并配合附图,详细说明如下。
附图说明
图1为本发明一实施例的的发光二极管基座的结构示意图。
具体实施方式
为更进一步阐述本发明为达成预定发明目的所采取的技术手端及功效,以下结合附图及较佳实施例,对依据本发明提出的发光二极管基座及使用其的光源的具体实施方式、结构、特征及其功效,详细说明如下:
图1为本发明的一实施例的发光二极管基座的结构示意图。如图1所示,发光二极管(light emitting diode,LED)基座1包括设置区10,设置区10包括挡光面101及底面102,底面102用于放置LED芯片2。其中,其中,挡光面101与LED芯片2位于底面102的同一侧,以调整位于底面102上的LED芯片2的发光角度。
在本发明的一实施方式中,LED基座1包括多个设置区10(图中仅仅示出三个),多个设置区10相互连接。
在本发明的一实施方式中,多个设置区10呈阶梯形排列。
在本发明的一实施方式中,每个设置区10中的挡光面101与底面102之间的夹角相等。
在本发明的一实施方式中,每个设置区10中的挡光面101与底面102相邻,且互相垂直。当然本领域的技术人员可以理解的是,挡光面101与底面102的夹角可以根据LED芯片2发光角度的需要调整为其它角度。
本发明还公开了一种使用上述LED基座1的光源,光源包括发光二极管(light emitting diode,LED)基座1、LED芯片2及荧光胶3。LED基座1包括设置区10,设置区10包括挡光面101及底面102,LED芯片2位于设置区10的底面102上。其中,挡光面101与LED芯片2位于底面102的同一侧,以调整位于底面102上的LED芯片2的发光角度。荧光胶3用于密封LED芯片2。其中,荧光胶3未完全覆盖LED基座1,以加快LED芯片2的散热速度。
在本发明的一实施方式中,光源包括多个LED芯片2,多个LED芯片2串联在一起。
在本发明的一实施方式中,荧光胶3由多个三菱柱组成,且每个三菱柱的其中两面分别与挡光面101及底面102重叠。
本发明的LED基座及光源的挡光面101与LED芯片2位于底面102的同一侧,以调整位于底面102上的LED芯片2的发光角度,且根据底面102与挡光面101夹角可调整LED芯片2的发光角度,消除了光线刺眼的困扰,且灵活性高。
以上,仅是本发明的实施例而已,并非对本发明作任何形式上的限制,虽然本发明已以实施例揭露如上,然而并非用以限定本发明,任何熟悉本专业的技术人员,在不脱离本发明技术方案范围内,当可利用上述揭示的技术内容作出些许更动或修饰为等同变化的等效实施例,但凡是未脱离本发明技术方案内容,依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化与修饰,均仍属于本发明技术方案的范围内。
Claims (8)
1.一种发光二极管基座,其特征在于,所述发光二极管基座包括:
设置区,所述设置区包括:
挡光面;及
底面,所述底面用于放置发光二极管芯片;
其中,所述挡光面与所述发光二极管芯片位于所述底面的同一侧,以调整所述发光二极管芯片的发光角度。
2.如权利要求1所述的发光二极管基座,其特征在于,所述发光二极管基座包括多个设置区,所述多个设置区相互连接。
3.如权利要求2所述的发光二极管基座,其特征在于,所述多个设置区呈阶梯形排列。
4.如权利要求3所述的发光二极管基座,其特征在于,所述设置区中的所述底面与所述挡光面的夹角均相等。
5.如权利要求4所述的发光二极管基座,其特征在于,所述设置区中的所述底面与所述挡光面相互垂直。
6.一种光源,其特征在于,包含如权利要求1-5任一项所述的发光二极管基座。
7.如权利要求6所述的光源,其特征在于,所述光源还包括:
发光二极管芯片,所述发光二极管芯片位于所述设置区的底面上;及
荧光胶,所述荧光胶用于密封所述发光二极管芯片;
其中,所述荧光胶未完全覆盖所述发光二极管基座。
8.如权利要求7所述的光源,其特征在于,所述光源包括多个发光二极管芯片,所述多个发光二极管芯片串联在一起。
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PCT/CN2015/074171 WO2015139581A1 (zh) | 2014-03-18 | 2015-03-13 | 一种发光二极管基座及使用其的光源 |
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WO2015139581A1 (zh) * | 2014-03-18 | 2015-09-24 | 深圳市光之谷新材料科技有限公司 | 一种发光二极管基座及使用其的光源 |
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---|---|---|---|---|
CN201526842U (zh) * | 2009-09-30 | 2010-07-14 | 艾笛森光电股份有限公司 | 具有环场照明的led灯具 |
CN102543987A (zh) * | 2012-02-07 | 2012-07-04 | 达亮电子(苏州)有限公司 | 固态发光组件 |
CN203800074U (zh) * | 2014-03-18 | 2014-08-27 | 深圳市光之谷新材料科技有限公司 | 一种发光二极管基座及使用其的光源 |
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JP2001251057A (ja) * | 2000-03-08 | 2001-09-14 | Nec Corp | 多層プリント配線基板にデバイスが搭載された装置、多層プリント配線基板、及びデバイス |
CN201212639Y (zh) * | 2008-06-02 | 2009-03-25 | 奥古斯丁科技股份有限公司 | 发光二极管路灯的灯座改良结构 |
CN202442462U (zh) * | 2012-02-20 | 2012-09-19 | 珠海格力电器股份有限公司 | 空调面板体及具有其的空调器 |
CN202493953U (zh) * | 2012-03-19 | 2012-10-17 | 吴育林 | 一种多级led灯管 |
CN103904196A (zh) * | 2014-03-18 | 2014-07-02 | 深圳市光之谷新材料科技有限公司 | 一种发光二极管基座及使用其的光源 |
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CN201526842U (zh) * | 2009-09-30 | 2010-07-14 | 艾笛森光电股份有限公司 | 具有环场照明的led灯具 |
CN102543987A (zh) * | 2012-02-07 | 2012-07-04 | 达亮电子(苏州)有限公司 | 固态发光组件 |
CN203800074U (zh) * | 2014-03-18 | 2014-08-27 | 深圳市光之谷新材料科技有限公司 | 一种发光二极管基座及使用其的光源 |
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