TW201332037A - 接合方法、電腦記憶媒體及接合系統 - Google Patents

接合方法、電腦記憶媒體及接合系統 Download PDF

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Publication number
TW201332037A
TW201332037A TW101132534A TW101132534A TW201332037A TW 201332037 A TW201332037 A TW 201332037A TW 101132534 A TW101132534 A TW 101132534A TW 101132534 A TW101132534 A TW 101132534A TW 201332037 A TW201332037 A TW 201332037A
Authority
TW
Taiwan
Prior art keywords
heat treatment
processed
substrate
wafer
treatment chamber
Prior art date
Application number
TW101132534A
Other languages
English (en)
Chinese (zh)
Inventor
Masatoshi Deguchi
Masatoshi Shiraishi
Shinji Okada
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW201332037A publication Critical patent/TW201332037A/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW101132534A 2011-09-07 2012-09-06 接合方法、電腦記憶媒體及接合系統 TW201332037A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011195470A JP5427856B2 (ja) 2011-09-07 2011-09-07 接合方法、プログラム、コンピュータ記憶媒体及び接合システム

Publications (1)

Publication Number Publication Date
TW201332037A true TW201332037A (zh) 2013-08-01

Family

ID=47832048

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101132534A TW201332037A (zh) 2011-09-07 2012-09-06 接合方法、電腦記憶媒體及接合系統

Country Status (3)

Country Link
JP (1) JP5427856B2 (ja)
TW (1) TW201332037A (ja)
WO (1) WO2013035599A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI612595B (zh) * 2014-08-07 2018-01-21 東京威力科創股份有限公司 接合裝置、接合系統、接合方法及電腦記憶媒體
TWI833848B (zh) * 2019-03-20 2024-03-01 日商新創機電科技股份有限公司 加熱裝置、基板處理系統、及基板處理方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016129197A (ja) * 2015-01-09 2016-07-14 東京エレクトロン株式会社 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4563748B2 (ja) * 2004-08-02 2010-10-13 本田技研工業株式会社 接着剤注入装置および接着剤注入方法
JP4954663B2 (ja) * 2005-10-17 2012-06-20 東京エレクトロン株式会社 貼り合せ装置
JP4781802B2 (ja) * 2005-12-06 2011-09-28 東京応化工業株式会社 サポートプレートの貼り合わせ手段及び貼り合わせ装置、並びにサポートプレートの貼り合わせ方法
JP2008166536A (ja) * 2006-12-28 2008-07-17 Tokyo Ohka Kogyo Co Ltd 貼り合わせ装置
JP5207037B2 (ja) * 2008-04-08 2013-06-12 株式会社島津製作所 接着剤注入装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI612595B (zh) * 2014-08-07 2018-01-21 東京威力科創股份有限公司 接合裝置、接合系統、接合方法及電腦記憶媒體
TWI833848B (zh) * 2019-03-20 2024-03-01 日商新創機電科技股份有限公司 加熱裝置、基板處理系統、及基板處理方法

Also Published As

Publication number Publication date
WO2013035599A1 (ja) 2013-03-14
JP5427856B2 (ja) 2014-02-26
JP2013058572A (ja) 2013-03-28

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