TW201331336A - 導電性黏著劑 - Google Patents

導電性黏著劑 Download PDF

Info

Publication number
TW201331336A
TW201331336A TW101147453A TW101147453A TW201331336A TW 201331336 A TW201331336 A TW 201331336A TW 101147453 A TW101147453 A TW 101147453A TW 101147453 A TW101147453 A TW 101147453A TW 201331336 A TW201331336 A TW 201331336A
Authority
TW
Taiwan
Prior art keywords
particles
resin composition
component
weight
conductive adhesive
Prior art date
Application number
TW101147453A
Other languages
English (en)
Chinese (zh)
Inventor
Keiji Ogino
Kiyonori Furuta
Original Assignee
Ajinomoto Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Kk filed Critical Ajinomoto Kk
Publication of TW201331336A publication Critical patent/TW201331336A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
TW101147453A 2011-12-22 2012-12-14 導電性黏著劑 TW201331336A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011281593A JP2015042696A (ja) 2011-12-22 2011-12-22 導電性接着剤

Publications (1)

Publication Number Publication Date
TW201331336A true TW201331336A (zh) 2013-08-01

Family

ID=48668434

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101147453A TW201331336A (zh) 2011-12-22 2012-12-14 導電性黏著劑

Country Status (3)

Country Link
JP (1) JP2015042696A (ja)
TW (1) TW201331336A (ja)
WO (1) WO2013094543A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107004459A (zh) * 2014-12-26 2017-08-01 哈利玛化成株式会社 导电性糊剂

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5725559B2 (ja) * 2011-12-28 2015-05-27 信越化学工業株式会社 液状導電性樹脂組成物及び電子部品
JP5880300B2 (ja) * 2012-06-14 2016-03-08 日立化成株式会社 接着剤組成物及びそれを用いた半導体装置
JP2017031227A (ja) * 2013-12-13 2017-02-09 日立化成株式会社 接着剤組成物及びそれを用いた半導体装置
JP6383183B2 (ja) * 2014-06-03 2018-08-29 太陽インキ製造株式会社 導電性接着剤およびそれを用いた電子部品
JP6371148B2 (ja) * 2014-07-16 2018-08-08 ナミックス株式会社 カメラモジュール用接着剤
KR102359684B1 (ko) * 2014-11-12 2022-02-07 쓰리본드 화인 케미칼 가부시키가이샤 에폭시 수지조성물
JP7332129B2 (ja) * 2019-02-27 2023-08-23 ナミックス株式会社 導電性組成物および導電性接着剤

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3450839B2 (ja) * 2000-08-31 2003-09-29 松下電器産業株式会社 導電性接着剤を用いた実装構造体
JP2005244118A (ja) * 2004-02-27 2005-09-08 Toshiba Corp 半導体素子の製造方法およびカメラモジュールの製造方法
KR100704980B1 (ko) * 2005-11-28 2007-04-09 삼성전기주식회사 카메라 모듈 패키지
JP2010219948A (ja) * 2009-03-17 2010-09-30 Sharp Corp 表示パネルおよびその製造方法
WO2010147070A1 (ja) * 2009-06-15 2010-12-23 味の素株式会社 樹脂組成物及び有機電解液電池

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107004459A (zh) * 2014-12-26 2017-08-01 哈利玛化成株式会社 导电性糊剂
TWI684186B (zh) * 2014-12-26 2020-02-01 日商哈利瑪化成股份有限公司 導電性糊劑、晶片型電子零件的端子電極、及晶片型電子零件

Also Published As

Publication number Publication date
JP2015042696A (ja) 2015-03-05
WO2013094543A1 (ja) 2013-06-27

Similar Documents

Publication Publication Date Title
TW201331336A (zh) 導電性黏著劑
JP5030196B2 (ja) 回路接続用接着剤
US8133412B2 (en) Anisotropic conductive film
JP2015026519A (ja) 導電性樹脂組成物および半導体装置
KR101456396B1 (ko) 이방 도전성 접착 필름 및 경화제
WO2013150907A1 (ja) 導電性組成物
JP2008094908A (ja) 電極接続用接着剤
JP2009245938A (ja) 導電性接着ペースト及び電子部品搭載基板
KR20130057151A (ko) 이방 전도성 조성물 및 필름
EP3369781A1 (en) Resin composition, bonded body and semiconductor device
JP6496431B2 (ja) 導電材料及び接続構造体
JP2012084440A (ja) 熱硬化型導電性ペースト
KR102363322B1 (ko) 이방성 도전 필름
US20130175485A1 (en) Electroconductive liquid resin composition and an electronic part
JP6420626B2 (ja) 電子部品接着用導電性樹脂組成物
JP2007056209A (ja) 回路接続用接着剤
JP6576736B2 (ja) 導電性接着剤および半導体装置
TW201546237A (zh) 導電性接著劑及使用其之電子零件
JP2005089629A (ja) 導電性接着剤
JP5558184B2 (ja) 異方性導電フィルム、接合体及び接続方法
JP2001076534A (ja) 導電性ペースト
WO2022014626A1 (ja) 導電性接着剤組成物
JP2006022230A (ja) 異方導電性接着剤および異方導電性接着剤フィルム
JP6549555B2 (ja) 導電性接着剤および半導体装置
JP2005317491A (ja) 導電ペーストおよびそれを用いた電子部品搭載基板