TW201328811A - 分斷裝置、被加工物之分斷方法、及具有光學元件圖案之基板的分斷方法 - Google Patents

分斷裝置、被加工物之分斷方法、及具有光學元件圖案之基板的分斷方法 Download PDF

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Publication number
TW201328811A
TW201328811A TW101141050A TW101141050A TW201328811A TW 201328811 A TW201328811 A TW 201328811A TW 101141050 A TW101141050 A TW 101141050A TW 101141050 A TW101141050 A TW 101141050A TW 201328811 A TW201328811 A TW 201328811A
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TW
Taiwan
Prior art keywords
laser light
scribing
scribe line
workpiece
laser
Prior art date
Application number
TW101141050A
Other languages
English (en)
Chinese (zh)
Inventor
Tetsuo Hoki
Shohei Nagatomo
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW201328811A publication Critical patent/TW201328811A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
    • C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
TW101141050A 2011-12-28 2012-11-05 分斷裝置、被加工物之分斷方法、及具有光學元件圖案之基板的分斷方法 TW201328811A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011288134A JP2013136074A (ja) 2011-12-28 2011-12-28 分断装置、被加工物の分断方法、および光学素子パターン付き基板の分断方法

Publications (1)

Publication Number Publication Date
TW201328811A true TW201328811A (zh) 2013-07-16

Family

ID=48674319

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101141050A TW201328811A (zh) 2011-12-28 2012-11-05 分斷裝置、被加工物之分斷方法、及具有光學元件圖案之基板的分斷方法

Country Status (4)

Country Link
JP (1) JP2013136074A (ko)
KR (1) KR20130076702A (ko)
CN (1) CN103182746A (ko)
TW (1) TW201328811A (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103692083A (zh) * 2013-11-21 2014-04-02 西安交通大学 一种基于激光双波复合加工调整微深孔形状和形貌的系统
CN104325220B (zh) * 2014-10-22 2016-10-05 华南理工大学 一种多功能激光复合加工设备及方法
JP7292006B2 (ja) * 2015-03-24 2023-06-16 コーニング インコーポレイテッド ディスプレイガラス組成物のレーザ切断及び加工
CN105911726B (zh) * 2016-06-13 2022-12-13 江西合力泰科技有限公司 一种液晶显示板自动断条设备及其自动断条方法
CN109273812A (zh) * 2018-08-30 2019-01-25 陈亮 一种小型化程控步进衰减器
JP7364860B2 (ja) 2019-07-01 2023-10-19 日亜化学工業株式会社 発光素子の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4132172B2 (ja) * 1998-02-06 2008-08-13 浜松ホトニクス株式会社 パルスレーザ加工装置
JP2005178288A (ja) * 2003-12-22 2005-07-07 Shibuya Kogyo Co Ltd 脆性材料の割断方法とその装置
JP4750720B2 (ja) * 2004-12-08 2011-08-17 三星ダイヤモンド工業株式会社 被分割体における分割起点形成方法、被分割体の分割方法
JP4256840B2 (ja) * 2004-12-24 2009-04-22 株式会社日本製鋼所 レーザ切断方法及びその装置
CN101087678A (zh) * 2004-12-28 2007-12-12 三星钻石工业股份有限公司 脆性材料基板的截断方法及基板截断系统
JP5010832B2 (ja) * 2006-01-19 2012-08-29 株式会社ディスコ レーザー加工装置
JP2008205486A (ja) * 2008-03-17 2008-09-04 Hamamatsu Photonics Kk レーザ加工装置
WO2009128314A1 (ja) * 2008-04-14 2009-10-22 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法
CN102046345A (zh) * 2008-04-15 2011-05-04 三星钻石工业股份有限公司 脆性材料基板的加工方法
JP5560096B2 (ja) * 2010-05-28 2014-07-23 三星ダイヤモンド工業株式会社 レーザ加工方法

Also Published As

Publication number Publication date
CN103182746A (zh) 2013-07-03
KR20130076702A (ko) 2013-07-08
JP2013136074A (ja) 2013-07-11

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