CN103182746A - 分断装置、被加工物的分断方法、及附有光学元件图案的基板的分断方法 - Google Patents

分断装置、被加工物的分断方法、及附有光学元件图案的基板的分断方法 Download PDF

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Publication number
CN103182746A
CN103182746A CN2012105287210A CN201210528721A CN103182746A CN 103182746 A CN103182746 A CN 103182746A CN 2012105287210 A CN2012105287210 A CN 2012105287210A CN 201210528721 A CN201210528721 A CN 201210528721A CN 103182746 A CN103182746 A CN 103182746A
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CN
China
Prior art keywords
laser
line
machined object
outgoing
irradiation
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Pending
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CN2012105287210A
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English (en)
Chinese (zh)
Inventor
法贵哲夫
长友正平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Publication of CN103182746A publication Critical patent/CN103182746A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
    • C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
CN2012105287210A 2011-12-28 2012-12-10 分断装置、被加工物的分断方法、及附有光学元件图案的基板的分断方法 Pending CN103182746A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011288134A JP2013136074A (ja) 2011-12-28 2011-12-28 分断装置、被加工物の分断方法、および光学素子パターン付き基板の分断方法
JP2011-288134 2011-12-28

Publications (1)

Publication Number Publication Date
CN103182746A true CN103182746A (zh) 2013-07-03

Family

ID=48674319

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012105287210A Pending CN103182746A (zh) 2011-12-28 2012-12-10 分断装置、被加工物的分断方法、及附有光学元件图案的基板的分断方法

Country Status (4)

Country Link
JP (1) JP2013136074A (ko)
KR (1) KR20130076702A (ko)
CN (1) CN103182746A (ko)
TW (1) TW201328811A (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103692083A (zh) * 2013-11-21 2014-04-02 西安交通大学 一种基于激光双波复合加工调整微深孔形状和形貌的系统
CN105911726A (zh) * 2016-06-13 2016-08-31 江西合力泰科技有限公司 一种液晶显示板自动断条设备及其自动断条方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104325220B (zh) * 2014-10-22 2016-10-05 华南理工大学 一种多功能激光复合加工设备及方法
WO2016154284A1 (en) * 2015-03-24 2016-09-29 Corning Incorporated Laser cutting and processing of display glass compositions
CN109273812A (zh) * 2018-08-30 2019-01-25 陈亮 一种小型化程控步进衰减器
JP7364860B2 (ja) 2019-07-01 2023-10-19 日亜化学工業株式会社 発光素子の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005178288A (ja) * 2003-12-22 2005-07-07 Shibuya Kogyo Co Ltd 脆性材料の割断方法とその装置
EP1862280A1 (en) * 2004-12-28 2007-12-05 Mitsuboshi Diamond Industrial Co., Ltd. Method for cutting brittle material substrate and substrate cutting system
US20090224432A1 (en) * 2004-12-08 2009-09-10 Syohei Nagatomo Method of forming split originating point on object to be split, method of splitting object to be split, and method of processing object to be processed by pulse laser beam
CN102026925A (zh) * 2008-04-14 2011-04-20 三星钻石工业股份有限公司 脆性材料基板的加工方法
CN102046345A (zh) * 2008-04-15 2011-05-04 三星钻石工业股份有限公司 脆性材料基板的加工方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4132172B2 (ja) * 1998-02-06 2008-08-13 浜松ホトニクス株式会社 パルスレーザ加工装置
JP4256840B2 (ja) * 2004-12-24 2009-04-22 株式会社日本製鋼所 レーザ切断方法及びその装置
JP5010832B2 (ja) * 2006-01-19 2012-08-29 株式会社ディスコ レーザー加工装置
JP2008205486A (ja) * 2008-03-17 2008-09-04 Hamamatsu Photonics Kk レーザ加工装置
JP5560096B2 (ja) * 2010-05-28 2014-07-23 三星ダイヤモンド工業株式会社 レーザ加工方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005178288A (ja) * 2003-12-22 2005-07-07 Shibuya Kogyo Co Ltd 脆性材料の割断方法とその装置
US20090224432A1 (en) * 2004-12-08 2009-09-10 Syohei Nagatomo Method of forming split originating point on object to be split, method of splitting object to be split, and method of processing object to be processed by pulse laser beam
EP1862280A1 (en) * 2004-12-28 2007-12-05 Mitsuboshi Diamond Industrial Co., Ltd. Method for cutting brittle material substrate and substrate cutting system
CN102026925A (zh) * 2008-04-14 2011-04-20 三星钻石工业股份有限公司 脆性材料基板的加工方法
CN102046345A (zh) * 2008-04-15 2011-05-04 三星钻石工业股份有限公司 脆性材料基板的加工方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103692083A (zh) * 2013-11-21 2014-04-02 西安交通大学 一种基于激光双波复合加工调整微深孔形状和形貌的系统
CN105911726A (zh) * 2016-06-13 2016-08-31 江西合力泰科技有限公司 一种液晶显示板自动断条设备及其自动断条方法
CN105911726B (zh) * 2016-06-13 2022-12-13 江西合力泰科技有限公司 一种液晶显示板自动断条设备及其自动断条方法

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Publication number Publication date
JP2013136074A (ja) 2013-07-11
KR20130076702A (ko) 2013-07-08
TW201328811A (zh) 2013-07-16

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Application publication date: 20130703