TW201318818A - 用於具有覆蓋成型熱塑薄膜之可攜式電子裝置的外殼 - Google Patents

用於具有覆蓋成型熱塑薄膜之可攜式電子裝置的外殼 Download PDF

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TW201318818A
TW201318818A TW101133773A TW101133773A TW201318818A TW 201318818 A TW201318818 A TW 201318818A TW 101133773 A TW101133773 A TW 101133773A TW 101133773 A TW101133773 A TW 101133773A TW 201318818 A TW201318818 A TW 201318818A
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thermoplastic film
layer
outer layer
electronic device
flexible
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Bryan Hynecek
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Speculative Product Design Llc
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
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Abstract

本發明係揭露與用於個人電子裝置有關的外殼，其包含一個或多個自薄膜熱塑材料形成之層，以及其製造方法。在一揭露的具體例中，用於個人電子裝置的外殼包含可撓式內層以及薄膜熱塑外層。

Description

用於具有覆蓋成型熱塑薄膜之可攜式電子裝置的外殼
本申請案係請求美國臨時申請案61/536,437之優先權，其申請日為2011年9月19日，本臨時申請案之全部內容併入本文中參考。
本發明之揭露大體上係與用於電子裝置的保護外殼有關，以及特別地，與包括至少一可撓式內層與熱塑外層的外殼有關。
行動手機、智慧型手機、平板電腦、個人閱讀器、個人電子助理、MP3播放器以及其他可攜式電子裝置廣泛地使用，且在我們的日常生活中日趨普及。雖然這些裝置設計於真實世界的環境中使用，但通常含有敏感的電子元件，且自正常操作位置掉下時會造成損傷。儘管我們嘗試設計這些用於真實世界應用的複雜電子裝置，通常需要使用某些形式的保護外殼以屏蔽和保護電子裝置因掉下或墜落而造成的損傷。存在許多不同種類及設計的外殼，且提供廣泛的保護。外殼的範圍可從純粹的裝飾性到實用性，從軟韌性的外殼到共同成型軟和硬的外殼到剛性的外殼。軟外殼往往比剛性外殼提供較少的保 護，但卻更容易使用和安裝在電子裝置上。剛性外殼提供最大的保護，但因為剛性材料的本質，其較困難或較不可能將電子裝置插入一體成型的外殼內。於是，大部分的剛性外殼由多個部件所構成，例如，前和後或上和下，可增加其大小和所使用材料的厚度和整體裝置的體積。其通常需要咬合在一起且圍繞裝置組裝以形成用於裝置的剛性殼層。傳統的共同成型外殼具有軟和硬層，該共同成型外殼提供可撓性和保護的最佳平衡，但因為傳統的製造技術，常產生具有比所需外層外殼較厚的外殼，而導致外殼於裝置上增加顯著的體積。因此，理想狀態為具有多層外殼提供保護和可撓性同時減少外層外殼的厚度和重量。本發明的具體例揭露此裝置。
本發明之揭露提供用於保護封閉式個人電子裝置的外殼，且使用製造薄膜熱塑外層的技術製造該外殼。
此揭露外殼的具體例可包括至少兩層：可撓式內層以及熱塑薄膜外層。
在一些具體例中，熱塑薄膜外層可使可撓式內層能從比在其他較佳情況下之更軟和更有彈性的材料被製造，因為，舉例來說，熱塑薄膜外層提供外殼的整體剛性而沒顯著增加體積。在一具體例中，薄膜外層介於0.178至0.5mm之間，且更佳地在0.188或0.25mm的範圍內。 薄膜越薄，越精細的詳細設計越為可能。這些薄膜允許深引伸條件，但更容易變形和破裂。較厚的膜不產生複雜細節的設計，較困難形成深引伸條件，但更能如同一個整體般地提供外殼剛性及保護。
在一些具體例中，外殼具有足夠可撓性以變形來容納可攜式電子裝置的插入，且在插入後恢復至其原本的形狀。
在一具體例中，熱塑薄膜外層可自硬塑膠製造因而提供其外殼的整體剛性和提供封閉式個人電子裝置的保護。
在其他具體例中，圖案或圖形可在熱塑製程之前或之後被印製於熱塑薄膜外層之上。而且，熱塑薄膜外層可於外殼提供平滑、不黏的外部，因而允許使用者自其口袋輕易地取出外殼，及/或允許製造拋光，其無法用非平滑的物質例如橡膠或矽來達到。
在許多具體例中，熱塑薄膜外層可覆蓋可撓式彈性內層的整個背部表面，以及側表面的很大部份。
在一具體例中，一種可攜式電子裝置的外殼，包含：可撓式彈性內層，其具有內部份和外部份。內部份具有後面部份和側面部份，其形成用於可攜式電子裝置的外罩，以及可撓式彈性內層具有附接，用於保持可攜式電子裝置於外罩中，以及外殼另包含熱塑薄膜外層，經調整尺寸與形狀以覆蓋可撓式彈性內層的外部份。
在另一具體例中，熱塑薄膜外層附接至可撓式彈性內 層。在另一具體例中，熱塑薄膜外層藉由化學接合、熱接合、共同成型或機械附接永久地附接至可撓式彈性內層。
在另一具體例中，熱塑薄膜外層實質上覆蓋可撓式彈性內層的外部份。在另一具體例中，熱塑薄膜外層可充分變形以允許個人電子裝置插入外罩，以及熱塑薄膜外層在個人電子裝置插入外罩後，恢復至其原形狀。
在另一具體例中，熱塑薄膜外層自至少塑膠、聚對苯二甲酸乙二醇酯、聚碳酸酯、聚丙烯、雙軸向聚丙烯、定向聚丙烯、苯乙烯、非晶形聚酯對苯二甲酸酯、或雙軸向聚對苯二甲酸乙二醇酯形成。在另一具體例中，可撓式彈性內層自至少矽氧烷、橡膠、氯丁橡膠、熱塑性聚胺基甲酸酯、或熱塑性彈性體形成。
在另一具體例中，熱塑薄膜外層具有熱塑薄膜外層內表面和熱塑薄膜外層外表面，且熱塑薄膜外層的內表面與可撓式彈性內層的外表面接觸，且塑薄膜外層的外表面含有圖形。
在另一具體例中，熱塑薄膜外層的外表面為平滑的。
一種用於形成個人電子裝置外殼的方法，個人電子裝置外殼具有熱塑薄膜外層和可撓式彈性內層，該方法包含施加熱塑薄膜的片材至一種樣式，自熱塑薄膜形成薄膜外層；修整該成形的薄膜外層至其最終的型態，附接該經修整的薄膜外層至可撓式彈性內層。在另一具體例中，附接藉由至少共同成型、化學接合、振動焊接、熱 接合、或機械接合來執行。
在下述的實施方式中，將藉由具體例的方式闡述許多具體的細節以提供相關教示之徹底瞭解。然而，對熟悉該項技藝之人而言，可明顯將本發明的教示在沒有提供細節之下實行。在其他情況下，習知的方法、程序及/或構件將在沒有提供細節之下以相對高層次被描述，以避免本發明教示之不必要的混淆。
大體而言，可撓式內層包含彈性材料(例如TPU或TPE)及/或熱塑薄膜外層，可作為保護封閉式個人電子裝置而不受因例如暴露在灰塵、污染物、撞擊或衝擊而造成損傷。
熱塑外層允許包含比使用傳統射出成型製程所製造更薄材料的外層。可撓式內層可塑形以封裝可攜式電子裝置，例如行動手機、膝上型電腦或平板電腦。可撓式內層可具有背表面以及一個或多個側表面，其塑形以分別覆蓋個人電子裝置的背表面以及一個或多個側表面。
可撓式內層可自任一適當地可撓式彈性材料製成，例如，橡膠、矽氧烷、氯丁橡膠、塑膠、熱塑性聚胺基甲酸酯(TPU)、以及熱塑性彈性體(TPE)，且可包括介於外殼與可攜式電子裝置間維持附接的機制。一些附接機制包括夾子、擴充部份、黏合材料、突出部份、表框、掣 子、舌片、摩擦或磁性材料。可撓式內層可為任一顏色或顏色的圖案。可撓式內層接觸可攜式電子裝置的表面可為平滑或波狀的，且可含有凹陷、切割、織構、釋放溝或任一其他圖案。內部織構可為裝飾的及/或可提供裝置的保護功能且可增強可撓式內層對可攜式電子裝置的黏合。
熱塑薄膜外層可自任一適當薄膜材料製造，例如，塑膠、聚對苯二甲酸乙二醇酯(PET)、聚碳酸酯(PC)、聚丙烯(PP)、雙軸向聚丙烯(BOPP)、定向聚丙烯(OPP)、苯乙烯、非晶形聚酯對苯二甲酸酯(APET)或雙軸向聚對苯二甲酸乙二醇酯(BoPET)，且可經調整尺寸與形狀以緊密地配合且經由任一熱塑過程覆蓋可撓式內層的外部份，例如，真空成形、化學成形、熱成形、壓力成形、高壓力成形或壓縮成形。在一具體例中，薄膜外層介於0.178至0.5mm之間，且更佳地在0.188或0.25mm的範圍內。在另一具體例中，熱塑薄膜外層覆蓋可撓式內層的全部或實質上全部。
熱塑薄膜外層可藉由任一方法被附貼至可撓式彈性內層，包括夾子、黏合、連鎖部件、環氧樹脂、共同成型、化學接合、振動焊接、熱接合(thermal bonding)、機械接合、加熱接合(heat bonding)、成型或振動焊接，但不限於上述。
第1圖根據本發明揭露的具體例繪示多層外殼的橫截面。繪示熱塑薄膜外層105接觸可撓式內層115。可撓 式內層115形成外罩20，而可攜式電子裝置可被插入外罩20。在此具體例中，使用附接10以保持可攜式電子裝置於外罩20之內，且附接10結合至可撓式內層115。應瞭解附接10可被整合至可撓式內層115之內或與可撓式內層115分開。熟悉該項技藝之人士也應瞭解，本發明並不限於僅僅二層，而是可運用多層熱塑薄膜和可撓式層以形成多層外殼。例如，本發明揭露的外殼能與具有可撓式層的第一熱塑薄膜層和第二熱塑薄膜結合而形成本發明揭露之外殼，但不限於上述。
第2A至2C圖根據本發明揭露繪示製造外殼方法的具體例。首先，意欲被熱塑的材料片材200熱塑至預定的樣式210，如第2A和2B圖所示。熱塑片材215可被修整至規格，例如，至特定的外殼及/或個人電子裝置設計，如第2C圖所示。然後，經修整產生的熱塑薄膜外層外殼220可被插入至模具和以具有包含可撓式內層115的可撓式材料覆蓋成型，如第1圖所示。另外及/或可選擇地，熱塑薄膜外層外殼220可藉由任一附接方法，例如，機械法、化學法、黏合法或焊接法，被附接至預先形成可撓式內層115以形成多層外殼。
熱塑片材215之修整掉的剩餘物225可被回收或廢棄。另外及/或可選擇地，片材200可為足夠大地而在同一時間用以熱塑多個外殼，且樣式210可體現多個裝置形式，因而產生同時形成的多個熱塑薄膜外層外殼220。
片材200可藉由任一印刷方法具有印製的圖案或設 計，例如，絲網印刷、模板印刷或在熱塑薄膜外層外殼220形成之前或之後和片材220具有整合形成的設計或圖案。
第3圖繪示第2A至2C圖所示方法的步驟。在步驟300中，片材200置於預先樣式210上。在步驟310中，執行成形方法而產生成形的片材215。為清楚起見，熱塑在整個本發明揭露中被參考，但熟悉該項技藝之人士也應瞭解，薄膜成形方法能被其他方法所實行，例如真空成形、化學成形、熱成形、壓力成形、高壓力成形、壓縮成形或其任一組合。在步驟320中，已成形的片材215經修整以產生熱塑薄膜外層外殼220。熱塑薄膜外層外殼220可進一步完成步驟330，其中開口可被加至熱塑薄膜外層外殼220以容納需要用於已完成的外殼之附件及/或開口。在步驟340中，熱塑薄膜外層外殼220可藉由前述任一已知揭露的手段而使用可撓式內層115模製成型。
第4圖繪示藉由本發明揭露的具體例形成的外殼400。外殼400包含可撓式內層115、熱塑薄膜外層外殼220、附件開口410以及附件外蓋或按鈕420。如相對第3圖所揭露，附件開口410以及外蓋或按鈕420可在修整製程期間被形成。
對熟悉該項技藝之人士將辨認本發明的教示可加以修正成各種變化及/或改良。對於各種修正及/或增強為適合的。當前述以描述考慮何者為最佳模式及/或其他例子 時，應瞭解在本文中可做各種修改，以及本文所揭露的標的，將以各種形式和例子被實行，且該教示將被應用至眾多的應用之中，但只有部份描述於本文之中。下述申請專利範圍中意欲請求任一且全部的應用、修改以及變化，其在本發明教示的真實範圍之中。
10‧‧‧附接
105‧‧‧薄膜外層
115‧‧‧可撓式內層
20‧‧‧外罩
200‧‧‧片材
210‧‧‧樣式
215‧‧‧片材
220‧‧‧薄膜外層外殼
225‧‧‧剩餘物
300‧‧‧步驟
310‧‧‧步驟
320‧‧‧步驟
330‧‧‧步驟
340‧‧‧步驟
400‧‧‧殼
410‧‧‧開口
420‧‧‧外蓋或按鈕
本文所描述的方法及裝置進一步描述於特定具體例。這些具體例將參閱圖式詳細描述。這些具體例為非限制性的，其中像元件符號在圖式的幾個視圖中代表相似的結構，且其中：第1圖係根據本發明揭露的具體例繪示外殼的橫截面圖；第2A至2C圖係根據本發明揭露的具體例繪示形成外殼方法的步驟；第3圖係根據本發明揭露的具體例為形成外殼方法步驟的流程圖；以及第4圖係為根據本發明揭露的具體例所製外殼的透視圖。
10‧‧‧附接
105‧‧‧薄膜外層
115‧‧‧可撓式內層

Claims (11)

  1. 一種用於可攜式電子裝置的外殼，包含：一可撓式彈性內層，具有一內部份和一外部份，其中該內部份具有一後面部份和一側面部份，形成一用於該可攜式電子裝置的外罩，以及；其中該可撓式彈性內層具有一附接，用於保持該可攜式電子裝置於該外罩中；以及一熱塑薄膜外層，經調整尺寸與形狀以覆蓋該可撓式彈性內層的該外部份。
  2. 如請求項1所述之外殼，其中該熱塑薄膜外層附接至該可撓式彈性內層。
  3. 如請求項1所述之外殼，其中該熱塑薄膜外層藉由至少下述之一者永久地附接至該可撓式彈性內層：化學接合、熱接合、共同成型以及機械附接。
  4. 如請求項2所述之外殼，其中該熱塑薄膜外層實質上覆蓋該可撓式彈性內層的該外部份。
  5. 如請求項1所述之外殼，其中該熱塑薄膜外層可充分變形以允許該個人電子裝置插入該外罩，以及其中該熱塑薄膜外層在個人電子裝置插入該外罩 後，恢復至其原形狀。
  6. 如請求項1所述之外殼，其中該熱塑薄膜外層自至少下述之一者中形成：塑膠、聚對苯二甲酸乙二醇酯、聚碳酸酯、聚丙烯、雙軸向聚丙烯、定向聚丙烯、苯乙烯、非晶形聚酯對苯二甲酸酯、以及雙軸向聚對苯二甲酸乙二醇酯。
  7. 如請求項1所述之外殼，其中該可撓式彈性內層自至少下述之一者中形成：矽氧烷、橡膠、氯丁橡膠、熱塑性聚胺基甲酸酯、以及熱塑性彈性體。
  8. 如請求項1所述之外殼，其中該熱塑薄膜外層具有一熱塑薄膜外層內表面和一熱塑薄膜外層外表面，其中該熱塑薄膜外層的內表面與該可撓式彈性內層的外表面接觸，以及其中該熱塑薄膜外層的外表面含有一圖形。
  9. 如請求項8所述之外殼，其中該熱塑薄膜外層的外表面為平滑的。
  10. 一種用於形成一個人電子裝置外殼的方法，該個人電子裝置外殼具有一熱塑薄膜外層和一可撓式彈性內層， 該方法包含下列步驟；施加一熱塑薄膜的片材至一樣式；自該熱塑薄膜形成一薄膜外層；修整該成形的薄膜外層至其最終的型態；附接該經修整的薄膜外層至一可撓式彈性內層。
  11. 如請求項10所述之方法，其中該附接藉由至少下述之一者來執行：共同成型、化學接合、振動焊接、熱接合、以及機械接合。
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