TW201315767A - 預浸體、積層板、半導體封裝及積層板之製造方法 - Google Patents

預浸體、積層板、半導體封裝及積層板之製造方法 Download PDF

Info

Publication number
TW201315767A
TW201315767A TW101120866A TW101120866A TW201315767A TW 201315767 A TW201315767 A TW 201315767A TW 101120866 A TW101120866 A TW 101120866A TW 101120866 A TW101120866 A TW 101120866A TW 201315767 A TW201315767 A TW 201315767A
Authority
TW
Taiwan
Prior art keywords
prepreg
resin
epoxy resin
less
base material
Prior art date
Application number
TW101120866A
Other languages
English (en)
Chinese (zh)
Inventor
Mitsuo Taketani
Takayuki Baba
Akihiko Tobisawa
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of TW201315767A publication Critical patent/TW201315767A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/02—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
    • B32B17/04—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments bonded with or embedded in a plastic substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/07—Parts immersed or impregnated in a matrix
    • B32B2305/076—Prepregs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
TW101120866A 2011-06-28 2012-06-11 預浸體、積層板、半導體封裝及積層板之製造方法 TW201315767A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011142630 2011-06-28

Publications (1)

Publication Number Publication Date
TW201315767A true TW201315767A (zh) 2013-04-16

Family

ID=47423658

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101120866A TW201315767A (zh) 2011-06-28 2012-06-11 預浸體、積層板、半導體封裝及積層板之製造方法

Country Status (5)

Country Link
JP (1) JP5696786B2 (ja)
KR (1) KR101574907B1 (ja)
CN (1) CN103649185B (ja)
TW (1) TW201315767A (ja)
WO (1) WO2013001726A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105006436A (zh) * 2015-06-05 2015-10-28 华进半导体封装先导技术研发中心有限公司 提高微凸点制备良率的装置及微凸点的制备工艺
JP7062331B2 (ja) * 2017-11-16 2022-05-06 株式会社ディスコ 芯材の製造方法及び銅張積層板の製造方法
US10796998B1 (en) 2019-04-10 2020-10-06 Gan Systems Inc. Embedded packaging for high voltage, high temperature operation of power semiconductor devices
CN114302907A (zh) * 2019-09-06 2022-04-08 松下知识产权经营株式会社 树脂组合物、预浸料、具有树脂的膜、具有树脂的金属箔、覆金属层压体和印刷线路板
CN111303788A (zh) * 2020-02-25 2020-06-19 深圳赛兰仕科创有限公司 高频复合材料及其制备方法
US11342248B2 (en) 2020-07-14 2022-05-24 Gan Systems Inc. Embedded die packaging for power semiconductor devices

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0759626B2 (ja) * 1989-07-12 1995-06-28 日立化成工業株式会社 印刷配線板用エポキシ樹脂組成物
JPH06316643A (ja) * 1993-05-07 1994-11-15 Hitachi Chem Co Ltd プリプレグの製造方法
JPH10279779A (ja) * 1997-04-07 1998-10-20 Hitachi Chem Co Ltd 印刷配線板用エポキシ樹脂組成物及び該組成物を用いたプリプレグ、金属張り積層板
JP4348785B2 (ja) * 1999-07-29 2009-10-21 三菱瓦斯化学株式会社 高弾性率ガラス布基材熱硬化性樹脂銅張積層板
JP2002003626A (ja) * 2000-06-19 2002-01-09 Shin Kobe Electric Mach Co Ltd 有機繊維基材含浸用エポキシ樹脂組成物ならびにそれを用いたプリプレグ、積層板及びプリント配線板
JP2002003627A (ja) * 2000-06-21 2002-01-09 Matsushita Electric Works Ltd プリプレグ、及び、それを用いたレーザー加工用積層板
JP2003147051A (ja) * 2001-11-09 2003-05-21 Hitachi Chem Co Ltd 樹脂組成物及びその製造方法、並びにそれらを用いた印刷配線板用プリプレグ
JP2003213021A (ja) * 2002-01-18 2003-07-30 Hitachi Chem Co Ltd プリプレグ、これを用いた金属張積層板および印刷配線板
JP2006310572A (ja) * 2005-04-28 2006-11-09 Hitachi Chem Co Ltd プリント配線板の製造方法
JP5260458B2 (ja) * 2009-09-25 2013-08-14 パナソニック株式会社 プリプレグ用エポキシ樹脂組成物とそれを用いたプリプレグ、積層板、多層板

Also Published As

Publication number Publication date
CN103649185B (zh) 2017-06-09
CN103649185A (zh) 2014-03-19
JPWO2013001726A1 (ja) 2015-02-23
JP5696786B2 (ja) 2015-04-08
KR101574907B1 (ko) 2015-12-04
WO2013001726A1 (ja) 2013-01-03
KR20140027493A (ko) 2014-03-06

Similar Documents

Publication Publication Date Title
JP5493853B2 (ja) エポキシ樹脂組成物、プリプレグ、積層板、多層プリント配線板、半導体装置、絶縁樹脂シート、多層プリント配線板の製造方法
KR102077867B1 (ko) 열경화성 에폭시 수지 조성물, 절연층 형성용 접착 필름 및 다층 프린트 배선판
JP6512521B2 (ja) 積層板、金属張積層板、プリント配線板、多層プリント配線板
JP5206600B2 (ja) エポキシ樹脂組成物、プリプレグ、積層板、樹脂シート、多層プリント配線板、及び半導体装置
TW201328870A (zh) 熱固型樹脂組成物及使用其之預浸材與覆金屬層壓板
TW201315767A (zh) 預浸體、積層板、半導體封裝及積層板之製造方法
JP2012131947A (ja) プリント配線板用エポキシ樹脂組成物、プリプレグ、金属張積層板、樹脂シート、プリント配線板及び半導体装置
JP2020029494A (ja) 絶縁層用樹脂組成物、シート状積層材料、多層プリント配線板及び半導体装置
JP5737028B2 (ja) プリント配線板用プリプレグ、積層板、プリント配線板、および半導体パッケージ
JP2008038066A (ja) プリプレグ、基板および半導体装置
JP5594128B2 (ja) プリント配線板用樹脂組成物、プリプレグ、積層板、樹脂シート、プリント配線板及び半導体装置
WO2014192421A1 (ja) プリント配線板および半導体装置
KR101907713B1 (ko) 빌드업용 프리프레그
JP6269401B2 (ja) 表面処理無機充填材、該無機充填材の製造方法、および該無機充填材を含有する樹脂組成物
KR101423401B1 (ko) 다층 인쇄 회로 기판 및 그 제조 방법
JP2017084949A (ja) 回路基板用樹脂組成物、プリプレグ、金属張積層板、回路基板、および半導体パッケージ
JP5977969B2 (ja) 絶縁シート、絶縁シートの製造方法及び多層基板
JP2012158645A (ja) プリント配線板用エポキシ樹脂組成物、プリプレグ、金属張積層板、樹脂シート、プリント配線板及び半導体装置
JP2012169600A (ja) プリント配線板の製造方法
JP6816566B2 (ja) 樹脂組成物、接着フィルム、プリプレグ、多層プリント配線板及び半導体装置
JP2012158681A (ja) エポキシ樹脂組成物
JP2015086293A (ja) プリプレグ及び多層プリント配線板
JP3412572B2 (ja) エポキシ樹脂組成物、プリプレグ、樹脂付き金属箔、接着シート、積層板及び多層板
JP6582807B2 (ja) 樹脂シートの製造方法
JP2013057065A (ja) プリプレグ、基板および半導体装置