TW201313639A - Method for scribing a glass board and a processing device - Google Patents
Method for scribing a glass board and a processing device Download PDFInfo
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- TW201313639A TW201313639A TW101130387A TW101130387A TW201313639A TW 201313639 A TW201313639 A TW 201313639A TW 101130387 A TW101130387 A TW 101130387A TW 101130387 A TW101130387 A TW 101130387A TW 201313639 A TW201313639 A TW 201313639A
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本發明係關於一種玻璃基板之刻劃線方法，特別是沿著對在表面具有具壓縮應力之強化層的玻璃進行刻劃線(scribe line)之玻璃基板之刻劃線方法。 The present invention relates to a method of scribing a glass substrate, and more particularly to a method of scribing a glass substrate along a scribe line of a glass having a reinforcing layer having a compressive stress on the surface.
就用以分斷玻璃基板而形成刻劃線溝之方法而言，係有利用雷射光而形成刻劃線溝之方法。此時，沿著刻劃線預定線照射雷射光，使基板之一部分溶解、蒸發而形成刻劃線溝。然而，在該方法中，被溶解、蒸發之基板的一部分係附著在基板表面，而有伴隨品質劣化之情形。此外，以溶解、蒸發之部分所形成之裂痕係成為基板端面強度降低之原因。 A method for forming a scribe groove by dividing a glass substrate is a method of forming a scribe groove by using laser light. At this time, the laser light is irradiated along a predetermined line of the scribe line, and one of the substrates is partially dissolved and evaporated to form a scribe groove. However, in this method, a part of the substrate which is dissolved and evaporated adheres to the surface of the substrate, and there is a case where the quality is deteriorated. Further, the crack formed by the dissolved and evaporated portion is a cause of a decrease in the strength of the end face of the substrate.
因此，就形成刻劃線溝之其他方法而言，有專利文獻1或2所示之方法。在此，於成為玻璃基板之刻劃線溝之起點的場所形成有初期龜裂，在該初期龜裂照射有雷射光。藉此，在雷射照射部分產生熱應力，且龜裂會進展而形成刻劃線溝。 Therefore, there is a method shown in Patent Document 1 or 2 for other methods of forming the scribe groove. Here, an initial crack is formed in a place where the starting line of the scribe line of the glass substrate is formed, and the initial crack is irradiated with laser light. Thereby, thermal stress is generated in the laser irradiation portion, and the crack progresses to form the scribe groove.
再者，在照射雷射光而形成刻劃線溝之方法中，會有在玻璃基板之周緣部中刻劃線溝之龜裂變深之傾向。在此狀態下，當沿著刻劃線溝將玻璃基板予以分斷時，會產生分斷面之品質降低之問題、或刻劃線溝不會筆直地形成之問題。 Further, in the method of irradiating the laser light to form the scribe groove, the crack of the scribe groove in the peripheral portion of the glass substrate tends to become deep. In this state, when the glass substrate is divided along the scribe groove, there is a problem that the quality of the cross-section is lowered, or the scribe groove is not formed straight.
因此，在專利文獻3中揭示有一種在刻劃線預定線之 終端部形成未形成有刻劃線溝之區域的雷射刻劃線方法。依據該方法，可在不進行複雜之控制的情形下提升玻璃基板之終端部中之分斷後的剖面品質。 Therefore, in Patent Document 3, there is disclosed a predetermined line in the scribe line. The terminal portion forms a laser scribing method in which a region in which the scribe groove is not formed is formed. According to this method, the sectional quality after the break in the end portion of the glass substrate can be improved without complicated control.
專利文獻1：日本特開平3-489號公報 Patent Document 1: Japanese Patent Laid-Open No. 3-489
專利文獻2：日本特開平9-1370號公報 Patent Document 2: Japanese Patent Laid-Open Publication No. 9-1370
專利文獻3：日本再公表特許WO2007/094348號公報 Patent Document 3: Japanese Re-issued Patent No. WO2007/094348
然而，在最近之FPD(flat panel display，平板顯示器)業者中，由於重視基板端面之強度，因此主要使用在表面形成有強化層之化學強化玻璃，來作為玻璃基板。該化學強化玻璃係具有藉由離子交換處理在表面具壓縮應力之層(強化層)，且在內部存在有拉伸應力。最近，該化學強化玻璃係使用在特別要求端面強度之觸控板等蓋玻璃。 However, in recent FPD (flat panel display) companies, since the strength of the end face of the substrate is emphasized, a chemically strengthened glass having a reinforcing layer formed on the surface thereof is mainly used as the glass substrate. The chemically strengthened glass has a layer (strengthening layer) which is subjected to compressive stress on the surface by ion exchange treatment, and has tensile stress inside. Recently, this chemically strengthened glass is used for a cover glass such as a touch panel which particularly requires end face strength.
本案發明者係藉由實驗發現：藉由雷射刻劃線方法將刻劃線溝形成在該強化玻璃中之最近開發之特別是表面高強度之強化玻璃時，深的龜裂會主要從刻劃線溝之終端部沿著刻劃線溝進展而自然分斷。在此，所謂自然分斷係在形成刻劃線溝之後，在不實施分斷步驟之情形下玻璃基板沿著刻劃線溝分斷之現象。 The inventor of the present invention discovered through experiments that when the scribed groove is formed in the tempered glass by the laser scribing method, especially the surface-strength tempered glass, the deep crack will mainly be engraved. The terminal portion of the scribe groove is naturally separated along the progress of the scribe groove. Here, the natural breaking is a phenomenon in which the glass substrate is broken along the scribe groove without forming the dicing groove after the scribe line is formed.
自然分斷可能是起因於在刻劃線溝之龜裂在玻璃基板之周緣部變深，隨著該深的龜裂沿著刻劃線溝進展而產生 者。而且，刻劃線溝之龜裂在玻璃基板之周緣部變深之現象可能為以下之理由。 The natural breaking may be caused by the crack in the groove of the scribe groove becoming deeper at the peripheral portion of the glass substrate, and the deep crack is generated along the scribe groove. By. Further, the phenomenon that the crack of the scribe groove becomes deeper at the peripheral portion of the glass substrate may be the following reason.
在形成有刻劃線溝之玻璃基板的終端部，由於端面不被拘束，因此刻劃線溝之兩側打開。 At the end portion of the glass substrate on which the scribe groove is formed, since the end faces are not restrained, both sides of the scribe groove are opened.
在形成有刻劃線溝之玻璃基板的終端部，因沒有使熱從終端部先散熱之場所，而造成熱停滯在終端部。 At the end portion of the glass substrate on which the scribe groove is formed, heat is not stopped at the end portion, and heat is stagnated at the end portion.
由於以上之原因而產生自然分斷時，後序步驟之處理將變得困難。 When natural breaks occur due to the above reasons, the processing of the subsequent steps becomes difficult.
因此，為了使刻劃線溝不會形成在玻璃基板之周緣部，乃考慮在刻劃線預定線之終端部貼上鋁帶而遮蔽雷射光。然而，從生產性之觀點來看，該方法並不實用。 Therefore, in order to prevent the scribed groove from being formed on the peripheral portion of the glass substrate, it is considered that the aluminum strip is attached to the end portion of the predetermined line of the scribe line to shield the laser light. However, this method is not practical from the viewpoint of productivity.
再者，藉由控制雷射光之照射，使加熱處理及冷卻處理不會在玻璃基板之周緣部實施，而可使刻劃線溝不會到達至刻劃線預定線之終端。然而，該方法難以在所希望之位置擋止刻劃線溝，且不具穩定性。 Further, by controlling the irradiation of the laser light, the heat treatment and the cooling treatment are not performed on the peripheral portion of the glass substrate, and the scribe groove does not reach the end of the predetermined line of the scribe line. However, this method is difficult to block the scribe groove at the desired position and is not stable.
本發明之課題係在於對在表面具備強化層之玻璃容易且穩定地形成所希望之刻劃線溝，以防止自然分斷。 An object of the present invention is to easily and stably form a desired scribe groove for a glass having a reinforcing layer on its surface to prevent natural breakage.
第1發明之玻璃基板之刻劃線方法，係沿著刻劃線預定線對在表面具有具壓縮應力之強化層的玻璃進行刻劃線之玻璃基板之刻劃線方法，其具有以下步驟。 The scribe line method for a glass substrate according to the first aspect of the invention is a scribe line method for dicing a glass having a reinforcing layer having a compressive stress on a surface along a predetermined line of scribe lines, and has the following steps.
第1步驟：將玻璃載置在具有基板保持用之複數個吸著孔之台座，並且以比中央部更強之吸著壓將玻璃之刻劃線預定線的終端側之玻璃端部予以吸著。 In the first step, the glass is placed on a pedestal having a plurality of suction holes for holding the substrate, and the glass end portion on the terminal side of the predetermined line of the scribe line of the glass is sucked by a stronger suction pressure than the central portion. With.
第2步驟：在玻璃之表面形成初期龜裂。 The second step: forming an initial crack on the surface of the glass.
第3步驟：將雷射光照射在玻璃之表面並予以加熱，並且將加熱過之區域予以冷卻，並沿著刻劃線預定線使龜裂進展而形成刻劃線溝。 Step 3: The laser light is irradiated onto the surface of the glass and heated, and the heated region is cooled, and the crack is progressed along the predetermined line of the scribe line to form a scribe groove.
在此，首先台座載置要加工之玻璃。在台座設置複數個吸著用之孔，透過該吸著用孔而吸引玻璃，以保持在台座之預定位置。此時，刻劃線預定線之終端側的玻璃端部係以比其他區域強之力被吸引且保持。並且，在形成初期龜裂後，將雷射光照射在玻璃表面並予以加熱，且將加熱過之區域予以冷卻。藉由該加熱及冷卻處理，初期龜裂係沿著刻劃線預定線進展，且形成有刻劃線溝。 Here, first, the pedestal is placed with the glass to be processed. A plurality of holes for suction are provided in the pedestal, and the glass is sucked through the suction holes to be held at a predetermined position of the pedestal. At this time, the glass end portion on the terminal side of the predetermined line of the scribe line is attracted and held with a stronger force than the other regions. Further, after the initial crack is formed, the laser light is irradiated onto the surface of the glass and heated, and the heated region is cooled. By this heating and cooling treatment, the initial cracking progresses along the predetermined line of the scribe line, and the scribe groove is formed.
在該方法中，刻劃線預定線之終端側的玻璃端部係以更強之吸著力保持在台座。因此，玻璃端部係在實施加熱及冷卻處理時不容易變形。因此，龜裂不容易在玻璃端部裂開，而可抑制深的龜，且可避免自然分斷。此外，不需要貼上鋁帶等之煩雜作業，且可穩定地在所希望之位置阻止刻劃線溝之形成。 In this method, the glass end portion on the terminal side of the predetermined line of the score line is held at the pedestal with a stronger suction force. Therefore, the glass end portion is not easily deformed when subjected to heating and cooling treatment. Therefore, cracks are not easily split at the ends of the glass, and deep turtles can be suppressed, and natural breakage can be avoided. Further, it is not necessary to attach a troublesome work such as an aluminum tape, and it is possible to stably prevent the formation of the scribe groove at a desired position.
第2發明之玻璃基板之刻劃線方法係在第1發明之刻劃線方法中，於第1步驟中，以比中央部更強之吸著壓將玻璃之刻劃線預定線的開始端側之玻璃端部予以吸著。 In the scribing method for the glass substrate according to the second aspect of the invention, in the first step, in the first step, the glass is scribed at the beginning of the predetermined line at a stronger suction pressure than the central portion. The end of the glass on the side is sucked.
在例如食器龜裂之溝深較深時，在刻劃線溝之形成步驟(第3步驟)中，深的龜裂會從初期龜裂朝與加熱及冷卻之掃描方向相反之方向、亦即朝玻璃端部進展，而有產生自然分斷之情形。 For example, when the groove of the food crack is deep, in the step of forming the groove (step 3), the deep crack will be from the initial crack to the direction opposite to the scanning direction of heating and cooling, that is, Progress towards the end of the glass, and there is a natural break.
因此，在該第2發明中，以強的吸著力保持刻劃線預定線的開始端側之玻璃端部。藉此，抑制刻劃線溝之形成時在玻璃端部之變形，且可抑制龜裂朝刻劃線預定線的開始端側進展。因此，可避免自然分斷。 Therefore, in the second aspect of the invention, the glass end portion on the start end side of the predetermined line of the score line is held by the strong suction force. Thereby, deformation at the end portion of the glass at the time of formation of the scribe groove is suppressed, and the progress of the crack toward the start end side of the predetermined line of the scribe line can be suppressed. Therefore, natural breaks can be avoided.
第3發明之玻璃基板之刻劃線方法係在第1發明之刻劃線方法中，於第3步驟中，沿著相互正交之複數個刻劃線預定線而形成刻劃線溝。並且，在第1步驟中，以比其他區域更強之吸著壓將玻璃之全外周端部予以吸著。 In the scribing method for the glass substrate according to the third aspect of the invention, in the third step, the scribe line is formed along a predetermined line of a plurality of scribe lines orthogonal to each other. Further, in the first step, the entire outer peripheral end portion of the glass is sucked by a stronger suction pressure than the other regions.
在此，進行交叉刻劃線時，與前述同樣地可抑制在玻璃端部形成深的龜裂，且可避免自然分斷。 Here, when the cross scribe line is formed, it is possible to suppress the formation of deep cracks at the end portions of the glass in the same manner as described above, and it is possible to avoid natural breakage.
第4發明之玻璃基板之加工裝置，係沿著刻劃線預定線對在表面具有具壓縮應力之強化層的玻璃進行刻劃線之玻璃基板之裝置，其具有座台、照射部、冷卻部、移動手段及吸著壓控制部。座台係具有複數個吸著孔，且吸著並保持載置在表面之玻璃。照射部係將雷射束放射在玻璃。冷卻部係將藉由照射部所加熱之區域予以冷卻。移動手段係沿著設定在玻璃之刻劃線預定線而使照射部及冷卻部相對移動。吸著壓控制部係以玻璃之至少刻劃線預定線之終端側的端部比中央部更強之方式控制座台之吸著壓。 The apparatus for processing a glass substrate according to the fourth aspect of the invention is a device for dicing a glass having a reinforcing layer having a compressive stress on a surface along a predetermined line of a scribe line, and has a pedestal, an illuminating unit, and a cooling unit. , moving means and suction pressure control unit. The platform has a plurality of suction holes and sucks and holds the glass placed on the surface. The illuminating unit radiates the laser beam to the glass. The cooling portion is cooled by the region heated by the irradiation portion. The moving means moves the irradiation portion and the cooling portion relative to each other along a predetermined line which is set at the time of the glass. The suction pressure control unit controls the suction pressure of the seat so that the end portion on the terminal side of the predetermined line of the at least scribe line of the glass is stronger than the central portion.
如上所述，本發明係對於在表面具有具壓縮應力之強化層的玻璃，容易且穩定地阻止龜裂在刻劃線預定線之終端部正前進展。因此，可防止玻璃在將刻劃線溝形成在玻璃之時間點自然分斷。 As described above, the present invention is directed to a glass having a reinforcing layer having a compressive stress on the surface, and it is easy and stable to prevent the crack from progressing in front of the end portion of the predetermined line of the scribe line. Therefore, it is possible to prevent the glass from being naturally broken at the time point when the scribe groove is formed in the glass.
第1圖係用以實施本發明之一實施形態之刻劃線方法之裝置的概略構成圖。第1圖係用以實施本發明之一實施形態之刻劃線方法之裝置的概略構成圖。刻劃線裝置1係將例如主玻璃基板分斷成使用在FPD(平板顯示器)之複數個單位基板的裝置。在此之玻璃基板係主要使用於表面形成有強化層之化學強化玻璃。如前所述，該化學強化玻璃係具有藉由離子交換處理而在表面具壓縮應力的強化層。 Fig. 1 is a schematic configuration diagram of an apparatus for carrying out a scribing method according to an embodiment of the present invention. Fig. 1 is a schematic configuration diagram of an apparatus for carrying out a scribing method according to an embodiment of the present invention. The scribe line device 1 is a device that divides, for example, a main glass substrate into a plurality of unit substrates used in an FPD (Flat Panel Display). The glass substrate used here is mainly used for chemically strengthened glass in which a reinforcing layer is formed on the surface. As described above, the chemically strengthened glass has a strengthening layer which has a compressive stress on the surface by ion exchange treatment.
刻劃線裝置1係具備載置有玻璃基板G之台座2、切割輪3、雷射照射部4、冷卻部5、驅動機構6、2個抽吸泵7a、7b、及控制部8。 The scribe line apparatus 1 includes a pedestal 2 on which a glass substrate G is placed, a cutting wheel 3, a laser irradiation unit 4, a cooling unit 5, a drive mechanism 6, two suction pumps 7a and 7b, and a control unit 8.
在台座2形成有其上部解放在台座表面之複數個貫通孔10。複數個貫通孔10中之形成在對應於玻璃基板G之外周端部之位置的貫通孔10a，係透過實線所示之第1通路11而連接在第1抽吸泵7a。此外，貫通孔10a以外之複數個貫通孔10b係透過一點鏈線所示之第2通路12而連接在第2抽吸泵7b。 A plurality of through holes 10 whose upper portion is liberated on the surface of the pedestal are formed in the pedestal 2. The through hole 10a formed in the through hole 10 at a position corresponding to the outer peripheral end portion of the glass substrate G is connected to the first suction pump 7a through the first passage 11 indicated by the solid line. Further, the plurality of through holes 10b other than the through hole 10a are connected to the second suction pump 7b through the second passage 12 indicated by the one-point chain line.
切割輪3係用以在玻璃基板G之端部形成作為刻劃線之起點之龜裂的工具。該切割輪3係主要具有保持具、及支持在保持具之刻劃線輪。 The cutter wheel 3 is a tool for forming a crack as a starting point of the score line at the end portion of the glass substrate G. The cutting wheel 3 mainly has a holder and a scribing wheel that supports the holder.
雷射照射部4係具有照射雷射束之雷射振盪器(例如CO2雷射)，透過光學系統將該雷射束作為射束點照射在玻璃基板G上。此外，冷卻部5係透過噴嘴將從未圖示之冷 媒源供給之冷媒(例如水與空氣、氦氣等)而形成冷卻點。 The laser irradiation unit 4 has a laser oscillator (for example, a CO 2 laser) that irradiates a laser beam, and the laser beam is irradiated onto the glass substrate G as a beam spot through an optical system. Further, the cooling unit 5 forms a cooling point by a refrigerant (for example, water, air, helium, or the like) supplied from a refrigerant source (not shown) through a nozzle.
驅動機構6係沿著軌道14使切割輪3、雷射照射部4、冷卻部5移動之機構。藉由該驅動機構6，使切割輪3、雷射照射部4、冷卻部5沿著設定在玻璃基板G之刻劃線預定線移動。 The drive mechanism 6 is a mechanism that moves the cutting wheel 3, the laser irradiation unit 4, and the cooling unit 5 along the rail 14. By the drive mechanism 6, the cutting wheel 3, the laser irradiation unit 4, and the cooling unit 5 are moved along a predetermined line which is set on the glass substrate G.
控制部8係控制切割輪3、雷射照射部4、冷卻部5、驅動機構6、2個抽吸泵7a、7b。具體而言，藉由控制部8來控制切割輪3對玻璃基板G之推壓力、雷射輸出、冷媒之噴射量、驅動速度(掃描速度)、抽吸泵7a、7b之旋轉數(吸著壓)。 The control unit 8 controls the cutting wheel 3, the laser irradiation unit 4, the cooling unit 5, the drive mechanism 6, and the two suction pumps 7a and 7b. Specifically, the control unit 8 controls the pressing force of the cutting wheel 3 on the glass substrate G, the laser output, the amount of injection of the refrigerant, the driving speed (scanning speed), and the number of rotations of the suction pumps 7a and 7b (sucking Pressure).
以下顯示變更雷射輸出與掃描速度且以各自之條件變更吸著壓時之刻劃線結果。將各實驗例之結果顯示在第2圖。 The following shows the results of the scribing when the laser output and the scanning speed are changed and the suction pressure is changed under the respective conditions. The results of the respective experimental examples are shown in Fig. 2.
玻璃基板G對台座2之吸著壓(kPa)：5，10，20 The suction pressure (kPa) of the glass substrate G to the pedestal 2: 5, 10, 20
雷射輸出：140W Laser output: 140W
掃描速度：190mm/s Scanning speed: 190mm/s
在該實驗例1中，在低吸著壓5kPa時雖顯示可刻劃線(在第2圖中以○表示)，但在高吸著壓10及20kPa時不能刻劃線(在第2圖中以×表示)。 In the first experimental example, although the scribe line can be scored at a low suction pressure of 5 kPa (indicated by ○ in FIG. 2), the scribe line cannot be scored at a high suction pressure of 10 and 20 kPa (in FIG. 2). In the middle of ×).
玻璃基板G對台座2之吸著壓(kPa)：5，10，20 The suction pressure (kPa) of the glass substrate G to the pedestal 2: 5, 10, 20
雷射輸出：160W Laser output: 160W
掃描速度：230mm/s Scanning speed: 230mm/s
在該實驗例2中，在低吸著壓5及10kPa時雖可刻劃線，但在吸著壓20kPa時不能刻劃線。 In the experimental example 2, although the scribe line was drawn at a low suction pressure of 5 and 10 kPa, the scribe line could not be scribed when the suction pressure was 20 kPa.
玻璃基板G對台座2之吸著壓(kPa)：5，10，20 The suction pressure (kPa) of the glass substrate G to the pedestal 2: 5, 10, 20
雷射輸出：170W Laser output: 170W
掃描速度：250mm/s Scanning speed: 250mm/s
在該實驗例3中，在低吸著壓5及10kPa時雖可刻劃線，但在吸著壓20kPa時不能刻劃線。 In Experimental Example 3, although the scoring was performed at a low suction pressure of 5 and 10 kPa, the scribing could not be performed at a suction pressure of 20 kPa.
玻璃基板G對台座2之吸著壓(kPa)：5，10，20 The suction pressure (kPa) of the glass substrate G to the pedestal 2: 5, 10, 20
雷射輸出：180W Laser output: 180W
掃描速度：260mm/s Scanning speed: 260mm/s
在該實驗例4中，在低吸著壓5及10kPa時雖可刻劃線，但在吸著壓20kPa時不能刻劃線。 In the experimental example 4, although the low suction pressure is 5 and 10 kPa, the score line can be scribed, but the scribe line cannot be scored when the suction pressure is 20 kPa.
由以上實驗例得知，當提升吸著壓時、亦即增強抽吸力，在刻劃線溝形成時抑制玻璃基板之變形時，龜裂之進展會停止。 From the above experimental examples, it is known that when the suction pressure is raised, that is, the suction force is increased, the deformation of the glass substrate is suppressed when the scribe groove is formed, and the progress of the crack is stopped.
根據以上之見解，在本實施形態中，藉由以下之刻劃線方法而形成刻劃線溝。 According to the above findings, in the present embodiment, the scribe groove is formed by the following scribing method.
首先，將作為加工對象之玻璃基板G載置在台座2上。然後，驅動第1抽吸泵7a及第2抽吸泵7b，並將玻璃基板G吸著在台座2上。此時，藉由控制部8控制各抽吸泵 7a、7b之旋轉數，將第1抽吸泵7a之吸著壓控制成20kPa以上，將第2抽吸泵7b之吸著壓控制成10kPa以下。 First, the glass substrate G to be processed is placed on the pedestal 2. Then, the first suction pump 7a and the second suction pump 7b are driven, and the glass substrate G is sucked onto the pedestal 2. At this time, each suction pump is controlled by the control unit 8. The number of rotations of 7a and 7b is controlled so that the suction pressure of the first suction pump 7a is 20 kPa or more, and the suction pressure of the second suction pump 7b is controlled to 10 kPa or less.
接著，利用切割輪3將作為刻劃線之起點的初期龜裂形成在玻璃基板G之端部。 Next, the initial crack which is the starting point of the score line is formed on the end portion of the glass substrate G by the cutter wheel 3.
然後，對玻璃基板G，從雷射照射部4照射雷射束。該雷射束係作為射束點照射在玻璃基板G上。然後，從雷射照射部4射出之雷射束係沿著刻劃線預定線掃描。玻璃基板G係藉由射束點而被加熱至被玻璃基板G之軟化點更低的溫度。此外，使冷卻點追隨在射束點之移動方向。 Then, the laser beam is irradiated from the laser irradiation unit 4 to the glass substrate G. This laser beam is irradiated onto the glass substrate G as a beam spot. Then, the laser beam emitted from the laser irradiation unit 4 is scanned along a predetermined line of the scribe line. The glass substrate G is heated by the beam spot to a temperature lower than the softening point of the glass substrate G. In addition, the cooling point follows the direction of movement of the beam spot.
如以上所述，雖在藉由雷射束之照射而被加熱之射束點的附近會產生壓縮應力，但之後藉由冷媒之噴射而形成冷卻點，因此會產生對於垂直裂痕有效之壓縮應力。藉由該壓縮應力，以形成在玻璃基板G之端部的初期龜裂為起點而形成沿著刻劃線預定線之垂直裂痕，以形成所希望之刻劃線溝。 As described above, although compressive stress is generated in the vicinity of the beam spot heated by the irradiation of the laser beam, the cooling point is formed by the ejection of the refrigerant, so that compressive stress effective for the vertical crack is generated. . By the compressive stress, a vertical crack along a predetermined line of the scribe line is formed with the initial crack formed at the end portion of the glass substrate G as a starting point to form a desired scribe groove.
在此，於刻劃線溝之形成步驟，刻劃線預定線之開始端部及終端部、亦即玻璃基板G之端部係以強之吸著壓(抽吸力)所保持。因此，可抑制因加熱及冷卻處理所造成之玻璃基板G的變形，且可抑制龜裂之進展。因此，可抑制在玻璃基板G之端部形成深的龜裂，且可防止基板自然地被分斷。 Here, in the step of forming the scribed groove, the beginning end portion and the end portion of the predetermined line of the scribe line, that is, the end portion of the glass substrate G are held by the strong suction pressure (suction force). Therefore, deformation of the glass substrate G due to heating and cooling treatment can be suppressed, and progress of cracks can be suppressed. Therefore, it is possible to suppress formation of deep cracks at the end portions of the glass substrate G, and it is possible to prevent the substrate from being naturally broken.
在本實施形態中，係強的作用力將玻璃基板保持在台座上，以抑制加工中之變形，因此，可抑制在玻璃基板端 部形成深的龜裂，且可避免基板之自然分斷。 In the present embodiment, a strong urging force holds the glass substrate on the pedestal to suppress deformation during processing, and therefore, it can be suppressed at the glass substrate end. The part forms deep cracks and avoids the natural breaking of the substrate.
再者，就使玻璃基板端部之龜裂進展停止的手段而言，藉由控制而實現基板對於台座之吸著壓，因此能以簡單之方法避免基板之自然分斷。 Further, in the means for stopping the crack growth at the end portion of the glass substrate, the suction pressure of the substrate to the pedestal is achieved by the control, so that the natural division of the substrate can be avoided in a simple manner.
本發明並非限定在以上之實施形態者，在不脫離本發明之範圍之下可進行各種變形或修正。 The present invention is not limited to the embodiments described above, and various modifications and changes can be made without departing from the scope of the invention.
(a)在前述實施形態中，雖以強的作用力將玻璃基板之刻劃線預定線的開始側之端部及終端部之端部兩方，但亦能以強的作用力僅保持刻劃線預定線之終端部之端部。再者，以強的作用力保持開始側之端部時，會抑制初期龜裂之進展，而有不會形成刻劃線溝之情形，因此開始側之端部係保持成比終端側之端部弱且比中央部強。 (a) In the above embodiment, the glass substrate is scribed to both the end portion of the start side and the end portion of the end portion of the predetermined line with a strong urging force, but it can be kept only with a strong force. The end portion of the terminal portion of the predetermined line is scribed. Further, when the end portion on the start side is held by a strong urging force, the progress of the initial crack is suppressed, and the scribe groove is not formed, so that the end portion of the start side is held at the end than the terminal side. The Ministry is weaker and stronger than the Central Department.
(b)在前述實施形態中，雖固定台座並使雷射照射部等移動，但亦可固定雷射照射部等，並使台座移動。 (b) In the above embodiment, the pedestal is fixed and the laser irradiation unit or the like is moved. However, the laser irradiation unit or the like may be fixed and the pedestal may be moved.
(c)在前述實施形態中，雖將用以形成初期龜裂之切割輪與雷射照射部等一同設置在相同裝置，但亦可將切割輪設置在與雷射照射部等不同之裝置。此時，首先在形成初期龜裂後，玻璃基板會吸著在台座上。亦即，初期龜裂形成步驟(第2步驟)與玻璃基板對於台座之載置步驟(第1步驟)之順序係與前述實施形態相反。 (c) In the above embodiment, the cutting wheel for forming the initial crack is provided in the same apparatus as the laser irradiation unit or the like, but the cutting wheel may be provided in a device different from the laser irradiation unit or the like. At this time, first, after the initial crack is formed, the glass substrate is sucked on the pedestal. That is, the order of the initial crack forming step (second step) and the step of placing the glass substrate on the pedestal (first step) is the reverse of the above embodiment.
(d)在前述實施形態中，雖使用用以形成初期龜裂之切割輪，但亦可利用雷射燒蝕或改質等之雷射加工來形成初期龜裂。此時，設置以UV雷射或綠雷射等作為光源之雷 射照射機構，用來作為初期龜裂形成。 (d) In the above embodiment, the cutting wheel for forming the initial crack is used, but the initial crack may be formed by laser processing such as laser ablation or modification. At this time, set a laser with a UV laser or a green laser as a light source. The irradiation mechanism is used as an initial crack formation.
1‧‧‧刻劃線裝置 1‧‧‧ marking device
2‧‧‧台座 2‧‧‧ pedestal
3‧‧‧切割輪 3‧‧‧Cutting wheel
4‧‧‧雷射照射部 4‧‧‧Laser illumination department
5‧‧‧冷卻部 5‧‧‧ Cooling Department
6‧‧‧驅動機構 6‧‧‧Drive mechanism
7a、7b‧‧‧抽吸泵 7a, 7b‧‧‧ suction pump
8‧‧‧控制部 8‧‧‧Control Department
10、10a、10b‧‧‧貫通孔 10, 10a, 10b‧‧‧ through holes
11‧‧‧第1通路 11‧‧‧1st pathway
12‧‧‧第2通路 12‧‧‧2nd pathway
14‧‧‧軌道 14‧‧‧ Track
G‧‧‧玻璃基板 G‧‧‧glass substrate
第1圖係用以實施本發明之一實施形態之刻劃線方法之裝置的概略構成圖。 Fig. 1 is a schematic configuration diagram of an apparatus for carrying out a scribing method according to an embodiment of the present invention.
第2圖係顯示對座台之基板吸著壓與刻劃線處理之關係的圖。 Fig. 2 is a view showing the relationship between the substrate absorbing pressure and the scribe line processing on the pedestal.
1‧‧‧刻劃線裝置 1‧‧‧ marking device
2‧‧‧台座 2‧‧‧ pedestal
3‧‧‧切割輪 3‧‧‧Cutting wheel
4‧‧‧雷射照射部 4‧‧‧Laser illumination department
5‧‧‧冷卻部 5‧‧‧ Cooling Department
6‧‧‧驅動機構 6‧‧‧Drive mechanism
7a、7b‧‧‧抽吸泵 7a, 7b‧‧‧ suction pump
8‧‧‧控制部 8‧‧‧Control Department
10、10a、10b‧‧‧貫通孔 10, 10a, 10b‧‧‧ through holes
11‧‧‧第1通路 11‧‧‧1st pathway
12‧‧‧第2通路 12‧‧‧2nd pathway
14‧‧‧軌道 14‧‧‧ Track
G‧‧‧玻璃基板 G‧‧‧glass substrate
Claims (4)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011187412A JP5437333B2 (en) | 2011-08-30 | 2011-08-30 | Glass substrate scribing method and processing apparatus |
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| TW201313639A true TW201313639A (en) | 2013-04-01 |
| TWI491573B TWI491573B (en) | 2015-07-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| TW101130387A TWI491573B (en) | 2011-08-30 | 2012-08-22 | Method for scribing a glass board and a processing device |
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| Country | Link |
|---|---|
| JP (1) | JP5437333B2 (en) |
| KR (1) | KR101396990B1 (en) |
| CN (1) | CN102964059B (en) |
| TW (1) | TWI491573B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI607976B (en) * | 2014-06-11 | 2017-12-11 | Ｉｈｉ股份有限公司 | Cutting method of brittle material substrate and cutting apparatus of brittle material substrate |
| US10479719B2 (en) | 2014-08-28 | 2019-11-19 | Corning Incorporated | Apparatus and method for cutting a glass sheet |
| US10793462B2 (en) | 2015-07-07 | 2020-10-06 | Corning Incorporated | Apparatuses and methods for heating moving glass ribbons at separation lines and/or for separating glass sheets from glass ribbons |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP6229411B2 (en) * | 2013-09-30 | 2017-11-15 | 日本電気株式会社 | Laser processing apparatus and laser processing method |
| WO2015084670A1 (en) | 2013-12-03 | 2015-06-11 | Corning Incorporated | Apparatus and method for severing a moving ribbon of inorganic material |
| JP2016069223A (en) * | 2014-09-30 | 2016-05-09 | 三星ダイヤモンド工業株式会社 | Breaking method and breaking device |
| JP2016069222A (en) * | 2014-09-30 | 2016-05-09 | 三星ダイヤモンド工業株式会社 | Breaking method and breaking device |
| JP2016102048A (en) * | 2014-11-13 | 2016-06-02 | 三星ダイヤモンド工業株式会社 | Scribe method and scribe device |
| CN105643112A (en) * | 2016-02-25 | 2016-06-08 | 成都亨通兆业精密机械有限公司 | Glass cutting equipment |
| KR101826235B1 (en) * | 2016-08-05 | 2018-02-06 | 한국미쯔보시다이아몬드공업(주) | Method for dividing glass substrate inducing time difference |
| CN107116702A (en) * | 2017-06-27 | 2017-09-01 | 盐城市宁润玻璃制品有限公司 | A kind of glass substrate cutting equipment |
| KR20200065210A (en) * | 2018-11-29 | 2020-06-09 | 주식회사 탑 엔지니어링 | Scribing method |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3088327B2 (en) * | 1997-03-24 | 2000-09-18 | 鹿児島日本電気株式会社 | Glass substrate cutting method |
| DE10041519C1 (en) | 2000-08-24 | 2001-11-22 | Schott Spezialglas Gmbh | Cutting flat glass plate into several rectangular plates comprises cutting the flat glass plate along cutting lines into several partial plates |
| WO2010044217A1 (en) * | 2008-10-17 | 2010-04-22 | 株式会社リンクスタージャパン | Method for cutting mother glass substrate for display and brittle material substrate and method for manufacturing display |
| JP5280825B2 (en) * | 2008-12-17 | 2013-09-04 | 株式会社リンクスタージャパン | Substrate table and laser processing apparatus using the same |
| JP2010150068A (en) * | 2008-12-25 | 2010-07-08 | Mitsuboshi Diamond Industrial Co Ltd | Method for breaking brittle material substrate |
| JP5795000B2 (en) | 2009-11-30 | 2015-10-14 | コーニング インコーポレイテッド | Laser scribing and separation method for glass substrate |
| JP5729604B2 (en) * | 2011-07-20 | 2015-06-03 | 株式会社レミ | Glass substrate processing equipment |
-
2011
- 2011-08-30 JP JP2011187412A patent/JP5437333B2/en not_active Expired - Fee Related
-
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- 2012-08-22 TW TW101130387A patent/TWI491573B/en not_active IP Right Cessation
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI607976B (en) * | 2014-06-11 | 2017-12-11 | Ｉｈｉ股份有限公司 | Cutting method of brittle material substrate and cutting apparatus of brittle material substrate |
| US10479719B2 (en) | 2014-08-28 | 2019-11-19 | Corning Incorporated | Apparatus and method for cutting a glass sheet |
| US10793462B2 (en) | 2015-07-07 | 2020-10-06 | Corning Incorporated | Apparatuses and methods for heating moving glass ribbons at separation lines and/or for separating glass sheets from glass ribbons |
| US11820694B2 (en) | 2015-07-07 | 2023-11-21 | Corning Incorporated | Apparatuses and methods for heating moving continuous glass ribbons at desired lines of separation and/or for separating glass sheets from continuous glass ribbons |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5437333B2 (en) | 2014-03-12 |
| TWI491573B (en) | 2015-07-11 |
| CN102964059B (en) | 2015-08-19 |
| JP2013049588A (en) | 2013-03-14 |
| CN102964059A (en) | 2013-03-13 |
| KR101396990B1 (en) | 2014-05-20 |
| KR20130045166A (en) | 2013-05-03 |
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