TW201307466A - 硬化性樹脂組成物、及硬化物 - Google Patents

硬化性樹脂組成物、及硬化物 Download PDF

Info

Publication number
TW201307466A
TW201307466A TW101111434A TW101111434A TW201307466A TW 201307466 A TW201307466 A TW 201307466A TW 101111434 A TW101111434 A TW 101111434A TW 101111434 A TW101111434 A TW 101111434A TW 201307466 A TW201307466 A TW 201307466A
Authority
TW
Taiwan
Prior art keywords
group
bond
fluorine
structural unit
resin composition
Prior art date
Application number
TW101111434A
Other languages
English (en)
Chinese (zh)
Inventor
Tsuneo Yamashita
Yoshito Tanaka
Tomohiro Yoshida
Original Assignee
Daikin Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daikin Ind Ltd filed Critical Daikin Ind Ltd
Publication of TW201307466A publication Critical patent/TW201307466A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C09J133/16—Homopolymers or copolymers of esters containing halogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C08L27/14—Homopolymers or copolymers of vinyl fluoride
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS
TW101111434A 2011-03-30 2012-03-30 硬化性樹脂組成物、及硬化物 TW201307466A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011076471 2011-03-30

Publications (1)

Publication Number Publication Date
TW201307466A true TW201307466A (zh) 2013-02-16

Family

ID=46931256

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101111434A TW201307466A (zh) 2011-03-30 2012-03-30 硬化性樹脂組成物、及硬化物

Country Status (3)

Country Link
JP (1) JP5288018B2 (ja)
TW (1) TW201307466A (ja)
WO (1) WO2012133548A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI696002B (zh) * 2018-04-04 2020-06-11 南韓商Ｕｔｉ有限公司 近紅外線濾波器及其製造方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104201115A (zh) * 2014-09-12 2014-12-10 苏州晶方半导体科技股份有限公司 晶圆级指纹识别芯片封装结构及封装方法
KR101908186B1 (ko) * 2016-06-15 2018-10-15 삼성에스디아이 주식회사 윈도우 필름용 조성물, 이로부터 형성된 윈도우 필름 및 이를 포함하는 플렉시블 디스플레이 장치
JP7326358B2 (ja) * 2020-01-08 2023-08-15 ダイキン工業株式会社 ディスプレイ保護膜

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3765839B2 (ja) * 1994-07-28 2006-04-12 大日本インキ化学工業株式会社 樹脂組成物
JP2008274306A (ja) * 1998-05-26 2008-11-13 Jsr Corp 組成物
JP3666575B2 (ja) * 2000-06-29 2005-06-29 信越化学工業株式会社 硬化性フルオロポリエーテルゴム組成物
JP3742861B2 (ja) * 2000-08-29 2006-02-08 ダイキン工業株式会社 硬化性含フッ素ポリマー、それを用いた硬化性樹脂組成物および反射防止膜
EP2085408B1 (en) * 2002-03-14 2012-01-18 Daikin Industries, Ltd. Fluorocopolymer curable composition, and cured object
US9127114B2 (en) * 2006-10-12 2015-09-08 Daikin Industries, Ltd. Curable fluorine-containing polymer composition
JP5448388B2 (ja) * 2008-08-19 2014-03-19 株式会社カネカ 上塗り塗料用硬化性樹脂組成物
JP5282635B2 (ja) * 2009-04-10 2013-09-04 信越化学工業株式会社 含フッ素硬化性組成物及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI696002B (zh) * 2018-04-04 2020-06-11 南韓商Ｕｔｉ有限公司 近紅外線濾波器及其製造方法

Also Published As

Publication number Publication date
WO2012133548A1 (ja) 2012-10-04
JP5288018B2 (ja) 2013-09-11
JP2012214753A (ja) 2012-11-08

Similar Documents

Publication Publication Date Title
JP5293588B2 (ja) 光硬化性含フッ素ポリマーを含む光学材料および光硬化性含フッ素樹脂組成物
TWI570174B (zh) Near Infrared Cutoff Filter and Device Using Near Infrared Cutoff Filter
TWI390353B (zh) 蝕刻光罩用含矽膜形成用組成物，蝕刻光罩用含矽膜及使用其之基板加工中間體及被加工基板之加工方法
TWI557444B (zh) Blocking near-infrared filters and using a device that blocks near-infrared filters
TW201302920A (zh) 光學元件封裝用含氟樹脂組成物、及硬化物
TW201115278A (en) Coating compositions for use with an overcoated photoresist
JP6006594B2 (ja) フォトリソグラフィのための組成物および反射防止コーティング
CN102516459B (zh) 含氟化合物、含氟聚合物和含氟树脂组合物
TWI250170B (en) Curable surface modifier and curable composition for surface modification comprising the same
WO2017188047A1 (ja) 樹脂組成物、その硬化膜およびその製造方法ならびに固体撮像素子
TW201307466A (zh) 硬化性樹脂組成物、及硬化物
KR20180086202A (ko) 폴리메탈록산, 그의 제조 방법, 그의 조성물, 경화막 및 그의 제조 방법, 및 그것을 구비한 부재 및 전자 부품
WO2012053453A1 (ja) 塗布型絶縁膜形成用含フッ素組成物、絶縁膜、及び薄膜トランジスタ
JP2013087162A (ja) 含フッ素ポリマー、硬化性樹脂組成物、及び、硬化物
TW201343686A (zh) 含氟聚合物及其製造方法
JP2018066011A (ja) 反射防止被膜用の組成物
JP5223977B2 (ja) 硬化性樹脂組成物及び硬化物
TWI812716B (zh) 固體攝像元件、電子機器、感放射線性組成物及固體攝像元件的製造方法
KR101441563B1 (ko) 실리콘을 포함하는 다기능 반사방지막 제조용 열경화성 실리콘 수지 및 이 수지를 사용하여 제조된 반사방지막
JP2011213886A (ja) 複合粒子、樹脂組成物、樹脂成形体、光学部品および光学デバイス