TW201305989A - Bonding apparatus and method for controlling same - Google Patents

Bonding apparatus and method for controlling same Download PDF

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Publication number
TW201305989A
TW201305989A TW101131101A TW101131101A TW201305989A TW 201305989 A TW201305989 A TW 201305989A TW 101131101 A TW101131101 A TW 101131101A TW 101131101 A TW101131101 A TW 101131101A TW 201305989 A TW201305989 A TW 201305989A
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workpiece
unit
valve
vacuum
bonding apparatus
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TW101131101A
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Chinese (zh)
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TWI470595B (en
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Yoshihiro Shirakawa
Noriyuki Yokota
Takuya Ida
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Shibaura Mechatronics Corp
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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133308Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133331Cover glasses
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133354Arrangements for aligning or assembling substrates

Abstract

Provided is a low-cost and small bonding apparatus which can efficiently align and bond works by using a turntable. A method for controlling the bonding apparatus is also provided. The bonding apparatus which bonds a pair of works (S1, S2) is provided with: a turntable (1) which intermittently rotates corresponding to a plurality of positions; a plurality of holding apparatuses (2) which are provided on the turntable (1) and hold the works (S1, S2); an aligning section (300) which is provided on the holding apparatuses (2) and aligns the work (S1); and a pressing apparatus (5) which bonds the work (S2) on the work (S1) by urging the work (S2) held by the holding apparatus (2). A driving section (400) which drives the aligning section (300) is provided independently from the turntable (1) and removably from the aligning section (300).

Description

貼合裝置及其控制方法 Laminating device and control method thereof

本發明係關於對貼合液晶模組及覆蓋面板般的平板狀工件之技術施以改良之貼合裝置及其控制方法。 The present invention relates to an improved bonding apparatus and a control method thereof for a technique of bonding a liquid crystal module and a flat-plate-like workpiece.

一般而言,液晶面板係藉由將液晶模組、保護其表面之保護薄片、及操作用的觸控面板等予以積層而構成。此等液晶模組、保護薄片、及觸控面板等(以下稱為工件),係組裝於液晶模組的框體,且為了避免因保護面板或觸控面板的變形而與液晶玻璃接觸,係於相互之間形成有空間。 In general, a liquid crystal panel is formed by laminating a liquid crystal module, a protective sheet for protecting a surface thereof, and a touch panel for operation. These liquid crystal modules, protective sheets, touch panels, and the like (hereinafter referred to as workpieces) are assembled in the casing of the liquid crystal module, and are in contact with the liquid crystal glass in order to avoid deformation of the protective panel or the touch panel. There is space between each other.

然而,當空氣層進入於液晶模組、保護薄片、及觸控面板等(以下稱為工件)之間時,由於外光的反射,使顯示面的觀看性降低。因應於此,乃藉由雙面膠帶或接著劑等之貼著材,以形成有埋填工件間的層之方式來進行貼合。 However, when the air layer enters between the liquid crystal module, the protective sheet, and the touch panel (hereinafter referred to as a workpiece), the visibility of the display surface is lowered due to the reflection of the external light. In this case, the bonding is performed by forming a layer between the workpieces by a bonding material such as a double-sided tape or an adhesive.

因此,液晶面板的製造時,必須具有準備貼著材並對至少一方的工件進行貼合之貼合裝置。此外,為了防止氣泡等混入於貼合的工件之間,貼合較佳係在真空中進行。因此,貼合裝置亦須具備真空處理室等。 Therefore, in the production of a liquid crystal panel, it is necessary to have a bonding apparatus that prepares a bonding material and bonds at least one of the workpieces. Further, in order to prevent air bubbles or the like from being mixed between the bonded workpieces, the bonding is preferably carried out in a vacuum. Therefore, the bonding apparatus must also have a vacuum processing chamber or the like.

此般貼合工件之技術,例如有專利文獻1~3所示者。專利文獻1及2所記載之技術,為在真空中將貼合工件之方法。專利文獻3所記載之技術,是為了有效率地進行貼 合,使保持工件之裝置,一邊藉由間歇地旋轉之旋轉台來移動一邊依序進行處理之技術。 The technique of bonding the workpiece in this way is, for example, those disclosed in Patent Documents 1 to 3. The techniques described in Patent Documents 1 and 2 are methods for bonding a workpiece in a vacuum. The technique described in Patent Document 3 is for efficient labeling. In combination, a technique for sequentially holding a device while holding the workpiece while moving it by intermittently rotating the rotary table.

先前技術文獻 Prior technical literature 專利文獻 Patent literature

專利文獻1:日本特開2004-170974號公報 Patent Document 1: Japanese Laid-Open Patent Publication No. 2004-170974

專利文獻2:日本特開2004-170975號公報 Patent Document 2: Japanese Laid-Open Patent Publication No. 2004-170975

專利文獻3:日本特許第3595125號公報 Patent Document 3: Japanese Patent No. 3595125

為了正確地定位工件,較佳是具備於平面上可在直交方向(X-Y方向)上及旋轉方向(θ方向)上移位之X-Y-θ平台。然而,若此X-Y-θ平台含有用以驅動其之驅動源等,則會變得大型化。所以,當將X-Y-θ平台裝載於旋轉台時,會導致裝置全體的大型化,並且使電源及控制線的處理變得複雜。再者,當欲將含有驅動源等之X-Y-θ平台全體收納於真空處理室內並確保密閉時,真空處理室亦會變得大型化。此般大型化會使裝置的製造成本增大。 In order to accurately position the workpiece, it is preferable to have an X-Y-θ platform which is displaceable in the orthogonal direction (X-Y direction) and the rotational direction (θ direction) on the plane. However, if the X-Y-θ platform includes a driving source for driving the same, it will become large. Therefore, when the X-Y-θ platform is mounted on the rotary table, the size of the entire device is increased, and the processing of the power supply and the control line is complicated. In addition, when the entire X-Y-θ platform including the driving source or the like is to be housed in the vacuum processing chamber and sealed, the vacuum processing chamber is also increased in size. Such a large increase will increase the manufacturing cost of the device.

本發明係為了解決上述以往技術之問題點而創作出之發明,其主要目的在於提供一種使用旋轉台,能夠有效率地進行工件的定位與貼合,並且為便宜且小型之貼合裝置及其控制方法。 The present invention has been made to solve the above problems of the prior art, and a main object thereof is to provide a laminating apparatus capable of efficiently performing positioning and lamination of a workpiece using a rotary table, and which is an inexpensive and compact laminating apparatus and Control Method.

此外,本發明之其他目的在於提供一種能夠實現安定 的運轉,不會產生氣泡或雜質等的混入,並且能夠以高精度來進行貼合之貼合裝置及其控制方法。 Furthermore, another object of the present invention is to provide a stable environment In the operation, the bonding device and the control method thereof can be bonded without causing the incorporation of air bubbles, impurities, and the like with high precision.

為了達成上述目的,本發明是一種貼合構成顯示裝置之一對工件的貼合裝置,其特徵為具有:因應複數個作業位置而間歇地旋轉之旋轉台;及於前述旋轉台上設置有複數個,並保持一對工件之保持裝置;及設置於前述保持裝置,並將一對工件的至少一方予以定位之定位部;以及藉由彈壓前述保持裝置之一對工件的至少一方,來貼合一對工件之按壓裝置;驅動前述定位部之驅動部,係與前述旋轉台獨立且能夠與前述定位部裝卸自如地設置。 In order to achieve the above object, the present invention provides a laminating apparatus for laminating a workpiece to a workpiece, characterized in that it has a rotary table that intermittently rotates in response to a plurality of working positions, and a plurality of rotary tables are provided on the rotating table. And a holding device for holding a pair of workpieces; and a positioning portion provided on the holding device to position at least one of the pair of workpieces; and fitting at least one of the workpieces by one of the holding devices A pressing device for the pair of workpieces; a driving portion for driving the positioning portion is detachably provided to the positioning portion independently of the rotating table.

在以上所述之本發明中,旋轉台的旋轉時,可將保持裝置從驅動部分離,並隨著旋轉台的旋轉而移動。因此,不需將驅動部裝載於旋轉台,亦不需具備電源及控制線。此外,由於可裝載複數台保持裝置,所以可實現高速且效率佳之貼合。此外,僅需在一場所設置驅動部,所以可便宜地構成。再者,由於可在定位後的保持裝置上進行貼合,所以可進行精度高的貼合。 In the invention described above, when the rotary table is rotated, the holding device can be separated from the driving portion and moved in accordance with the rotation of the rotary table. Therefore, it is not necessary to mount the drive unit on the rotary table, and it is not necessary to have a power supply and a control line. In addition, since a plurality of holding devices can be mounted, high speed and efficient bonding can be achieved. Further, since it is only necessary to provide the driving portion at one place, it can be configured inexpensively. Further, since the bonding can be performed on the positioning holding device, it is possible to perform bonding with high precision.

其他型態的特徵為:在前述旋轉台的至少1個作業位置,係裝卸自如地設置有用以剝離貼附於至少一方的工件之雙面膠帶的剝離紙之剝離裝置。 The other type is characterized in that a peeling device for peeling paper for peeling off a double-sided tape attached to at least one of the workpieces is detachably provided at at least one working position of the turntable.

在以上所述之發明中,由於剝離裝置裝卸自如地設置在旋轉台,所以如接著劑的塗佈裝置般可更換用以準備貼 著材之其他種類的裝置,因此可對應於多種製品。 In the invention described above, since the peeling device is detachably provided on the rotary table, it can be replaced as a coating device for the adhesive to prepare the sticker. Other types of devices are available, and thus can correspond to a variety of articles.

其他型態的特徵為:在前述旋轉台的至少1個作業位置,係設置有用以剝離貼附於至少一方的工件之雙面膠帶的剝離紙之剝離裝置;前述剝離裝置,係具有:將黏著膠帶壓抵於剝離紙之剝離頭;及將黏著膠帶供給至前述剝離頭之供給部;及捲取來自前述剝離頭的黏著膠帶之捲取部;以及以從與前述剝離頭之前述黏著膠帶的長度方向為不同之方向,來進行依據前述供給部所進行之前述黏著膠帶的供給之方式,轉換黏著膠帶的供給方向之轉換部。 Another aspect is characterized in that a peeling device for peeling paper for peeling off a double-sided tape attached to at least one of the workpieces is provided at at least one working position of the turntable; and the peeling device has a bonding device a peeling head that presses the tape against the release paper; and a supply portion that supplies the adhesive tape to the peeling head; and a take-up portion that winds the adhesive tape from the peeling head; and the adhesive tape from the peeling head and the adhesive tape The longitudinal direction is a different direction, and the conversion portion of the adhesive tape in the supply direction is switched in accordance with the supply of the adhesive tape by the supply unit.

在以上所述之發明中,由於黏著膠帶從供給部之供給方向與剝離頭之黏著膠帶的長度方向為不同,所以可縮短該長度方向的裝置空間。 In the above invention, since the direction in which the adhesive tape is supplied from the supply portion is different from the longitudinal direction of the adhesive tape of the peeling head, the device space in the longitudinal direction can be shortened.

其他型態的特徵為:在從前述供給部與前述剝離頭之間以及從前述剝離頭與前述捲取部之間,設置有導引黏著膠帶的移動之導引構件;對應於將剝離紙剝離之工件的作業位置,前述剝離頭及前述導引構件的配置為不同之複數個單元係構成為可更換。 Another aspect is characterized in that a guiding member for guiding movement of the adhesive tape is provided between the supply portion and the peeling head and between the peeling head and the winding portion; corresponding to peeling off the release paper The working position of the workpiece is such that the plurality of units are different in configuration in which the peeling head and the guiding member are arranged to be replaceable.

在以上所述之發明中,可藉由轉換部,將供給部配置在剝離頭之與黏著膠帶的長度方向為不同之位置。因此,供給部與捲取部維持原狀,並準備剝離頭及導引構件的配置為不同之複數個單元並加以更換,藉此可對應相對於不同位置的工件之剝離紙的剝離。 In the above invention, the supply portion can be disposed at a position where the longitudinal direction of the peeling head and the adhesive tape are different by the conversion portion. Therefore, the supply unit and the winding unit are maintained in the original shape, and a plurality of units in which the separation head and the guide member are disposed are prepared and replaced, whereby the peeling of the release paper with respect to the workpiece at different positions can be performed.

其他型態的特徵為:在前述旋轉台的至少1個作業位置,設置有分別檢測出一對工件之方形的3點角隅之檢測 裝置;並且具有:計算出構成方形的對角線兩端之2點的中點作為工件的重心之重心計算部;及根據構成方形的邊之2點來計算出工件的斜率之斜率計算部;以及根據前述重心及前述斜率來計算出前述定位部的控制量之定位運算部。 Other types are characterized in that at least one working position of the rotating table is provided with detection of a 3-point angle 分别 which respectively detects a square of a pair of workpieces And a center-of-gravity calculation unit that calculates a center point of two points on both ends of a diagonal line forming a square as a center of gravity of the workpiece; and a slope calculation unit that calculates a slope of the workpiece based on two points of the side forming the square; And a positioning calculation unit that calculates the control amount of the positioning unit based on the center of gravity and the slope.

其他型態是一種貼合裝置的控制方法,為藉由電腦或電子電路來控制貼合裝置而貼合一對工件之貼合裝置的控制方法,該貼合裝置係具有:因應複數個作業位置而間歇地旋轉之旋轉台;及於前述旋轉台上設置有複數個,並保持構成顯示裝置之一對工件的保持裝置;及設置於前述保持裝置,並將一對工件的至少一方予以定位之定位部;以及藉由彈壓前述保持裝置之一對工件的至少一方,來貼合一對工件之按壓裝置;其特徵為:前述電腦或電子電路,係具有:檢測部、重心計算部、斜率計算部、及定位運算部;前述檢測部,檢測出一對工件之方形的3點角隅;前述重心計算部,計算出構成方形的對角線兩端之2點的中點作為工件的重心;前述斜率計算部,根據構成方形的邊之2點來計算出工件的斜率;前述定位運算部,根據前述重心及前述斜率來計算出前述定位部的控制量。 The other type is a control method of a bonding device, and is a control method for bonding a pair of workpieces by controlling a bonding device by a computer or an electronic circuit, the bonding device having: a plurality of working positions a rotating table that rotates intermittently; and a plurality of holding means on the rotating table, and holding a holding device constituting one of the display devices; and being disposed on the holding device, and positioning at least one of the pair of workpieces a positioning unit; and a pressing device for bonding a pair of workpieces by at least one of the workpieces being biased by one of the holding devices; wherein the computer or the electronic circuit has a detecting unit, a center of gravity calculating unit, and a slope calculation And a positioning calculation unit that detects a square point of a pair of workpieces; the center of gravity calculation unit calculates a midpoint of two points on both ends of a diagonal line forming the square as a center of gravity of the workpiece; The slope calculating unit calculates a slope of the workpiece based on two points of the side forming the square; the positioning calculating unit calculates the front based on the center of gravity and the slope The control amount of the positioning unit.

在以上所述之發明中,可藉由檢測出各個方形的3點來計算出一對工件的重心及斜率並決定定位量,所以可將處理量抑制在最低限度,而進行正確的對位。 In the above-described invention, the center of gravity and the slope of the pair of workpieces can be calculated by detecting the three points of each square, and the amount of positioning can be determined. Therefore, the amount of processing can be minimized and the correct alignment can be performed.

其他型態的特徵為:在前述旋轉台的至少1個作業位置,設置有檢測出一對工件的位置之檢測裝置;前述檢測 裝置,係具有:將一方的工件攝像之第1攝像機;以及插入於一對工件之間,並將另一方的工件攝像之第2攝像機;在前述第2攝像機之與第1攝像機相對向的面,設置有反射部。 Another type of feature is: at least one working position of the rotating table, a detecting device for detecting a position of a pair of workpieces; the detecting The apparatus includes: a first camera that images one workpiece; a second camera that is inserted between the pair of workpieces and that images the other workpiece; and a surface of the second camera that faces the first camera , a reflection portion is provided.

在以上所述之發明中,即使工件具有彎曲部分等,來自第1攝像機側的照射光,亦可藉由第2攝像機的反射面所反射而在第1攝像機感光,所以可確實地檢測出。 In the above-described invention, even if the workpiece has a curved portion or the like, the illumination light from the first camera side can be reflected by the reflection surface of the second camera and can be detected by the first camera, so that it can be reliably detected.

其他型態的特徵為:前述按壓裝置,係具有:能夠將前述定位部之保持工件的部分從前述驅動部獨立出而收納之真空處理室。 In another aspect, the pressing device includes a vacuum processing chamber in which a portion of the positioning portion that holds the workpiece is separately detached from the driving portion.

在以上所述之發明中,用以進行真空貼合之真空處理室,可收納保持裝置的定位部之保持工件的部分,而不需由驅動部所收納,因此可達到小型化。 In the above-described invention, the vacuum processing chamber for vacuum bonding can accommodate the portion of the positioning portion of the holding device that holds the workpiece, and does not need to be housed by the driving portion, so that the size can be reduced.

其他型態的特徵為:係具有連通於真空源之通氣路徑;並且具有:將一方的工件真空吸附於前述定位部之吸附部;以及將前述通氣路徑切換至真空源側與真空處理室側之閥。 The other type is characterized in that it has a ventilation path connected to the vacuum source, and has: an adsorption portion that vacuum-adsorbs one workpiece to the positioning portion; and switches the ventilation path to the vacuum source side and the vacuum processing chamber side. valve.

在以上所述之發明中,將真空處理室減壓以形成真空時,藉由切換閥,可將用以真空吸附工件之通氣路徑構成與真空處理室為同壓力,所以可防止工件的偏離。 In the above-described invention, when the vacuum processing chamber is depressurized to form a vacuum, the ventilation path for vacuum-adsorbing the workpiece can be configured to be the same pressure as the vacuum processing chamber by switching the valve, so that the deviation of the workpiece can be prevented.

其他型態的特徵為:係具有:設置於前述真空處理室內之真空計;及記憶電壓值以及用以計算出對應於此之壓力的複數個多項近似式之記憶部;及根據記憶於前述記憶部之電壓值及多項近似式,選擇對應於來自前述真空計的 電壓值之多項近似式的式選擇部;以及根據所選擇之多項近似式來計算出壓力之壓力運算部。 The other type is characterized by: a vacuum gauge disposed in the vacuum processing chamber; and a memory voltage value and a memory portion for calculating a plurality of multiple approximations corresponding to the pressure; and storing the memory according to the foregoing The voltage value of the part and a plurality of approximations, the selection corresponding to the vacuum gauge from the foregoing a formula selection unit that approximates a plurality of approximations of voltage values; and a pressure calculation unit that calculates a pressure based on the selected plurality of approximation formulas.

其他型態是一種貼合裝置的控制方法,為藉由控制裝置來控制貼合裝置而貼合一對工件之貼合裝置的控制方法,該貼合裝置係具有:因應複數個作業位置而間歇地旋轉之旋轉台;及於前述旋轉台上設置有複數個,並保持構成顯示裝置之一對工件的保持裝置;及設置於前述保持裝置,並將一對工件的至少一方予以定位之定位部;及藉由彈壓前述保持裝置之一對工件的至少一方,來貼合一對工件之按壓裝置;及設置於前述按壓裝置,且能夠將前述定位部之保持工件的部分從前述驅動部獨立出而收納之真空處理室;以及設置於前述真空處理室內之真空計;其特徵為:前述控制裝置,係具有:記憶部、式選擇部、及壓力運算部;前述記憶部,記憶電壓值以及用以計算出對應於此之壓力的複數個多項近似式;前述式選擇部,根據記憶於前述記憶部之電壓值及多項近似式,選擇對應於來自前述真空計的電壓值之多項近似式;前述壓力運算部,根據所選擇之多項近似式來計算出壓力。 The other type is a control method of a bonding apparatus, and is a control method of a bonding apparatus for bonding a pair of workpieces by controlling a bonding apparatus by a control apparatus, the bonding apparatus having: intermittently responding to a plurality of working positions a rotating table that rotates on the ground; and a plurality of holding means for holding the one of the display devices on the rotating table; and a positioning portion provided on the holding device and positioning at least one of the pair of workpieces And a pressing device that bonds the pair of workpieces by at least one of the workpieces by one of the holding devices; and the pressing device is provided, and the portion of the positioning portion that holds the workpiece can be separated from the driving portion And a vacuum processing chamber stored therein; and a vacuum gauge installed in the vacuum processing chamber; wherein the control device includes: a memory unit, a formula selection unit, and a pressure calculation unit; and the memory unit, the memory voltage value and the Calculating a plurality of multiple approximations corresponding to the pressures; the equation selection unit is based on the voltage value stored in the memory portion and Item approximate expression, the number of voltage values corresponding to the gauge from the approximate expression; the pressure calculating unit, based on the selection of the polynomial approximate expression to calculate the pressure.

在以上所述之發明中,由於因應藉由真空計所檢測出之電壓值來選擇適當的多項近似式,所以可藉由較低階的近似函數來計算出高精度的壓力。此外,常常只需依據單純的一項函數來進行運算處理,所以可減輕處理負擔。 In the invention described above, since an appropriate multiple approximation formula is selected in response to the voltage value detected by the vacuum gauge, a high-precision pressure can be calculated by a lower-order approximation function. In addition, it is often only necessary to perform arithmetic processing based on a simple function, so that the processing load can be reduced.

其他型態的特徵為:在前述定位部及前述按壓部的至少一方之與工件的接觸面,設置有將多孔質薄片貼附於彈 性構件之保護構件。 In another aspect, the contact surface of at least one of the positioning portion and the pressing portion with the workpiece is provided with a porous sheet attached to the bomb. Protective member of a component.

在以上所述之發明中,係藉由將多孔質薄片貼附於彈性構件來構成保護構件,所以可吸收貼合時對工件之衝擊,並防止工件貼附於彈性構件。 In the invention described above, since the protective member is formed by attaching the porous sheet to the elastic member, it is possible to absorb the impact on the workpiece at the time of bonding and prevent the workpiece from being attached to the elastic member.

其他型態的特徵為:在前述旋轉台的至少1個作業位置,係裝卸自如地設置有將接著劑塗佈於至少一方的工件之塗佈裝置。 The other type is characterized in that a coating device that applies an adhesive to at least one of the workpieces is detachably provided at at least one working position of the turntable.

在以上所述之發明中,由於塗佈裝置裝卸自如地設置在旋轉台,所以可更換用以準備貼著材之其他種類的裝置,因此可對應於多種製品。 In the invention described above, since the coating device is detachably provided on the rotary table, other types of devices for preparing the attached material can be exchanged, and thus it is possible to correspond to a plurality of products.

如以上所說明般,根據本發明,可提供一種使用旋轉台能夠有效率地進行工件的定位與貼合,並且為便宜且小型之貼合裝置及其控制方法。 As described above, according to the present invention, it is possible to provide a bonding apparatus and a control method thereof which are capable of efficiently performing positioning and bonding of a workpiece using a rotary table, and which are inexpensive and small.

此外,根據本發明,可提供一種能夠實現安定的運轉,不會產生氣泡或雜質等的混入,並且能夠以高精度來進行貼合之貼合裝置及其控制方法。 Further, according to the present invention, it is possible to provide a bonding apparatus capable of achieving stable operation without mixing bubbles or impurities, and capable of bonding with high precision and a control method therefor.

接著參照圖面,具體地說明本發明之實施形態(以下稱為實施形態)。 Next, an embodiment (hereinafter referred to as an embodiment) of the present invention will be specifically described with reference to the drawings.

[A.構成] [A. Composition] [1.全體構成] [1. Overall composition]

首先說明本實施形態之貼合裝置(以下稱為本裝置)的全體構成。本裝置,如第1圖所示,係於旋轉台1上裝載有4台的保持裝置2。旋轉台1係藉由索引機構11,配合投入取出作業位置1A、貼著材準備作業位置1B、定位作業位置1C、真空貼合作業位置1D來間歇地旋轉而構成。 First, the overall configuration of the bonding apparatus (hereinafter referred to as the present apparatus) of the present embodiment will be described. As shown in Fig. 1, the apparatus is equipped with four holding devices 2 mounted on the rotary table 1. The turntable 1 is configured to be intermittently rotated by the indexing mechanism 11 in cooperation with the input and take-out work position 1A, the sticking material preparation work position 1B, the positioning work position 1C, and the vacuum sticking cooperative position 1D.

保持裝置2,如第2圖及第3圖所示,為將工件S1及工件S2上下相對向地保持之裝置。本實施形態中,工件S1、工件S2例如使用液晶模組及覆蓋面板般之長方形狀的基板。於工件S1、工件S2,係對應於虛擬的長方形或正方形之4個頂點來設置檢測用標記M1、M2。此保持裝置2,係具有將工件S1、工件S2的位置對位之定位部300等。 As shown in FIGS. 2 and 3, the holding device 2 is a device for holding the workpiece S1 and the workpiece S2 up and down. In the present embodiment, the workpiece S1 and the workpiece S2 are, for example, a liquid crystal module and a rectangular substrate such as a cover panel. The workpieces S1 and S2 are provided with detection marks M1 and M2 corresponding to four vertices of a virtual rectangle or a square. This holding device 2 has a positioning unit 300 that aligns the positions of the workpiece S1 and the workpiece S2, and the like.

於貼著材準備作業位置1B,係裝卸自如地設置有剝離裝置3或塗佈裝置。剝離裝置3,如第13圖~第19圖所示,為將預先貼著於工件S1之雙面膠帶T1的剝離紙(剝離薄片等,不論其材質)F剝離之裝置。塗佈裝置,雖然圖中未顯示,但為將接著劑塗佈於工件S1之裝置。塗佈裝置可使用一般所知的裝置。 At the sticking material preparation work position 1B, the peeling device 3 or the coating device is detachably provided. As shown in FIGS. 13 to 19, the peeling device 3 is a device for peeling off a release paper (a peeling sheet or the like regardless of the material) F of the double-sided tape T1 that has been attached to the workpiece S1 in advance. The coating device, although not shown in the drawings, is a device for applying an adhesive to the workpiece S1. As the coating device, a generally known device can be used.

於定位作業位置1C,如第20圖及第21圖所示,係設置有檢測出工件S1、工件S2的位置之檢測裝置4。根據藉由此檢測裝置4所檢測之值,來決定定位部300之工件S1相對於工件S2的定位量。 At the positioning work position 1C, as shown in Figs. 20 and 21, a detecting device 4 that detects the positions of the workpiece S1 and the workpiece S2 is provided. Based on the value detected by the detecting device 4, the amount of positioning of the workpiece S1 of the positioning portion 300 with respect to the workpiece S2 is determined.

於真空貼合作業位置1D,如第2圖、第23圖~第25 圖所示,係設置有按壓裝置5。此按壓裝置5,在真空處理室51內的減壓空間中,可藉由將工件S2往工件S1側按壓而將兩者貼合。 In the vacuum paste cooperation industry position 1D, as shown in Figure 2, Figure 23 ~ 25 As shown in the figure, a pressing device 5 is provided. The pressing device 5 can press the workpiece S2 toward the workpiece S1 side in the decompression space in the vacuum processing chamber 51 to bond the two.

[2.保持裝置] [2. Holding device]

接下來說明各部的詳細內容。首先,保持裝置2係具備保持部100、支柱部200、定位部300、驅動部400、鎖定部350、及吸附部500。 Next, the details of each part will be explained. First, the holding device 2 includes a holding portion 100, a pillar portion 200, a positioning portion 300, a driving portion 400, a locking portion 350, and an adsorption portion 500.

[2-1.保持部] [2-1. Holding Department]

保持部100,如第3圖所示,為保持工件S2之左右的邊緣之大致呈反ㄈ字狀的框。 As shown in FIG. 3, the holding portion 100 is a substantially sinuous frame that holds the left and right edges of the workpiece S2.

[2-2.支柱部] [2-2. Pillars]

支柱部200為往垂直方向舉起之2根的柱狀構件。藉由此支柱部200,以能夠升降地支撐保持部100。保持部100,於初期位置中位於與工件S1相間隔之上方,並將工件S2保持在水平方向上。然後於貼合時,藉由按壓裝置5使工件S2與保持部100一同往下方按壓而下降,來進行工件S1與工件S2之貼合。 The pillar portion 200 is a columnar member that is lifted in the vertical direction. The support portion 100 can be supported by the pillar portion 200 so as to be movable up and down. The holding portion 100 is located above the workpiece S1 in the initial position and holds the workpiece S2 in the horizontal direction. Then, at the time of bonding, the workpiece S2 is pressed downward by the pressing device 5 together with the holding portion 100, and the workpiece S1 and the workpiece S2 are bonded together.

[2-3.定位部] [2-3. Positioning Department]

定位部300,如第4圖所示,係具有由固定在旋轉台1之架台1a所支撐的載置部310、X軸部320、Y軸部330、θ軸部340等。 As shown in FIG. 4, the positioning unit 300 has a mounting portion 310, an X-axis portion 320, a Y-axis portion 330, a θ-axis portion 340, and the like supported by the gantry 1a fixed to the turntable 1.

[2-3-1.載置部] [2-3-1. Mounting Department]

載置部310係具有X-Y-θ平台311、軸部312、可動台313、伸縮囊314及滑輪315等。 The placing unit 310 includes an X-Y-θ stage 311, a shaft portion 312, a movable table 313, a bellows 314, a pulley 315, and the like.

X-Y-θ平台311為用以定位工件S1之水平的平台。此X-Y-θ平台311係設置為於水平面上可在直交之直線方向(X方向及Y方向)上移動,並且能夠以軸部312為中心而轉動(θ方向)。 The X-Y-θ platform 311 is a platform for positioning the level of the workpiece S1. The X-Y-θ stage 311 is provided to be movable in a straight line direction (X direction and Y direction) on a horizontal plane, and is rotatable (θ direction) around the shaft portion 312.

軸部312為垂直方向的柱狀構件。軸部312的上端係可轉動地連結於X-Y-θ平台311。軸部312的下端貫通旋轉台1而固定在可動台313。可動台313,如後述般,係能夠藉由X軸部320及Y軸部330在X軸方向及Y軸方向上移動地設置。 The shaft portion 312 is a columnar member in the vertical direction. The upper end of the shaft portion 312 is rotatably coupled to the X-Y-θ stage 311. The lower end of the shaft portion 312 passes through the turntable 1 and is fixed to the movable table 313. The movable table 313 can be provided to move in the X-axis direction and the Y-axis direction by the X-axis portion 320 and the Y-axis portion 330 as will be described later.

於可動台313與旋轉台1之間,安裝有覆蓋軸部312之伸縮囊314。伸縮囊314的安裝端係確保氣密性。此外,由於伸縮囊314具有可撓性,所以可因應可動台313的移動,在保持氣密之狀態下柔軟地移位。滑輪315係固定在X-Y-θ平台311。於此滑輪315,張掛有後述的正時皮帶343。 A bellows 314 covering the shaft portion 312 is attached between the movable table 313 and the turntable 1. The mounting end of the bellows 314 ensures airtightness. Further, since the bellows 314 is flexible, it can be flexibly displaced in a state of being kept airtight in response to the movement of the movable table 313. The pulley 315 is fixed to the X-Y-θ stage 311. On the pulley 315, a timing belt 343 to be described later is attached.

[2-3-2. X軸部] [2-3-2. X-axis section]

X軸部320係具有旋轉軸321、偏心輥322及電樞323等。旋轉軸321為可藉由驅動部400進行旋轉之垂直方向的構件。偏心輥322安裝於旋轉軸321的上端。此偏心輥322,如第5圖所示,係插入在形成於可動台313之Y方向的槽313a。 The X-axis portion 320 has a rotating shaft 321 , an eccentric roller 322 , an armature 323 , and the like. The rotating shaft 321 is a member that can be rotated in the vertical direction by the driving portion 400. The eccentric roller 322 is attached to the upper end of the rotating shaft 321 . As shown in Fig. 5, the eccentric roller 322 is inserted into a groove 313a formed in the Y direction of the movable table 313.

因此,偏心輥322,藉由隨著旋轉軸321的旋轉來彈壓槽313a的內壁,可使可動台313在X方向上移動。此時,軸部312及X-Y-θ平台311與可動台313一同在X 方向上移動。 Therefore, the eccentric roller 322 can move the movable table 313 in the X direction by pressing the inner wall of the groove 313a in accordance with the rotation of the rotating shaft 321. At this time, the shaft portion 312 and the X-Y-θ stage 311 are together with the movable table 313 at X. Move in the direction.

電樞323安裝於旋轉軸321的下端。此電樞323係可裝卸地設置在後述的離合器420。藉由使電樞323連接於離合器420,可依據驅動部400來驅動旋轉軸321。 The armature 323 is attached to the lower end of the rotating shaft 321. The armature 323 is detachably provided to a clutch 420 which will be described later. By connecting the armature 323 to the clutch 420, the rotating shaft 321 can be driven in accordance with the driving portion 400.

[2-3-3. Y軸部] [2-3-3. Y-axis section]

Y軸部330係具有旋轉軸331、偏心輥332及電樞333等。旋轉軸331為可藉由驅動部400進行旋轉之垂直方向的構件。偏心輥332安裝於旋轉軸331的上端。此偏心輥332,如第5圖所示,係插入在形成於可動台313之X方向的槽313b。 The Y-axis portion 330 has a rotating shaft 331, an eccentric roller 332, an armature 333, and the like. The rotating shaft 331 is a member that can be rotated in the vertical direction by the driving portion 400. The eccentric roller 332 is attached to the upper end of the rotating shaft 331. As shown in Fig. 5, the eccentric roller 332 is inserted into a groove 313b formed in the X direction of the movable table 313.

因此,偏心輥332,藉由隨著旋轉軸331的旋轉來彈壓槽313b的內壁,可使可動台313在Y方向上移動。此時,軸部312及X-Y-θ平台311與可動台313一同在Y方向上移動。 Therefore, the eccentric roller 332 can move the movable table 313 in the Y direction by pressing the inner wall of the groove 313b in accordance with the rotation of the rotating shaft 331. At this time, the shaft portion 312 and the X-Y-θ stage 311 move together with the movable table 313 in the Y direction.

電樞333安裝於旋轉軸331的下端。此電樞333係可裝卸地設置在後述的離合器430。藉由使電樞333連接於離合器430,可依據驅動部400來驅動旋轉軸331。 The armature 333 is attached to the lower end of the rotating shaft 331. The armature 333 is detachably provided to a clutch 430 which will be described later. By connecting the armature 333 to the clutch 430, the rotating shaft 331 can be driven in accordance with the driving portion 400.

[2-3-4. θ軸部] [2-3-4. θ axis part]

θ軸部340係具有上旋轉軸341、滑輪342、正時皮帶343、伸縮囊聯結器344、下旋轉軸345及電樞346等。上旋轉軸341為垂直方向的構件,於其上端固定有滑輪342。於滑輪342張掛有正時皮帶343。藉此,如第6圖所示,當上旋轉軸341轉動時,由於該轉動經由正時皮帶343被傳達至滑輪315,所以使X-Y-θ平台311轉動。 The θ-axis portion 340 includes an upper rotating shaft 341, a pulley 342, a timing belt 343, a bellows coupling 344, a lower rotating shaft 345, an armature 346, and the like. The upper rotating shaft 341 is a member in the vertical direction, and a pulley 342 is fixed to the upper end thereof. A timing belt 343 is hung on the pulley 342. Thereby, as shown in Fig. 6, when the upper rotary shaft 341 is rotated, since the rotation is transmitted to the pulley 315 via the timing belt 343, the X-Y-θ stage 311 is rotated.

上旋轉軸341的下端連結於伸縮囊聯結器344的上端。此伸縮囊聯結器344,為藉由可吸收X方向及Y方向的偏移之可撓性的伸縮囊所構成之連結構件。於伸縮囊聯結器344的下端,連結有下旋轉軸345。下旋轉軸345為垂直方向的構件,該旋轉係經由伸縮囊聯結器344被傳達至上旋轉軸341。 The lower end of the upper rotating shaft 341 is coupled to the upper end of the bellows coupling 344. The bellows coupling 344 is a connecting member formed of a flexible bellows that can absorb the offset in the X direction and the Y direction. A lower rotating shaft 345 is coupled to the lower end of the bellows coupling 344. The lower rotating shaft 345 is a member in the vertical direction, and the rotation is transmitted to the upper rotating shaft 341 via the bellows coupling 344.

電樞346安裝於下旋轉軸345的下端。此電樞346係可裝卸地設置在後述的離合器440。藉由使電樞346連接於離合器440,可依據驅動部400來驅動下旋轉軸345、上旋轉軸341。 The armature 346 is attached to the lower end of the lower rotating shaft 345. The armature 346 is detachably provided to a clutch 440 which will be described later. By connecting the armature 346 to the clutch 440, the lower rotating shaft 345 and the upper rotating shaft 341 can be driven in accordance with the driving unit 400.

[2-4.驅動部] [2-4. Drive Department]

驅動部400係具有固定平台410、離合器420、430、440、馬達450、460、470等。固定平台410為固定在旋轉台1的下部之平台。於此固定平台410之對應於X軸部320、Y軸部330、θ軸部340的位置上,固定有離合器420、430、440。此外,於離合器420、430、440,分別連接有傳達旋轉之馬達450、460、470。 The drive unit 400 has a fixed platform 410, clutches 420, 430, 440, motors 450, 460, 470, and the like. The fixed platform 410 is a platform fixed to the lower portion of the rotary table 1. The clutches 420, 430, and 440 are fixed to the fixed platform 410 at positions corresponding to the X-axis portion 320, the Y-axis portion 330, and the θ-axis portion 340. Further, motors 460, 460, and 470 that transmit rotation are connected to the clutches 420, 430, and 440, respectively.

離合器420、430、440,當對線圈421、431、441進行通電時,係藉由在轉子422、432、442與電樞323、333、346之間所產生的磁通量將電樞323、333、346吸附。藉此,可使馬達450、460、470的驅動力傳達至X軸部320、Y軸部330、θ軸部340。 The clutches 420, 430, 440, when energizing the coils 421, 431, 441, armatures 323, 333, by magnetic flux generated between the rotors 422, 432, 442 and the armatures 323, 333, 346, 346 adsorption. Thereby, the driving force of the motors 450, 460, and 470 can be transmitted to the X-axis portion 320, the Y-axis portion 330, and the θ-axis portion 340.

[2-5.鎖定部] [2-5. Locking Department]

鎖定部350,如第4圖、第7圖~第9圖所示,係具有 制動器板351、制動器352、升降軸353、彈簧354、被按壓部355、壓缸356等。制動器板351為固定在可動台313之例如為彈簧鋼板。制動器352,為藉由在與架台1a的一部分之間夾持制動器板351並予以壓著而將可動台313鎖定之構件。於制動器352與制動器板351之接觸面,例如形成有橡膠內襯等之止滑構件。 The locking portion 350, as shown in FIG. 4 and FIG. 7 to FIG. The brake plate 351, the brake 352, the lift shaft 353, the spring 354, the pressed portion 355, the pressure cylinder 356, and the like. The brake plate 351 is, for example, a spring steel plate fixed to the movable table 313. The brake 352 is a member that locks the movable table 313 by pressing and pressing the brake plate 351 between a portion of the gantry 1a. A slip preventing member such as a rubber lining is formed on the contact surface of the brake 352 and the brake plate 351, for example.

升降軸353係設置為可貫通架台1a並進行升降。於升降軸353的上端,安裝有制動器板351。彈簧354為將升降軸353往下方彈壓之彈簧等的彈壓構件。被按壓部355係安裝於升降軸353的下端。壓缸356被固定在固定平台410,為藉由將來到其上部之被按壓部355予以彈壓而解除鎖定之手段。圖示的鎖定部350為對應於X軸部320者,其他雖然圖中未顯示,但亦對應於Y軸部330、θ軸部340而設置有同樣構造的鎖定部。 The lifting shaft 353 is provided so as to be movable up and down through the gantry 1a. A brake plate 351 is attached to the upper end of the lift shaft 353. The spring 354 is a spring member such as a spring that biases the lift shaft 353 downward. The pressed portion 355 is attached to the lower end of the lifting shaft 353. The pressure cylinder 356 is fixed to the fixed platform 410, and is a means for releasing the lock by pressing the pressed portion 355 which comes to the upper portion thereof. The lock portion 350 shown in the figure corresponds to the X-axis portion 320. Others, although not shown in the drawings, are also provided with lock portions having the same structure corresponding to the Y-axis portion 330 and the θ-axis portion 340.

[2-6.吸附部] [2-6. Adsorption section]

吸附部500,如第10圖及第11圖所示,係具有吸附平板510、三向閥520、吸附泵浦530(參照第26圖)等。吸附平板510係固定在X-Y-θ平台311上。於吸附平板510上,安裝有將聚胺基甲酸酯多孔質薄膜製的薄片貼附於橡膠等彈性構件的表面之保護構件511。於吸附平板510及保護構件511,形成有圖中未顯示的吸附孔。此吸附孔係經由形成於吸附平板510內之通氣路徑,而連接於配管512的一端。 As shown in FIGS. 10 and 11 , the adsorption unit 500 includes an adsorption plate 510 , a three-way valve 520 , an adsorption pump 530 (see FIG. 26 ), and the like. The adsorption plate 510 is fixed to the X-Y-θ stage 311. A protective member 511 for attaching a sheet made of a porous polyurethane film to the surface of an elastic member such as rubber is attached to the adsorption flat plate 510. Adsorption holes (not shown) are formed on the adsorption plate 510 and the protective member 511. The adsorption hole is connected to one end of the pipe 512 via a vent path formed in the adsorption plate 510.

三向閥520係固定在旋轉台1。此三向閥520係具有 內管部521、上側閥522、下側閥523、連桿524及被按壓部525等。內管部521為在垂直方向上所連續之管。此內管部521貫通旋轉台1往其上面側及下面側突出。 The three-way valve 520 is fixed to the rotary table 1. The three-way valve 520 has The inner tube portion 521, the upper side valve 522, the lower side valve 523, the link 524, the pressed portion 525, and the like. The inner tube portion 521 is a tube that is continuous in the vertical direction. The inner tube portion 521 protrudes through the turntable 1 toward the upper surface side and the lower surface side thereof.

在往旋轉台1的上面側突出之內管部521,連接有上述配管512的另一端。藉此使X-Y-θ平台311的吸附孔與內管部521經由通氣路徑連通。在往旋轉台1的下面側突出之內管部521的側面,連接有配管526的一端。此配管526的另一端連接於真空源的吸附泵浦530。係以即使旋轉台1旋轉,亦可確保吸附泵浦530與配管526的連通之方式,使吸附泵浦530與配管526之間經由圖中未顯示的迴轉接頭來連接。 The other end of the pipe 512 is connected to the inner pipe portion 521 that protrudes toward the upper surface side of the turntable 1. Thereby, the adsorption hole of the X-Y-θ stage 311 and the inner tube portion 521 are communicated via the ventilation path. One end of the pipe 526 is connected to the side surface of the inner pipe portion 521 that protrudes toward the lower surface side of the turntable 1. The other end of this pipe 526 is connected to the adsorption pump 530 of the vacuum source. The adsorption pump 530 and the pipe 526 are connected to each other via a swivel joint (not shown) so that the flow between the adsorption pump 530 and the pipe 526 can be ensured even if the rotary table 1 rotates.

上側閥522為藉由升降將內管部521的上端予以開閉之閥。下側閥523為藉由在內管部521內升降,將與吸附泵浦530之連通予以開閉之閥。連桿524係可在內管部521內升降地設置。此連桿524連結上側閥522及下側閥523。被按壓部525被設置於連桿524的下端。此被按壓部525,係藉由以壓缸等所構成之按壓部527往上方被彈壓。按壓部527被固定在固定平台410。 The upper side valve 522 is a valve that opens and closes the upper end of the inner tube portion 521 by lifting. The lower valve 523 is a valve that is opened and closed by communicating with the adsorption pump 530 by moving up and down in the inner tube portion 521. The link 524 is provided to be movable up and down in the inner tube portion 521. This link 524 connects the upper side valve 522 and the lower side valve 523. The pressed portion 525 is provided at the lower end of the link 524. The pressed portion 525 is biased upward by a pressing portion 527 formed of a pressure cylinder or the like. The pressing portion 527 is fixed to the fixed platform 410.

此般三向閥520,在工件S1的吸附時,如第12圖(A)所示,係將連通吸附孔與吸附泵浦530之管線連接(參照黑色箭頭線)。然後如第12圖(B)所示,當藉由按壓部527將下端的被按壓部525往上舉時,上側閥522開啟且下側閥523關閉,所以吸附孔與周圍成為同氣壓,並且與吸附泵浦530之連通被關閉而構成(參照黑色箭頭線 )。 The three-way valve 520 is connected to the line of the adsorption pump 530 (refer to the black arrow line) as shown in Fig. 12(A) when the workpiece S1 is adsorbed. Then, as shown in FIG. 12(B), when the pressed portion 525 of the lower end is lifted up by the pressing portion 527, the upper side valve 522 is opened and the lower side valve 523 is closed, so that the adsorption hole becomes the same air pressure as the surroundings, and The communication with the adsorption pump 530 is closed to form (refer to the black arrow line) ).

[3.剝離裝置] [3. Stripping device]

剝離裝置3,為將貼附於工件S1或工件S2之雙面膠帶T1的剝離紙F,貼附於黏著膠帶T2並剝離之裝置。此剝離裝置3,如第13圖~第15圖所示,係具有供給部31、轉換部32、剝離部33及捲取部34等。 The peeling device 3 is a device in which the release paper F attached to the double-sided tape T1 of the workpiece S1 or the workpiece S2 is attached to the adhesive tape T2 and peeled off. As shown in FIGS. 13 to 15 , the peeling device 3 includes a supply unit 31 , a conversion unit 32 , a peeling unit 33 , a winding unit 34 , and the like.

供給部31,係具有送出捲軸31a及捲軸旋轉機構31b(參照第26圖)。送出捲軸31a為將供給的黏著膠帶T2捲繞之捲軸。捲軸旋轉機構31b為控制圖中未顯示之送出捲軸31a的制動之機構。轉換部32,如第14圖所示,係將來自供給部31之黏著膠帶T2的行進方向轉換成直角之銷或輥。 The supply unit 31 has a delivery reel 31a and a reel rotation mechanism 31b (see Fig. 26). The delivery reel 31a is a reel that winds the supplied adhesive tape T2. The reel rotating mechanism 31b is a mechanism that controls the braking of the delivery reel 31a (not shown). As shown in Fig. 14, the converting portion 32 converts the traveling direction of the adhesive tape T2 from the supply portion 31 into a pin or roller having a right angle.

剝離部33係具有剝離頭33a、壓缸33b、導引輥33c~33e等。剝離頭33a將從供給部31所供給的黏著膠帶T2,從該貼著面的內面進行按壓,藉此來壓抵至工件S1上的剝離紙F。剝離頭33a,係以從工件S1的一端開始進行黏著膠帶T2的壓著之方式,形成有傾斜。壓缸33b為使剝離頭33a往前方方向(圖中為左方向)移動之機構,在此動作時,可解除送出捲軸31a的制動而將黏著膠帶T2拉出。導引輥33c~33e,為將黏著膠帶T2的移動從轉換部32導引至剝離頭33a,以及從剝離頭33a導引至捲取部34之輥(導引構件)。 The peeling portion 33 has a peeling head 33a, a pressure cylinder 33b, guide rollers 33c to 33e, and the like. The peeling head 33a presses the adhesive tape T2 supplied from the supply unit 31 from the inner surface of the adhering surface, thereby pressing against the release paper F on the workpiece S1. The peeling head 33a is formed to have an inclination so as to press the adhesive tape T2 from one end of the workpiece S1. The pressure cylinder 33b is a mechanism that moves the peeling head 33a in the forward direction (the left direction in the drawing). During this operation, the brake of the delivery spool 31a can be released and the adhesive tape T2 can be pulled out. The guide rollers 33c to 33e are rollers (guide members) that guide the movement of the adhesive tape T2 from the conversion portion 32 to the peeling head 33a and from the peeling head 33a to the winding portion 34.

捲取部34,係具有捲取捲軸34a、捲軸升降機構34b、捲軸旋轉機構34c(參照第26圖)等。捲取捲軸34a為 從剝離頭33a捲取黏著膠帶T2之捲軸。捲取捲軸34a的軸,係設置為在與供給部31的軸直交之方向上。捲軸升降機構34b,為例如藉由傳送螺絲的旋轉等而使捲取捲軸34a升降之機構。捲軸旋轉機構34c具有圖中未顯示的驅動源等,為控制捲取捲軸34a的旋轉及制動之機構。 The winding unit 34 has a take-up reel 34a, a reel elevating mechanism 34b, a reel rotating mechanism 34c (see Fig. 26), and the like. The take-up reel 34a is The reel of the adhesive tape T2 is taken up from the peeling head 33a. The shaft of the take-up reel 34a is disposed in a direction orthogonal to the axis of the supply portion 31. The reel lifting mechanism 34b is a mechanism that elevates and lowers the take-up reel 34a by, for example, rotation of a conveying screw. The reel rotating mechanism 34c has a driving source or the like not shown, and is a mechanism for controlling the rotation and braking of the take-up reel 34a.

上述剝離裝置3,係裝著有用以從下側的工件S1將剝離紙F剝離之第1單元U1。此剝離裝置3中,第1單元U1,如第16圖所示,係設置為可與用以從上側的工件S2將剝離紙F剝離之第2單元U2進行更換。 The peeling device 3 is provided with a first unit U1 for peeling the release paper F from the lower workpiece S1. In the peeling device 3, as shown in Fig. 16, the first unit U1 is provided so as to be replaceable with the second unit U2 for peeling off the release paper F from the upper workpiece S2.

第1單元U1,如第13圖及第17圖所示,係以使來自轉換部32的黏著膠帶T2從剝離頭33a的下側被供給,並通過上側被引導至捲取捲軸34a之方式來設置導引輥33c~33e。第1單元U1的導引輥33e,係將通過剝離頭33a之黏著膠帶T2的行進方向轉變為下方。 As shown in FIGS. 13 and 17, the first unit U1 is such that the adhesive tape T2 from the conversion unit 32 is supplied from the lower side of the peeling head 33a and guided to the take-up reel 34a by the upper side. Guide rollers 33c to 33e are provided. The guide roller 33e of the first unit U1 converts the traveling direction of the adhesive tape T2 passing through the peeling head 33a downward.

另一方面,第2單元U2,如第16圖及第18圖所示,係以使來自轉換部32的黏著膠帶T2從剝離頭33a的上側被供給,並通過下側被引導至捲取捲軸34a之方式來設置導引輥33f、33g。第2單元U2的導引輥33g,係將通過剝離頭33a之黏著膠帶T2的行進方向轉變為下方。 On the other hand, as shown in FIGS. 16 and 18, the second unit U2 is such that the adhesive tape T2 from the conversion unit 32 is supplied from the upper side of the peeling head 33a, and is guided to the take-up reel by the lower side. Guide rollers 33f, 33g are provided in the manner of 34a. The guide roller 33g of the second unit U2 converts the traveling direction of the adhesive tape T2 passing through the peeling head 33a downward.

再者,第1單元U1及第2單元U2,以可藉由壓缸35進行升降地設置。第1單元U1,於下降時可將剝離頭33a的黏著膠帶T2壓抵於工件S1的剝離紙F。第2單元U2,於上升時可將剝離頭33a的黏著膠帶T2壓抵於工件S2的剝離紙F。 Further, the first unit U1 and the second unit U2 are provided to be vertically movable by the pressure cylinder 35. The first unit U1 can press the adhesive tape T2 of the peeling head 33a against the release paper F of the workpiece S1 when descending. The second unit U2 can press the adhesive tape T2 of the peeling head 33a against the release paper F of the workpiece S2 when rising.

依據該剝離裝置3之剝離,係以下列方式進行。亦即,如第17圖(A)、第18圖(A)所示,係藉由壓缸33b使剝離頭33a往前方移動,並從送出捲軸31a將黏著膠帶T2拉出,藉由壓缸35使第1單元U1下降或使第2單元U2上升,藉此將黏著膠帶T2壓抵於剝離紙F,在捲軸旋轉機構31b、34c對送出捲軸31a及捲取捲軸34a的旋轉施以制動之狀態下,藉由捲軸升降機構34b使捲取捲軸34a下降。 The peeling according to the peeling device 3 was carried out in the following manner. That is, as shown in Figs. 17(A) and 18(A), the peeling head 33a is moved forward by the pressure cylinder 33b, and the adhesive tape T2 is pulled out from the delivery reel 31a by pressing The cylinder 35 lowers the first unit U1 or raises the second unit U2, thereby pressing the adhesive tape T2 against the release paper F, and applies a brake to the rotation of the delivery reel 31a and the take-up reel 34a by the reel rotating mechanisms 31b and 34c. In this state, the take-up reel 34a is lowered by the reel lifting mechanism 34b.

如此,如第17圖(B)、第18圖(B)所示,黏著膠帶T2被拉往下方,並且剝離頭33a一邊將黏著膠帶T2壓抵於剝離紙F一邊後退。藉此,剝離紙F被貼附於黏著膠帶T2,並從工件S1或工件S2剝離。 As described above, as shown in FIGS. 17(B) and 18(B), the adhesive tape T2 is pulled downward, and the peeling head 33a is retracted while pressing the adhesive tape T2 against the release paper F. Thereby, the release paper F is attached to the adhesive tape T2, and is peeled off from the workpiece S1 or the workpiece S2.

[4.檢測裝置] [4. Detection device]

檢測裝置4,如第20圖及第21圖所示,係具有2台CCD攝像機41、42、支撐此等之臂45、46、以及攝像機驅動機構49等。配置於上方之CCD攝像機41,為透鏡面朝向下方,並將上方之工件S2之角隅或標記M2攝像之攝像機(第1攝像機)。配置於下方之CCD攝像機42,為透鏡面朝向下方,並將下方之工件S1之角隅或標記M1攝像之攝像機(第2攝像機)。 As shown in Figs. 20 and 21, the detecting device 4 has two CCD cameras 41 and 42, arms 45 and 46 for supporting the cameras, a camera driving mechanism 49, and the like. The CCD camera 41 disposed above is a camera (first camera) in which the lens surface faces downward and the upper workpiece S2 is angled or marked with M2. The CCD camera 42 disposed below is a camera (second camera) in which the lens surface faces downward and the lower surface of the workpiece S1 or the mark M1 is imaged.

攝像機驅動機構49係具有圖中未顯示的驅動源等,為驅動臂45、46之機構。(例如X-Y軸驅動機構)。臂45係設置為可藉由攝像機驅動機構49往水平方向(前後左右方向)移動,並藉此使CCD攝像機41可進出工件S2 的上方。同樣的,臂46亦設置為可藉由攝像機驅動機構49往水平方向(前後左右方向)移動,並藉此使CCD攝像機42可進出工件S1的上方。 The camera drive mechanism 49 has a drive source or the like (not shown) and is a mechanism for driving the arms 45 and 46. (for example, X-Y axis drive mechanism). The arm 45 is arranged to be movable in the horizontal direction (front, rear, left and right directions) by the camera driving mechanism 49, and thereby the CCD camera 41 can enter and exit the workpiece S2. Above. Similarly, the arm 46 is also arranged to be movable in the horizontal direction (front, rear, left and right directions) by the camera drive mechanism 49, and thereby the CCD camera 42 can be moved in and out of the workpiece S1.

各CCD攝像機41、42,為藉由檢測出內藏之光源(同軸照射照明)的反射光,來進行檢測對象的攝像之攝像機。各CCD攝像機41、42的攝像,如後述般,係藉由攝像控制部662所控制。此外,於下部的CCD攝像機42上面,設置有用以將來自上部的CCD攝像機41之光線反射之反射面42a。此反射面42a例如可由鋁膠帶等之簡易構件所構成。 Each of the CCD cameras 41 and 42 is a camera that detects an object to be detected by detecting reflected light from a built-in light source (coaxial illumination). The imaging of each of the CCD cameras 41 and 42 is controlled by the imaging control unit 662 as will be described later. Further, on the lower CCD camera 42, a reflecting surface 42a for reflecting the light from the upper CCD camera 41 is provided. This reflecting surface 42a can be constituted by a simple member such as an aluminum tape.

[5.按壓裝置] [5. Pressing device]

按壓裝置5,如第2圖、第23圖~第25圖所示,係具有真空處理室51、加壓頭52、升降機構53及壓缸54等。真空處理室51為覆蓋旋轉台1上的保持裝置2並予以密閉之處理室。加壓頭52係設置於真空處理室51內,為將工件S2往下方加壓之手段。 As shown in FIG. 2 and FIG. 23 to FIG. 25, the pressing device 5 includes a vacuum processing chamber 51, a pressurizing head 52, a lifting mechanism 53, a pressure cylinder 54, and the like. The vacuum processing chamber 51 is a processing chamber that covers the holding device 2 on the turntable 1 and is sealed. The pressurizing head 52 is provided in the vacuum processing chamber 51 and is a means for pressurizing the workpiece S2 downward.

升降機構53係藉由圖中未顯示的驅動源等,使真空處理室51與加壓頭52一同升降之機構。壓缸54為藉由進退的驅動連桿使加壓頭52升降之機構。此外,於加壓頭52,安裝有將聚胺基甲酸酯多孔質薄膜製的薄片貼附於橡膠的表面之保護構件52a。 The elevating mechanism 53 is a mechanism that elevates and lowers the vacuum processing chamber 51 together with the pressurizing head 52 by a driving source or the like not shown. The pressure cylinder 54 is a mechanism for moving the pressure head 52 up and down by the drive link that advances and retracts. Further, a protective member 52a for attaching a sheet made of a porous polyurethane film to the surface of the rubber is attached to the pressurizing head 52.

再者,於真空處理室51,係經由配管連接有真空源的減壓泵浦55,且設置有用以檢測出內部壓力之真空計56(參照第26圖)。 Further, in the vacuum processing chamber 51, a vacuum pump 55 of a vacuum source is connected via a pipe, and a vacuum gauge 56 for detecting the internal pressure is provided (see Fig. 26).

[6.控制裝置] [6. Control device]

旋轉台1、保持裝置2、剝離裝置3、檢測裝置4、按壓裝置5等之構成要素,係藉由第26圖所示之控制裝置6來使各個驅動源、開關、電源等動作而進行控制。此控制裝置6,例如可藉由以專用的電子電路或特定程式動作之電腦等,來實現下列各功能而構成。 The components of the turntable 1, the holding device 2, the peeling device 3, the detecting device 4, and the pressing device 5 are controlled by the control device 6 shown in Fig. 26 by operating the respective driving source, switch, power source, and the like. . The control device 6 can be realized by, for example, a computer operating in a dedicated electronic circuit or a specific program.

以下參照虛擬的功能方塊圖之第26圖,來說明此控制裝置6。對於作業人員用來操作控制裝置6之開關、觸控面板、鍵盤、滑鼠等之輸入裝置,以及用來確認控制裝置6的狀態之顯示器、燈、儀表等輸出裝置,係省略其說明。 This control device 6 will be described below with reference to Fig. 26 of the virtual functional block diagram. The input device for operating the switch, the touch panel, the keyboard, the mouse, and the like of the control device 6, and the output device such as a display, a lamp, and a meter for confirming the state of the control device 6 are omitted.

亦即,控制裝置6係具有平台控制部610、記憶部620、時序控制部630、輸出入界面640、剝離控制部650、位置檢測部660、定位控制部670、真空控制部680等之功能。 That is, the control device 6 has functions of the platform control unit 610, the storage unit 620, the sequence control unit 630, the input/output interface 640, the peeling control unit 650, the position detecting unit 660, the positioning control unit 670, and the vacuum control unit 680.

[6-1.平台控制部] [6-1. Platform Control Department]

平台控制部610,為控制索引機構11的間歇旋轉動作之手段。 The platform control unit 610 is a means for controlling the intermittent rotation operation of the indexing unit 11.

[6-2.記憶部] [6-2. Memory Department]

記憶部620,為記憶動作時序、運算式、運算結果等的各種設定或數據等之手段。 The memory unit 620 is a means for storing various settings, data, and the like of the operation timing, the calculation formula, and the calculation result.

[6-3.時序控制部] [6-3. Timing Control Department]

時序控制部630,為在預先設定的時序中控制各部的動作時序之手段。 The sequence control unit 630 is a means for controlling the operation timing of each unit at a predetermined timing.

[6-4.輸出入界面] [6-4. Input and output interface]

輸出入界面640,為在與成為控制對象的各部之間控制訊號的轉換或輸出入之手段。 The input/output interface 640 is a means for controlling the conversion or output of signals between the units to be controlled.

[6-5.剝離控制部] [6-5. Stripping Control Department]

剝離控制部650,為控制剝離裝置3的動作之手段。此剝離控制部650係具有頭控制部651、旋轉控制部652、升降控制部653等。 The peeling control unit 650 is a means for controlling the operation of the peeling device 3. The peeling control unit 650 includes a head control unit 651, a rotation control unit 652, a lift control unit 653, and the like.

頭控制部651為控制用以驅動剝離頭33a之壓缸33b,以及用以驅動第1單元U1或第2單元U2之壓缸35之手段。旋轉控制部652為控制供給部31的捲軸旋轉機構31b,以及捲取部34的捲軸旋轉機構34c之手段。升降控制部653為控制捲軸升降機構34b之手段。 The head control unit 651 is a means for controlling the pressure cylinder 33b for driving the peeling head 33a and the pressure cylinder 35 for driving the first unit U1 or the second unit U2. The rotation control unit 652 is a means for controlling the reel rotation mechanism 31b of the supply unit 31 and the reel rotation mechanism 34c of the winding unit 34. The elevation control unit 653 is a means for controlling the reel lifting mechanism 34b.

[6-6.位置檢測部] [6-6. Position Detection Department]

位置檢測部660為控制檢測裝置4之手段。此位置檢測部660係具有攝像機驅動部661、攝像控制部662、三點抽出部663、重心計算部664、斜率計算部665等。攝像機驅動部661,為控制使臂45~48移動之攝像機驅動機構49之手段。攝像控制部662,為控制依據CCD攝像機41~44所進行的攝像之手段。 The position detecting unit 660 is a means for controlling the detecting device 4. The position detecting unit 660 includes a camera driving unit 661, an imaging control unit 662, a three-point extracting unit 663, a centroid calculating unit 664, a slope calculating unit 665, and the like. The camera drive unit 661 is a means for controlling the camera drive mechanism 49 that moves the arms 45 to 48. The imaging control unit 662 is a means for controlling imaging by the CCD cameras 41 to 44.

三點抽出部663為從藉由CCD攝像機41、42所攝像之畫像中,抽出工件S1、S2之角隅或標記M1、M2的3點之手段。重心計算部664,為從三點抽出部663所抽出之點來計算出重心之手段。斜率計算部665,為從三點抽出部663所抽出之點來計算出斜率之手段。 The three-point extracting unit 663 is a means for extracting the corners of the workpieces S1 and S2 or the three points of the marks M1 and M2 from the images captured by the CCD cameras 41 and 42. The center of gravity calculation unit 664 is a means for calculating the center of gravity from the point extracted by the three-point extraction unit 663. The slope calculating unit 665 is a means for calculating the slope from the point extracted by the three-point extracting unit 663.

[6-7.定位控制部] [6-7. Positioning Control Department]

定位控制部670為控制定位部300之手段。此定位控制部670係具有離合器控制部671、定位運算部672、馬達控制部673等。離合器控制部671,為藉由控制對線圈421、431、441之通電,來進行電樞323、333、346與離合器420、430、440之裝卸。離合器控制部671亦可藉由與對線圈421、431、441之通電同步地使壓缸356動作,而依據鎖定部350來進行鎖定。定位運算部672,為根據重心計算部664及斜率計算部665所計算出之工件S1、S2的重心及斜率,來計算出X-Y-θ平台311的移動量之手段。 The positioning control unit 670 is a means for controlling the positioning unit 300. The positioning control unit 670 includes a clutch control unit 671, a positioning calculation unit 672, a motor control unit 673, and the like. The clutch control unit 671 performs attachment and detachment of the armatures 323, 333, and 346 and the clutches 420, 430, and 440 by controlling energization of the coils 421, 431, and 441. The clutch control unit 671 can also operate the cylinder 356 in synchronization with the energization of the coils 421, 431, and 441, and can be locked in accordance with the lock portion 350. The positioning calculation unit 672 is a means for calculating the amount of movement of the X-Y-θ stage 311 based on the center of gravity and the slope of the workpieces S1 and S2 calculated by the center of gravity calculation unit 664 and the slope calculation unit 665.

[6-8.真空控制部] [6-8. Vacuum Control Department]

真空控制部680為控制吸附部500及按壓裝置5之手段。此真空控制部680係具有處理室控制部681、減壓控制部682、真空運算部683、閥控制部684、按壓控制部685及吸附控制部686等。處理室控制部681,為控制使真空處理室51升降之升降機構53之手段。 The vacuum control unit 680 is a means for controlling the adsorption unit 500 and the pressing unit 5. The vacuum control unit 680 includes a processing chamber control unit 681, a pressure reduction control unit 682, a vacuum calculation unit 683, a valve control unit 684, a pressing control unit 685, an adsorption control unit 686, and the like. The processing chamber control unit 681 is a means for controlling the elevating mechanism 53 that elevates and lowers the vacuum processing chamber 51.

減壓控制部682,為控制對真空處理室51內進行減壓之減壓泵浦55之手段。真空運算部683,為根據真空計的檢測值,來運算真空處理室51內的壓力之手段。 The pressure reduction control unit 682 is a means for controlling the pressure reduction pump 55 for decompressing the inside of the vacuum processing chamber 51. The vacuum calculation unit 683 is a means for calculating the pressure in the vacuum processing chamber 51 based on the detected value of the vacuum gauge.

真空運算部683,如第27圖所示,係具有電壓判定部683a、式選擇部683b、壓力運算部683c等。電壓判定部683a,為判定來自真空計56的類比輸出(電壓值)是否位於記憶部620中所設定的電壓範圍內之手段。式選擇部 683b,為根據記憶部620中所設定的電壓範圍與對應於此之多項近似式,來選擇出因應電壓判定部683a所判定的電壓範圍之多項近似式之手段。壓力運算部683c,為根據判定後的電壓值與所選擇的多項近似式,來運算壓力值之手段。 As shown in Fig. 27, the vacuum calculation unit 683 includes a voltage determination unit 683a, a formula selection unit 683b, a pressure calculation unit 683c, and the like. The voltage determination unit 683a is a means for determining whether or not the analog output (voltage value) from the vacuum gauge 56 is within the voltage range set in the memory unit 620. Selection department 683b is a means for selecting a plurality of approximate expressions of the voltage range determined by the voltage determining unit 683a based on the voltage range set in the memory unit 620 and a plurality of approximate expressions corresponding thereto. The pressure calculation unit 683c is a means for calculating the pressure value based on the determined voltage value and the selected multiple approximation formula.

閥控制部684,為根據真空運算部683的運算結果,控制用以切換三向閥520的開閉之按壓部527之手段。按壓控制部685,為控制用以使加壓頭52升降之壓缸54之手段。吸附控制部686,為控制用以將工件S1吸附於吸附平板510上之吸附泵浦530之手段。 The valve control unit 684 controls a pressing portion 527 for switching the opening and closing of the three-way valve 520 based on the calculation result of the vacuum calculation unit 683. The pressing control unit 685 is a means for controlling the pressure cylinder 54 for moving the pressing head 52 up and down. The adsorption control unit 686 is a means for controlling the adsorption pump 530 for adsorbing the workpiece S1 on the adsorption plate 510.

在此,參照第31圖~第36圖,說明上述真空運算部683之運算例。亦即,係考量來自一般真空計的類比輸出與指示壓力具有第31圖所示的關係之情況。此情況下,從類比值導出壓力之方法,有預先將第31圖般的表(類比數據表)預先記憶於記憶裝置內,並逐次比較此表與目前的類比值之方法。然而,此方法中必須逐次搜尋該數據,所以運算處理程式會增大,處理時間亦會增長。 Here, an example of calculation of the vacuum calculation unit 683 will be described with reference to FIGS. 31 to 36. That is, the case where the analog output from the general vacuum gauge and the indicated pressure have the relationship shown in Fig. 31 are considered. In this case, the method of deriving the pressure from the analog value has a method in which the table (analog data table) as shown in Fig. 31 is stored in advance in the memory device, and the table and the current analog value are successively compared. However, in this method, the data must be searched sequentially, so the arithmetic processing program will increase and the processing time will increase.

此外,有將表中之各數據間的變化量視為線性來進行運算處理之方法。然而,若為了提升壓力導出結果的精度而增加記憶於記憶裝置之表的數據數,則運算處理裝置內的處理會變慢。相反的,若減少數據數,則壓力導出結果的精度惡化,但運算速度變快。 Further, there is a method of performing arithmetic processing by considering the amount of change between each data in the table as linear. However, if the number of data stored in the table of the memory device is increased in order to increase the accuracy of the pressure derivation result, the processing in the arithmetic processing device becomes slow. Conversely, if the number of data is reduced, the accuracy of the pressure derivation result is deteriorated, but the calculation speed is faster.

其他方法有使用多項近似式來進行運算之方法。然而,當表較為複雜時,若建立可滿足必要精度之多項近似式 ,則近似函數的階數亦會增加,使運算處理花費極多時間。例如,在將上述表予以圖表化時,如第32圖所示,電壓與電力的關係為非線性,難以建立可於全範圍內獲得高精度之多項近似式。第32圖亦對應於第33圖~第36圖,但為了廣泛地表示出壓力範圍,係採取單軸對數圖表。 Other methods have methods that use multiple approximations to perform operations. However, when the table is more complex, if you create a multiple approximation that satisfies the necessary accuracy Then, the order of the approximation function is also increased, which makes the calculation process take a lot of time. For example, when the above table is graphed, as shown in Fig. 32, the relationship between voltage and electric power is nonlinear, and it is difficult to establish a multi-approximation formula that can obtain high precision over the entire range. Fig. 32 also corresponds to Fig. 33 to Fig. 36, but in order to broadly show the pressure range, a uniaxial logarithmic graph is employed.

本實施形態中,係將表分割為任意複數個區間,並建立對應各區間之多項近似式。然後因應檢測出之電壓值,選擇多項近似式的某一項來進行壓力計算運算。 In the present embodiment, the table is divided into an arbitrary plurality of sections, and a plurality of approximate expressions corresponding to the respective sections are established. Then, according to the detected voltage value, one of the multiple approximations is selected to perform the pressure calculation operation.

例如,當來自真空計56的類比檢測電壓值與其所指示之壓力具有第33圖的圖表關係時,係將電壓值的範圍區隔為下列3項。 For example, when the analog detection voltage value from the vacuum gauge 56 has the graph relationship of Fig. 33 with the pressure indicated thereto, the range of the voltage value is divided into the following three items.

(1)0V以上~未滿3V (1) above 0V~ less than 3V

(2)3V以上~未滿8V (2) 3V or more ~ less than 8V

(3)8V以上~10V以下 (3) 8V or more and below 10V

對應此等(1)~(3)的範圍,來設定下列3個多項近似式。 The following three polynomial approximations are set corresponding to the ranges of (1) to (3).

(a)PL=-36.837V3+320.94V2-1104.9V+1724.7[Pa] (a)PL=-36.837V3+320.94V2-1104.9V+1724.7[Pa]

(b)Pm=-0.8021V3+23.787V2-240.08V+832.07[Pa] (b) Pm=-0.8021V3+23.787V2-240.08V+832.07[Pa]

(c)Ph=-0.6572V3+21.162V2-231.87V+859.72[Pa] (c) Ph=-0.6572V3+21.162V2-231.87V+859.72[Pa]

各範圍的多項近似式,能夠以3次函數來滿足充分精度。亦即,如第34圖所示,當比較(1)的範圍中之基準的圖表與運算結果的圖表時,可成為幾乎一致的線。此結果於第35圖及第36圖所示之(2)(3)的範圍中亦相同。 A multiple approximation of each range can satisfy sufficient accuracy with a cubic function. That is, as shown in Fig. 34, when the graph of the reference in the range of (1) and the graph of the calculation result are compared, they can be almost uniform lines. This result is also the same in the range of (2) (3) shown in Fig. 35 and Fig. 36.

如第27圖所示,於記憶部620,設定有成為使閥控制部684用以切換三向閥520之臨限值的閥用壓力值,以及按壓控制部685用以使加壓頭52下降之臨限值的按壓用壓力值。因此,當由壓力運算部683c所運算之壓力值成為閥用壓力值時,係切換三向閥520,當成為按壓用壓力值時,使加壓頭52下降、 As shown in Fig. 27, the memory unit 620 is provided with a valve pressure value for causing the valve control unit 684 to switch the threshold value of the three-way valve 520, and the pressing control unit 685 for lowering the pressure head 52. The pressure value for pressing the threshold value. Therefore, when the pressure value calculated by the pressure calculation unit 683c is the valve pressure value, the three-way valve 520 is switched, and when the pressure value for pressing is set, the pressure head 52 is lowered,

[B.作用] [B. Function]

具有以上構成之本實施形態的作用,如下列所述。以下列所說明之步驟來控制貼合裝置之方法以及使控制裝置動作之電腦程式,亦為本發明之一型態。 The action of the present embodiment having the above configuration is as follows. The method of controlling the bonding apparatus and the computer program for operating the control apparatus by the steps described below are also one aspect of the present invention.

[1.工件的裝著] [1. Loading of the workpiece]

首先說明工件S1、S2對保持裝置2之裝著。係設定為在工件S1貼附有雙面膠帶T1之一方的黏著面者。此時,於雙面膠帶T1之另一方的面為貼附有剝離紙F之狀態。 First, the attachment of the workpieces S1, S2 to the holding device 2 will be described. The adhesive surface is set to attach one of the double-sided tapes T1 to the workpiece S1. At this time, the other surface of the double-sided tape T1 is in a state in which the release paper F is attached.

亦即,第1圖所示之投入取出作業位置1A中,如第2圖~第4圖所示,作業人員係以使黏著雙面膠帶T1之面朝上之方式,將工件S1載置於吸附平板510的保護構件511上。此時,吸附控制部686使吸附泵浦530動作,藉由吸附平板510及保護構件511的吸附孔來吸附工件S1。此外,作業人員將工件S2安置在保持部100。亦可不藉由人力來進行工件的投入,而是藉由自動載入等供給機構,自動地將經處理後的工件投入。 That is, in the input/extraction work position 1A shown in Fig. 1, as shown in Figs. 2 to 4, the worker places the workpiece S1 so that the surface of the double-sided adhesive tape T1 faces upward. The protective member 511 of the flat plate 510 is adsorbed. At this time, the adsorption control unit 686 operates the adsorption pump 530 to adsorb the workpiece S1 by the adsorption holes of the adsorption plate 510 and the protective member 511. Further, the worker places the workpiece S2 on the holding portion 100. It is also possible to automatically put the processed workpiece into the workpiece by automatically loading the workpiece without the input of the workpiece.

[2.剝離紙的剝離] [2. Stripping of release paper]

如上述般,保持工件S1、S2之保持裝置2,係藉由旋轉台1的旋轉來到貼著材準備作業位置1B。在此,剝離裝置3係將工件S1的剝離紙F剝離。亦即,如第13圖及第17圖(A)所示,頭控制部651係藉由驅動壓缸33b使剝離頭33a往前方移動,並藉由驅動壓缸35使第1單元U1上升,並將剝離用的黏著膠帶T2抵接於工件S1之雙面膠帶T1的剝離紙F的邊緣。 As described above, the holding device 2 for holding the workpieces S1 and S2 comes to the bonding material preparation working position 1B by the rotation of the rotary table 1. Here, the peeling device 3 peels off the release paper F of the workpiece S1. That is, as shown in Fig. 13 and Fig. 17(A), the head control unit 651 moves the peeling head 33a forward by the driving cylinder 33b, and raises the first unit U1 by driving the cylinder 35. And the adhesive tape T2 for peeling is abutted on the edge of the peeling paper F of the double-sided tape T1 of the workpiece S1.

在旋轉控制部652藉由控制捲軸旋轉機構31b、34c對送出捲軸31a及捲取捲軸34a的旋轉施以制動之狀態下,升降控制部653使捲軸升降機構34b動作而使捲取捲軸34a下降。如此,黏著膠帶T2一邊往下方被拉引,剝離頭33a一邊後退。此時,如第17圖(B)所示,黏著膠帶T2所接觸之剝離紙F,貼附於雙面膠帶T1而被剝離。 When the rotation control unit 652 brakes the rotation of the delivery reel 31a and the take-up reel 34a by the control reel rotation mechanisms 31b and 34c, the elevation control unit 653 operates the reel elevating mechanism 34b to lower the take-up reel 34a. As described above, the adhesive tape T2 is pulled downward, and the peeling head 33a is retracted. At this time, as shown in Fig. 17 (B), the release paper F that the adhesive tape T2 contacts is attached to the double-sided tape T1 and peeled off.

然後,旋轉控制部652一邊使捲軸旋轉機構34c動作而使捲取捲軸34a旋轉,升降控制部653一邊使捲軸升降機構34b動作而使捲取捲軸34a上升,藉此返回至從下一個工件S1將剝離紙F剝離之狀態。 Then, the rotation control unit 652 operates the reel rotation mechanism 34c to rotate the take-up reel 34a, and the elevating control unit 653 moves the reel elevating mechanism 34b to raise the take-up reel 34a, thereby returning to the next workpiece S1. The state in which the release paper F is peeled off.

上述係說明使用第1單元U1從下側的工件S1將剝離紙F剝離之情況,但對於使用第2單元U2從上側的工件S2將剝離紙F剝離之情況,其基本的動作步驟相同(參照第18圖(A)(B))。 In the above description, the peeling paper F is peeled off from the lower workpiece S1 by using the first unit U1. However, the basic operation steps are the same when the second paper U2 is used to peel the release paper F from the upper workpiece S2 (see Figure 18 (A) (B)).

[3.工件的定位] [3. Positioning of workpiece]

接著,保持工件S1、S2之保持裝置2,係藉由旋轉台1的旋轉來到定位作業位置1C。此時,藉由鎖定部350 的壓缸356來彈壓被按壓部355,藉此解除定位部300的鎖定(X、Y、θ軸全部)。如此,係進行依據檢測裝置4之位置檢測以及依據定位部300之定位。該步驟可依照第28圖的流程圖,並參照第20圖~第22圖、第29圖而說明如下。 Next, the holding device 2 for holding the workpieces S1, S2 is brought to the positioning work position 1C by the rotation of the rotary table 1. At this time, by the locking portion 350 The cylinder 356 presses the pressed portion 355 to release the lock of the positioning portion 300 (all X, Y, and θ axes). In this way, the position detection according to the detecting device 4 and the positioning according to the positioning unit 300 are performed. This step can be explained as follows in accordance with the flowchart of Fig. 28 and with reference to Figs. 20 to 22 and Fig. 29.

[3-1.位置檢測] [3-1. Position Detection]

攝像機驅動部661藉由使攝像機驅動機構49動作而使臂45、46移動。藉此,如第20圖及第21圖所示,CCD攝像機41往工件S2的上方移動,CCD攝像機42於工件S1與工件S2之間移動(步驟101)。 The camera drive unit 661 moves the arms 45 and 46 by operating the camera drive mechanism 49. Thereby, as shown in FIGS. 20 and 21, the CCD camera 41 moves above the workpiece S2, and the CCD camera 42 moves between the workpiece S1 and the workpiece S2 (step 101).

然後,CCD攝像機41、42依序在對應於工件S1及S2之角隅或標記M1、M2之位置停止(步驟102)。攝像控制部662係依序使CCD攝像機41對工件S1、S2之角隅或標記M1、M2進行攝像(步驟103)。攝像後的畫像被輸入至控制裝置6(步驟104)。 Then, the CCD cameras 41, 42 are sequentially stopped at positions corresponding to the corners or marks M1, M2 of the workpieces S1 and S2 (step 102). The imaging control unit 662 sequentially causes the CCD camera 41 to image the corners 工件 or the marks M1 and M2 of the workpieces S1 and S2 (step 103). The image after imaging is input to the control device 6 (step 104).

上述攝像時,當工件S2為正常時,如第22圖(A)所示,依據同軸照射照明所形成之來自工件S2的反射光會返回CCD攝像機41,所以可在無問題下進行攝像。然而,如第3圖所示,工件S2並非如工件S1被吸附於吸附平板510,而是藉由保持部100保持在空中。因此,如第22圖(B)所示,容易產生工件S2的彎曲、扭曲等,此時有可能會使來自工件S2的反射光無法返回CCD攝像機41。 In the above imaging, when the workpiece S2 is normal, as shown in Fig. 22(A), the reflected light from the workpiece S2 formed by the coaxial illumination illumination is returned to the CCD camera 41, so that imaging can be performed without any problem. However, as shown in FIG. 3, the workpiece S2 is not adsorbed to the adsorption flat plate 510 as the workpiece S1, but is held in the air by the holding portion 100. Therefore, as shown in Fig. 22(B), the bending, twisting, and the like of the workpiece S2 are likely to occur, and at this time, the reflected light from the workpiece S2 may not be returned to the CCD camera 41.

本實施形態中,在該情況下,如第22圖(C)所示, 來自CCD攝像機41的照明,會反射至安裝在CCD攝像機42之反射面42a,並確實地返回CCD攝像機41,所以可進行攝像。當以標記M1、M2為檢測對象時,為了反射光的感光,較佳為工件S2之對應於標記M1、M2的部分,具有可使光透射之場所。 In this embodiment, as shown in Fig. 22(C), The illumination from the CCD camera 41 is reflected to the reflection surface 42a attached to the CCD camera 42, and is surely returned to the CCD camera 41, so that imaging can be performed. When the marks M1 and M2 are to be detected, in order to illuminate the reflected light, it is preferable that the portion of the workpiece S2 corresponding to the marks M1 and M2 has a place where light can be transmitted.

如上述般,至少攝像3點之後(步驟105),三點抽出部663從攝像後的畫像中,抽出工件S1之角隅或辨識標記M1的3點,並且抽出對應於此之工件S2之角隅或辨識標記M2的3點(步驟106)。從畫像抽出點之處理,可藉由以往之一般的畫像處理技術來實現,所以省略該說明。 As described above, after at least three points of imaging (step 105), the three-point extracting unit 663 extracts the corner 工件 of the workpiece S1 or the three points of the identification mark M1 from the image after imaging, and extracts the corner of the workpiece S2 corresponding thereto.隅 or identify 3 points of the marker M2 (step 106). The process of extracting a point from the image can be realized by a conventional image processing technique, and thus the description is omitted.

重心計算部664,如第29圖(A)所示,在各工件S1、S2的3點中,係將對角2點的中點計算出作為工件S1、S2的重心座標G1、G2(步驟107)。此外,斜率計算部665,在各工件S1、S2的3點中,係將連結長邊或短邊的2點之直線的斜率計算出作為工件S1、S2的斜率(步驟108)。 As shown in FIG. 29(A), the center-of-gravity calculation unit 664 calculates the center-of-gravity coordinates G1 and G2 of the workpieces S1 and S2 at three points of the diagonal points at three points of the workpieces S1 and S2 (steps). 107). Further, the slope calculating unit 665 calculates the slopes of the straight lines connecting the long sides or the short sides at three points of the respective workpieces S1 and S2 as the slopes of the workpieces S1 and S2 (step 108).

然後,定位控制部670的定位運算部672,係以使兩工件S1、S2的重心及斜率成為一致之方式,運算工件S1的移動量(步驟109)。亦即,係計算出用以對準重心之X-Y方向的移動量(旋轉軸321、331的轉動量),並且計算出用以對準斜率之θ方向的轉動量(下旋轉軸345的轉動量)。 Then, the positioning calculation unit 672 of the positioning control unit 670 calculates the amount of movement of the workpiece S1 so that the centers of gravity and the inclinations of the two workpieces S1 and S2 match each other (step 109). That is, the amount of movement in the XY direction (the amount of rotation of the rotating shafts 321, 331) for aligning the center of gravity is calculated, and the amount of rotation in the θ direction for aligning the slope (the amount of rotation of the lower rotating shaft 345) is calculated. ).

離合器控制部671,係藉由對線圈421、431、441通 電來連接轉子422、432、442與電樞323、333、346(步驟110)。馬達控制部673使馬達450、460、470動作而使旋轉軸321、331、345轉動(步驟111)。當旋轉軸321、331、345僅轉動所計算出的轉動量時,馬達450、460、470停止動作(步驟112)。 The clutch control unit 671 is connected to the coils 421, 431, and 441 The rotors 422, 432, 442 and the armatures 323, 333, 346 are electrically connected (step 110). The motor control unit 673 operates the motors 450, 460, and 470 to rotate the rotary shafts 321, 331, and 345 (step 111). When the rotation axes 321, 331, 345 only rotate the calculated amount of rotation, the motors 450, 460, 470 stop operating (step 112).

接著,離合器控制部671使鎖定部350的壓缸356動作,並解除對被按壓部355的彈壓,藉此,藉由彈簧354的彈壓力使制動器352下降,並夾持制動器板351而鎖定(步驟113)。此動作對X、Y、θ軸全部為幾乎同時進行。然後,離合器控制部671停止對線圈421、431、441的通電,依據離合器420~440來解除X軸部320、Y軸部330、θ軸部340與驅動部400之連接。 Then, the clutch control unit 671 operates the cylinder 356 of the lock unit 350 to release the biasing force against the pressed portion 355, whereby the brake 352 is lowered by the elastic pressure of the spring 354, and the brake plate 351 is clamped and locked ( Step 113). This action is performed almost simultaneously on the X, Y, and θ axes. Then, the clutch control unit 671 stops energization of the coils 421, 431, and 441, and releases the connection between the X-axis unit 320, the Y-axis unit 330, and the θ-axis unit 340 and the drive unit 400 in accordance with the clutches 420 to 440.

藉此,係以使兩工件S1、S2的位置對準之方式,來調節X-Y-θ平台311的位置。例如,當工件S1、S2產生如第29圖(A)所示之偏移時,如第29圖(B)所示,可藉由往X-Y方向的移動,使重心G1、G2一致,並且如第29圖(C)所示,藉由轉動,使斜率一致。 Thereby, the position of the X-Y-θ stage 311 is adjusted in such a manner that the positions of the two workpieces S1, S2 are aligned. For example, when the workpieces S1, S2 are offset as shown in Fig. 29(A), as shown in Fig. 29(B), the centers of gravity G1, G2 can be made coincident by the movement in the XY direction, and As shown in Fig. 29(C), the slope is made uniform by rotation.

當角隅或標記等的檢測對象於每個工件的變動較少時,若檢測出對角的2點,則可藉由對準重心與對角線的斜率來進行對位。因此,本實施形態中,可檢測出工件S1、S2之對角的2點,藉由往X-Y方向的移動使相互的重心G1、G2一致,並且藉由轉動,使對角線的斜率一致。藉此可減少運算處理的負擔。 When the detection target of the corner or the mark or the like has less variation per workpiece, if two points of the diagonal are detected, the alignment can be performed by aligning the slopes of the center of gravity and the diagonal. Therefore, in the present embodiment, two points diagonal to the workpieces S1 and S2 can be detected, and the mutual centers of gravity G1 and G2 are aligned by the movement in the X-Y direction, and the slopes of the diagonal lines are made uniform by the rotation. Thereby, the burden of the arithmetic processing can be reduced.

[4.真空貼合] [4. Vacuum fit]

接著,保持工件S1、S2之保持裝置2,係藉由旋轉台1的旋轉來到真空貼合作業位置1D。如此,係藉由按壓裝置5來進行真空貼合。該步驟可依照第30圖的流程圖,並參照第2圖、第10圖~第12圖、第23圖~第25圖而說明如下。 Next, the holding device 2 for holding the workpieces S1, S2 is brought to the vacuum bonding cooperative position 1D by the rotation of the rotary table 1. In this manner, the vacuum bonding is performed by the pressing device 5. This step can be explained as follows in accordance with the flowchart of FIG. 30 with reference to FIGS. 2, 10 to 12, and 23 to 25.

亦即,如第23圖及第24圖所示,處理室控制部681藉由使升降機構53動作而使真空處理室51下降,並將保持裝置2的周圍密閉(步驟201)。然後,減壓控制部682使減壓泵浦55動作而對真空處理室51內進行減壓(步驟202)。 That is, as shown in Figs. 23 and 24, the processing chamber control unit 681 lowers the vacuum processing chamber 51 by operating the elevating mechanism 53, and seals the periphery of the holding device 2 (step 201). Then, the pressure reduction control unit 682 operates the pressure reduction pump 55 to decompress the inside of the vacuum processing chamber 51 (step 202).

真空計56將檢測出的電壓值輸出至控制裝置(步驟203)。真空運算部683中,電壓判定部683a係判定由真空計56所檢測的電壓值位於上述(1)~(3)的哪一範圍內(步驟204)。因應此判定結果,式選擇部683b選擇多項近似式(步驟205-1~3)。壓力運算部683c根據所檢測的電壓值與所選擇的多項近似式,來計算出壓力(步驟206)。 The vacuum gauge 56 outputs the detected voltage value to the control device (step 203). In the vacuum calculation unit 683, the voltage determination unit 683a determines which of the above (1) to (3) the voltage value detected by the vacuum gauge 56 is located (step 204). In response to this determination result, the formula selection unit 683b selects a plurality of approximate expressions (steps 205-1 to 3). The pressure calculation unit 683c calculates the pressure based on the detected voltage value and the selected multiple approximation formula (step 206).

閥控制部684,當判定所計算出的壓力值為特定的閥用壓力以下時(步驟207),係使按壓部527上升而彈推三向閥520的被按壓部525。如此,如第11圖及第12圖(B)所示,使三向閥520的連桿524上升,上側閥522將內管部521的上端開啟,使下側閥523成為關閉狀態(步驟208)。藉此使吸附平板510內與真空處理室51內成為相同壓力,以防止從吸附孔之吹出。 When the valve control unit 684 determines that the calculated pressure value is equal to or lower than the specific valve pressure (step 207), the pressing portion 527 is raised to push the pressed portion 525 of the three-way valve 520. As described above, as shown in FIG. 11 and FIG. 12(B), the link 524 of the three-way valve 520 is raised, and the upper valve 522 opens the upper end of the inner tube portion 521, and the lower valve 523 is closed (step 208). ). Thereby, the inside of the adsorption flat plate 510 is brought to the same pressure as the inside of the vacuum processing chamber 51 to prevent blowing out from the adsorption holes.

再者,按壓控制部685,當判定所計算出的壓力值為特定的按壓用壓力以下時(步驟209),如第25圖所示,係使壓缸54動作,使加壓頭52下降而將工件S2壓抵至工件S1(步驟210)。然後,減壓控制部682使減壓泵浦55停止(步驟211),處理室控制部681使加壓頭52及真空處理室51上升,而開放為大氣壓(步驟212、213)。 When the pressure control unit 685 determines that the calculated pressure value is equal to or lower than the specific pressing pressure (step 209), as shown in Fig. 25, the pressure cylinder 54 is operated to lower the pressing head 52. The workpiece S2 is pressed against the workpiece S1 (step 210). Then, the pressure reduction control unit 682 stops the pressure reduction pump 55 (step 211), and the processing chamber control unit 681 raises the pressure head 52 and the vacuum processing chamber 51 to open to atmospheric pressure (steps 212 and 213).

[5.工件的取出] [5. Removal of workpiece]

如上述般,當保持貼合後的工件S1、S2之保持裝置2,藉由旋轉台1的旋轉來到投入取出作業位置1A時,作業人員係從保持部100取出工件S1、S2。此作業亦可藉由搬運機構等以自動化來進行。 As described above, when the holding device 2 for holding the workpieces S1 and S2 after bonding is brought to the take-out operation position 1A by the rotation of the turntable 1, the worker takes out the workpieces S1 and S2 from the holding unit 100. This work can also be performed by automation by a transport mechanism or the like.

[C.效果] [C. Effect]

根據上述本實施形態,可獲得下列效果。亦即,可在一場所的作業位置來進行一對工件S1、S2的供給,並且可在同一作業位置進行貼合後之工件S1、S2的取出,所以可縮小作業空間來完成。 According to the above embodiment, the following effects can be obtained. In other words, the supply of the pair of workpieces S1 and S2 can be performed at the work position of one place, and the workpieces S1 and S2 after the bonding can be taken out at the same work position, so that the work space can be reduced and completed.

由於剝離裝置3的剝離頭33a呈傾斜,所以可從工件S1、S2的邊端開始進行黏著膠帶T2的壓著,而確實地將剝離紙F剝離。此外,由於剝離頭33a呈傾斜,以及藉由轉換部32使供給部31從剝離部33之黏著膠帶T2的長度方向偏移,以及捲取捲軸34a的移動方向為上下方向,所以可縮小縱深方向的所需空間。此剝離裝置3的優點,例如為第19圖(A)~(D)所示,相較於配置有捲取捲軸 L1、送出捲軸L2、剝離頭L3,並使捲取捲軸L1在黏著膠帶T2的長度方向上移動所構成之以往例者,更能夠明瞭。 Since the peeling head 33a of the peeling apparatus 3 is inclined, the pressure-adhesive tape T2 can be pressed from the edge of the workpieces S1 and S2, and the peeling paper F can be peeled off reliably. Further, since the peeling head 33a is inclined, and the feeding portion 31 is displaced from the longitudinal direction of the adhesive tape T2 of the peeling portion 33 by the converting portion 32, and the moving direction of the take-up reel 34a is the up and down direction, the depth direction can be reduced. The space required. The advantages of the peeling device 3 are, for example, shown in Figs. 19(A) to (D), compared to the configuration of the take-up reel It is more clear that the L1, the take-up reel L2, the peeling head L3, and the winding reel L1 are moved in the longitudinal direction of the adhesive tape T2.

此外,剝離裝置3,藉由更換單元U1、U2,能夠容易地對應於從下側的工件S1之剝離紙F的剝離以及從上側的工件S2之剝離紙F的剝離。此般剝離裝置3的優點,例如在第19圖(A)(B)所示之下側的工件S1之以往例,以及在第19圖(C)(D)所示之上側的工件S2之以往例中,由於需變更捲取捲軸L1、送出捲軸L2的配置本身,所以亦能夠明顯得知難以進行單元化。例如,藉由構成為具備第17圖、第18圖所示之輥33c~33g之裝置,即使不設為單元更換式,亦僅需將黏著膠帶T2更換張掛如第17圖或第18圖所示者,而能夠對應上側剝離用及下側剝離用。 Further, the peeling device 3 can easily correspond to the peeling of the release paper F from the lower workpiece S1 and the peeling of the release paper F from the upper workpiece S2 by the replacement units U1 and U2. The advantages of the peeling device 3 are, for example, the conventional example of the workpiece S1 on the lower side shown in Fig. 19 (A) and (B), and the workpiece S2 on the upper side shown in Fig. 19 (C) and (D). In the conventional example, since it is necessary to change the arrangement of the take-up reel L1 and the take-up reel L2, it is also apparent that it is difficult to perform unitization. For example, by means of the device having the rollers 33c to 33g shown in Figs. 17 and 18, even if the unit replacement type is not used, it is only necessary to replace the adhesive tape T2 as shown in Fig. 17 or Fig. 18. The present invention can be used for the upper side peeling and the lower side peeling.

此外,剝離裝置3,即使設為可裝卸於貼合裝置之獨立構成,亦不須具備移載裝置,所以可防止雜質的附著等。再者,由於剝離裝置3及塗佈裝置為可更換,所以可對應於多樣化製品。 Further, the peeling device 3 does not need to be provided with a transfer device even if it is configured to be detachable from the bonding device, so that adhesion of impurities or the like can be prevented. Further, since the peeling device 3 and the coating device are replaceable, they can correspond to various products.

可使旋轉台1上的X-Y-θ平台311,在藉由離合器420、430、440從馬達450、460、470分離之狀態下移動。因此,於旋轉台1不需裝載驅動源,亦不須具備電源線及控制線,所以可藉由簡單的構成來實現安定的運轉。此外,由於可裝載複數台的保持裝置2於旋轉台1,所以能夠實現高速且效率佳的貼合。 The X-Y-θ stage 311 on the rotary table 1 can be moved in a state of being separated from the motors 450, 460, 470 by the clutches 420, 430, 440. Therefore, since the rotary table 1 does not need to be loaded with a drive source and does not need to have a power supply line and a control line, the stable operation can be realized by a simple configuration. Further, since the plurality of holding devices 2 can be mounted on the turntable 1, it is possible to achieve high speed and efficient bonding.

此外,驅動源等能夠僅在一個場所中具備,所以可便宜地構成。此外,X-Y-θ平台311為小型者即足夠,所以容易收納於真空中,而簡單地實現氣泡等之混入防止。再者,由於可在定位後的X-Y-θ平台311上貼合工件S1、S2,所以可進行高精度的貼合。 Further, since the drive source or the like can be provided in only one place, it can be configured inexpensively. Further, since the X-Y-θ stage 311 is sufficient for a small size, it is easy to store in a vacuum, and it is easy to prevent mixing of bubbles or the like. Further, since the workpieces S1 and S2 can be bonded to the positioned X-Y-θ stage 311, high-precision bonding can be performed.

尤其,檢測裝置4式乙3點來進行工件S1、S2之重心及斜率的檢測,所以可將處理負擔抑制在最低限度而正確地檢測出。此外,即使工件S1、S2具有彎曲等,來自CCD攝像機41側的照射光可藉由CCD攝像機42的反射面42a所反射,所以可正確地檢測出。因此,可依據正確的檢測來進行高精度的貼合。 In particular, since the detection device 4 detects the center of gravity and the slope of the workpieces S1 and S2 at three points, the processing load can be accurately detected by suppressing the processing load to a minimum. Further, even if the workpieces S1 and S2 have curvature or the like, the illumination light from the CCD camera 41 side can be reflected by the reflection surface 42a of the CCD camera 42, so that it can be accurately detected. Therefore, high-precision bonding can be performed based on correct detection.

由於可在旋轉台1上的1作業位置進行真空貼合,所以可達成省空間化。此外,由於不需在真空處理室51內進行定位,所以可縮小並簡化裝置。此外,對真空處理室51內進行減壓時,在藉由三向閥520來阻隔吸附部500的吸附管線的同時,可與真空處理室51內保持相同壓力,所以可防止從吸附孔的吹出導致工件S1的偏移,而實現安定的運轉。此外,可藉由單一的三向閥520來進行切換,所以能夠小型且便宜地製造出。 Since the vacuum bonding can be performed at one working position on the rotary table 1, space saving can be achieved. Further, since positioning is not required in the vacuum processing chamber 51, the apparatus can be reduced and simplified. Further, when the pressure in the vacuum processing chamber 51 is reduced, the adsorption line of the adsorption unit 500 is blocked by the three-way valve 520, and the same pressure can be maintained in the vacuum processing chamber 51, so that the discharge from the adsorption hole can be prevented. This results in a shift in the workpiece S1 and a stable operation. Further, since the switching can be performed by the single three-way valve 520, it can be manufactured in a small size and inexpensively.

在真空處理室51內之壓力的檢測時,可選擇因應電壓值之適當的近似式來計算出壓力,所以可藉由低階的近似函數來計算出高精度的壓力。此外,經常可藉由單純的1項函數來進行運算處理,所以可減輕負擔。 At the time of detecting the pressure in the vacuum processing chamber 51, the pressure can be calculated by appropriately approximating the appropriate value of the voltage value, so that the high-precision pressure can be calculated by the low-order approximation function. In addition, the arithmetic processing can often be performed by a simple one-item function, so that the burden can be reduced.

由於吸附部500的保護構件511及按壓裝置5的保護 構件52a可使用將多孔質薄片貼附於彈性構件者,所以可一邊吸收對工件S1、S2的衝擊,一邊防止工件S1、S2對保護構件511、52a的貼附,而實現安定的貼合。此外,相較於藉由機械加工來粗化橡膠的表面者,其滑動性較佳且不易磨損。此外,相較於對橡膠進行低能量照射處理者,乃較為便宜。再者,當劣化時,相較於更換橡膠全體者,薄片的貼換較為容易。 Protection by the protective member 511 and the pressing device 5 of the adsorption portion 500 Since the member 52a can be attached to the elastic member by the porous sheet, it is possible to prevent the impact of the workpieces S1 and S2 on the protective members 511 and 52a while absorbing the impact on the workpieces S1 and S2, thereby achieving stable bonding. Further, the slidability is better and the abrasion is less than that of the surface of the rubber which is roughened by mechanical processing. In addition, it is relatively inexpensive compared to the low energy irradiation treatment of rubber. Further, when it is deteriorated, it is easier to replace the sheet than the entire rubber replacement.

[D.其他實施形態] [D. Other embodiments]

本發明並不限定於上述實施形態。例如,如上述般,當使用接著劑的塗佈裝置來取代剝離裝置時,接著劑可適用目前或將來所能夠利用之所有材質者。可適用如紫外線硬化型或輻射線硬化型的樹脂般,藉由從外部照射廣義的電磁波,或是如熱硬化型的樹脂般,藉由施加溫度變化使其硬化者。塗佈裝置,如上述般,可使用一般所知的裝置。例如噴墨塗佈裝置、網版印刷裝置、擠壓塗佈裝置、分注噴嘴塗佈裝置,但並不限定於此。 The present invention is not limited to the above embodiment. For example, as described above, when a coating device using an adhesive is used instead of the peeling device, the adhesive can be applied to all materials that can be utilized currently or in the future. It can be applied to a resin such as an ultraviolet curing type or a radiation curing type by irradiating a generalized electromagnetic wave from the outside or a hardening type resin to cure it by applying a temperature change. As the coating apparatus, as described above, a generally known apparatus can be used. For example, an inkjet coating device, a screen printing device, an extrusion coating device, and a dispensing nozzle coating device are not limited thereto.

在藉由塗佈裝置來進行接著劑的塗佈時,如第37圖所示,可考量設置接著劑的硬化作業位置1E作為旋轉台1的停止作業位置。此時,係在硬化作業位置1E設置有照射電磁波的裝置或是加熱裝置等,當貼合後的工件來到硬化作業位置1E,藉由照射電磁波或進行加熱使接著劑硬化。 When the application of the adhesive is performed by the coating device, as shown in Fig. 37, the curing work position 1E of the adhesive can be measured as the stop working position of the turntable 1. At this time, a device for irradiating electromagnetic waves or a heating device or the like is provided at the hardening work position 1E, and when the bonded workpiece comes to the hardening work position 1E, the adhesive is cured by irradiation of electromagnetic waves or heating.

此外,剝離裝置的細部構成並不限定於上述實施形態。例如,剝離頭可為一邊使黏著膠帶移動一邊壓抵於剝離 紙而構成,該驅動機構亦可為接觸間離於剝離紙之構成。此外,導引輥的配置位置或數目亦可自由選擇。再者,轉換部的轉換角度,只要為送出部從剝離頭之黏著膠帶的長度方向偏移之角度者,則不限定於直角。此外,剝離裝置亦可使用其他一般所知的裝置。 Further, the detailed configuration of the peeling device is not limited to the above embodiment. For example, the peeling head can be pressed against the peeling while moving the adhesive tape on one side. The paper is constructed by paper, and the driving mechanism may be configured to be separated from the release paper. In addition, the position or number of the guide rollers can be freely selected. Further, the conversion angle of the conversion portion is not limited to a right angle as long as the delivery portion is offset from the longitudinal direction of the adhesive tape of the peeling head. In addition, other generally known devices can be used for the stripping device.

將定位部與驅動部予以裝卸之裝卸構件,可適用一般所知的所有構件。例如,可為不依據線圈的激磁之機械式的離合器。偶合器、伸縮囊,只要是可容許軸的移位之構造的連接構件,則可適用其他一般所知者。 The detachable member that attaches and detaches the positioning portion and the driving portion can be applied to all members generally known. For example, it may be a mechanical clutch that does not rely on the excitation of the coil. The coupling member and the bellows can be applied to other generally known ones as long as they are connecting members that can accommodate the displacement of the shaft.

保護構件的材質、厚度、硬度等,亦可自由選擇。例如,加壓頭側可使用以雙面膠帶將聚胺基甲酸酯多孔質薄膜製的薄片貼附於硬度40的胺基甲酸酯橡膠者,吸附平板側可使用聚胺基甲酸酯多孔質薄膜製的薄片貼附於硬度80的胺基甲酸酯橡膠者,但不限定於此。 The material, thickness, hardness, etc. of the protective member can also be freely selected. For example, a sheet made of a porous polyurethane film with a double-sided tape may be attached to a urethane rubber having a hardness of 40, and a polyurethane may be used for the side of the adsorption plate. The sheet made of a porous film is attached to a urethane rubber having a hardness of 80, but is not limited thereto.

檢測裝置之攝像機的數目,並不限定於上述數目。可僅設置1台,或是在水平方向上僅設置2台或在水平方向上僅設置3~4台,並將此依序從上側移往下側。此外,可分別於上下方設置2台並前後移動。再者,可分別於上下方設置3~4台並同時將上下3點攝像。首先,將對角的2點攝像,當具有無法從此抽出之點時,再將其他點攝像。或是將4個場所攝像後,再從可抽出的場所或是畫像為良好的3個場所中抽出3點。攝像機數目愈多,驅動此等攝像機之機構愈可簡化,並可進行高速攝像。 The number of cameras of the detecting device is not limited to the above number. It is possible to set only one unit, or set only two units in the horizontal direction or only three to four units in the horizontal direction, and move this from the upper side to the lower side in order. In addition, two sets can be set up and down, respectively, and moved back and forth. Furthermore, it is possible to set 3 to 4 sets in the upper and lower sides and simultaneously capture the upper and lower 3 points. First, the two points of the diagonal are imaged, and when there is a point that cannot be extracted therefrom, the other points are imaged. Or, after shooting four places, extract 3 points from the three places that can be taken out or the three places where the portrait is good. The greater the number of cameras, the simpler the mechanism for driving these cameras and the high speed camera.

此外,如第38圖所示,下側的CCD攝像機42可採 用藉由稜鏡將來自光源的光往上下方照射之構成,並且使上側的CCD攝像機41將照射至上方的光予以感光構成。或是如第39圖所示,下側的CCD攝像機42可將上下方攝像,且可將來自光源的光往上下方照射,並藉由反射面42a將上方的光反射而構成。此外,反射面的材質可考量金屬、玻璃、樹脂等,只要可使照射光反射者,則可為任意材質。再者,亦可將反射面與攝像機的框體構成為一體。 In addition, as shown in Fig. 38, the lower side CCD camera 42 can be taken The light from the light source is irradiated upward and downward by 稜鏡, and the upper CCD camera 41 is configured to sensitize the light irradiated to the upper side. Alternatively, as shown in Fig. 39, the lower CCD camera 42 can image the upper and lower sides, and can illuminate the light from the light source upward and downward, and reflect the upper light by the reflecting surface 42a. Further, the material of the reflecting surface may be metal, glass, resin, or the like, and any material may be used as long as it can reflect the irradiation light. Furthermore, the reflecting surface and the frame of the camera may be integrally formed.

作為貼合對象之工件,覆蓋面板與液晶模組(將顯示面板、背光積層而成者)為其典型例,但將構成顯示裝置之要素予以貼合的裝置,可廣泛地使用。因此,亦可適用於將觸控面板與液晶模組予以貼合之情況。 As a workpiece to be bonded, a cover panel and a liquid crystal module (a display panel and a backlight are laminated) are typical examples, but an apparatus that bonds the elements constituting the display device can be widely used. Therefore, it can also be applied to the case where the touch panel and the liquid crystal module are attached.

用於定位之檢測對象,亦可因應工件的型態而適當地變更。例如,如第40圖所示,當將覆蓋面板的工件S2貼合於液晶模組的工件S1時,亦可檢測出印刷於工件S2之框H的角隅。此時,如第41圖所示,較佳係以使工件S1(或可顯示區域,以下相同)的邊與框H的邊為一致之方式進行定位。尤其是,框H的邊為購入製品之使用者所觀看的部分,所以當框H相對於工件S1傾斜時,成為不良品的可能性高。 The object to be used for positioning can be appropriately changed depending on the type of the workpiece. For example, as shown in FIG. 40, when the workpiece S2 covering the panel is attached to the workpiece S1 of the liquid crystal module, the corner 印刷 of the frame H printed on the workpiece S2 can also be detected. At this time, as shown in Fig. 41, it is preferable to position the side of the workpiece S1 (or the displayable area, the same below) so as to coincide with the side of the frame H. In particular, since the side of the frame H is a portion viewed by the user who purchased the product, when the frame H is inclined with respect to the workpiece S1, there is a high possibility that it becomes a defective product.

為了防止此情形,就下列理由來看,依據3點檢測所進行之定位較依據2點檢測所進行之定位為有效。亦即,框H的的大小或形狀是藉由印刷等所形成,所以每個工件S2可能有產生變動時。例如,如第42圖(A)所示,當 工件S1與框H的形狀不一致時,即使分別檢測出對角的2點並使重心及對角線的斜率一致,亦如第42圖(B)所示,框H是以相對於工件S1傾斜之狀態被定位。 In order to prevent this, for the following reasons, the positioning based on the 3-point detection is more effective than the positioning based on the 2-point detection. That is, the size or shape of the frame H is formed by printing or the like, so that each of the workpieces S2 may have a change. For example, as shown in Figure 42 (A), when When the shapes of the workpiece S1 and the frame H do not match, even if two diagonal points are detected and the slopes of the center of gravity and the diagonal are matched, as shown in Fig. 42(B), the frame H is inclined with respect to the workpiece S1. The status is located.

相對於此,與上述實施形態相同,當檢測出3點並使重心及長邊的斜率一致時,如第42圖(C)所示,工件S1與框H的邊為平行。藉此,不會產生購入製品之使用者所觀看的框H相對於可顯示區域呈傾斜之事態,而能夠防止不良品的產生。 On the other hand, in the same manner as in the above-described embodiment, when three points are detected and the slopes of the center of gravity and the long side are matched, as shown in FIG. 42(C), the sides of the workpiece S1 and the frame H are parallel. Thereby, the state in which the frame H viewed by the user who purchased the product is inclined with respect to the displayable area is not generated, and the occurrence of defective products can be prevented.

1‧‧‧旋轉台 1‧‧‧Rotary table

1a‧‧‧架台 1a‧‧‧Rack

2‧‧‧保持裝置 2‧‧‧ Keeping device

3‧‧‧剝離裝置 3‧‧‧ peeling device

4‧‧‧檢測裝置 4‧‧‧Detection device

5‧‧‧按壓裝置 5‧‧‧ Pressing device

6‧‧‧控制裝置 6‧‧‧Control device

11‧‧‧索引機構 11‧‧‧ Indexing agency

31‧‧‧供給部 31‧‧‧Supply Department

31a‧‧‧送出捲軸 31a‧‧‧Send the reel

31b、34c‧‧‧捲軸旋轉機構 31b, 34c‧‧‧ reel rotating mechanism

32‧‧‧轉換部 32‧‧‧Transition Department

33‧‧‧剝離部 33‧‧‧ peeling department

33a‧‧‧剝離頭 33a‧‧‧ peeling head

33b、35、54、356‧‧‧壓缸 33b, 35, 54, 356‧ ‧ pressure cylinder

33c~33g‧‧‧導引輥 33c~33g‧‧‧guide roller

34‧‧‧捲取部 34‧‧‧Winding Department

34a‧‧‧捲取捲軸 34a‧‧‧Reel

34b‧‧‧捲軸升降機構 34b‧‧‧Reel lifting mechanism

41~44‧‧‧CCD攝像機 41~44‧‧‧CCD camera

43a、44a‧‧‧反射面 43a, 44a‧‧‧reflecting surface

45~48‧‧‧臂 45~48‧‧‧ Arm

49‧‧‧攝像機驅動機構 49‧‧‧Camera drive mechanism

51‧‧‧真空處理室 51‧‧‧vacuum processing room

52‧‧‧加壓頭 52‧‧‧ Pressing head

52a、511‧‧‧保護構件 52a, 511‧‧‧ protective components

53‧‧‧升降機構 53‧‧‧ Lifting mechanism

55‧‧‧減壓泵浦 55‧‧‧Relief pump

56‧‧‧真空計 56‧‧‧ Vacuum gauge

100‧‧‧保持部 100‧‧‧ Keeping Department

200‧‧‧支柱部 200‧‧‧ Pillars

300‧‧‧定位部 300‧‧‧ Positioning Department

310‧‧‧載置部 310‧‧‧Loading Department

311‧‧‧X-Y-θ平台 311‧‧‧X-Y-θ platform

312、320、330、340‧‧‧軸部 312, 320, 330, 340‧‧‧ shaft

313‧‧‧可動台 313‧‧‧ movable table

313a、313b‧‧‧槽 313a, 313b‧‧‧ slots

314‧‧‧伸縮囊 314‧‧‧ telescopic bladder

315‧‧‧滑輪 315‧‧‧ pulley

321、331、345‧‧‧旋轉軸 321,331,345‧‧‧Rotary axis

322、332‧‧‧偏心輥 322, 332‧ ‧ eccentric roller

323、333、346‧‧‧電樞 323, 333, 346‧‧‧ armature

341‧‧‧上旋轉軸 341‧‧‧Upper axis

342‧‧‧滑輪 342‧‧‧ pulley

343‧‧‧正時皮帶 343‧‧‧ Timing belt

344‧‧‧伸縮囊聯結器 344‧‧‧ Telescopic bladder coupling

345‧‧‧下旋轉軸 345‧‧‧lower axis of rotation

350‧‧‧鎖定部 350‧‧‧Locking Department

351‧‧‧制動器板 351‧‧‧ brake plate

352‧‧‧制動器 352‧‧‧ brake

353‧‧‧升降軸 353‧‧‧ lifting shaft

354‧‧‧彈簧 354‧‧ ‧ spring

355、525‧‧‧被按壓部 355, 525‧‧‧ pressed parts

400‧‧‧驅動部 400‧‧‧ Drive Department

410‧‧‧固定平台 410‧‧‧Fixed platform

420、430、440‧‧‧離合器 420, 430, 440 ‧ ‧ clutch

421、431、441‧‧‧線圈 421, 431, 441‧‧ ‧ coil

422、432、442‧‧‧轉子 422, 432, 442‧‧ ‧ rotor

450、460、470‧‧‧馬達 450, 460, 470‧‧ motor

500‧‧‧吸附部 500‧‧‧Adsorption Department

510‧‧‧吸附平板 510‧‧‧Adsorption plate

512、526‧‧‧配管 512, 526‧‧‧ piping

520‧‧‧三向閥 520‧‧‧Three-way valve

521‧‧‧內管部 521‧‧‧Inside Department

522‧‧‧上側閥 522‧‧‧Upper valve

523‧‧‧下側閥 523‧‧‧Bottom valve

524‧‧‧連桿 524‧‧‧ Connecting rod

527‧‧‧按壓部 527‧‧‧ Pressing Department

530‧‧‧吸附泵浦 530‧‧‧Adsorption pump

610‧‧‧平台控制部 610‧‧‧ Platform Control Department

620‧‧‧記憶部 620‧‧‧Memory Department

624‧‧‧計算部 624‧‧‧ Calculation Department

630‧‧‧時序控制部 630‧‧‧Sequence Control Department

640‧‧‧輸出入界面 640‧‧‧output interface

650‧‧‧剝離控制部 650‧‧‧Dismanence Control Department

651‧‧‧頭控制部 651‧‧‧ head control department

652‧‧‧旋轉控制部 652‧‧‧Rotation Control Department

653‧‧‧升降控制部 653‧‧‧ Lift Control Department

660‧‧‧位置檢測部 660‧‧‧Location Detection Department

661‧‧‧攝像機驅動部 661‧‧‧Camera Drive Department

662‧‧‧攝像控制部 662‧‧‧Video Control Department

663‧‧‧三點抽出部 663‧‧‧Three points of withdrawal

664‧‧‧重心計算部 664‧‧‧ Center of Gravity Calculation

665‧‧‧斜率計算部 665‧‧‧Slope calculation department

670‧‧‧定位控制部 670‧‧‧ Positioning Control Department

671‧‧‧離合器控制部 671‧‧‧Clutch Control Department

672‧‧‧定位運算部 672‧‧‧Location Computing Department

673‧‧‧馬達控制部 673‧‧ ‧Motor Control Department

680‧‧‧真空控制部 680‧‧‧ Vacuum Control Department

681‧‧‧處理室控制部 681‧‧‧Process Room Control Department

682‧‧‧減壓控制部 682‧‧‧Decompression Control Department

683‧‧‧真空運算部 683‧‧‧ Vacuum Computing Department

683a‧‧‧電壓判定部 683a‧‧‧Voltage Judgment Department

683b‧‧‧式選擇部 683b‧‧‧Selection Department

683c‧‧‧壓力運算部 683c‧‧‧Pressure Computing Department

684‧‧‧閥控制部 684‧‧‧Valve Control Department

685‧‧‧按壓控制部 685‧‧‧Press Control Department

第1圖為顯示本發明之一實施形態的全體構成之概略俯視圖。 Fig. 1 is a schematic plan view showing the overall configuration of an embodiment of the present invention.

第2圖為顯示第1圖的實施形態之保持裝置的縱向剖面圖。 Fig. 2 is a longitudinal sectional view showing a holding device of the embodiment of Fig. 1.

第3圖為顯示第2圖的保持裝置之保持部及吸附部的立體圖。 Fig. 3 is a perspective view showing a holding portion and an adsorption portion of the holding device of Fig. 2;

第4圖為顯示第1圖的實施形態之定位部的縱向剖面圖。 Fig. 4 is a longitudinal sectional view showing a positioning portion of the embodiment of Fig. 1.

第5圖為顯示第4圖的定位部之X方向及Y方向的定位之俯視圖。 Fig. 5 is a plan view showing the positioning of the positioning portion of Fig. 4 in the X direction and the Y direction.

第6圖為顯示第4圖的定位部之θ方向的定位之俯視圖。 Fig. 6 is a plan view showing the positioning of the positioning portion in the θ direction of Fig. 4;

第7圖為顯示第4圖的定位部之鎖定部的鎖定解除時之縱向剖面圖。 Fig. 7 is a longitudinal cross-sectional view showing the unlocking of the lock portion of the positioning portion in Fig. 4;

第8圖為顯示第7圖的鎖定時之縱向剖面圖。 Fig. 8 is a longitudinal sectional view showing the locking of Fig. 7.

第9圖為第7圖的俯視圖。 Figure 9 is a plan view of Figure 7.

第10圖為顯示第1圖的實施形態之壓合部的吸附時之縱向剖面圖。 Fig. 10 is a longitudinal cross-sectional view showing the nip of the embodiment of Fig. 1 when it is adsorbed.

第11圖為顯示第10圖之壓合部的吸附開放時之縱向剖面圖。 Fig. 11 is a longitudinal sectional view showing the adsorption opening of the nip portion of Fig. 10;

第12圖為顯示第10圖的三向閥(A)、第11圖的三向閥(B)之縱向剖面圖。 Fig. 12 is a longitudinal sectional view showing the three-way valve (A) of Fig. 10 and the three-way valve (B) of Fig. 11.

第13圖為顯示第1圖的實施形態之剝離裝置(第1單元)的側視圖。 Fig. 13 is a side view showing the peeling device (first unit) of the embodiment of Fig. 1.

第14圖為第13圖的俯視圖。 Fig. 14 is a plan view of Fig. 13.

第15圖為第13圖的後視圖。 Figure 15 is a rear view of Figure 13.

第16圖為顯示第1圖的實施形態之剝離裝置(第2單元)的側視圖。 Fig. 16 is a side view showing the peeling device (second unit) of the embodiment of Fig. 1.

第17圖為顯示依據第13圖的剝離裝置所進行之剝離的說明圖。 Fig. 17 is an explanatory view showing peeling by the peeling device according to Fig. 13.

第18圖為顯示依據第16圖的剝離裝置所進行之剝離的說明圖。 Fig. 18 is an explanatory view showing peeling by the peeling device according to Fig. 16.

第19圖為顯示依據以往的剝離裝置所進行之下側的剝離(A)(B)、上側的剝離(C)(D)之說明圖。 Fig. 19 is an explanatory view showing peeling (A) (B) and peeling (C) (D) on the lower side by the conventional peeling apparatus.

第20圖為顯示第1圖的實施形態之檢測裝置的立體圖。 Fig. 20 is a perspective view showing the detecting device of the embodiment of Fig. 1.

第21圖為顯示第20圖的檢測裝置之側視圖。 Figure 21 is a side view showing the detecting device of Figure 20.

第22圖為顯示第20圖的檢測裝置之同軸照射照明的 感光之說明圖。 Figure 22 is a view showing the coaxial illumination illumination of the detecting device of Figure 20 Photographic illustration.

第23圖為顯示第1圖的實施形態之按壓裝置的真空處理室上升時之縱向剖面圖。 Fig. 23 is a longitudinal sectional view showing a state in which the vacuum processing chamber of the pressing device of the embodiment of Fig. 1 is raised.

第24圖為顯示第23圖之按壓裝置的真空處理室下降時之縱向剖面圖。 Fig. 24 is a longitudinal sectional view showing the vacuum processing chamber of the pressing device of Fig. 23 as it descends.

第25圖為顯示第23圖之按壓裝置的加壓頭下降時之縱向剖面圖。 Fig. 25 is a longitudinal sectional view showing the pressing head of the pressing device of Fig. 23 as it descends.

第26圖為顯示第1圖的實施形態之控制裝置的功能方塊圖。 Fig. 26 is a functional block diagram showing a control device of the embodiment of Fig. 1.

第27圖為顯示第26圖的真空運算部之功能方塊圖。 Fig. 27 is a functional block diagram showing the vacuum calculation unit of Fig. 26.

第28圖為顯示第1圖的實施形態之定位步驟的流程圖。 Fig. 28 is a flow chart showing the positioning procedure of the embodiment of Fig. 1.

第29圖為顯示第1圖的實施形態之定位步驟的說明圖。 Fig. 29 is an explanatory view showing a positioning step of the embodiment of Fig. 1.

第30圖為顯示第1圖的實施形態之貼合步驟的流程圖。 Fig. 30 is a flow chart showing the bonding step of the embodiment of Fig. 1.

第31圖為顯示以往之表示出依據真空計所測定之檢測電壓與壓力的關係之表格的說明圖。 Fig. 31 is an explanatory view showing a table showing the relationship between the detected voltage and the pressure measured by a vacuum gauge.

第32圖為將第31圖的表格予以圖表化之說明圖。 Fig. 32 is an explanatory view showing a table of Fig. 31.

第33圖為顯示本實施形態之表示出依據真空計所測定之檢測電壓與壓力的關係之圖表的說明圖。 Fig. 33 is an explanatory view showing a graph showing the relationship between the detected voltage and the pressure measured by the vacuum gauge according to the embodiment.

第34圖為顯示第33圖的圖表之(1)區間的說明圖。 Fig. 34 is an explanatory diagram showing a section (1) of the graph of Fig. 33.

第35圖為顯示第33圖的圖表之(2)區間的說明圖 。 Figure 35 is an explanatory diagram showing the interval of (2) of the graph of Fig. 33 .

第36圖為顯示第33圖的圖表之(3)區間的說明圖。 Fig. 36 is an explanatory view showing a section (3) of the graph of Fig. 33.

第37圖為顯示使用本發明之接著劑的塗佈裝置時之一實施形態的簡略俯視圖。 Fig. 37 is a schematic plan view showing an embodiment of a coating apparatus using the adhesive of the present invention.

第38圖為顯示其他檢測裝置的一例之縱向剖面圖。 Figure 38 is a longitudinal sectional view showing an example of another detecting device.

第39圖為顯示其他檢測裝置的一例之縱向剖面圖。 Fig. 39 is a longitudinal sectional view showing an example of another detecting device.

第40圖為顯示貼合之工件的一例之說明圖。 Fig. 40 is an explanatory view showing an example of a workpiece to be bonded.

第41圖為顯示第40圖的對位例之說明圖。 Fig. 41 is an explanatory view showing a registration example of Fig. 40;

第42圖為顯示第40圖的實施形態之定位步驟的說明圖。 Fig. 42 is an explanatory view showing a positioning step of the embodiment of Fig. 40;

1‧‧‧旋轉台 1‧‧‧Rotary table

1a‧‧‧架台 1a‧‧‧Rack

300‧‧‧定位部 300‧‧‧ Positioning Department

310‧‧‧載置部 310‧‧‧Loading Department

311‧‧‧X-Y-θ平台 311‧‧‧X-Y-θ platform

312、320、330、340‧‧‧軸部 312, 320, 330, 340‧‧‧ shaft

313‧‧‧可動台 313‧‧‧ movable table

313a、313b‧‧‧槽 313a, 313b‧‧‧ slots

314‧‧‧伸縮囊 314‧‧‧ telescopic bladder

315‧‧‧滑輪 315‧‧‧ pulley

321、331、345‧‧‧旋轉軸 321,331,345‧‧‧Rotary axis

322、332‧‧‧偏心輥 322, 332‧ ‧ eccentric roller

323、333、346‧‧‧電樞 323, 333, 346‧‧‧ armature

341‧‧‧上旋轉軸 341‧‧‧Upper axis

342‧‧‧滑輪 342‧‧‧ pulley

343‧‧‧正時皮帶 343‧‧‧ Timing belt

344‧‧‧伸縮囊聯結器 344‧‧‧ Telescopic bladder coupling

345‧‧‧下旋轉軸 345‧‧‧lower axis of rotation

350‧‧‧鎖定部 350‧‧‧Locking Department

351‧‧‧制動器板 351‧‧‧ brake plate

352‧‧‧制動器 352‧‧‧ brake

353‧‧‧升降軸 353‧‧‧ lifting shaft

354‧‧‧彈簧 354‧‧ ‧ spring

355、525‧‧‧被按壓部 355, 525‧‧‧ pressed parts

356‧‧‧壓缸 356‧‧‧pressure cylinder

400‧‧‧驅動部 400‧‧‧ Drive Department

410‧‧‧固定平台 410‧‧‧Fixed platform

420、430、440‧‧‧離合器 420, 430, 440 ‧ ‧ clutch

421、431、441‧‧‧線圈 421, 431, 441‧‧ ‧ coil

422、432、442‧‧‧轉子 422, 432, 442‧‧ ‧ rotor

450、460、470‧‧‧馬達 450, 460, 470‧‧ motor

500‧‧‧吸附部 500‧‧‧Adsorption Department

510‧‧‧吸附平板 510‧‧‧Adsorption plate

511‧‧‧保護構件 511‧‧‧protective components

S1‧‧‧工件 S1‧‧‧ workpiece

Claims (12)

一種貼合裝置,為貼合構成顯示裝置之一對工件的貼合裝置,其特徵為:具有:因應複數個作業位置而間歇地旋轉之旋轉台;及於前述旋轉台上設置有複數個,並保持一對工件之保持裝置;及設置於前述保持裝置,並將一對工件的至少一方予以定位之定位部;以及藉由彈壓前述保持裝置之一對工件的至少一方,來貼合一對工件之按壓裝置;前述按壓裝置,係具有:能夠將前述定位部之保持工件的部分予以收納之真空處理室;該貼合裝置具有:將與前述真空處理室內的壓力因應的電壓值輸出之真空計;記憶電壓值以及用以計算出對應於此之壓力值的複數個多項近似式之記憶部;根據記憶於前述記憶部之電壓值及多項近似式,選擇對應於來自前述真空計的電壓值之多項近似式的式選擇部;以及根據所選擇之多項近似式來計算出壓力值之壓力運算部。 A laminating device is a laminating device for laminating one of a display device and a workpiece, and is characterized in that: a rotating table that intermittently rotates according to a plurality of working positions; and a plurality of rotating tables are provided And holding a pair of workpiece holding devices; and positioning portions provided on the holding device to position at least one of the pair of workpieces; and attaching a pair of at least one of the workpieces by one of the holding devices a pressing device for a workpiece; the pressing device having: a vacuum processing chamber capable of accommodating a portion of the positioning portion that holds a workpiece; the bonding device having a vacuum that outputs a voltage value corresponding to a pressure in the vacuum processing chamber a memory voltage value and a memory portion for calculating a plurality of multiple approximations corresponding to the pressure value; selecting a voltage value corresponding to the vacuum gauge from the voltage value and the plurality of approximations stored in the memory portion a formula selection unit of a plurality of approximate expressions; and a pressure calculation unit that calculates a pressure value based on the selected plurality of approximate expressions. 如申請專利範圍第1項所記載之貼合裝置,其中前 述記憶部,在分割為複數區間的電壓值的每個區間,記憶多項近似式。 A laminating device as recited in claim 1, wherein the front The memory unit stores a multiple approximation equation for each of the voltage values divided into complex sections. 如申請專利範圍第1項所記載之貼合裝置,其中前述定位部,具有:具有與真空源連接的通氣路徑的吸附平板、以與前述通氣路徑連通的方式設置於前述吸附平板,藉由前述真空源,將一方的工件真空吸附於前述吸附平板的吸附孔、以及用來切換:前述通氣路徑連通於真空源的狀態、與前述通氣路徑連通於真空處理室的狀態之閥;前述保持裝置,在前述吸附平板的工件的相對向的位置,具有用來保持另一方的工件的保持部。 The bonding apparatus according to claim 1, wherein the positioning unit includes an adsorption flat plate having a ventilation path connected to a vacuum source, and is disposed on the adsorption flat plate so as to communicate with the ventilation path. a vacuum source that vacuum-adsorbs one workpiece to an adsorption hole of the adsorption plate and a valve for switching between a state in which the ventilation path communicates with a vacuum source and a state in which the ventilation path communicates with the vacuum processing chamber; and the holding device At a position facing the workpiece of the suction flat plate, there is a holding portion for holding the other workpiece. 如申請專利範圍第3項所記載之貼合裝置,其中具有:根據藉由前述壓力運算部所運算的壓力值,來將前述閥的開閉進行控制的閥控制部。 The bonding apparatus according to claim 3, further comprising: a valve control unit that controls opening and closing of the valve based on a pressure value calculated by the pressure calculating unit. 如申請專利範圍第4項所記載之貼合裝置,其中具有:記憶成為使前述閥控制部用以切換前述閥之臨限值的閥用壓力值之閥用壓力值記憶部。 The bonding apparatus according to claim 4, further comprising: a valve pressure value storage unit that stores a valve pressure value for causing the valve control unit to switch the threshold value of the valve. 如申請專利範圍第3項所記載之貼合裝置,其中前述閥,具有:垂直方向的內管部、設置成可於前述內管部內升降的連桿、設置於前述連桿,藉由前述連桿的升降,將前述真空源與前述通氣路徑的連通進行開閉的閥、 以及設置於前述連桿,藉由前述連桿的升降,將前述真空處理室與前述通氣路徑的連通進行開閉的閥。 The bonding apparatus according to claim 3, wherein the valve has an inner tube portion in a vertical direction, a connecting rod that is provided to be movable up and down in the inner tube portion, and a connecting rod provided on the connecting rod. a lifting and lowering of the rod, a valve for opening and closing the communication between the vacuum source and the ventilation path, And a valve provided on the link to open and close the communication between the vacuum processing chamber and the air passage by the raising and lowering of the link. 如申請專利範圍第6項所記載之貼合裝置,其中具有:與前述旋轉台獨立設置的固定平台、以及設置於前述固定平台,藉由按壓進行前述閥的切換的按壓部。 The bonding apparatus according to claim 6, comprising: a fixing platform provided separately from the rotating table; and a pressing portion provided on the fixed platform and switching the valve by pressing. 如申請專利範圍第3項所記載之貼合裝置,其中在前述吸附平板之與工件接觸的面,設置有:在彈性構件貼附多孔質的薄片的保護構件。 The bonding apparatus according to claim 3, wherein a protective member that adheres a porous sheet to the elastic member is provided on a surface of the adsorption flat plate that is in contact with the workpiece. 一種貼合裝置的控制方法,為藉由控制裝置來控制貼合裝置而貼合一對工件之貼合裝置的控制方法,該貼合裝置係具有:因應複數個作業位置而間歇地旋轉之旋轉台;及於前述旋轉台上設置有複數個,並保持構成顯示裝置之一對工件的保持裝置;及設置於前述保持裝置,並將一對工件的至少一方予以定位之定位部;及藉由彈壓前述保持裝置之一對工件的至少一方,來貼合一對工件之按壓裝置;及設置於前述按壓裝置,能夠將前述定位部之保持工件的部分予以收納之真空處理室;以及設置於前述真空處理室內之真空計;其特徵為:前述控制裝置,係具有:記憶部、式選擇部、及壓力運算部;前述記憶部,記憶電壓值以及用以計算出對應於此之壓力值的複數個多項近似式;前述式選擇部,根據記憶於前述記憶部之電壓值及多 項近似式,選擇對應於來自前述真空計的電壓值之多項近似式;前述壓力運算部,根據所選擇之多項近似式來計算出壓力值。 A control method of a bonding apparatus is a control method of a bonding apparatus for bonding a pair of workpieces by controlling a bonding apparatus, wherein the bonding apparatus has a rotation that intermittently rotates in response to a plurality of working positions And a plurality of holding means for holding the workpiece on the rotating table; and a positioning means for arranging the holding means and positioning at least one of the pair of workpieces; and a pressing device that presses one of the holding devices to at least one of the workpieces to bond the pair of workpieces; and a vacuum processing chamber that is provided in the pressing device to accommodate a portion of the positioning portion that holds the workpiece; and a vacuum gauge in a vacuum processing chamber; the control device includes: a memory unit, a formula selection unit, and a pressure calculation unit; the memory unit, a memory voltage value, and a plurality of values for calculating a pressure value corresponding thereto a plurality of approximation formulas; the above-mentioned formula selection unit is based on the voltage value stored in the memory portion and The term approximation formula selects a plurality of approximation formulas corresponding to voltage values from the vacuum gauge; the pressure calculation unit calculates a pressure value based on the selected plurality of approximation formulas. 如申請專利範圍第9項所記載之貼合裝置的控制方法,其中前述記憶部,在分割為複數區間的電壓值的每個區間,記憶多項近似式。 The control method of the bonding apparatus according to claim 9, wherein the memory unit stores a multiple approximation formula in each of the sections divided into voltage values of the complex section. 如申請專利範圍第9項所記載之貼合裝置的控制方法,其中前述貼合裝置具有:吸附部、閥、以及控制前述閥的閥控制部;前述吸附部,具有與真空源及真空處理室連通的通氣路徑,將與前述定位部的工件相對向之工件真空吸附;前述閥,用來切換:前述通氣路徑連通於真空源的狀態、與前述通氣路徑連通於真空處理室的狀態;前述閥控制部,根據藉由前述壓力運算部所運算的壓力值,來將前述閥的開閉進行控制。 The method of controlling a bonding apparatus according to claim 9, wherein the bonding apparatus includes: an adsorption unit, a valve, and a valve control unit that controls the valve; and the adsorption unit has a vacuum source and a vacuum processing chamber. a communication path that is vacuum-absorbed to the workpiece facing the workpiece of the positioning portion; the valve is configured to switch between a state in which the ventilation path communicates with the vacuum source and a state in which the ventilation path communicates with the vacuum processing chamber; The control unit controls opening and closing of the valve based on a pressure value calculated by the pressure calculation unit. 如申請專利範圍第11項所記載之貼合裝置的控制方法,其中前述閥控制部,在藉由前述壓力運算部所運算的壓力值,成為預先記憶的臨限值的閥用壓力值的情況,則將前述閥控制成:前述通氣路徑連通於真空處理室的狀態。 The control method of the bonding apparatus according to claim 11, wherein the valve control unit is a valve pressure value that is stored in advance as a threshold value by a pressure value calculated by the pressure calculation unit. Then, the valve is controlled such that the aforementioned ventilation path communicates with the vacuum processing chamber.
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CN102937754A (en) 2013-02-20
KR20110065508A (en) 2011-06-15

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