JP2002023851A - Method for aligning plural members and device for the same - Google Patents

Method for aligning plural members and device for the same

Info

Publication number
JP2002023851A
JP2002023851A JP2000205405A JP2000205405A JP2002023851A JP 2002023851 A JP2002023851 A JP 2002023851A JP 2000205405 A JP2000205405 A JP 2000205405A JP 2000205405 A JP2000205405 A JP 2000205405A JP 2002023851 A JP2002023851 A JP 2002023851A
Authority
JP
Japan
Prior art keywords
step
members
pattern
plurality
detected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2000205405A
Other languages
Japanese (ja)
Inventor
Tomoyuki Kubota
智之 久保田
Original Assignee
Canon Inc
キヤノン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc, キヤノン株式会社 filed Critical Canon Inc
Priority to JP2000205405A priority Critical patent/JP2002023851A/en
Publication of JP2002023851A publication Critical patent/JP2002023851A/en
Application status is Withdrawn legal-status Critical

Links

Abstract

(57) [Summary] [PROBLEMS] To position and bond a plurality of members with high precision. SOLUTION: At least two or more alignment marks formed on a member are acquired by respective corresponding visual sensors, the positions thereof are detected, and based on the results, relative alignment marks of a plurality of members are determined. The movement amount of one of the members is calculated so that the displacement amount has a predetermined positional relationship. Alignment marks are detected by detecting an alignment mark formed on an actual member by pattern matching based on a previously registered master pattern immediately before bonding a plurality of members (S71). The positioning is performed by correcting the relative displacement between the bonding members determined here as a pattern (S81).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for aligning a plurality of members by pattern recognition while heating, and an apparatus for implementing the method.

[0002]

2. Description of the Related Art Conventionally, the positions of alignment marks attached to a plurality of members are obtained by pattern matching of image information captured by a visual sensor. For the detection by pattern matching, a method is used in which a correlation value with a pre-registered master pattern is obtained, and the correlation value exceeds a predetermined threshold value and a pattern having the highest correlation value is detected from the correlation values. Have been.

[0003]

However, in the above-described method, the alignment marks provided on the actual members are not aligned with the pattern center position when the mark shape varies from member to member as shown in FIG. Shifts in the position of the center of gravity, and the positioning accuracy deteriorates. If the variation is large, it will not be possible to find a pattern whose correlation value with a pre-registered pattern exceeds a predetermined threshold. If the threshold value is lowered, if there are a plurality of similar marks in the same image as shown in FIG. 25, or if there is dirt or the like attached in the previous process, it is difficult to distinguish them, and there is a risk of erroneous detection. is there. These are serious problems that high-precision positioning and high-precision bonding of a plurality of members cannot be performed.

[0004]

In order to solve the above-mentioned problems, an apparatus for aligning a plurality of members according to the present invention comprises a visual sensor corresponding to at least two or more alignment marks formed on the members. Detecting means for detecting the position and moving one of the members based on the position detected by the detecting means such that the relative displacement amounts of the alignment marks of the plurality of members have a predetermined positional relationship. Calculating means for calculating an amount, and control means for controlling the position of the one member in accordance with the movement amount calculated by the calculating means, wherein the detection of the alignment mark by the detecting means is performed immediately before the bonding of the plurality of members. Detecting an alignment mark formed on an actual member by pattern matching based on a previously registered master pattern, Mark the actual pattern, the control means, characterized in that the positioning obtained by correcting the relative positional deviation of the bonded member mutually determined from the actual pattern.

[0005] Preferably, the registration device for a plurality of members performs pattern matching in a state where the registration of the actual pattern is lower than the threshold value of the normal correlation value or the threshold value is eliminated.

Preferably, in the apparatus for positioning a plurality of members described above, when the registration of the actual pattern cannot be automatically performed, a predetermined number of candidate patterns having a large correlation value with the master pattern are detected. A pattern to be registered as an actual pattern can be selected from the candidates.

A method of aligning a plurality of members includes a step of detecting at least two or more alignment marks formed on the members by corresponding visual sensors and detecting the positions thereof; A calculating step of calculating a moving amount of one of the members based on the positions detected in the steps so that the relative displacement amounts of the alignment marks of the plurality of members have a predetermined positional relationship; and a moving amount calculated in the calculating step. And a control step of controlling the position of the one member according to the above. The detection of the alignment mark by the detection step is performed by pattern matching based on a previously registered master pattern immediately before bonding of a plurality of members. Detecting an alignment mark formed on the member and using the detected mark as an actual pattern; Characterized by positioning obtained by correcting the relative positional deviation of the bonding members mutually determined from over emissions.

[0008] Preferably, the registration of the actual pattern in the above-described method of aligning a plurality of members is performed by pattern matching in a state where the threshold value is lower than a normal correlation value threshold value or the threshold value is eliminated.

Preferably, when the registration of the actual pattern in the method for positioning a plurality of members is not automatically performed, a predetermined number of candidate patterns having a large correlation value with a master pattern are detected. A pattern to be registered as a real pattern can be selected from the candidates.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment in which the present invention is applied to the assembly of a panel used for a display will be described below with reference to the accompanying drawings.

<Description of Configuration to be Assembled> First, a panel to be assembled will be described with reference to FIGS. 3A and 3B show a panel (hereinafter, panel unit) 100 after assembly, and FIG. 3A shows a part of the frame 130 so that the inside of the panel unit 100 can be seen. 3 is a perspective view of the panel unit 100 shown in FIG.
FIG. 3B shows a cross section of the panel unit 100 at a location indicated by DD in FIG. These FIG. 3 (a),
As shown in (b), the panel unit 100 includes:
It is obtained by erecting a spacer 110 between the face panel 105 and the rear panel 120, sandwiching a frame 130 around the periphery, and bonding together. The spacer 110 is provided to prevent the face panel 105 and the rear panel 120 from breaking when the panel unit 100 is evacuated, and is set at a position that does not hinder the pixels. The face panel 105 and the rear panel 120 are formed with a diagonal size of 15 to 40 inches and a thickness of about 3 mm.
The spacer 110 has a thickness of 0.1 mm, a width of 40 mm, and a height of 4
mm.

Next, a face panel, a rear panel, and a jig used during assembly will be described with reference to FIG. FIG. 4A shows a jig 111 for erecting spacers 110 on the black stripe 104 at regular intervals.
4B shows the face panel 105, and FIG. 4C shows the rear panel 120.

An alignment mark M1 for detecting a position is provided on the face panel 105 on the face panel 105.
05 are formed at four corners. Alignment mark M1
As shown in the enlarged view, the display screen portion 102 on the same side as the surface on which is formed is coated with RGB (red, green, blue) phosphors 103 corresponding to one pixel. Glows when hit. In addition, there is a portion 104 (hereinafter, referred to as a black stripe) in which no pixel exists, and extends in the horizontal direction of the screen.

On the jig 111, a face panel 105
An alignment mark M2 having a shape different from that of the upper alignment mark M1 is formed. This alignment mark M2 is provided on the face panel 105 by the spacer 110.
Are alignment marks for aligning. The positional relationship between the alignment marks M1 and M2 and the pixels is clear, and therefore, the positional relationship between the alignment marks M1 and M2 after assembly is also clear. Here, the positional relationship of the alignment marks M1 and M2 after assembly is formed so as not to overlap due to thermal expansion during a heating process for bonding.

An alignment mark M2 having the same shape as the jig 111 is also formed on the rear panel 120. Further, on the display screen portion 122 on the same side as the surface on which the alignment mark M2 is formed, conductive lines 123 are stacked in a grid pattern, and an insulating film (not shown) is provided between the vertical lines 123a and the horizontal lines 123b. Is provided. Further, in a portion surrounded by the conductive line 123, there is a light emitting element (not shown) connected to the conductive line 123. When a potential difference occurs, electrons jump out of the light emitting element and the phosphor 1 of the face panel 105
03, the phosphor 103 is illuminated.

FIG. 5A shows alignment marks M1 and M
2 shows an example.

M1 and M2 have different shapes that can be distinguished by pattern recognition. Further, each alignment mark is composed of a plurality of marks of the same shape whose area slightly increases stepwise from the upper left. Therefore, the center position of the alignment mark (a plurality of marks) can be estimated from the area of the detected mark.
The plurality of marks are provided so as to be parallel to the panel and so that the center positions of the plurality of marks coincide with each other so that the angle of the panel can be calculated from the marks. Further, as shown in FIG.
Even if 1 and M2 overlap, all of the plurality of marks constituting the alignment mark are formed so as not to overlap. Further, the marks are marked in a sufficiently wide range with respect to the visual field range of a visual sensor such as a CCD camera, and with respect to the printing error of the marks and the variation range of the mark positions in the initial member setting.

<Schematic Description of Laminating (Assembly) Step> The face panel 105, the spacer 110, and the rear panel 120 have been individually described above. These laminating steps will be described in detail later. explain.

FIG. 6 is an enlarged view of a portion of the face panel 105 where the spacer is erected. As shown in FIG. 6, when the spacer 110 is erected on the face panel 105, the black stripe 10
4 to be erected. That is, in the step of erecting the spacer, only the accuracy in the Y-axis direction is required, and the accuracy in the X-axis direction is not important.

The adhesive 106 for erecting the spacer 110 is made of a material similar to glass, and does not degas when the inside of the panel unit 100 is evacuated. Note that, in this embodiment, melting at around 400 ° C.
An adhesive (hereinafter referred to as a frit) 106 called a frit that solidifies at around 0 ° C. is used.

When the face panel 105 on which the spacers 110 are erected and the rear panel 120 are bonded together, a frit 106 ′ similar to the frit 106 but having a different melting point and solidification point is used. This is to prevent the plasticity of the once-fixed frit 106 from being deformed when the face panel 105 and the rear panel 120 are bonded together.

<Description of Assembling Apparatus> Next, referring to FIG.
An assembling apparatus that realizes the above-described assembling will be described.

A face panel 105 (FIG. 4B) is attached to the upper hot plate 1. At this time,
The face panel 105 is attached to the upper hot plate 1 with the surface on which the alignment mark M1 is formed facing downward in FIG.
Is warmed from room temperature to 440 ° C. Further, the upper hot plate 1 is attached to the vertical drive unit 13 and
It is driven up and down by a C motor 26 (FIG. 1).

The lower hot plate 2 has a spacer 11
In the process of erecting 0 on the face panel 105, the jig 1
11 is attached, and the rear panel 120 is attached in the step of bonding with the rear panel 120. The jig 111 (FIG. 4A) and the rear panel 120 (FIG. 4C) are attached to the lower hot plate 2 such that the surface on which the alignment mark M2 is formed faces upward in FIG. . The temperature of the lower hot plate 2 is controlled in synchronization with the upper hot plate 1, which will be described in detail later.

The lower hot plate 2 is attached to an XYθ table 10 composed of an X table 10a, a Y table 10b, and a θ table 10c.
Driven in the X, Y, and θ directions by the C motor 26, the face panel 1 attached to the upper hot plate 1
05 is aligned. This alignment is performed by aligning the alignment mark M1 attached to the face panel 105 with the alignment mark M2 formed on the jig 111 and the rear panel 120.
20, four CCD cameras (hereinafter, referred to as cameras) 3, which are arranged corresponding to the four corners and mounted on the XY stage, respectively.
Detected by 4, 5 and 6, 4 CCD cameras 3 to 6
After moving the XY stages 621 to 624 so that the alignment mark M1 attached to the face panel 105 is located at the center of the visual field range, the alignment marks M1 and M2 are set to have a predetermined positional relationship. Done.

It should be noted that the camera 3 is set to channel 1 (ch).
1), camera 4 side is channel 2 (ch2), camera 5
Side is channel 3 (ch3) and the camera 6 side is channel 4 (ch4).
This will be described as ch4. Lighting 7 is for cameras 3, 4,
Reference numerals 5 and 6 denote transmissive illumination for enabling the alignment marks M1 and M2 to be detected.

A face panel 105 to be attached to the upper hot plate 1 and a spacer jig 111 or a rear panel 120 to be attached to the lower hot plate 2
The displacement sensors 8a and 8b for detecting the height position of the camera are fixed to positions where they are not affected by heat, in this embodiment, a mount for the CCD camera. These sensors 8a, 8
The value read by b is transmitted to the robot control device 24 via the sensor controller 9 (FIG. 1). <Description of Control System> Next, referring to FIG. explain.

The control system 20 has four cameras 3,
The four monitors 21 for inputting and displaying respective image data from 4, 5, and 6, and the alignment marks M1 and M2 are extracted from the image data, and the amount of misalignment between the face panel 105, the jig 111, and the rear panel 120 is calculated. , An image processing device 23 for calculating a correction amount, a robot control device 24 for performing positioning control of the lower hot plate 2 and bonding (up and down driving) control of the upper hot plate 1, and an operation program of the robot control device 24 Computer 22 for editing, executing, and teaching operations, a temperature controller 25 for controlling the temperatures of the upper hot plate 1 and the lower hot plate 2, and a stage for controlling the position of the XY stage for moving the CCD cameras 3-6. It has a control device 26.

The four cameras 3, 4, which are arranged in the assembling apparatus so as to avoid the XYθ table 10 and are arranged at four corners facing upward from directly below the lower hot plate 2.
Reference numerals 5 and 6 denote monitors 21 for displaying captured images.
, And also to an input terminal of the image processing device 23. The image data taken into the image processing device 23 is converted into an XY coordinate system on the XYθ table 10 by a coordinate conversion coefficient and a calibration value, and is processed according to an image processing program.

The image processing device 23 includes a serial I / F 20
2, a command is received from the robot controller 24 via the CPU 181, and the CPU 181 performs an arithmetic operation on image data corresponding to the command based on the data on the RAM 183 according to a program written on the ROM 182. Processing from image capture to data processing is performed in response to a processing command sent from the robot controller 24 via serial communication.

The robot controller 24 is connected to the XYθ table 10 and each of the NC motors 26 of the vertical drive unit 13 and controls the entire operation procedure.
0 and a temperature control device 2 for controlling the position of the robot in accordance with an instruction from the main control unit 200.
5 comprises a serial I / O board 400 for performing serial I / O communication with the I / O board 500 in the apparatus.

The main control unit 200 operates when the CPU 201
It executes according to the program written on the OM 210 and controls the operation of the entire system based on the data on the RAM 220. Further, communication of processing commands and processing results with the image processing apparatus 23 is performed via serial communication. In addition,
Details of the contents of the ROM 210 and the RAM 220 will be described later.

Serial I / Fs 202, 203, 204,
Reference numeral 205 denotes a communication with the personal computer 22 that edits an operation program, edits an operation point, and the like;
Interface with the sensor controller 9 and the stage controller 26.

The serial I / O 206 is an interface for performing sensor input in the assembling apparatus, ON / OFF control of an LED, a solenoid, and the like, or communication with the temperature controller 25.

The position control unit 300 is connected to the NC motor 26 as a drive unit in the assembling apparatus and the encoder detector 27 of each motor 26, and rotates the motor 26 by a required amount in accordance with an instruction from the main control unit 200. Also, the origin sensor 28 and the overrun sensor (limit switch L
S) Based on the information from the sensors 29 and the like, the process of finding the origin and performing abnormal operation is performed.

The temperature control device 25 includes a heater 25A mounted in the upper and lower hot plates 1 and 2 and a temperature sensor 2
5B is connected, and while maintaining the temperature distribution in the upper and lower hot plates 1 and 2 at ± 5 ° C. or less, from normal temperature to 440 ° C.
Temperature rise / fall control is performed up to the vicinity.

The stage control device 26 receives a command from the robot control device 24 via the serial I / F 600 to control the position of the XY stages 621 to 624 for driving the four CCD cameras 3 to 6 and specifies the position. A command value is sent to the controllers 611 to 614 of the stage, and the operation is performed according to the command value.

Next, referring to FIGS. 7 (a) and 7 (b), the R provided in the main control unit 200 of the robot controller 24 will be described.
The contents of the OM 210 and the RAM 220 will be described. FIG.
FIG. 2A is a configuration diagram of a program stored in a ROM 210.

The multitask OS 211 is a multitask operating system program part.

The operation program interpretation and execution unit 212 is a program part for interpreting and executing an operation program described in a high-level language for the operation of the assembling apparatus. In the present embodiment, a Basic-like robot language is adopted as a high-level language.

The operation program editing unit 213 is a program part for editing the operation program of the assembling apparatus input by the personal computer 22A or the TP 22B as the input / output device.

The operation point teaching section 214 is a program portion for teaching operation points of the assembly apparatus input by the input / output devices 22A and 22B and editing point data.

The I / O output oscillating section 215 is connected to the input / output device 2
This is a program part for operating ON / OFF of the output of the I / O unit by 2A and 22B.

The I / O input monitoring unit 216 is connected to the input / output device 2
This is a program part for monitoring input information of the I / O unit by 2A and 22B.

The I / O attribute management section 217 is a part for managing I / O attributes.

Each of the program parts is a multitask O
The processing is performed by one CPU 201 in S211.

FIG. 7B is a configuration diagram of a program stored in the RAM 220.

The table operation program storage area 221 stores operation programs of the assembling apparatus.

The table teaching point storage area 222 stores the teaching points of the assembling apparatus.

The time management program storage area 223 contains
A time management program is stored.

The I / O assignment table storage area 224 stores the I / O assignment status.

The I / O data table storage area 225 stores input / output information data of the I / O unit and an input / output attribute table for selecting and specifying input or output.

The lead pitch conversion coefficient storage area 226 is
The lead pitch conversion coefficient for each of the XYθZ axes is stored.

<Master Pattern Registration> FIG. 24 shows master patterns (MP1 to MP7) in which a master pattern is registered for each shape. In the present embodiment, seven types of master patterns are registered.

<Description of Assembly Device Calibration Method> Next, a calibration method of the assembly device will be described with reference to FIGS. 8A to 10. For calibration, calculation of the lead pitch correction coefficient of the XYθ table 10, XY coordinates and XYθ of each of the four cameras 3, 4, 5, and 6
Calculation of coordinate conversion coefficients with XY coordinates in table 10 (deleted before) Calculation of optical axis inclination correction coefficients of cameras 3, 4, 5, 6 Each of four cameras 3, 4, 5, 6 And the XY coordinates of the XY stage corresponding to each camera are calculated.

FIG. 8A shows a glass calibration jig 132 for performing the above calibration. The calibration jig 132
As shown in FIG. 8A, at least three or more, here, five marks A1 to A5 are provided so as to fall within the field of view of each of the cameras 3, 4, 5, and 6. The positional relationship between the marks A1 to A5 is separately clarified in a measuring instrument. Calibration jig 1
First, the camera 32 is mounted near the position of the alignment mark on the actual panel of the upper hot plate 1 so that the mark A3 is positioned at the center of the field of view.
Adjust 4,5,6. At this time, the mounting portion of the calibration jig 132 is structured so that the position can be obtained mechanically with a certain degree of accuracy. In addition, the calibration jig 132 can be used one time or four times, and can be used simultaneously.

Next, the calibration jig 132 is mounted on the lower hot plate 2 and the following calibration is performed.

Correction of lead pitch of XYθ table 10 As shown in FIG.
The XY table is moved to a position where all of the marks A1 to A5 on the X. 32 are within the field of view. Next, marks A1
The number of pixels (VX0, VY0) between two marks (in the figure, A2 and A4 on the X axis and A1 and A5 on the Y axis) of two points parallel to the X axis and the Y axis of A5 are read by the camera 3, and The known distance data (X0, Y0) [unit: mm] between two points and the distance (SX, SY) per pixel from the pixel data are calculated by the equation (1). At the same time, the inclination θA of the line connecting the two points A2 and A4 is determined by equation (4).

Next, as shown in FIG. 8C, movement amounts VXT and VYT [number of pixels] when the XYθ table 10 is moved by a fixed distance TX and TY in the X direction and the Y direction, respectively, are obtained from the image data. The lead pitch conversion coefficient is derived from the ratio with the value by the equations (2) and (3). At the same time, the inclination θT of the movement locus of the mark is obtained by equation (5). Said,
The obtained inclination θT of the movement locus of the mark is the inclination of the table X axis, and is stored in the RAM 183 in the image processing device 23.

SX = X0 / VX0, SY = Y0 / VY0 (1) LPX = TX / (VXT · SX) · LPX0 (2) LPY = TY / (VYT · SY) · LPY0 (3) θA = arcTan (VYA / VXA) (4) θT = arcTan (VYT / VXT) (5) where LPX and LPY are the current X-axis and Y-axis lead pitch conversion coefficients.
The number of pixels of the movement amount when the table 10 is moved by TX and TY is VXT and VYT. The lead pitch conversion coefficient obtained here is used as a control parameter in the robot controller 24 as the lead pitch conversion coefficient storage area 22 of the RAM 220.
6 is stored. Thereby, the moving amount of the XYθ table 10 thereafter matches the image data (actually measured values).

Further, as shown in FIG. 8D, the angle difference θAT (= θ) between the two angles θA and θT calculated on the way is described.
A- [theta] T) is converted into position data of the five marks A1 to A5 in the table coordinate system using equations (6) and (7).

XTm = XAm · cosθAT−YAm · sinθAT (6) YTm = XAm · sinθAT + YAm · cosθAT (7) where m is an integer of 1 to 5 corresponding to marks A1 to A5.

Calculation of Coordinate Conversion Coefficient The calculation of the coordinate conversion coefficient will be described with reference to FIG. X
Table 10 is moved to a position where all of marks A1 to A5 provided on calibration jig 132 are within the field of view. At that position, image data (XVm, YVm) of the marks A1 to A5 is acquired from the camera 3. The position conversion data (XTm, YTm) of the marks A1 to A5 in the table coordinate system obtained with the obtained image data is substituted into an n-dimensional equation, and the coordinate transformation coefficient in the camera 3 is calculated by a known method of solving the equation. calculate. Repeat the above operation for the other three cameras 4,
In steps 5 and 6, the same operation is performed to obtain coordinate conversion coefficients.

The coordinate conversion coefficients obtained here are stored in the RAM 183 in the image processing device 23. Subsequent image data is obtained not by the number of pixels but by position data in the table coordinate system after coordinate conversion.

Correction of tilt of optical axis of CCD camera Correction of tilt of the optical axis of the cameras 3 to 6 will be described with reference to FIG. In FIG. 10, only one camera 3 is calibrated, but four cameras 3 to 6 are calibrated by the same operation.

The cameras 3 to 6 must be mounted vertically to the panels 105 and 120, but it is very difficult to mount them completely vertically in practice, and the cameras are slightly tilted. To correct the error due to the inclination,
The upper hot plate 1 to which the calibration jig 132 is attached is driven at two or more points in the upper and lower directions. The hot plate 1 at that time
Image data (Xk1, Yk) at each position data P1, P2
1), (Xk2, Yk2) (where k is the channel number), and from equations (8) and (9), the inclinations θkX and θkY of the camera optical axis are obtained.
Is obtained and registered in the RAM 183 as an image data correction value.

At the time of execution of bonding, the surface of the member on the lower hot plate 2 at room temperature is used as a reference surface, the height h 1 of the face panel 105 from the reference surface and the rear panel 12.
0 or the height h2 of the spacer jig 111 from the reference plane is detected, and the corrected values Xkh and Ykh of the image data are calculated by substituting into the equation (10), and the corrected image data obtained by adding Xkh and Ykh. Output x and y.

TanθkX = (Xk1-Xk2) / (P1-P2) (8) tanθkY = (Yk1-Yk2) / (P1-P2) (9) Xkh = hn · tanθkX, Ykh = hn · tanθkY ( 10) In the equation (10), n is the alignment mark shape M
1, M2.

Here, the position detection of the hot plate 1 is performed by distance sensors 8a and 8b attached to members independent of the hot plate and not affected by heat.

The reason why the height of the rear panel 120 or the spacer jig 111 from the reference plane is measured is that the height fluctuates due to thermal expansion.

Calculation of Coordinate Conversion Coefficients of XY Stage The calculation of the coordinate conversion coefficients of the XY stages 621 to 624 will be described with reference to FIG. In the case of calculating the coordinate conversion coefficient of the XYθ table 10, instead of moving the XYθ table 10, the XY stages 621 to 624 are moved,
Marks A1 to A on calibration jig 132 in stage coordinate system
The position data (XTm, YTm) of No. 5 is obtained, and the coordinate conversion coefficients are calculated in the same manner as described above. The above operation is similarly performed on the four XY stages 621 to 624 to obtain coordinate conversion coefficients. XY stages 621 to 62 found here
4 is stored in the RAM 18 in the image processing device 23.
3 is stored. Thus, when the camera is moved, the shift amount between the center coordinates of the alignment mark M1 and the center of the visual field of the cameras 3 to 6 can be obtained not by the number of pixels but by the position data in the stage coordinate system after the coordinate conversion.

<Description of Assembly Process> The assembly process will be described in detail below.

Here, the actual assembling process will be described by describing the process of erecting and mounting the spacer 110 on the face panel 105 and the process of attaching the face panel 105 to the rear panel 1.
The process of bonding the substrate with the substrate 20 will be described with reference to the flowcharts of FIGS. In both steps, [registration of actual pattern] is performed first. Details will be described later.

First, the spacer 1 is attached to the face panel 105.
The step of attaching 10 will be described.

At step S1, alignment mark M1
The face panel 105 is attached to the upper hot plate 1 with the surface on which is formed facing downward. At this point, the frit 106 is applied to the black stripe 104 of the face panel 105.

At step S2, alignment mark M2
A jig 111 for holding the spacer 110 with the surface on which the is formed facing upward is attached to the lower hot plate 2.

In step S3, the upper hot plate 1 is lowered, and positioned 1 mm above the position where the spacer 110 can be attached to the face panel 105.

In step S4, the face panel 105
The alignment is performed until the amount of displacement between the alignment marks M1 and M2 of the jig 110 becomes equal to or less than a predetermined value. This alignment will be described in detail with reference to FIG.

In step S 5, a start command for starting temperature control is issued from the robot controller 24 to the temperature controller 25 via the I / O 400.

In step S6, the displacement of the upper and lower panels is corrected for each sampling time. The position correction will be described later in detail with reference to FIG.

In step S7, the temperatures of the hot plates 1 and 2 are monitored. If the temperature is 360 ° C., the process proceeds to step S8, and if not, the process proceeds to step S9. This 360 ° C
Is the frit 10 used in the present embodiment.
6 is the temperature at which melting begins. Here, the method of acquiring the temperature is as follows.
When the temperature reaches ° C, an OUT signal is output, and the robot controller 24 receives a signal by I / O or a method of receiving the actual temperature by serial communication such as RS232C. In this embodiment, The time is measured in the robot controller 24, and the temperature is estimated from the elapsed time from the time when the temperature controller 25 was started. Hereinafter, the temperature monitoring step is performed in the same manner.

In step S8, the upper hot plate 1 is lowered to attach the spacer 110 to the face panel 105, and then the process returns to step S6. At this time, a constant load is applied to the upper hot plate 1.

In step S9, the temperatures of the hot plates 1 and 2 are monitored. The temperature of 440 ° C. is a temperature at which the frit 106 used in the present embodiment is completely solidified.

In step S10, the upper hot plate 1
Is raised to a height at which the spacer 110 comes out of the jig 110, and the position correction is stopped. Next, step S11
Move on to

In step S11, hot plates 1 and 2
Is monitored, and when it is confirmed that the temperature has dropped to the panel-removable temperature (50 ° C. in the present embodiment), the process proceeds to the next step.

In step S12, the upper hot plate 1
And this step is completed.

Next, a step of attaching the rear panel 120 to the face panel 105 to which the spacer 110 has been attached will be described with reference to FIG.

At step SS1, the face panel 105 is attached to the upper hot plate 1 with the surface on which the spacer 110 is attached facing downward. At this point, the spacer 11 is placed on the black stripe 104 of the face panel 105.
0 is set.

In step SS2, alignment mark M
The rear panel 120 is attached to the lower hot plate 2 with the upper side 2 facing upward. The rear panel 120 includes the spacer 11
The frit 106 'is painted on the portion where 0 hits.

In step SS3, the upper hot plate 1
And the face panel 105 and the rear panel 120
Are positioned 1 mm above the position where the spacer 110 and the rear panel 120 are brought into contact with each other.

At step SS4, the face panel 105
The alignment is performed until the amount of misalignment between the alignment marks M1 and M2 formed on the rear panel 120 and the rear panel 120 becomes equal to or smaller than a predetermined value. This alignment is described in detail in FIG.
Will be described later.

At step SS5, the robot controller 24
Then, a start command for starting temperature control is issued to temperature controller 25 via I / O 400.

In step SS6, the displacement of the upper and lower panels is corrected for each sampling time. The position correction will be described later in detail with reference to FIG.

In step SS7, hot plates 1 and 2
Is monitored. If the temperature is 410 ° C., the process proceeds to step SS8, and if not, the process proceeds to step SS9. This 41
The temperature of 0 ° C. is a temperature at which the frit 106 ′ used in the present embodiment starts to melt.

In step SS8, the upper hot plate 1
Is lowered, and the rear panel 120 and the spacer 110 are bonded to each other. At this time, a constant load is applied to the upper hot plate 1.

In step SS9, hot plates 1 and 2
Is monitored, and if it is 360 ° C., the process proceeds to step SS10, and if not, the process returns to step SS6. This 360
The temperature of ° C. is the frit 1 used in the present embodiment.
06 'begins to solidify as it falls from 410 ° C,
It is the temperature at which it completely solidifies.

At step SS10, the position correction is stopped, and the routine goes to step SS11.

In step SS11, hot plate 1
When the temperature of the panel No. 2 is monitored and it is confirmed that the temperature has dropped to the panel-removable temperature (50 ° C. in the present embodiment), the process proceeds to the next step.

In step SS12, the face panel 105 is released from the holding mechanism of the upper hot plate 1, and the upper hot plate 1 is raised, thus completing this process.

<Description of Position Adjustment Step> Next, in the above two steps (FIGS. 12 and 13), a description will be given of the initial position adjustment before the temperature is raised and the process from the temperature increase to the end of the bonding.

First, the image processing apparatus 2 shown in FIG.
3 will be described. RA
M183 is the storage area m1 of the position (Xn-1, Yn-1) of the previous alignment mark M1, M2, and the size L of the detection range (illustrated in FIG. 14B, 480 is the maximum in this embodiment). A storage area m2, a storage area m3 for the displacement coefficients (Xk, Yk) of the alignment marks M1 and M2 with respect to the temperature, and a current position of the alignment marks M1 and M2 (X
(n, Yn) storage areas m4 are provided, and each area stores data of each channel and each alignment mark. Further, as a common storage area, a storage area m5 of the previous work temperature Tn-1 and a current work temperature Tn
Storage area m6 is provided.

The initial value of each storage area is the area m1
Are (256, 240), the area m2 is 480, the areas m3 and m4 are (0, 0), and the areas m5 and m6 are 0. Here, the initial value (256, 240) of the area m1 is
Horizontal 512 which is the processing range of the screen acquired from cameras 3 and 4
Pixel, the center coordinates of 480 pixels vertically. In the initial stage, since the positions of the alignment marks M1 and M2 cannot be predicted at all, the value stored in the area m2 is set to the maximum value 480 of the processing range that can be set on the screen.

[Actual Pattern Registration] The registration process of the actual pattern will be described with reference to FIGS. 23A and 23B.

FIG. 24 shows a master pattern (MP0-M
P6), and one-to-one corresponds to all patterns existing in one camera channel field of view. In this embodiment, as shown in FIG. 5A, there are seven types of patterns attached to the plurality of members, and therefore, there are also seven types of master patterns (MP0 to MP6). FIG.
FIG. 4 is a diagram showing a shape of an alignment mark attached to one channel (ch) of one of a plurality of members to be actually bonded. The four patterns (JPch3 to JPch6) in the figure correspond to the master patterns MP4 to MP7. In this embodiment, since there are seven patterns in each of the four channels (ch = 0 to 3), a total of 28 patterns are registered.

FIG. 23A shows the automatic registration of the actual pattern.
The process of semi-automatic registration will be described with reference to FIG. 23B. FIG. 23A
Consists of the following steps.

In step S101, the registration number of the actual pattern
(Ptn) and the camera channel (ch) are cleared (ptn = 0, ch = 0).

In step S102, the camera channel is set to c.
Change to h.

At step S103, the master pattern No.
(Mptn) is cleared to 0.

In step S104, an alignment mark is detected by pattern matching with a master pattern MPmptn registered in advance.

The alignment mark detected in step S105 is shifted from the center of the mark by a predetermined range to the actual pattern JPch.
It is registered as mptn in an area different from the recording area of the master pattern in the RAM in the image processing apparatus.

The actual pattern registered in step S106 is binarized and the position of the center of gravity is calculated.

In step S107, an offset between the position of the center of gravity and the center of the pattern is calculated.

The offset calculated in step S108 is registered in the RAM in the image processing apparatus.

In step S109, the master pattern No.
(Mptn) is incremented.

In step S110, the registration number of the actual pattern
(Ptn) is incremented.

If registration has been completed for all seven types of shapes in step S111, the process proceeds to step S112, and if not completed, the process proceeds to step S104.

In step S112, the camera channel ch
Is incremented.

When the registration has been completed for all camera channels in step S113, the registration of the actual pattern ends.
If not completed, the process moves to step S102.

Next, semi-automatic actual pattern registration will be described with reference to FIG. 23B.

If the automatic registration of the actual pattern cannot be performed normally, the registration is performed semi-automatically by the following processing of FIG. 23B.

In step S121, the registration number of the actual pattern
(Ptn) and camera channel (ch) are cleared.
(Ptn = 0, ch = 0) In step S122, the camera channel is changed to ch.

In step S123, the master pattern No.
(Mptn) is cleared to 0.

By pattern matching with the master pattern MPmpnt registered in advance in step S124, a predetermined number of alignment marks are detected from all the ones whose correlation values exceed a predetermined threshold value or from those with high layer sensitivity. .

A plurality of alignment mark patterns detected in step S125 are displayed.

In step S126, among the candidates, the pattern having the highest correlation value is highlighted by thickening the frame.

In step S126, if the pattern is a pattern to be registered, the operator selects "register" and proceeds to the next step S128.
Is selected and the process moves to S126. At this time, the pattern to be emphasized (the next candidate) is the pattern having the next highest correlation value.

A predetermined range from the center of the alignment mark pattern selected in step S128 is registered as an actual pattern JPch mptn in an area different from the recording area of the master pattern in the RAM in the image processing apparatus.

The actual pattern registered in step S129 is binarized to calculate the position of the center of gravity.

In step S130, the offset between the position of the center of gravity and the center of the pattern is calculated.

[0130] The offset amount calculated in step S131 is registered in the RAM in the image processing apparatus.

At step S132, the master pattern No.
(Mptn) is incremented.

In step S133, the registration number of the actual pattern
(Ptn) is incremented.

If registration has been completed for all the shapes in step S134, the process proceeds to step S112, and if not completed, the process proceeds to step S124.

In step S135, the camera channel ch
Is incremented.

When the registration has been completed for all camera channels in step S136, the registration of the actual pattern is terminated.
If not completed, the process moves to step S122.

Here, in steps S126 and S127, the operator may do the following. The operator selects a pattern to be registered as an actual pattern from the plurality of alignment mark patterns detected in step S125 using a mouse or a cursor. Alternatively, a method is selected by inputting a number or the like, and the selected pattern is registered in step S128 and above.

During the bonding step, the registered real pattern (JPch0 to JPch6 (ch in this embodiment)
Is a channel number, and the position of the corresponding alignment mark is detected by pattern matching with 0 to 3) to perform the position alignment.

Conventionally, the mark detection during the bonding process has been performed by pattern matching with the master pattern. However, as shown in FIG. 25, the actual pattern is not as designed but deformed. Although it was sometimes detected, it is possible to eliminate any erroneous detection during the bonding process by registering the actual pattern in advance as described above and performing pattern matching with the registered actual pattern Becomes

[Initial Positioning] Initial positioning will be described with reference to FIG. Note that the following processing is basically performed by the CPU 181 of the image processing apparatus 23.

At step S21, the storage areas m1 to m6 of the RAM 183 in the image processing device 23 are initialized.

In step S22, the XY stages 261 to 264 on which the cameras 3 to 6 are mounted are moved so that the center of the alignment mark is located at the center of the camera's field of view.
The details will be described later in [Moving the camera XY stage].

In step S23, the current work temperature Tn
Is acquired from the temperature control device 25 via the robot control device 24.

In step S24, the previous position data (X
(n-1, Yn-1) is read from the area m1.

In step S25, the size L of the detection range is read from the area m2.

In step S26, the previous position data (X
(n-1, Yn-1) is set as a detection range in a range of L squares.

In step S27, each channel ch1,
In ch2, ch3 and ch4, the positions (pixel data) of the alignment marks M1 and M2 are detected by image correlation.

In step S28, a detection error is checked. If there is an error, the process proceeds to step S36, and if there is no error, the process proceeds to step S29.

In step S29, each detected position data is stored in the storage area m4 of the RAM 183.

In step S30, each position data is subjected to coordinate conversion from image data to data in a robot coordinate system according to the coordinate conversion coefficients calculated by calibration of the assembling apparatus.

In step S31, a rotation correction amount is calculated in the first step from each position data converted into the robot coordinate system, and an XY correction amount is calculated in the second step.
The XYθ table 10 is moved according to the correction amount. The movement control of the XYθ table 10 is performed by the robot controller 24. Details will be described in [Position Correction Method] described later. Here, the rotation correction and the XY correction are performed in the order described above, and both corrections are performed to complete one position correction.

In step S32, the previous position data stored in the area m1 is updated.

In step S33, the size L of the detected position stored in the area m2 is determined by using the alignment marks M1 and M2.
Set to a unique value.

In step S34, correction of the rotation direction, XY
If both corrections of the direction have been completed, the flow returns to S35; otherwise, the flow returns to s23.

In step S35, it is checked whether the positional accuracy is within a predetermined value. If it is within the predetermined value, the procedure goes to step S37. If not, the process returns to step S23.

In step S36, the size L of the detection range is increased to a predetermined size, and the process returns to step S25.

In step S37, the current work temperature Tn
Is set as the previous work temperature Tn-1, and the area m5 is updated.
Thus, the initial positioning is completed.

[Position Adjustment During Temperature Increase / Decrease] Next, position adjustment during temperature increase / decrease will be described with reference to FIGS.
FIG. 16 is a flowchart of a position correction method during temperature rise / fall, and FIG. 17 is a diagram showing processing contents. This process is also basically performed by the CPU 181 of the image processing device 23.

The frit 106 is once melted and then solidified to form the spacer 1 on the face panel 105.
10 is attached, and the face panel 105 in that state is attached to the rear panel 120. For this purpose, the hot plates 1 and 2 are heated by the temperature control device 25 and each panel 1 is heated.
05 and 120 and the jig 111 are heated. During the process of raising and lowering the temperature, each work (panels 105, 12)
0), the jig 111 and the assembling apparatus are forced to undergo thermal expansion and thermal contraction. Since the directions of thermal expansion and contraction are not uniform, the upper and lower panels 105 and 120 are displaced. Further, the rotation center of the XYθ table 10 is also shifted. Therefore, it is necessary to correct the positional deviation at any time during the assembly process. The position correction method will be described below with reference to FIGS. Here, each process is basically performed by the CPU 181 of the image processing apparatus 23.

In step S41, the processing after step S42 is performed at every predetermined sampling time set in advance. The sampling time is determined by the robot controller 24.
A command as each processing command is transmitted to the image processing device 23.

In step S42, the XY stages 261 to 264 on which the cameras 3 to 6 are mounted are moved so that the center of the alignment mark is located at the center of the camera's field of view.
The details will be described later in [Moving the camera XY stage].

In step S43, the current work temperature Tn
From the temperature controller 25 via the robot controller 24.

In step S44, R of the image processing device 23
The previous temperature Tn- stored in the area m5 of AM183
Read 1

In step S45, the temperature change dT (= T
n-Tn-1) is calculated.

In step S46, the previous alignment mark position (Xn-1, Yn-1) is read.

In step S47, the work position displacement coefficient (Xk, Yk) is read from the area m3.

In step S48, as understood from FIG. 17A, Xc = Xn-1 + Xk.dT, Yc = Yn-1
The current position of the alignment mark is estimated from + Yk · dT.

In step S49, the size L of the detection range is read from the area m2.

In step S50, as shown in FIG. 17B, a predetermined range L is set as a detection range around the estimated position (XC, YC).

In step S51, the position of each alignment mark M1, M2 is detected as pixel data by image correlation in the set detection range.

In step S52, a detection error is checked. If there is an error, the process proceeds to step S62, and if there is no error, the process proceeds to step S53.

In step S53, each detected position data is stored in the area m4 of the RAM 183.

In step S54, each position data is coordinate-converted from image data to data in a robot coordinate system.

In step S55, the first step calculates a rotation correction amount from each position data converted into the robot coordinate system, and the second step calculates an XY correction amount.
The XYθ table 10 is moved according to the correction amount. The movement control of the XYθ table 10 is performed by the robot controller 24. Details will be described in [Position Correction Method] described later. Here, the rotation correction and the XY correction are performed in the order described above, and both corrections are performed to complete one position correction.

In step S56, the current work temperature Tn
Is set as the previous work temperature Tn-1, and the area m5 is updated.

In step S57, dX = Xn-Xn-1, d
The work position displacement amount is calculated from Y = Yn-Yn-1.

In step S58, the previous position data of the area m1 is updated.

In step S59, as understood from FIG. 17C, the displacement coefficient of the alignment mark position is calculated by Xk = dX / dT and Yk = dY / dT.

In step S60, the displacement coefficient of the alignment mark position in the area m3 is updated.

In step S61, correction of rotation direction, XY
If both corrections of the direction have been completed, the flow returns to S66; otherwise, the flow returns to s43.

In step S62, as shown in FIG. 17D, the center coordinate (XC, YC) of the detection range is set to the previous alignment mark detection position (Xn-1, Yn-1).

In step S63, the size L of the detection range is increased (for example, L = LX2).

If the size L of the detection range exceeds the maximum value 480 in step S64, it is determined that detection is not possible, and the flow advances to step S65. If not, step S4
Return to 9.

In step S65, the positioning process is interrupted.

In step S66, the positioning process ends.

Here, the end of the alignment process is considered to be a time elapsed from the start of the alignment, a predetermined temperature or less, until there is a stop command from the temperature control device 25, or a state where the correction of the NC control becomes ineffective. However, any judgment method may be used.

The work temperature can be obtained by a method of receiving the temperature data from the temperature control device 25 or a method of estimating the work temperature from the elapsed time.

[Camera XY Stage Movement] Next, FIG.
The specific method of moving the camera XY stage in the step S22 of FIG. 16 and the step S42 of FIG. 16 will be described below with reference to the flowcharts of FIGS.

In step S91, all or some of the plurality of marks forming the alignment mark M1 on the panel attached to the upper hot plate 1 are detected in each camera channel.

In step S92, the center coordinates of the alignment mark M1 are calculated from the detected mark position and area.

In step S93, the amount of deviation between the calculated center coordinates and the center of the camera field of view (center deviation X, center deviation Y)
Is calculated, and the coordinates are converted into data of the stage coordinate system.

At step S94, alignment mark M
If the shift between the center of 1 and the center of the camera exceeds a predetermined amount, the process proceeds to step 95, and the shift amount is corrected. If it is within the predetermined amount, the movement of the camera stage ends.

In step S95, the XY stage on which the camera is mounted is moved by the amount of the deviation so that the center of the alignment mark M1 is located at the center of the camera. After the movement, the process returns to step S91, and is repeated until the displacement becomes equal to or less than a predetermined amount.

[Position Correction Method] Next, a specific correction method of the amount of displacement in the rotation direction and the X and Y directions in the steps S31 in FIG. 15 and S55 in FIG. 16 will be described with reference to the flowchart in FIG. This will be described below. Figure 1
1A and 1B show rotation correction, and FIG. 11C shows correction in the XY directions.

In step S71, the positions (Xknm) of a plurality of individual marks constituting the two alignment marks M1 and M2 are determined by pattern matching with the previously registered actual pattern JPknm in all four channels. , Yknm) (where k is a camera channel, n is an alignment mark shape M1, M2, and m is a number given in order from the upper left to the side of a plurality of marks. The same symbols appearing in the following have the same meaning. Is detected). This data is data obtained in the process up to step S30 in FIG. 15 or step S54 in FIG.

Here, when a predetermined number m of marks cannot be detected, the area of the detected mark is measured, and the position of the mark among a plurality of marks is determined. Then, the center position of the alignment mark is determined from the result, and the process proceeds to the following steps. For example, as shown in FIG. 5B, when only two of the four marks of the alignment mark M2 are visible, it can be determined from the area of the marks that the left two are visible. From there, the center position of the alignment mark is found on the vertical bisector of the line connecting the two points, and the distance is calculated and calculated by calculating the position of 1/2 of the line connecting the two points. .

In step S72, next, in each of the members (the jig 111 or the rear panel 120) attached to the face panel 105 and the lower hot plate 2,
The distances hk1 and hk2 from the reference surface when the lower hot plate 2 at room temperature is used as the reference surface are detected.

In step S73, correction values Xhkn and Yhkn based on the inclination of the optical axis of the camera are obtained by equation (13).

In step S74, a value (Xk1m-Xhk1, Yk1m-Yhk1) obtained by subtracting the correction value based on the inclination of the camera optical axis from the data of M1 detected earlier, (Xk2m-Xhk2, Y
k2m-Yhk2). This storage is performed in the working area of the RAM 183. The same applies to the storage of the following similar processing.

In step S75, the execution destination is changed according to the correction method. If it is rotation correction, the process proceeds to S76, and if it is XY correction, the process proceeds to S78.

In step S76, the inclination of the line connecting the alignment marks M1 and M2 in the same channel is calculated by equations (11) to (13).

Θk1 = arcTan ((Yk13−Yk11) / (Xk13−Xk11)) (11) θk2 = arcTan ((Yk22−Yk21) / (Xk22−Xk21)) (12) θk = θk2−θk1 13) Here, θk1 and θk2 are the current inclinations of the line connecting the alignment marks (M1 and M2) of the same shape in each channel k and the X axis of the XYθ table.

In step S77, of the stored position data, the data of the reference alignment mark (left side) of ch1 and ch4 on the upper side of the panel is read out, and the positional relationship between the two cameras is as designed (Xc, Yc). Then, an absolute coordinate system is created, the inclination of a line segment connecting the same alignment marks is obtained from Expressions (14) and (15), and the inclination difference θL between the upper and lower panels is calculated from Expression (16). The inclination of the alignment mark M1, ie, the inclination of the face panel 105, is determined as θ1, and the inclination of the alignment mark M2, ie, the inclination of the jig 111 or the rear panel 120 is determined as θ2.

Θ1 = arcTan (((Y411−Yh41 + Yc) − (Y111−Yh11)) / ((X411−Xh41 + Xc) − (X111−Xh11))) (14) θ2 = arcTan (((Y421−Yh42 + Yc) − (Y121−Yh12)) / ((X421−Xh42 + Xc) − (X121−Xh12))) (15) θL = θ2−θ1 (16) In step S78, the angular deviation of the four channels obtained by equation (13) Among the values of θk, data whose difference from the angle θL obtained by the equation (16) is within a predetermined value α are averaged.

ΘL = (θ1 + θ2 + θ3 + θ4) / 4 (17) For example, when θ3> θL + α, θL = (θ1 + θ2 + θ4)
/ 3.

This is because θL has a small effect on the angle due to erroneous detection. Conversely, since θL calculates the angle at a very small distance, the effect on the angle due to erroneous detection becomes large, and therefore abnormalities due to erroneous detection etc. Has the role of preventing operation.

In step S79, a reference alignment mark (left side) M of the same channel is obtained from the detected position data.
The differences Xek and Yek between 1, M2 are calculated.

CXk2 = (Xk21 + Xk22 + Xk23 + Xk24) / 4-Xhk2 (k = 1 to 4) (18) CXk1 = (Xk11 + Xk12 + Xk13 + Xk14) / 4-Xhk1 (k = 1 to 4) ... (19) CYk2 = (Yk21 + Yk23 + 24) −Xhk2 (k = 1 to 4) (20) CYk1 = (Yk11 + Yk12 + Yk13 + Yk14) / 4−Yhk1 (k = 1 to 4) (21) Xek = CXk2−CXk1 (k = 1 to 4) (22) Yek = CYk2-CYk1 (k = 1 to 4) (23) In step S80, the average Xa and Ya of the shift amount in each of the X-direction component and the Y-direction component are obtained by the equations (24) and (25).

Xe = (Xe1 + Xe2 + Xe3 + Xe4) / 4 (24) Ye = (Ye1 + Ye2 + Ye3 + Ye4) / 4 (25) In step S81, the correction amount previously obtained is sent to the robot controller 24 via the serial transmission line, and The control device 24 moves the XYθ table 10 by the received correction amount.

In step S82, after moving the determined correction amount, the positions of the alignment marks M1 and M2 are
If it is within the detection range of the CD camera, the process ends normally. If it is out of the detection range, the process proceeds to step S84.

[0210] In step S84, an error signal is transmitted.
The robot controller 24 activates the alarm device, stops the automatic operation, and switches to the manual mode. The subsequent position correction is left to the operator.

Thereafter, the processing moves to the next step.

In this embodiment, the alignment mark M
The positions of M1 and M2 were detected by image correlation with a pattern of an alignment mark registered in advance. However, the present invention is not limited to this, and if the above-described detection range is considered as a binarization center-of-gravity calculation target range, the alignment mark can be detected by the center-of-gravity calculation. In this case, the detection error can be checked by comparing the area of the binarized target with a value registered in advance for each alignment mark.

In calculating the displacement coefficient of the alignment mark position with respect to the temperature rise of the work, it is possible to prevent a sudden displacement by averaging the past predetermined number of samplings.

[Second Embodiment] FIG. 19 shows an example of the second embodiment. As shown in the figure, a plurality of marks constituting an alignment mark are marked in a sufficiently wide range with respect to mark printing errors and variations in mark positions when setting members. This mark is a mark whose area changes stepwise in order from the upper left, so that the mark can be detected in a wider range and the members can be bonded.

As shown in FIG. 20B, a mark near the center of the field of view of the CCD camera is divided into three points in the alignment mark M1 as shown in FIG. , M2, extract 4 points,
Positioning is performed using the extracted marks.

At this time, according to the area of the extracted mark,
The positional relationship between the alignment marks M1 and M2 is determined, and the position correction amount is determined so as to have a predetermined positional relationship between the plurality of members.

[0219]

[Other Embodiments] Even if the present invention is applied to a system including a plurality of devices (for example, a host computer, an interface device, a reader, a printer, etc.), an apparatus (for example, a copying machine) Machine, facsimile machine, etc.).

Further, an object of the present invention is to supply a storage medium (or a recording medium) recording a program code of software for realizing the functions of the above-described embodiments to a system or an apparatus, and to provide a computer (a computer) of the system or apparatus. It is needless to say that the present invention can also be achieved by a CPU or an MPU) reading and executing the program code stored in the storage medium. In this case, the program code itself read from the storage medium implements the functions of the above-described embodiment, and the storage medium storing the program code constitutes the present invention. Also,
When the computer executes the readout program code, not only the functions of the above-described embodiments are realized, but also the operating system (OS) running on the computer based on the instructions of the program code.
It goes without saying that a case where the functions of the above-described embodiments are implemented by performing some or all of the actual processing, and the processing performs the functions of the above-described embodiments.

Further, after the program code read from the storage medium is written into the memory provided in the function expansion card inserted into the computer or the function expansion unit connected to the computer, the program code is read based on the instruction of the program code. Needless to say, the CPU included in the function expansion card or the function expansion unit performs part or all of the actual processing, and the processing realizes the functions of the above-described embodiments.

In the case where the present invention is applied to the storage medium, the storage medium described above (FIGS. 12, 13 and 1
5, 16, and FIGS. 18, 22, and 23A and 23B).

[0221]

As described above, according to the present invention,
Even if the shape of the alignment mark varies from member to member, or even if dirt or the like is present on the screen, the mark to be detected can be detected reliably and with high accuracy, and highly reliable bonding can be realized.

In addition, by registering an actual pattern, pattern matching is performed with the threshold value lower than the normal correlation value or without the threshold value, even if the shapes of the master pattern and the actual alignment mark are greatly different from each other. Thus, it is possible to perform the bonding in accordance with the variation of the alignment mark shape.

Further, the registration of the real pattern is performed by detecting a predetermined number of candidate patterns from those having a large correlation value with the master pattern, selecting a pattern to be registered as a real pattern from the candidates, and registering the pattern. Even when there is a mark that is difficult to distinguish from a mark or a pattern that has a higher correlation value than the pattern of the mark to be registered, even if automatic registration of the actual pattern is not possible, the target pattern can be registered as the actual pattern, and the alignment mark shape It is possible to perform high-precision alignment without wasting a member having a poor quality.

[Brief description of the drawings]

FIG. 1 is a block diagram illustrating a control system for controlling an assembly apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic perspective view illustrating an assembling apparatus according to the embodiment.

FIG. 3 is a view showing a panel unit 100, and FIG.
Is a frame 13 so that the inside of the panel unit 100 can be seen.
FIG. 2B is a perspective view of the panel unit 100 in which 0 is partially omitted, and FIG. 2B is a cross-sectional view of the panel unit 100 at a position indicated by DD in FIG.

FIG. 4A shows a jig 111 for erecting spacers 110 at regular intervals on a black stripe 104;
(B) is the face panel 105, (c) is the rear panel 1
FIG.

FIG. 5 is a view showing a calibration jig 132;

FIG. 6 is an enlarged view of a portion of the face panel 105 where a spacer is erected.

7A and 7B are diagrams illustrating the contents of a ROM 210 and a RAM 220 provided in a main control unit 200 of the robot controller 24. FIG. 7A is a configuration diagram of a program stored in the ROM 210, and FIG. FIG. 3 is a configuration diagram of a program stored in.

FIG. 8A is a view showing a calibration jig 132;

FIG. 8B is a diagram illustrating calculation of a distance per pixel in the calibration method.

FIG. 8C is a diagram illustrating calculation of a lead pitch of an XYθ table in the calibration method.

FIG. 8D is a diagram illustrating a process of converting the position of a mark on the calibration jig into position data in a robot coordinate system.

FIG. 9 is a diagram illustrating calculation of a coordinate conversion coefficient.

FIG. 10 is a diagram illustrating correction of the inclination of the optical axes of the cameras 3 to 6.

FIG. 11A is a diagram illustrating position correction in the rotation direction.

FIG. 11B is a diagram illustrating position correction in the rotation direction.

FIG. 11C is a diagram illustrating position correction in the XY directions.

FIG. 12 is a flowchart illustrating a process of mounting the spacer 110 on the face panel 105 by standing.

FIG. 13 is a flowchart showing a process of bonding the face panel 105 to the rear panel 120.

FIG. 14A shows a RAM 183 in the image processing apparatus 23;
FIG. 14B is a diagram for explaining a storage area of the RAM 183;
FIG. 6 is a diagram for explaining a size L of a detection range, which is one of data stored in the storage area.

FIG. 15 is a flowchart illustrating initial alignment.

FIG. 16 is a flowchart illustrating a position correction method during temperature rise / fall.

FIG. 17 is a diagram illustrating processing contents.

FIG. 18 is a flowchart illustrating a method of correcting a displacement amount.

FIG. 19 is a diagram for explaining the processing content of the second embodiment.

FIG. 20 is a diagram for describing processing content of the second embodiment.

FIG. 21 is a diagram illustrating movement of a camera stage.

FIG. 22 is a flowchart illustrating movement of a camera stage.

FIG. 23A is a flowchart illustrating automatic registration of an actual pattern.

FIG. 23B is a flowchart illustrating semi-automatic registration of an actual pattern.

FIG. 24 is a diagram showing a master pattern.

FIG. 25 is a diagram showing an actual pattern.

[Explanation of symbols]

 Reference Signs List 1 upper hot plate 105 face panel 110 spacer 120 rear panel 300 position controller

Continued on front page F term (reference) 5B057 AA03 AA05 BA02 BA08 BA19 BA30 DA07 DB02 DC02 DC06 DC08 DC34 5H303 AA05 BB02 BB08 CC01 DD01 FF13 GG14 HH02 HH09 QQ08 5L096 BA05 CA05 CA14 DA02 EA35 FA34 FA60 FA62 FA67 FA69

Claims (6)

[Claims]
1. A positioning device for positioning a plurality of members, wherein at least two or more alignment marks formed on the members are acquired by respective corresponding visual sensors, and a detecting means for detecting the positions thereof; A calculating unit that calculates a moving amount of one of the members based on the position detected by the detecting unit such that a relative displacement amount of the alignment marks of the plurality of members has a predetermined positional relationship; Control means for controlling the position of the one member in accordance with the amount of movement, wherein the detection of the alignment mark by the detection means is performed by pattern matching based on a previously registered master pattern immediately before bonding of the plurality of members. The alignment mark formed on the actual member is detected by the above, and the detected mark is used as an actual pattern. A positioning device for a plurality of members, wherein the positioning is performed by correcting the relative displacement between the bonding members obtained from the actual pattern.
2. The apparatus according to claim 1, wherein the registration of the actual pattern is performed in a state where the pattern matching is performed with a threshold value lower than a normal correlation value or without the threshold value.
3. When the actual pattern cannot be automatically registered, a predetermined number of candidate patterns are detected from those having a large correlation value with a master pattern, and a pattern to be registered as an actual pattern can be selected from the candidates. The apparatus for positioning a plurality of members according to claim 1, wherein:
4. A method for aligning a plurality of members, comprising: acquiring at least two or more alignment marks formed on the members by corresponding visual sensors, and detecting the positions thereof; A calculating step of calculating a movement amount of one of the members so that a relative displacement amount of the alignment marks of the plurality of members has a predetermined positional relationship based on the positions detected in the detecting step; A control step of controlling the position of the one member according to a moving amount, wherein the detection of the alignment mark by the detection step is performed by pattern matching based on a previously registered master pattern immediately before bonding of the plurality of members. Detecting an alignment mark formed on an actual member by using the detected mark as an actual pattern. A positioning method for a plurality of members, wherein the positioning is performed by correcting the relative displacement between the bonding members obtained from the actual pattern.
5. The method according to claim 4, wherein the registration of the actual pattern is performed in a state where the threshold value is lower than a normal correlation value or the threshold value is eliminated.
6. When the actual pattern cannot be automatically registered, a predetermined number of candidate patterns are detected from those having a large correlation value with a master pattern, and a pattern to be registered as an actual pattern can be selected from the candidates. The method for positioning a plurality of members according to claim 4, wherein:
JP2000205405A 2000-07-06 2000-07-06 Method for aligning plural members and device for the same Withdrawn JP2002023851A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000205405A JP2002023851A (en) 2000-07-06 2000-07-06 Method for aligning plural members and device for the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000205405A JP2002023851A (en) 2000-07-06 2000-07-06 Method for aligning plural members and device for the same

Publications (1)

Publication Number Publication Date
JP2002023851A true JP2002023851A (en) 2002-01-25

Family

ID=18702495

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000205405A Withdrawn JP2002023851A (en) 2000-07-06 2000-07-06 Method for aligning plural members and device for the same

Country Status (1)

Country Link
JP (1) JP2002023851A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012190047A (en) * 2008-09-04 2012-10-04 Shibaura Mechatronics Corp Laminating device and control method thereof
CN101576506B (en) * 2008-05-08 2012-11-28 索尼株式会社 Microbead automatic recognition method and microbead
US9786313B2 (en) 2015-10-05 2017-10-10 Hiatchi-Lg Data Storage, Inc. Optical-information recording/reproducing apparatus and optical-information recording/reproducing method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101576506B (en) * 2008-05-08 2012-11-28 索尼株式会社 Microbead automatic recognition method and microbead
JP2012190047A (en) * 2008-09-04 2012-10-04 Shibaura Mechatronics Corp Laminating device and control method thereof
US9786313B2 (en) 2015-10-05 2017-10-10 Hiatchi-Lg Data Storage, Inc. Optical-information recording/reproducing apparatus and optical-information recording/reproducing method

Similar Documents

Publication Publication Date Title
US20150230344A1 (en) Substrate-related-operation performing apparatus and substrate-related-operation performing system
KR880000554B1 (en) Automatic assembly system
CN1066608C (en) Device recognizing method and apparatus for surface mounting device mounter
US5388318A (en) Method for defining a template for assembling a structure
US6542783B2 (en) Tool position measurement method, offset measurement method, reference member and bonding apparatus
DE602005000512T2 (en) Method and device for mounting components
JP5186785B2 (en) Optical waveguide device, optical element mounting system for optical waveguide device, optical element mounting method, and program thereof
JP4681856B2 (en) Camera calibration method and camera calibration apparatus
EP0534720B1 (en) Register marks
US7349575B2 (en) Pattern inspection method and apparatus, and pattern alignment method
JP3977018B2 (en) Information input system
US7805219B2 (en) Carrier robot system and control method for carrier robot
US8294693B2 (en) Portable input device, method for calibration thereof, and computer readable recording medium storing program for calibration
EP0715493B1 (en) Method for mounting chip components and apparatus therefor
US5319443A (en) Detected position correcting method
TWI299083B (en) Methods of and apparatus for inspecting substrate
US8146814B2 (en) Remote crane bar code system
US4479145A (en) Apparatus for detecting the defect of pattern
KR100229855B1 (en) Paste coating machine
CN102990678B (en) Robot system and image capture method
KR970005616B1 (en) Automatic calibration method
CN101657767B (en) Method and device for controlling robots for welding workpieces
CN100407888C (en) Parts mounting device and method
US6863370B2 (en) Method of generating ejection pattern data, and head motion pattern data; apparatus for generating ejection pattern data; apparatus for ejecting functional liquid droplet; drawing system; method of manufacturing organic el device, electron emitting device, pdp device, electrophoresis display device, color filter, and organic el; and method of forming spacer, metal wiring, lens, resist, and light diffuser
US6944521B2 (en) Method of providing board packaging line program

Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20071002