KR102213748B1 - Display panel laminating system and display panel laminating method using thereof - Google Patents

Abstract

Disclosed are a display panel bonding system and a display panel bonding method using the same, capable of improving process efficiency and transport efficiency. According to one embodiment of the present invention, the display panel bonding system includes: a plurality of panel support stages on which a panel is placed; an adhesive layer forming unit having an adhesive discharge head for discharging an adhesive layer to the panel; a bonding unit provided radially in parallel with the adhesive layer forming unit, and configured to bond a bonding target panel to the panel on which the adhesive layer is formed; and a panel mounting support provided at a lower portion of the adhesive layer forming unit and the bonding unit to intermittently rotate the panel support stage along a horizontal rotation path, wherein the bonding unit includes: a loading module for loading the bonding target panel from the outside to a bonding position; a seating module for seating the bonding target panel on the panel on which the adhesive layer is formed, in which the bonding target panel and the panel on which the adhesive layer is formed are vertically arranged at the bonding position; and a pressure roller for slidably moving along a top surface of the bonding target panel seated on the panel on which the adhesive layer is formed to pressure-bond the bonding target panel to the panel on which the adhesive layer is formed.

Description

Display panel bonding system and display panel bonding method using the same {DISPLAY PANEL LAMINATING SYSTEM AND DISPLAY PANEL LAMINATING METHOD USING THEREOF}

The present invention relates to a display panel bonding system and a display panel bonding method using the same, and more particularly, to a display panel bonding system for bonding a plurality of panels constituting a display device to each other, and a display panel bonding method using the same.

Display devices include a liquid crystal display (LCD), an organic light emitting diode display (OLED display), and a plasma display panel (PDP) according to a light emission method.

In the display device, a panel to be bonded, such as a cover glass, for protecting a panel transmitting an image is attached to the front surface of the panel. At this time, an adhesive layer is interposed between the panel and the panel to be bonded to bond the panel and the panel to be bonded.

1 is a conceptual diagram showing a conventional display panel bonding process.

As shown in FIG. 1, a transfer process of transferring the panel on which the adhesive layer is formed before the bonding process after the bonding layer forming process is required. However, when moving to the bonding process after forming the adhesive layer, there was a problem in the transfer, such as changing the shape of the adhesive layer before solidification.

Korean Publication No. 10-2018-00560004 (Publication date: May 28, 2018)

One technical problem to be solved by the present invention is to provide a display panel bonding system in which a process of forming an adhesive layer on a panel and bonding the panel to be bonded is unified.

In order to solve the above technical problem, the present invention provides a display panel bonding system.

A display panel bonding system according to an embodiment of the present invention includes a plurality of panel support stages on which a panel is placed; An adhesive layer forming unit having an adhesive discharge head for discharging the adhesive layer on the panel; A bonding unit provided radially parallel to the bonding layer forming unit and bonding the bonded panel to the panel on which the bonding layer is formed; A panel mounting table provided below the adhesive layer forming unit and the bonding unit and intermittently rotating and moving the panel support stage along a horizontal rotation path, wherein the bonding unit includes a bonding position of the panel to be bonded from the outside. Loading module to be carried into; A seating module for mounting the to-be-bonded panel on a panel on which the adhesive layer is formed above and below the bonding position; And a pressure roller that slides along an upper surface of the adhered panel seated on the panel on which the adhesive layer is formed to pressurize.

A display panel bonding system according to another embodiment of the present invention includes: a lower chamber accommodating a plurality of panel support stages on which a panel is placed; A first upper chamber having an adhesive discharge head for discharging an adhesive layer on the panel; A second upper chamber provided radially parallel to the first upper chamber and having a fixing module for fixing and providing a bonded panel for bonding to the pad on which the adhesive layer is formed; A panel mounting table provided below the first upper chamber and the second upper chamber and intermittently rotating and moving the lower chamber along a horizontal rotation path; A first lift pin provided in a vertical direction parallel to the first upper chamber to lift the lower chamber from the panel mounting table; And a second lift pin provided in a vertical direction parallel to the second upper chamber to elevate and lower the lower chamber from the panel mount, wherein the lower chamber is coupled to the first upper chamber or the second upper chamber. Thus, the internal space can be selectively created in a vacuum atmosphere.

According to an embodiment, a loading unit provided on one side of the panel mounting table to carry the panel into the panel support stage from the outside; A protective film peeling unit for peeling the protective film attached to the panel carried on the panel support stage; And an unloading unit provided on one side of the panel mounting table to be spaced apart from the loading unit to carry the panel out of the panel support stage.

According to an embodiment, at least two or more of the panel support stages may be mounted on the panel mounting table.

A display panel bonding system according to another embodiment of the present invention includes a panel support stage on which a panel is placed; An adhesive layer forming unit having an adhesive discharge head for discharging the adhesive layer on the panel; A bonding unit provided radially parallel to the bonding layer forming unit and bonding the bonded panel to the panel on which the bonding layer is formed; It may include a process mount provided on the upper portion of the panel support stage and intermittently rotating and moving the adhesive layer forming unit and the bonding unit along a horizontal rotation path.

According to an embodiment, a loading unit provided on one side of the panel support stage to carry the panel into the panel support stage from the outside; A protective film peeling unit for peeling the protective film attached to the panel carried on the panel support stage; And an unloading unit provided on the other side of the panel support stage to carry the panel out from the panel support stage.

In order to solve the above technical problem, the present invention provides a display panel bonding method.

A method for attaching a display panel according to an embodiment of the present invention includes a loading step of carrying a panel into the panel support stage from the outside by rotating a panel support stage to a loading position along a horizontal rotation path; An adhesive layer forming step of discharging an adhesive to the panel at a position where an adhesive layer is formed according to the rotational movement of the panel supporting stage; A bonded panel bonding step of bonding the bonded panel to the panel on which the adhesive layer is formed at a bonded position according to the rotational movement of the panel supporting stage; And an unloading step of carrying the panel out from the panel support stage at an unloading position according to the rotational movement of the panel support stage.

A display panel bonding method according to another embodiment of the present invention includes a loading step of carrying a panel into a panel support stage from the outside; An adhesive layer forming step in which the process mounting table on which the adhesive layer forming unit is mounted is rotated along a horizontal rotation path so that the adhesive layer forming unit is moved to face the panel support stage to discharge an adhesive layer to the panel; The process mount on which the bonding unit is mounted radially parallel to the bonding layer forming unit rotates along a horizontal rotation path, so that the bonding unit moves to face the panel support stage so that the panel on which the bonding layer is formed adheres the bonded panel. A step of bonding the panels to be bonded; And an unloading step of carrying the panel out from the panel support stage.

According to an embodiment of the present invention, since the bonding layer forming process and the bonding process of the bonded panel proceed along the moving path of the panel mounting table, there is an advantage of improving process efficiency as well as transfer efficiency of the panel.

According to an embodiment of the present invention, since the bonding layer forming process and the bonding process of the bonded panel proceed along the moving path of the panel mounting table, shape deformation due to transfer of the adhesive layer before complete curing can be minimized.

According to another embodiment of the present invention, the distance between each process such as the bonding layer forming process and the bonding process is relatively close, thereby minimizing the time interval between forming the bonding layer and bonding, and smoothing the shape and thickness of the bonding layer. have.

According to another embodiment of the present invention, by providing a panel mounting table capable of continuously providing a plurality of panels in the bonding process, each process of the display panel system can be continuously repeated without interruption in the process operation in the unit system. There is an advantage.

According to another embodiment of the present invention, there is an advantage of unifying the bonding layer forming unit and the bonding unit to increase the bonding performance of the bonding layer, thereby improving product yield and enhancing price competitiveness.

According to another embodiment of the present invention, by providing a lower chamber and a first upper chamber or a second upper chamber capable of differently forming an internal environment for each process without creating a vacuum atmosphere in the entire system unit, a desired interior There is an advantage of creating an environment, minimizing the influence of each other, and minimizing the influence of external environmental factors on the interior of each chamber.

1 is a conceptual diagram showing a conventional display panel bonding process.
2 is a conceptual diagram showing a display panel bonding system according to an embodiment of the present invention.
3 is a diagram illustrating a process of forming an adhesive layer of FIG. 2.
4 is a view showing a bonding process of FIG. 2.
5 is a conceptual diagram showing a display panel bonding system according to another embodiment of the present invention.
6A and 6B are views showing before and after operations of the first upper chamber and the first lift pin in the process of forming the adhesive layer of FIG. 5.
7A and 7B are views showing before and after the operation of the second upper chamber and the second lift pin in the bonding process of FIG. 5.
8 is a conceptual diagram showing a display panel bonding system according to another embodiment of the present invention.
9 is a flowchart illustrating a method of bonding a display panel according to an embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the technical idea of the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments introduced herein are provided so that the disclosed contents may be thorough and complete, and the spirit of the present invention may be sufficiently conveyed to those skilled in the art.

In the present specification, when a component is referred to as being on another component, it means that it may be formed directly on the other component or that a third component may be interposed between them. In addition, in the drawings, the shape and size are exaggerated for effective description of technical content.

Further, in various embodiments of the present specification, terms such as first, second, and third are used to describe various elements, but these elements should not be limited by these terms. These terms are only used to distinguish one component from another component. Therefore, what is referred to as a first component in one embodiment may be referred to as a second component in another embodiment. Each embodiment described and illustrated herein also includes its complementary embodiment. In addition, in the present specification,'and/or' is used to mean including at least one of the elements listed before and after.

In the specification, expressions in the singular include plural expressions unless the context clearly indicates otherwise. In addition, terms such as "comprise" or "have" are intended to designate the presence of features, numbers, steps, elements, or a combination of the features described in the specification, and one or more other features, numbers, steps, and configurations It is not to be understood as excluding the possibility of the presence or addition of elements or combinations thereof. In addition, in the present specification, "connection" is used to include both indirectly connecting a plurality of constituent elements and direct connecting.

Further, in the following description of the present invention, when it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present invention, a detailed description thereof will be omitted.

FIG. 2 is a conceptual diagram illustrating a display panel bonding system 1000 according to an embodiment of the present invention, FIG. 3 is a view showing a process of forming an adhesive layer of FIG. 2, and FIG. 4 is a view showing a bonding process of FIG. 2.

3 and 4 illustrate an operation state in which an arbitrary region on the panel mounting table 2500 is located in one panel P1 for convenience of description.

Hereinafter, each component constituting the display panel bonding system 1000 according to the first embodiment of the present invention will be described in detail.

2 to 4, the display panel bonding system 1000 according to the first embodiment of the present invention includes a panel support stage 1100 and an adhesive layer forming unit 1300, a bonding unit 1400, and a panel mounting table. 1500), furthermore, a loading unit 3600 and a protective film peeling unit 3700, an unloading unit 3800, a main curing unit (not shown), an autoclave unit (not shown), a complete curing unit (not shown) ) And may further include a camera (not shown).

Panel Support Stage (1100)

Referring back to FIGS. 2 to 4, the panel support stage 1100 may provide a region on which the panel P1 is placed. At least two of the panel support stages 1100 may be disposed on a panel mounting table 1500 to be described later on one display panel bonding system 1000. That is, on the display panel bonding system 1000, a plurality of panels P1 are mounted on the panel mounting table 1500, respectively, so that different processes may be simultaneously performed. The number of the panel support stages 1100 may be increased or decreased according to the number of processes, the control unit, and the operating policy of the display panel bonding system 1000 in the entire process. According to an exemplary embodiment, at least two or more of the panel support stages 1100 may be mounted on the panel mounting table 1500.

According to an embodiment, the panel P1 means a display panel. The panel P1 may be a panel on which an image is displayed. The panel P1 may include an LCD panel, an OLED panel, a PDP display panel, a TSP panel, and the like. In addition, the panel P1 may include not only a rigid panel, but also a flexible panel made of a flexible material capable of bending, folding, and rolling.

The panel P1 may be transformed in shape corresponding to the shape of the panel P2 to be bonded.

According to an embodiment, the bonded panel P2 has a transparent flat plate shape. In addition, the panel to be bonded P2 may have a part or all of the edge region having a curved shape. That is, the bonded panel P2 may include a flat portion and a curved portion.

The bonded panel P2 may be a cover glass made of glass, plastic such as polyethylene terephthalate (PET), or a touch screen panel (TSP). The window panel may be made of a transparent material.

According to another embodiment, the panel P1 may be a cover glass, and the bonded panel P2 may be a display panel.

Adhesive layer forming unit (1300)

Referring back to FIGS. 2 and 3, the adhesive layer forming unit 1300 is a type of fluid forming device and may form a fluid, particularly an adhesive layer R, on the panel P1. An exemplary fluid forming device is a printing device, and a typical printing fluid is an adhesive (R).

The adhesive R may be interposed between the panel P1 and the bonded panel P2. The adhesive R can support and fix both sides while making surface contact between the panel P1 and the panel P2 to be bonded. The adhesive R may be formed on the panel P1 while forming a layer, or may be formed on the panel P2 to be bonded or on the panel P1 and the panel P2 to be bonded, respectively. The adhesive R may have a uniform thickness or may be formed to have a three-dimensional cross-sectional shape having a different thickness for each region.

According to an embodiment, the edge region of the adhesive R may have a curved cross section. In the central region and the edge region surrounding the central region, the adhesive R may be formed by varying the density difference from each other.

The adhesive R may be an optical clear resin (OCR). The adhesive (R) may be any one of acrylic, epoxy, silicone, or rubber resins, or a mixture thereof, and preferably, a UV curable resin.

The adhesive layer forming unit 1300 may include an adhesive discharge head 1310, and further include a gantry 1320, a temporary curing module (not shown), and an adhesive supply unit (not shown).

The adhesive discharge head 1310 may form the adhesive layer R by discharging the adhesive R that is continuous or forms a layer on the panel P1. At least one adhesive discharge head 1310 may be provided. The adhesive discharge head 1310 may be provided with tens to thousands of nozzles (not shown). The adhesive discharge head 1310 may be moved to correspond to the panel P1 in a vertical direction.

The nozzle (not shown) may discharge the adhesive R in the form of fine droplets. For the nozzle (not shown), a driving voltage and a voltage pulse time for each characteristic of each adhesive R may be adjusted according to programming data. Programming data may be stored in a memory module (not shown). The programming data may include content for controlling a movement operation of the adhesive discharge head 1310 and a discharge operation of a nozzle (not shown). For example, the programming data may control the amount of discharge that is discharged once, or whether or not the nozzle (not shown) is opened and discharged so that the thickness of the adhesive layer R for each position coordinate is changed several times.

The gantry 1320 supports the adhesive discharge head 1310 and a temporary curing module (not shown), and attaches the adhesive discharge head 1310 and the temporary curing module (not shown) to the front and rear sides to correspond to the panel P1. Can be moved.

The temporary curing module (not shown) may irradiate UV light at the same time as the adhesive discharge head 1310 is discharged or with a time difference after discharge. In the temporary curing module (not shown), the curing time and temperature may be adjusted according to the characteristics of the adhesive layer R by programming data.

The adhesive supply unit (not shown) may be mounted on the gantry 1320 or provided inside the adhesive discharge head 1310.

The number of the adhesive layer forming unit 1300 may be increased or decreased according to the number of processes, the control unit, and the operating policy of the display panel bonding system 1000 in the entire process.

Cementation unit (1400)

Referring again to FIGS. 2 and 4, the bonding unit 1400 may be provided in parallel with the adhesive layer forming unit 1300. The bonding unit 1400 may bond the panel P2 to be bonded to the panel P1 on which the adhesive layer R is formed. In the bonding unit 1400, a distance value between the bonding layer forming unit 1300 may be adjusted according to the characteristics of the panel P1 and the bonding layer P2.

The bonding unit 1400 may include a loading module 1410, a seating module 1420, and a pressure roller 1300.

The loading module 1410 may carry the bonded panel P2 from the outside to the bonded position. The bonding position means an arbitrary area in which the bonding unit 1400 is provided.

The mounting module 1420 may mount the bonded panel P2 on the panel P1 on which the adhesive layer R moved to the bonding position is formed. According to an embodiment, the seating module 1420 may include a position alignment module (not shown).

The alignment module (not shown) may position-align the panel P2 provided thereon on the panel P1 on which the adhesive layer R is formed. That is, the position alignment module (not shown) may position-align the upper panel P2 and the lower panel P1 on which the adhesive layer R is formed in the vertical direction.

The mounting module 14200 may mount the adhered panel P2 on the panel P1 on which the position-aligned adhesive layer R is formed.

The pressure roller 1430 may slide in a horizontal direction and press the bonded panel P2 to the panel P1 on which the adhesive layer R is formed. The pressure roller 1430 slides along an upper surface of the bonded panel P2 seated on the panel P1 on which the adhesive layer R is formed, and the panel P1 and the bonded panel P2 on which the adhesive layer R is formed. The bonding site of can be pressed and bonded. The pressure roller 1430 may be connected to one side of a pressure cylinder (not shown). The pressure cylinder (not shown) may apply pressure to the pressure roller 1430.

The number of the bonding units 1400 may be increased or decreased according to the number of processes, the control unit (not shown), and the operating policy of the display panel bonding system 1000 in all processes.

Panel mount table (1500)

Referring back to FIGS. 2 to 4, the panel mounting table 1500 may be configured to transfer the panel P1 to each process position. The panel mounting table 1500 may be provided under the adhesive layer forming unit 1300 and the bonding unit 1400. The panel mounting table 1500 may transfer the panel to each process position, such as the adhesive layer forming unit 1300 and the bonding unit 1400.

The panel mounting table 1500 may have a horizontal rotation path. The panel mounting table 1500 may rotate and move the panel support stage 1100 along a rotation path, and may be intermittently stopped to correspond to processes such as the adhesive layer forming unit 1300 and the bonding unit 1400. More specifically, the panel mounting table 1500 moves the loaded panel P1 to the corresponding positions of the protective film peeling unit 3700 and the adhesive layer forming unit 1300, the bonding unit 1400, and the unloading position. I can make it.

At least two or more panel support stages 1100 may be mounted on the panel mounting table 1500. The panel mounting table 1500 may arrange a plurality of panel support stages 1100 to be radially parallel to each other in a vertical or horizontal direction. The panel mounting table 1500 may include a driving module (not shown) for rotating and moving the panel support stage 1100 in a horizontal direction.

The panel mounting table 1500 rotates the panel P1 in a clockwise or counterclockwise direction around a Z axis by a driving module (not shown) to be transferred to each process unit 3700, 1300 or 1400. I can. The panel mounting table 1500 may rotate and move the panel support stage 1100 along a path having an arbitrary radius.

Loading unit (3600)

Referring back to FIG. 2, the loading unit 3600 may carry the panel P1 into the panel support stage 1100 from the outside in the form of a ball rail or a conveyor. The loading unit 3600 may be provided on one side of the panel mounting table 1500.

Protective film peeling unit (3700)

Referring again to FIGS. 2 and 3, the protective film peeling unit 3700 may peel a protective film (PF) attached to the panel P1. The protective film PF is a film attached to protect the surface of the panel P1 during manufacturing or transportation, and may be removed during the process.

Unloading unit (3800)

Referring back to FIG. 2, the unloading unit 4800 may carry out the panels P2/R/P1 from the panel support stage 1100 to the outside in the form of a ball rail or a conveyor. The unloading unit 4800 may be provided on one side of the panel mounting table 1100 to be spaced apart from the loading unit 3600.

The main curing unit (not shown) and the complete curing unit (not shown) may be configured to perform a curing operation on the panel P1 after the adhesive layer R is formed on the panel P1. The curing time and curing temperature of each of the main curing unit (not shown) and the complete curing unit (not shown) may be adjusted according to the characteristics of the panel P1 and the adhesive layer R.

The main curing unit (not shown) may be cured by irradiating UV light to the panel P1 at a relatively higher temperature than the temporary curing module (not shown). In the main curing unit (not shown), the curing operation time and temperature may be controlled by reflecting the degree of curing in the temporary curing module (not shown).

The autoclave unit (not shown) may remove the fine bubbles by moving the fine bubbles between the panel P1 and the panel P2 to be bonded to the outside of the adhesive layer R by applying constant heat and pressure.

The complete curing unit (not shown) can completely cure the adhesive layer R between the panel P1 and the panel P2 to be bonded. The complete curing unit (not shown) can completely bond the panel P1 and the panel P2 to be bonded.

The camera (not shown) may check the location path of each mounted panel P1 or P2/R/P1, and may provide an image for an operator to check each process state. A plurality of cameras (not shown) may be provided, one of which may be located above the panel mounting table 1000. Through the image information generated by the camera (not shown), the operator may determine the position of each panel P1 in the display panel bonding process.

According to an embodiment, the panel P1 may include an alignment mark (not shown) that facilitates the operator's identification. The operator may check the alignment mark (not shown) of the panel P1 from the image information generated by the camera (not shown).

The control unit (not shown) may rearrange each panel support stage 1100 after determining the position of each panel P1 based on the image information. The control unit (not shown) detects the moving path of the panel P1, and based on the position information of the panel P1, the driving direction and driving speed of the driving module (not shown) rotating the panel mount 1100 Can be controlled.

In addition, the control unit (not shown) may independently control movement positions of the plurality of panel support stages 1100. That is, the control unit (not shown) may control the moving speed according to the process speed for each panel P1.

Hereinafter, descriptions of parts in common with the above embodiments of the display panel bonding system 2000 according to the second embodiment of the present invention will be omitted, and the differences will be mainly described.

5 is a conceptual diagram showing a display panel bonding system 2000 according to another embodiment of the present invention, and FIGS. 6A and 6B are a first upper chamber 2300 and a first lift pin 2600 in the adhesive layer forming process of FIG. 5. ), and FIGS. 7A and 7B are views showing before and after the operation of the second upper chamber 2400 and the second lift pin 2700 in the bonding process of FIG. 5.

5 to 7B, the display panel bonding system 2000 according to the second embodiment of the present invention is characterized in that each process is performed in a vacuum environment. The display panel bonding system 2000 includes a lower chamber 2200 and a first upper chamber 2300, a second upper chamber 2400, a panel mounting table 2500, a first lift pin 2600, and a second lift pin. Including 2700, further includes a control unit (not shown) and an alignment unit (not shown) may be further included.

Lower chamber 2200

Referring again to FIGS. 5, 6B, and 7B, the lower chamber 2200 may accommodate a plurality of panel support stages 2100 on which the panel P1 is placed. At least two lower chambers 2200 may be disposed on a panel mounting table 2500 to be described later on one display panel bonding system 2000. That is, on the display panel bonding system 2000, a plurality of panels P1 are mounted in the lower chamber 2200, respectively, so that different processes may be simultaneously performed. The lower chamber 2200 may be coupled to the first upper chamber 2300 or the second upper chamber 2400 to be described later.

The lower chamber 2200 may include a vacuum pump (not shown) and a vacuum connector (not shown) connecting the vacuum pump (not shown) and the lower chamber 2200 to form a specific environmental condition. A vacuum pump (not shown) may provide a vacuum state by inhaling air from the inside of the lower chamber 2200 and the first upper chamber 2300 or the second upper chamber 2400.

The lower chamber 2200 may be moved upward and downward by a first lift pin 2600 to be described later to be coupled to the first upper chamber 2300. The lower chamber 2200 coupled with the first upper chamber 2300 may selectively create an internal space in a vacuum atmosphere. The lower chamber 2200 coupled with the first upper chamber 2300 may be isolated from the outside under an environmental condition suitable for an adhesive layer forming process condition.

The lower chamber 2200 may be moved upward and downward by a second lift pin 2700 to be described later to be coupled to the second upper chamber 2400. The lower chamber 2200 coupled with the second upper chamber 2400 may selectively create an internal space in a vacuum atmosphere. The lower chamber 2200 coupled with the second upper chamber 2400 may provide an environmental condition different from the interior of the lower chamber 2200 coupled with the first upper chamber 2300.

First upper chamber 2300

Referring again to FIGS. 5 to 6B, in the first upper chamber 2300, a process of forming an adhesive layer may be performed. The first upper chamber 2300 may have an adhesive discharge head 2310. The first upper chamber 2300 may include a control module (not shown) and a camera (not shown).

In this case, the control module (not shown) may adjust the inner space formed by combining the second upper chamber 2300 and the lower chamber 2200 for the bonding layer forming process as an independent environmental condition.

Second upper chamber 2400

Referring again to FIGS. 5, 7A, and 7B, a bonding process may be performed in the second upper chamber 2400. The second upper chamber 2400 may be provided radially parallel to the first upper chamber 2300. The second upper chamber 2400 includes a fixing module 2410, and further includes a loading module, a control module (not shown), and a camera (not shown) for carrying the bonded panel P2 from the outside to the bonded position. can do.

The fixing module 2410 can be provided by fixing the bonded panel P2. The fixing module 2410 may include a plurality of vacuum adsorption holes (not shown) connected to a vacuum source (not shown).

The vacuum suction hole (not shown) may be fixed by vacuum chucking the bonded panel P2. The vacuum adsorption hole (not shown) may inhale air on one side of the bonded panel P2 to fix the bonded panel P2.

The fixing module 2410 can be positioned so as to advance and retreat the panel P2 to be bonded in the Z direction while vacuum-sucking the panel P2 to be bonded.

In this case, the control module (not shown) may create the inside of the second upper chamber 2400 and the lower chamber 2300 under independent environmental conditions for the bonding process. The control module (not shown) may maintain a vacuum atmosphere, that is, a pure nitrogen environment substantially free of oxygen or moisture in the second upper chamber 2400 and the lower chamber 2200.

The camera (not shown) may provide an image for a worker to check the process state during the bonding process. The camera (not shown) may be located above the panel mounting table 2500 and at one end of the first upper chamber 2300 and the second upper chamber 2400.

Panel mount (2500)

Referring back to FIGS. 5 to 7B, the panel mounting table 2500 may be provided below the first upper chamber 2300 and the second upper chamber 2400. The panel mounting table 2500 may intermittently rotate and move the lower chamber 2200 along a horizontal rotation path. According to an embodiment, the panel mounting table 2500 is a plate-shaped container having a predetermined thickness, and a hole larger than the first and second lift pins 2600 and 2700 is formed so that the first and second lift pins 2600 and 2700 and Can avoid interference. According to another embodiment, the panel mounting table 2500 is formed of a rail providing a path along a ball rail (not shown), and interference with the first and second lift pins 2600 and 2700 can be avoided.

First lift pin (2600)

Referring back to FIGS. 6A and 6B, the first lift pin 2600 may be provided in parallel with the first upper chamber 2300 in a position where an adhesive layer is formed, that is, in a vertical direction. The first lift pin 2600 may vertically move in the Z direction. The first lift pin 2600 may raise and lower the lower chamber 2200 in the Z direction, thereby providing a relative vertical movement between the panel mounting table 2500 and the panel P1.

The first lift pin 2600 may lift the lower chamber 2200 apart from the panel mounting table 2100 to face the first upper chamber 2300. The first lift pin 2600 adjusts the gap between the adhesive discharge head 2310 and the panel P1 to an appropriate distance according to the thickness of the panel P1 and the panel P2 and the characteristics of the adhesive layer R. The elevation height of the panel P1 can be adjusted as much as possible.

2nd lift pin (2700)

Referring back to FIGS. 7A and 7B, the second lift pin 2700 may be provided in parallel with the second upper chamber 2400 in a bonding position, that is, in a vertical direction. The second lift pin 2700 may lift the lower chamber 2200 apart from the panel mounting table 2500 to face the second upper chamber 2400. The second lift pin 2700 may be provided under the panel mounting table 2500.

The control unit (not shown) may detect the moving path of the panel P1. The control unit (not shown) is based on the location information of the panel P1 and the open/closed information between the lower chamber 2200 and the first upper chamber 2300 or the second upper chamber 2400. ), a driving direction and a driving speed of a driving module (not shown) that rotates may be controlled.

The control unit (not shown) may determine a transfer position of the panel P1 between the first upper chamber 2300 and the second upper chamber 2400. The control unit (not shown) controls the open/close signals of the first upper chamber 2300 and the second upper chamber 2400, and, if necessary, the first upper chamber 2300 or the second upper chamber 2400 In order to separate/couple the combined lower chamber 2200, the first lift pin 2600 or the second lift pin 2700 may be driven and controlled.

Hereinafter, descriptions of parts in common with the above embodiment for the display panel bonding system 4000 according to the third embodiment of the present invention will be omitted, and the differences will be mainly described.

8 is a conceptual diagram showing a display panel bonding system 4000 according to another embodiment of the present invention.

In the display panel bonding system 4000 according to the third embodiment of the present invention, each of the processes is provided on the process mounting table 4500 on the upper panel P1 fixed at an arbitrary position, Each process may be performed on the lower panel P1 while moving along the rotation path. The display panel bonding system 4000 includes a panel support stage 4100, an adhesive layer forming unit 4300, a bonding unit 4400, and a process mounting table 4500, and a loading unit 3600 and a protective film peeling unit ( 3700) and an unloading unit 3800 may be included.

The panel support stage 4100 may be fixedly installed.

The bonding unit 4400 may be any one of a pressure roller (not shown) or a fixing module (not shown) using a vacuum intake method.

The process mount 4500 may be provided on the panel support stage 4100. The process mounting table 4500 may intermittently rotate and move the protective film peeling unit 3700, the adhesive layer forming unit 4300, and the bonding unit 4400 along a horizontal rotation path.

The loading unit 3600 may be provided on one side of the panel support stage 4100. The loading unit 3600 may carry the panel P1 into the panel support stage 4100.

The protective film peeling unit 3700 may peel the protective film PR attached on the panel P1 carried in the panel support stage 4100.

The unloading unit 3800 may be spaced apart from the loading unit 3600 and may be provided on the other side of the panel support stage 4100. The unloading unit 3800 may carry the panel out from the panel support stage 4100.

9 is a flowchart illustrating a method of bonding a display panel according to an embodiment of the present invention.

Hereinafter, each component constituting the display panel bonding method according to the first embodiment of the present invention will be described in detail.

The display panel bonding method may include a loading step (S10), an adhesive layer forming step (S30), a bonded panel bonding step (S40), an unloading step (S50), and a protective film peeling step (S20). have. In this case, in explaining the method of bonding the display panel, each will be described in a time series order.

In the loading step S10, the panel mounting table may rotate the panel support stage to the loading position along a horizontal rotation path. In the loading stage, the panel can be carried from outside to the panel support stage at the loading position.

In each step (S20 to S40), the panel support stage on which the panel is placed to correspond to each position may be moved along the panel mounting table.

In the protective film peeling step (S20), the panel may be positioned at the protective film peeling position according to the rotation of the panel mounting table. In the protective film peeling step, a part of the protective film may be separated upward using an intake pin provided on the protective film peeling position, and the protective film attached on the panel may be peeled.

In the adhesive layer forming step S30, the panel may be positioned at the adhesive layer forming position according to the rotation of the panel mounting table. In the step of forming the adhesive layer, the adhesive layer may be formed by discharging the adhesive layer on the panel.

In the bonding of the panel to be bonded (S40), the panel may be positioned in the bonding position of the panel to be bonded according to the rotation of the panel mounting table. In the step of bonding the bonded panel, the bonded panel may be bonded to the panel on which the adhesive layer is formed.

In the unloading step S50, the panel may be positioned in the unloading position according to the rotation of the panel mounting table. In the unloading step, the panel may be carried out from the panel support stage.

Hereinafter, each component constituting the method for bonding a display panel according to a second embodiment of the present invention will be described in detail.

The display panel bonding method includes a loading step (S10), an adhesive layer forming step (S30), a bonded panel bonding step (S40), an unloading step, and may further include a protective film peeling step (S20). In this case, in explaining the method of bonding the display panel, each will be described in a time series order.

In the loading step (S10), the panel may be brought into the panel support stage from the outside.

In each step (S20 to S40), the adhesive forming unit and the bonding unit may be moved along the process mount so as to correspond to each position.

In the protective film peeling step (S20), the protective film peeler may be positioned at the protective film peeling position according to the rotation of the process mounting table. In the protective film peeling step (S20), a part of the protective film may be separated upward using an intake pin provided on the protective film peeling position, and the protective film attached on the panel may be peeled.

In the adhesive layer forming step S30, the adhesive layer-shaped unit mounted on the process mounting table may be positioned at the adhesive layer forming position according to the rotation of the process mounting table. In the step of forming the adhesive layer, the adhesive layer may be formed by discharging the adhesive layer on the panel.

In the bonding of the panel to be bonded (S40), the bonding unit mounted on the process mounting table may be positioned at the bonding position of the panel to be bonded according to the rotation of the process mounting table. In the step of bonding the bonded panel, the bonded panel may be bonded to the panel on which the adhesive layer is formed.

In the unloading step S50, the panel may be carried out from the panel support stage.

As described above, the present invention has been described in detail using preferred embodiments, but the scope of the present invention is not limited to specific embodiments, and should be interpreted by the appended claims. In addition, those who have acquired ordinary knowledge in this technical field should understand that many modifications and variations can be made without departing from the scope of the present invention.

1000, 2000, 4000: Display panel bonding system
1100: panel support stage
1300: adhesive layer forming unit 1310: adhesive layer discharge head
1400: bonding unit 1410: loading module
1420: mounting module 1430: pressure roller
1500: panel mounting table
2100: panel support stage
2200: lower chamber
2300: first upper chamber 2310: adhesive layer discharge head
2400: second upper chamber 2410: fixed module
2500: panel mount
2600: first lift pin
2700: second lift pin
3600: loading unit
3700: protective film peeling unit
3800: unloading unit
4100: panel support stage
4300: adhesive layer forming unit 4310: adhesive layer discharge head
4400: cementing unit 4410: loading module
4420: mounting module 4430: pressure roller
4500: process mount
PF: Protective film P1: Panel
R: Adhesive layer P2: Panel to be bonded

Claims (8)

A plurality of panel support stages on which the panels are placed;
An adhesive layer forming unit having an adhesive discharge head for discharging the adhesive layer on the panel;
A bonding unit provided radially parallel to the bonding layer forming unit and bonding the bonded panel to the panel on which the bonding layer is formed;
A panel mounting table provided below the adhesive layer forming unit and the bonding unit and intermittently rotating and moving the panel support stage along a horizontal rotation path;
A loading unit provided on one side of the panel mounting table to carry the panel into the panel support stage from the outside;
A protective film peeling unit for peeling the protective film attached to the panel carried on the panel support stage; And
Further comprising an unloading unit provided on one side of the panel mounting table to be spaced apart from the loading unit to carry the panel out of the panel support stage,
The bonding unit,
A loading module for carrying the panel to be bonded into the bonded position from the outside;
A seating module for seating the bonded panel on a panel having the adhesive layer provided above and below the bonded position; And
It includes a pressure roller that slides along an upper surface of the bonded panel seated on the panel on which the adhesive layer is formed to pressurize and bond,
The unloading unit, at the same time or at two times, operates independently from the loading unit, thereby enabling continuous and repeatable progression without interruption in a process operation between a plurality of different panels.
A lower chamber accommodating a plurality of panel support stages on which a panel is placed;
A first upper chamber having an adhesive discharge head for discharging an adhesive layer on the panel;
A second upper chamber provided radially parallel to the first upper chamber and having a fixing module for fixing and providing a bonded panel for bonding to the panel on which the adhesive layer is formed;
A panel mounting table provided below the first upper chamber and the second upper chamber and intermittently rotating and moving the lower chamber along a horizontal rotation path;
A first lift pin provided in a vertical direction parallel to the first upper chamber, the lower chamber being elevated from the panel mounting table;
A second lift pin provided in a vertical direction in parallel with the second upper chamber to lift the lower chamber from the panel mounting table;
A loading unit provided on one side of the panel mounting table to carry the panel from the outside to the panel support stage;
A protective film peeling unit for peeling the protective film attached to the panel carried on the panel support stage; And
Further comprising an unloading unit provided on one side of the panel mounting table to be spaced apart from the loading unit to carry the panel out of the panel support stage,
The lower chamber is combined with the first upper chamber or the second upper chamber to selectively create an internal space into a vacuum atmosphere,
The unloading unit, at the same time or at two times, operates independently from the loading unit, thereby enabling continuous and repeatable progression without interruption in a process operation between a plurality of different panels.
delete The method according to claim 1 or 2,
At least two of the panel support stages are mounted on the panel mounting table.
delete delete A loading step in which the panel mounting table rotates the panel support stage to the loading position along the horizontal rotation path, and carries the panel into the panel support stage from the outside;
An adhesive layer forming step of discharging an adhesive to the panel at a position where an adhesive layer is formed according to the rotational movement of the panel supporting stage;
A bonded panel bonding step of bonding the bonded panel to the panel on which the adhesive layer is formed at a bonded position according to the rotational movement of the panel supporting stage; And
An unloading step of carrying the panel out from the panel support stage at an unloading position according to the rotational movement of the panel support stage,
At the same time or at the same time as the unloading step, the panel and the different panels are independently carried into the loading step so that the display panel bonding process can be continuously and repeatedly performed without interruption.
A loading step of bringing the panel into the panel support stage from the outside;
An adhesive layer forming step in which the process mounting table on which the adhesive layer forming unit is mounted is rotated along a horizontal rotation path so that the adhesive layer forming unit is moved to face the panel support stage to discharge an adhesive layer to the panel;
The process mount on which the bonding unit is mounted radially parallel to the bonding layer forming unit rotates along a horizontal rotation path, so that the bonding unit moves to face the panel support stage so that the panel on which the bonding layer is formed adheres the bonded panel. A step of bonding the panels to be bonded; And
Including an unloading step of carrying the panel out from the panel support stage,
At the same time or at the same time as the unloading step, the panel and the different panels are independently carried into the loading step so that the display panel bonding process can be continuously and repeatedly performed without interruption.

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