TW201304871A - Improved coating apparatus and coating method - Google Patents

Improved coating apparatus and coating method Download PDF

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Publication number
TW201304871A
TW201304871A TW100129004A TW100129004A TW201304871A TW 201304871 A TW201304871 A TW 201304871A TW 100129004 A TW100129004 A TW 100129004A TW 100129004 A TW100129004 A TW 100129004A TW 201304871 A TW201304871 A TW 201304871A
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Taiwan
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coating
substrates
coating liquid
nozzle device
suction platform
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TW100129004A
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Chinese (zh)
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Gab-Su Lee
Young-Soo Kim
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Naraenanotech Corp
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00Means for manipulating or holding work, e.g. for separate articles
    • B05C13/02Means for manipulating or holding work, e.g. for separate articles for particular articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/40Distributing applied liquids or other fluent materials by members moving relatively to surface

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  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)

Abstract

The present invention discloses an improved coating apparatus and coating method. A coating apparatus according to the present invention comprises a jig having a plurality of receiving parts for receiving a plurality of substrates and a plurality of releasing holes, being provided on a bottom of the plurality of receiving parts, for releasing the plurality of substrates; a suction table which the jig is mounted on; a nozzle device, being positioned on the suction table, for applying coating liquid onto the plurality of substrates in a whole surface coating manner in order to form a coating layer; and a gantry, which the nozzle device is mounted on, for moving the nozzle device over the jig in a reciprocating manner.

Description

一種改良的塗佈裝置及塗佈方法Improved coating device and coating method

本發明有關一種改良的塗佈裝置及塗佈方法。The present invention relates to an improved coating apparatus and coating method.

更明確地是,藉由使用能夠承接複數基板之夾具並藉由以整個表面塗佈之方式、局部塗佈之方式、分散式塗佈之方式、及局部與分散式塗佈之方式將塗佈液體施加至複數基板上,本發明有關一種能夠製造對應於各種基板尺寸之基板、去除基板之死區、顯著地減少整體製造成本及生產節拍時間、與輕易地滿足市場/客戶偏好或品味之改良的塗佈裝置及塗佈方法。More specifically, coating is performed by using a jig capable of receiving a plurality of substrates and by coating the entire surface, partially coating, dispersing coating, and partial and dispersion coating. The liquid is applied to a plurality of substrates, and the present invention relates to an improvement in the ability to manufacture substrates corresponding to various substrate sizes, remove dead zones of the substrate, significantly reduce overall manufacturing costs and tact time, and easily satisfy market/customer preferences or tastes. Coating device and coating method.

大致上,用於將塗佈液體施加至諸如玻璃的基板上之塗佈裝置,藉由使用噴嘴分配器或擠壓式噴嘴(在下文一般稱為“噴嘴裝置”),以便製造包括PDP(電漿顯示器面板)、LCD(液晶顯示器)、及OLED(有機發光二極體)等之平板顯示器(FPD)。In general, a coating device for applying a coating liquid onto a substrate such as glass by using a nozzle dispenser or a squeeze nozzle (hereinafter generally referred to as a "nozzle device") to manufacture a PDP including electricity A flat panel display (FPD) such as a plasma display panel, an LCD (Liquid Crystal Display), and an OLED (Organic Light Emitting Diode).

更明確地是,圖1a概要地說明用於根據先前技藝製造PDP或LCD之塗佈裝置。More specifically, Figure 1a schematically illustrates a coating apparatus for fabricating a PDP or LCD in accordance with the prior art.

參考圖1a,在待使用於製造FPD之平台式塗佈機(在下文稱為“塗佈裝置”)100中,其係使用一施加塗佈液體之塗佈方法,該方法包含譬如形成一包括在基板G上所形成之R、G、及B胞元的像素之操作、或一施加用於保護複數塗佈層之保護塗佈層的操作,該保護塗佈層係相繼地形成在該基板G等上,同時在將該基板G定位於空吸平台112上之後,於水平方向中移動一附接至支架125之噴嘴裝置120。Referring to FIG. 1a, in a flatbed coater (hereinafter referred to as "coating device") 100 to be used for manufacturing an FPD, a coating method using a coating liquid is used, which comprises, for example, forming a The operation of the pixels of the R, G, and B cells formed on the substrate G, or the operation of applying the protective coating layer for protecting the plurality of coating layers, the protective coating layers are successively formed on the substrate G or the like, while the substrate G is positioned on the suction platform 112, a nozzle device 120 attached to the holder 125 is moved in the horizontal direction.

更明確地是,首先其係需要將該基板G傳送至該空吸平台112上,以便將塗佈液體施加至該基板G上。在此之後,該基板G在該空吸平台112上藉由該空吸平台112上所形成之空吸區域(未示出)及被連接至該空吸區域的真空裝置(未示出)維持一空吸狀態。在此之後,該塗佈液體係經過形成在該噴嘴裝置120之底部的排出部份122施加至該基板G上。More specifically, first, it is necessary to transport the substrate G onto the suction platform 112 to apply a coating liquid onto the substrate G. After that, the substrate G is maintained on the suction platform 112 by a suction region (not shown) formed on the suction platform 112 and a vacuum device (not shown) connected to the suction region. An empty suction state. Thereafter, the coating liquid system is applied to the substrate G through the discharge portion 122 formed at the bottom of the nozzle device 120.

圖1b概要地說明一俯視圖及一側視圖,顯示圖1a所說明之塗佈裝置。Figure 1b schematically illustrates a top view and a side view showing the coating apparatus illustrated in Figure 1a.

參考圖1b,於使用根據先前技藝之塗佈裝置100的塗佈方法中,該噴嘴裝置120在一整個表面上施加塗佈液體,以便為了形成一塗佈層130,同時該噴嘴裝置120於如箭頭所指示的方向中移動在該基板G之上。在完成該塗佈液體之整個表面塗佈時,其係可能藉由將該基板G切割至所需之尺寸而獲得複數面板P。更明確地是,萬一該基板G係譬如高清晰度電視(HDTV),用於電視之複數面板係藉由將該基板G切割至所需之尺寸(例如40吋、50吋、60吋等)所獲得,而萬一該基板G係譬如用於智慧型手機之觸控螢幕面板(TSP)、諸如使用直接佈圖窗口技術之i-pon,複數觸控螢幕面板係藉由將該基板G切割至所需之尺寸所獲得。在此中,用於電視之複數面板及複數觸控螢幕面板一般將被稱為面板P。Referring to FIG. 1b, in a coating method using a coating apparatus 100 according to the prior art, the nozzle device 120 applies a coating liquid on an entire surface so as to form a coating layer 130 while the nozzle device 120 is The substrate G is moved in the direction indicated by the arrow. When the entire surface coating of the coating liquid is completed, it is possible to obtain the plurality of panels P by cutting the substrate G to a desired size. More specifically, in the event that the substrate G is, for example, a high definition television (HDTV), the plurality of panels for the television are cut to the desired size by the substrate G (for example, 40 吋, 50 吋, 60 吋, etc.) Obtained, and in case the substrate G is, for example, a touch screen panel (TSP) for a smart phone, such as an i-pon using a direct layout window technology, the plurality of touch screen panels are made by the substrate G Cut to the desired size. Here, the plural panel and the plurality of touch screen panels for the television will generally be referred to as the panel P.

於上面所詳細地敘述之先前技藝中,因為在該基板G被定位在該空吸平台112上、且接著該基板G將被切割至所需之尺寸的狀態之下,其係需要在一整個表面上藉由使用噴嘴裝置120將該塗佈液體施加至該基板G上,以下之問題發生。In the prior art described in detail above, since the substrate G is positioned on the suction platform 112 and then the substrate G is to be cut to a desired size, it is required to be entirely The following problem occurs by applying the coating liquid onto the substrate G by using the nozzle device 120 on the surface.

1.譬如,萬一用於行動電話之LCD面板,各種尺寸設計之行動電話產品係依據各種製造公司(例如三星電子、摩托羅拉、諾基亞等)而定以及依據單一製造公司(例如三星電子)而定所製成。為了製造大量生產之各種尺寸設計的LED面板,其必定需要視該等LED面板之尺寸而定使用包含不同種類之塗佈裝置100的高價製造設備。據此,整體製造之成本係顯著地增加,因為不同種類之製造設備應視各種LCD面板之尺寸而定被使用。1. For example, in the case of LCD panels for mobile phones, mobile phone products of various sizes are based on various manufacturing companies (such as Samsung Electronics, Motorola, Nokia, etc.) and are based on a single manufacturing company (such as Samsung Electronics). Made. In order to manufacture LED panels of various sizes designed in large quantities, it is necessary to use expensive manufacturing equipment including different types of coating devices 100 depending on the size of the LED panels. Accordingly, the cost of overall manufacturing is significantly increased because different types of manufacturing equipment should be used depending on the size of various LCD panels.

2.因為於先前技藝中,整個表面塗佈之方式被使用在基板G上,該塗佈液體將被施加至該基板G之整個表面上。在此之後,既然僅只被切割之複數面板P係使用作為最後產品,在此於該基板G上發生未被使用之死區(DR),如可由圖1b看出者。該基板G係高價零件,且如此該製造成本係由於此等死區(DR)之發生而大幅地增加。2. Since in the prior art, the entire surface coating method is used on the substrate G, the coating liquid will be applied to the entire surface of the substrate G. After that, since only the plurality of panel P to be cut is used as the final product, an unused dead zone (DR) occurs on the substrate G, as can be seen from FIG. 1b. The substrate G is a high-priced component, and thus the manufacturing cost is greatly increased due to the occurrence of such dead zones (DR).

3.再者,施加至該等死區(DR)上之不需要的塗佈液體將藉由使用分開的清潔製程及分開的處置製程被去除。如此,由於用以去除該等死區(DR)上之不需要的塗佈液體131之分開的清潔製程及分開的處置製程,該等製造成本及生產節拍時間係額外地增加。3. Again, the unwanted coating liquid applied to the dead zones (DR) will be removed by using separate cleaning processes and separate disposal processes. As such, these manufacturing costs and tact time are additionally increased due to the separate cleaning process and separate disposal processes used to remove the unwanted coating liquid 131 on the dead zones (DR).

4.即使藉由使用如上面所詳細地敘述之分開的、高價製造設備製造各種尺寸設計之面板,當該等最終產品(例如高清晰度電視或智慧型手機等)之銷售係視該市場/客戶偏好或品味而定而不順利時,其係不可能將此業已安裝之分開的、高價製造設備應用至不同尺寸設計之面板的製造。因此,以生產力及商業可行性態樣之觀點,根據先前技藝的塗佈裝置100及使用該塗佈裝置之塗佈方法係不適當的,以用小數量的各種尺寸應用至許多種面板之製造。4. Even when panels of various sizes are manufactured by using separate, high-priced manufacturing equipment as described in detail above, sales of such final products (such as high definition televisions or smart phones, etc.) are considered to be in the market/ When customer preferences or tastes are not smooth, it is not possible to apply separate, high-priced manufacturing equipment that has been installed to the manufacture of panels of different sizes. Therefore, from the viewpoint of productivity and commercial feasibility, the coating device 100 according to the prior art and the coating method using the coating device are not suitable for application to a wide variety of panels in a small number of various sizes. .

因此,用於解決該先前技藝問題之新的解決方法被要求。Therefore, new solutions for solving this prior art problem are required.

本發明被設計來解決上面所敘述之先前技藝問題的至少一或多個,且藉由使用能夠承接複數基板之夾具並藉由以整個表面塗佈之方式、局部塗佈之方式、分散式塗佈之方式、及局部與分散式塗佈之方式將塗佈液體施加至複數基板上,提供一種能夠製造對應於各種基板尺寸之基板、去除基板之死區、顯著地減少整體製造成本及生產節拍時間、與輕易地滿足市場/客戶偏好或品味之改良的塗佈裝置及塗佈方法。The present invention is designed to address at least one or more of the prior art problems described above, and by using a jig capable of receiving a plurality of substrates and by means of coating the entire surface, by partial coating, by dispersion coating The coating method and the partial and decentralized coating method apply the coating liquid to the plurality of substrates, providing a substrate capable of manufacturing substrates corresponding to various substrate sizes, removing dead zones of the substrate, significantly reducing overall manufacturing cost, and producing beats. Time, and improved coating equipment and coating methods that easily meet market/customer preferences or tastes.

根據本發明之第一態樣,本發明提供一塗佈裝置,包括夾具,其具有用於承接複數基板之複數承接零件、及設在該複數承接零件的底部上用於釋放該複數基板之複數釋放孔洞;空吸平台,該夾具被安裝在該空吸平台上;噴嘴裝置,其被定位在該空吸平台上,用於以整個表面塗佈之方式將塗佈液體施加至該複數基板上,以便形成一塗佈層;及支架,該噴嘴裝置被安裝在該支架上,用於在該夾具之上以往復移動之方式移動該噴嘴裝置。According to a first aspect of the present invention, there is provided a coating apparatus comprising a jig having a plurality of receiving parts for receiving a plurality of substrates, and a plurality of substrates disposed on a bottom of the plurality of receiving parts for releasing the plurality of substrates Release a hole; an air suction platform on which the clamp is mounted; a nozzle device positioned on the suction platform for applying a coating liquid to the plurality of substrates in a manner of coating the entire surface To form a coating layer; and a bracket, the nozzle device is mounted on the bracket for moving the nozzle device in a reciprocating manner over the clamp.

根據本發明之第二態樣,本發明提供一塗佈裝置,包括夾具,其具有用於承接複數基板之複數承接零件、及設在該複數承接零件的底部上用於釋放該複數基板之複數釋放孔洞;空吸平台,該夾具被安裝在該空吸平台上;噴嘴裝置,其被定位在該空吸平台上,用於以局部塗佈之方式將塗佈液體施加至該複數基板上,以便沿著施加該塗佈液體之方向形成複數塗佈層;及支架,該噴嘴裝置被安裝在該支架上,用於在該夾具之上以往復移動之方式移動該噴嘴裝置。According to a second aspect of the present invention, there is provided a coating apparatus comprising a jig having a plurality of receiving parts for receiving a plurality of substrates, and a plurality of substrates provided on the bottom of the plurality of receiving parts for releasing the plurality of substrates Dissipating a hole; a suction platform mounted on the suction platform; a nozzle device positioned on the suction platform for applying a coating liquid to the plurality of substrates in a partial coating manner, A plurality of coating layers are formed in a direction in which the coating liquid is applied; and a holder, the nozzle device being mounted on the holder for moving the nozzle device in a reciprocating manner over the jig.

根據本發明之第三態樣,本發明提供一塗佈裝置,包括夾具,其具有用於承接複數基板之複數承接零件、及設在該複數承接零件的底部上用於釋放該複數基板之複數釋放孔洞;空吸平台,該夾具被安裝在該空吸平台上;噴嘴裝置,其被定位在該空吸平台上,用於以分散式塗佈之方式將塗佈液體施加至該複數基板上,以便沿著與施加該塗佈液體之方向垂直的方向形成複數塗佈層;及支架,該噴嘴裝置被安裝在該支架上,用於在該夾具之上以往復移動之方式移動該噴嘴裝置。According to a third aspect of the present invention, there is provided a coating apparatus comprising: a jig having a plurality of receiving parts for receiving a plurality of substrates, and a plurality of substrates provided on the bottom of the plurality of receiving parts for releasing the plurality of substrates Release a hole; an air suction platform on which the clamp is mounted; a nozzle device positioned on the suction platform for applying a coating liquid to the plurality of substrates in a distributed coating manner Forming a plurality of coating layers in a direction perpendicular to a direction in which the coating liquid is applied; and a holder, the nozzle device being mounted on the holder for moving the nozzle device reciprocally over the jig .

根據本發明之第四態樣,本發明提供一塗佈裝置,包括夾具,其具有用於承接複數基板之複數承接零件、及設在該複數承接零件的底部上用於釋放該複數基板之複數釋放孔洞;空吸平台,該夾具被安裝在該空吸平台上;噴嘴裝置,其被定位在該空吸平台上,用於以局部與分散式塗佈之方式將塗佈液體施加至該複數基板上,以便在其上面形成個別之塗佈層;及支架,該噴嘴裝置被安裝在該支架上,用於在該夾具之上以往復移動之方式移動該噴嘴裝置。According to a fourth aspect of the present invention, there is provided a coating apparatus comprising a jig having a plurality of receiving parts for receiving a plurality of substrates, and a plurality of substrates disposed on a bottom of the plurality of receiving parts for releasing the plurality of substrates a voiding platform; the clamp is mounted on the suction platform; a nozzle device positioned on the suction platform for applying a coating liquid to the plurality in a partial and distributed coating manner a separate coating layer on the substrate to form thereon; and a bracket on which the nozzle device is mounted for moving the nozzle device in a reciprocating manner over the clamp.

根據本發明之第五態樣,本發明提供一塗佈方法,包含以下步驟:a)承接複數基板進入配備有一夾具之複數承接零件;b)將該夾具安裝至空吸平台上;及c)將塗佈液體施加至該複數基板上,同時在該夾具之上藉由使用支架以往復移動之方式移動噴嘴裝置,該噴嘴裝置係安裝在該支架上。According to a fifth aspect of the present invention, there is provided a coating method comprising the steps of: a) receiving a plurality of substrates into a plurality of receiving parts provided with a jig; b) mounting the jig to the suction platform; and c) A coating liquid is applied to the plurality of substrates while the nozzle device is moved over the jig by reciprocating movement using the holder, the nozzle device being mounted on the holder.

當使用根據本發明之改良的塗佈裝置及塗佈方法時,以下之優點被完成:When using the improved coating apparatus and coating method according to the present invention, the following advantages are achieved:

1.其係可能輕易以小數量地製造具有各種尺寸之許多種面板。1. It is possible to easily manufacture a wide variety of panels of various sizes in small quantities.

2.用於安裝製造設備之成本被大幅地減少,因為僅只代換能夠承接用於不同尺寸設計之面板的基板之夾具,以便製造各種尺寸設計之面板。再者,當與視面板之尺寸而定需要安裝分開單元之製造設備的先前技藝比較時,因為其於製造各種尺寸設計之面板中係需要僅只安裝一單元的製造設備,用於整個單元的製造設備所需要之成本被顯著地降低。2. The cost for installing the manufacturing equipment is greatly reduced because only the jigs capable of accepting substrates for panels of different sizes are replaced for manufacturing panels of various sizes. Furthermore, when comparing the prior art of manufacturing equipment that requires separate units depending on the size of the viewing panel, it is necessary to install only one unit of manufacturing equipment for manufacturing the entire unit because it is required to manufacture panels of various sizes. The cost of the equipment is significantly reduced.

3.既然使用能夠承接複數基板之夾具,在該等基板上不會發生死區,不像先前技藝,且如此製造成本係顯著地降低。再者,除了整個表面塗佈之方式以外,其係可能以局部塗佈之方式、分散式塗佈之方式、及局部與分散式塗佈之方式使用,不需要之塗佈液體的使用能被減少、減至最小、或去除,以致製造成本及生產節拍時間被減少。3. Since a jig capable of receiving a plurality of substrates is used, no dead zone occurs on the substrates, unlike the prior art, and the manufacturing cost is significantly reduced. Furthermore, in addition to the entire surface coating method, it may be used in a partial coating manner, a dispersion coating method, and a partial and dispersion coating method, and the use of the coating liquid which is not required can be used. Reduced, minimized, or removed, resulting in reduced manufacturing costs and tact time.

4.甚至當市場/客戶偏好或品味被改變時,其係非常易於經過代換一夾具來製造不同尺寸設計之面板,以致其係可能以生產力及商業可行性態樣之觀點滿足此一改變。4. Even when market/customer preferences or tastes are changed, it is very easy to replace panels with different sizes to create panels of different sizes so that they may satisfy this change in terms of productivity and commercial viability.

本發明之進一步特色及優點可參考所附圖面被明顯地了解,在該等圖面處,相同或類似的參考數字指示相同的結構性零組件。The features and advantages of the invention are apparent from the drawings, wherein the same or similar reference numerals indicate the same structural components.

在下文,本發明將參考較佳具體實施例及所附圖面被更詳細地敘述。In the following, the invention will be described in more detail with reference to preferred embodiments and drawings.

應注意的是根據本發明之所有具體實施例的塗佈裝置200將稍後藉由參考圖2a至2d被敘述,其大體上係與圖1a及1b所說明之先前技藝的塗佈裝置100相同,除了本發明使用1)夾具240,用於承接複數基板Ga,Gb,Gc,及2)各種塗佈之方式(明確地是,整個表面塗佈之方式、局部塗佈之方式、分散式塗佈之方式、及局部與分散式塗佈之方式的任何一種)以外。再者,其亦應注意的是在根據本發明之所有具體實施例的塗佈裝置200中,複數基板Ga,Gb,Gc對應於圖1a及1b所說明之先前技藝的面板P。It should be noted that the coating apparatus 200 in accordance with all embodiments of the present invention will be described later with reference to Figures 2a through 2d, which are generally identical to the prior art coating apparatus 100 illustrated in Figures 1a and 1b. In addition to the present invention, 1) the clamp 240 is used to receive a plurality of substrates Ga, Gb, Gc, and 2) various coating methods (specifically, the entire surface coating method, the partial coating method, the dispersion coating method Other than the method of cloth, and any of the methods of partial and dispersion coating. Furthermore, it should also be noted that in the coating apparatus 200 according to all of the embodiments of the present invention, the plurality of substrates Ga, Gb, Gc correspond to the panel P of the prior art illustrated in Figs. 1a and 1b.

再者,在圖2a至2d中所說明的本發明之所有具體實施例中,萬一需要,將稍後被敘述而指示複數基板之參考數字Ga,Gb,Gc一般可被稱為G。Furthermore, in all of the specific embodiments of the invention illustrated in Figures 2a to 2d, the reference numerals Ga, Gb, Gc, which will be described later, to indicate the plurality of substrates, may generally be referred to as G, if desired.

圖2a概要地說明根據本發明之第一具體實施例的塗佈裝置之俯視圖及一側視圖。Figure 2a schematically illustrates a top view and a side view of a coating apparatus in accordance with a first embodiment of the present invention.

隨同圖1a及1b參考圖2a,根據本發明之塗佈裝置200包括夾具240,其具有用於承接複數基板Ga,Gb,Gc之複數承接零件242、及被設在該複數承接零件242的底部上且用於釋放該複數基板Ga,Gb,Gc之複數釋放孔洞244;空吸平台212,該夾具240被安裝在該空吸平台212上;噴嘴裝置220,其被定位在該空吸平台212上,用於以整個表面塗佈之方式將塗佈液體施加至該複數基板Ga,Gb,Gc上,以便形成一塗佈層230;及支架125,該噴嘴裝置220被安裝在該支架125上,用於在該夾具240之上以往復移動之方式移動該噴嘴裝置220。Referring to FIG. 2a along with FIGS. 1a and 1b, a coating apparatus 200 according to the present invention includes a jig 240 having a plurality of receiving members 242 for receiving a plurality of substrates Ga, Gb, Gc, and a bottom portion of the plurality of receiving members 242. And a plurality of release holes 244 for releasing the plurality of substrates Ga, Gb, Gc; a suction platform 212, the clamp 240 is mounted on the suction platform 212; and a nozzle device 220 positioned on the suction platform 212 Applying a coating liquid to the plurality of substrates Ga, Gb, Gc in a manner of coating the entire surface to form a coating layer 230; and a holder 125 on which the nozzle device 220 is mounted The nozzle device 220 is moved over the clamp 240 in a reciprocating manner.

在下文,根據本發明之第一具體實施例的塗佈裝置200之結構及操作將被更詳細地敘述。Hereinafter, the structure and operation of the coating apparatus 200 according to the first embodiment of the present invention will be described in more detail.

回頭隨著圖1a及1b參考圖2a,根據本發明之第一具體實施例的塗佈裝置200包括具有複數承接零件242之夾具240。對應於所需要之尺寸設計的面板之複數基板G被承接在該夾具240之複數承接零件242內。譬如,當其係需要製造不同尺寸設計的面板時,其明顯的是具有複數承接零件242之夾具240應該被使用,而該等承接零件242滿足該等基板G之尺寸,該夾具240對應於相關面板之尺寸。Referring back to Figures 2a with Figures 1a and 1b, a coating apparatus 200 in accordance with a first embodiment of the present invention includes a clamp 240 having a plurality of receiving parts 242. A plurality of substrates G corresponding to the panels of the desired size are received within the plurality of receiving members 242 of the fixture 240. For example, when it is desired to manufacture panels of different sizes, it is obvious that the fixture 240 having the plurality of receiving parts 242 should be used, and the receiving parts 242 satisfy the dimensions of the substrates G, the fixtures 240 corresponding to the relevant The size of the panel.

再者,根據本發明之第一具體實施例的夾具240具有設在該複數承接零件242的底部上之複數釋放孔洞244,以便在將該塗佈液體施加至該複數基板Ga,Gb,Gc上被完成之後,由該夾具240釋放該複數基板Ga,Gb,Gc。萬一由該夾具240之頂部表面譬如藉由使用真空等空吸該複數基板Ga,Gb,Gc,此複數釋放孔洞244被設在複數承接零件242之底部的理由係保護該塗佈層230免於損壞,該塗佈層230係藉由該塗佈液體形成在該複數基板Ga,Gb,Gc上。Furthermore, the jig 240 according to the first embodiment of the present invention has a plurality of release holes 244 provided on the bottom of the plurality of receiving members 242 for applying the coating liquid to the plurality of substrates Ga, Gb, Gc. After being completed, the plurality of substrates Ga, Gb, Gc are released by the jig 240. The coating layer 230 is protected from the top surface of the jig 240 by, for example, vacuuming the plurality of substrates Ga, Gb, Gc, and the plurality of release holes 244 are provided at the bottom of the plurality of receiving members 242. In the case of damage, the coating layer 230 is formed on the plurality of substrates Ga, Gb, Gc by the coating liquid.

同時,該夾具240,該等承接複數基板Ga,Gb,Gc係被安裝在該空吸平台212。安裝在該支架125上之噴嘴裝置220能以往復移動之方式藉由該支架125在該夾具240之上移動。當該噴嘴裝置220在該夾具240之上沿著如箭頭所指示之方向移動時,該噴嘴裝置220將該塗佈液體施加至該複數基板Ga,Gb,Gc上,以便形成該塗佈層230。At the same time, the jig 240, which receives the plurality of substrates Ga, Gb, Gc, is mounted on the suction platform 212. The nozzle assembly 220 mounted on the bracket 125 is movable over the clamp 240 by the bracket 125 in a reciprocating manner. When the nozzle device 220 moves over the jig 240 in a direction as indicated by an arrow, the nozzle device 220 applies the coating liquid to the plurality of substrates Ga, Gb, Gc to form the coating layer 230. .

再者,於根據本發明之第一具體實施例的塗佈裝置200中,該塗佈液體係以整個表面塗佈之方式施加。於此案例中,該噴嘴裝置200具有一排放部份222,且沿著一與施加該塗佈液體之方向垂直的方向(亦即,一垂直於圖2a所顯示之箭頭的方向),設有與該複數基板Ga,Gb,Gc之寬度W2完全相同或比該複數基板Ga,Gb,Gc之寬度W2更寬的寬度W1。如此,於根據本發明之第一具體實施例的塗佈裝置200中,不需要之塗佈液體231被施加至該夾具240上,因為使用該整個表面塗佈之方式,同時死區(DR)不會發生在該複數基板Ga,Gb,Gc上。Further, in the coating device 200 according to the first embodiment of the present invention, the coating liquid system is applied in the form of the entire surface coating. In this case, the nozzle device 200 has a discharge portion 222 and is disposed along a direction perpendicular to the direction in which the coating liquid is applied (i.e., a direction perpendicular to the arrow shown in Fig. 2a). The width W2 of the plurality of substrates Ga, Gb, and Gc is completely the same or a width W1 wider than the width W2 of the plurality of substrates Ga, Gb, and Gc. Thus, in the coating apparatus 200 according to the first embodiment of the present invention, the unnecessary coating liquid 231 is applied to the jig 240 because the entire surface coating method is used, and the dead zone (DR) is simultaneously used. It does not occur on the plurality of substrates Ga, Gb, Gc.

圖2b概要地說明根據本發明之第二具體實施例的塗佈裝置之俯視圖及一側視圖。Figure 2b schematically illustrates a top view and a side view of a coating apparatus in accordance with a second embodiment of the present invention.

隨著圖1a及1b參考圖2b,根據本發明之第二具體實施例的塗佈裝置200包括夾具240,其具有用於承接複數基板Ga,Gb,Gc之複數承接零件242、及被設在該複數承接零件242的底部上且用於釋放該複數基板Ga,Gb,Gc之複數釋放孔洞244;空吸平台212,該夾具240被安裝在該空吸平台212上;噴嘴裝置220,其被定位在該空吸平台212上,用於以局部塗佈之方式將塗佈液體施加至該複數基板Ga,Gb,Gc上,以便沿著施加該塗佈液體之方向形成複數塗佈層230a,230b,230c;及支架125,該噴嘴裝置220被安裝在該支架125上,用於在該夾具240之上以往復移動之方式移動該噴嘴裝置220。1a and 1b with reference to FIG. 2b, a coating apparatus 200 according to a second embodiment of the present invention includes a jig 240 having a plurality of receiving parts 242 for receiving a plurality of substrates Ga, Gb, Gc, and is provided The plurality of receiving parts 242 are on the bottom of the part 242 for releasing the plurality of substrates Ga, Gb, Gc, the release holes 244, the suction platform 212, the fixture 240 is mounted on the suction platform 212, and the nozzle device 220 is Positioning on the suction platform 212 for applying a coating liquid to the plurality of substrates Ga, Gb, Gc in a partial coating manner to form a plurality of coating layers 230a in a direction in which the coating liquid is applied, 230b, 230c; and a bracket 125, the nozzle device 220 is mounted on the bracket 125 for moving the nozzle device 220 in a reciprocating manner over the clamp 240.

根據上述本發明之第二具體實施例的塗佈裝置200大體上係與圖2a所說明之根據本發明的第一具體實施例之塗佈裝置200相同,除了局部塗佈之方式被使用於該複數基板Ga,Gb,Gc以外。因此,根據本發明之第二具體實施例的塗佈裝置200之局部塗佈方式將在下文被詳細地敘述。The coating apparatus 200 according to the second embodiment of the present invention described above is substantially the same as the coating apparatus 200 according to the first embodiment of the present invention illustrated in Fig. 2a, except that a partial coating method is used for the coating apparatus 200. The plurality of substrates Ga, Gb, and Gc are included. Therefore, the partial coating mode of the coating device 200 according to the second embodiment of the present invention will be described in detail below.

回頭隨著圖1a及1b參考圖2b,於根據本發明之第二具體實施例的塗佈裝置200中,該塗佈液體係以局部塗佈之方式施加。於此案例中,該噴嘴裝置200具有複數排放部份222a,222b,222c。雖然其在圖2b之具體實施例中說明性地顯示該噴嘴裝置200具有三個排放部份222a,222b,222c,任何熟諳該技藝者可充分地了解該複數排放部份222a,222b,222c之數目對應於該複數基板Ga,Gb,Gc之列方向(垂直於圖2b所顯示之箭頭的方向)之數目,且如此可為少於3個或4個或更多個。Referring back to Figures 2b and Figures 1b, in a coating apparatus 200 in accordance with a second embodiment of the present invention, the coating liquid system is applied in a partial coating manner. In this case, the nozzle assembly 200 has a plurality of discharge portions 222a, 222b, 222c. Although it is illustratively shown in the embodiment of Figure 2b that the nozzle assembly 200 has three discharge portions 222a, 222b, 222c, the skilled person will be fully aware of the plurality of discharge portions 222a, 222b, 222c. The number corresponds to the number of columns of the plurality of substrates Ga, Gb, Gc (perpendicular to the direction of the arrow shown in Fig. 2b), and may be less than three or four or more.

同時,沿著一與施加該塗佈液體之方向垂直的方向,該複數排放部份222a,222b,222c之個別寬度具有與該複數基板Ga,Gb,Gc之個別寬度Wa,Wb,Wc完全相同或比該複數基板Ga,Gb,Gc之個別寬度Wa,Wb,Wc更寬的寬度。如此,於根據本發明之第二具體實施例的塗佈裝置200中,仍然不需要之塗佈液體231沿著施加該塗佈液體之方向被施加至該夾具240上,同時死區(DR)不會發生在該複數基板Ga,Gb,Gc上,因為使用該局部塗佈之方式。於此案例中,其為明顯的是根據本發明之第二具體實施例的夾具240上之不需要的塗佈液體231之數量係少於根據本發明之第一具體實施例的夾具240上之不需要的塗佈液體231之數量。Meanwhile, the respective widths of the plurality of discharge portions 222a, 222b, and 222c are exactly the same as the individual widths Wa, Wb, and Wc of the plurality of substrates Ga, Gb, and Gc in a direction perpendicular to a direction in which the coating liquid is applied. Or a wider width than the individual widths Wa, Wb, Wc of the plurality of substrates Ga, Gb, Gc. Thus, in the coating device 200 according to the second embodiment of the present invention, the coating liquid 231 which is still unnecessary is applied to the jig 240 in the direction in which the coating liquid is applied, while the dead zone (DR) It does not occur on the plurality of substrates Ga, Gb, Gc because the local coating method is used. In this case, it is apparent that the number of unnecessary coating liquids 231 on the jig 240 according to the second embodiment of the present invention is less than that of the jig 240 according to the first embodiment of the present invention. The amount of coating liquid 231 that is not required.

圖2c概要地說明根據本發明之第三具體實施例的塗佈裝置之俯視圖及一側視圖。Figure 2c schematically illustrates a top view and a side view of a coating apparatus in accordance with a third embodiment of the present invention.

隨著圖1a及1b參考圖2c,根據本發明之第三具體實施例的塗佈裝置200包括夾具240,其具有用於承接複數基板Ga,Gb,Gc之複數承接零件242、及被設在該複數承接零件242的底部上且用於釋放該複數基板Ga,Gb,Gc之複數釋放孔洞244;空吸平台212,該夾具240被安裝在該空吸平台212上;噴嘴裝置220,其被定位在該空吸平台212上,用於以分散式塗佈之方式將塗佈液體施加至該複數基板Ga,Gb,Gc上,以便沿著與施加該塗佈液體之方向垂直的方向形成複數塗佈層230a,230b,230c;及支架125,該噴嘴裝置220被安裝在該支架125上,用於在該夾具240之上以往復移動之方式移動該噴嘴裝置220。1a and 1b with reference to FIG. 2c, a coating apparatus 200 according to a third embodiment of the present invention includes a jig 240 having a plurality of receiving parts 242 for receiving a plurality of substrates Ga, Gb, Gc, and The plurality of receiving parts 242 are on the bottom of the part 242 for releasing the plurality of substrates Ga, Gb, Gc, the release holes 244, the suction platform 212, the fixture 240 is mounted on the suction platform 212, and the nozzle device 220 is Positioned on the suction platform 212 for applying a coating liquid to the plurality of substrates Ga, Gb, Gc in a dispersion coating manner to form a plurality in a direction perpendicular to a direction in which the coating liquid is applied. A coating layer 230a, 230b, 230c; and a bracket 125 is mounted on the bracket 125 for moving the nozzle device 220 in a reciprocating manner over the clamp 240.

根據上述本發明之第三具體實施例的塗佈裝置200大體上係與圖2a所說明之根據本發明的第一具體實施例之塗佈裝置200相同,除了分散式塗佈之方式被使用於該複數基板Ga,Gb,Gc以外。因此,根據本發明之第三具體實施例的塗佈裝置200之分散式塗佈方式將在下文被詳細地敘述。The coating apparatus 200 according to the third embodiment of the present invention described above is substantially the same as the coating apparatus 200 according to the first embodiment of the present invention illustrated in Fig. 2a, except that the method of dispersion coating is used. The plurality of substrates Ga, Gb, and Gc are other than the substrate. Therefore, the dispersion coating method of the coating device 200 according to the third embodiment of the present invention will be described in detail below.

回頭隨著圖1a及1b參考圖2c,於根據本發明之第三具體實施例的塗佈裝置200中,該塗佈液體係以分散式塗佈之方式施加。於此案例中,沿著一與施加該塗佈液體之方向垂直的方向(亦即,一垂直於圖2c所顯示之箭頭的方向),該噴嘴裝置220之排放部份222的寬度W1具有與該複數基板Ga,Gb,Gc之寬度W2完全相同或比該複數基板Ga,Gb,Gc之寬度W2更寬的寬度。Referring back to Figures 2c with Figures 1a and 1b, in a coating apparatus 200 in accordance with a third embodiment of the present invention, the coating liquid system is applied in a dispersion coating manner. In this case, along a direction perpendicular to the direction in which the coating liquid is applied (i.e., a direction perpendicular to the arrow shown in Fig. 2c), the width W1 of the discharge portion 222 of the nozzle device 220 has and The width W2 of the plurality of substrates Ga, Gb, and Gc is completely the same or wider than the width W2 of the plurality of substrates Ga, Gb, and Gc.

同時,該噴嘴裝置220開始經過該分配部份222緊接在該複數基板Ga,Gb,Gc之第一列Ga1,Gb1,Gc1的前端之前注入該塗佈液體,且緊接在該第一列Ga1,Gb1,Gc1的後端之後停止該塗佈液體之注入。在此之後,當該噴嘴裝置220藉由該支架125連續地移動時,該噴嘴裝置220開始經過該分配部份222緊接在該複數基板Ga,Gb,Gc之第二列Ga2,Gb2,Gc2的前端之前注入該塗佈液體,且緊接在該第二列Ga2,Gb2,Gc2的後端之後停止該塗佈液體之注入。在此之後,當該噴嘴裝置220藉由該支架125連續地移動時,該噴嘴裝置220重新開始經過該分配部份222緊接在該複數基板Ga,Gb,Gc之第三列Ga3,Gb3,Gc3的前端之前注入該塗佈液體,且緊接在該第三列Ga3,Gb3,Gc3的後端之後停止該塗佈液體之注入。亦即,緊接在該複數基板Ga,Gb,Gc的前端之前及緊接該後端之後,沿著該複數基板Ga,Gb,Gc的一列方向,該噴嘴裝置220相繼地施行注入該塗佈液體之開始及停止操作,該列方向係垂直於施加該塗佈液體之方向。該塗佈液體之此一塗佈方式係引用分散式塗佈之方式。雖然該複數基板Ga,Gb,Gc被說明性地顯示為具有三列,任何熟諳該技藝者可充分地了解該複數基板Ga,Gb,Gc能具有少於3列、或4或更多列之任一者。根據本發明之第三具體實施例的塗佈裝置200可額外地包括具有內建之控制程式的控制器(未示出),用於控制根據該分散式塗佈之方式注入該塗佈液體的開始及停止操作。此一控制器(未示出)可藉由譬如微處理器或個人電腦(PC)等被具體化,而該控制程式可被預先程式設計。At the same time, the nozzle device 220 begins to inject the coating liquid through the dispensing portion 222 immediately before the front ends of the first columns Ga1, Gb1, Gc1 of the plurality of substrates Ga, Gb, Gc, and immediately adjacent to the first column. The injection of the coating liquid is stopped after the rear end of Ga1, Gb1, and Gc1. After that, when the nozzle device 220 is continuously moved by the bracket 125, the nozzle device 220 starts to pass through the distributing portion 222 and is adjacent to the second column Ga2, Gb2, Gc2 of the plurality of substrates Ga, Gb, Gc. The coating liquid is injected before the front end, and the injection of the coating liquid is stopped immediately after the rear end of the second column Ga2, Gb2, Gc2. After that, when the nozzle device 220 is continuously moved by the bracket 125, the nozzle device 220 restarts to pass through the distribution portion 222 next to the third column Ga3, Gb3 of the plurality of substrates Ga, Gb, Gc, The coating liquid is injected before the front end of the Gc3, and the injection of the coating liquid is stopped immediately after the rear end of the third column Ga3, Gb3, Gc3. That is, immediately before and immediately after the front end of the plurality of substrates Ga, Gb, Gc, the nozzle device 220 successively performs the application of the coating along a column direction of the plurality of substrates Ga, Gb, and Gc. The start and stop operations of the liquid are perpendicular to the direction in which the coating liquid is applied. This coating of the coating liquid is by way of dispersion coating. Although the plurality of substrates Ga, Gb, Gc are illustratively shown as having three columns, the skilled artisan can fully understand that the plurality of substrates Ga, Gb, Gc can have less than 3 columns, or 4 or more columns. Either. The coating apparatus 200 according to the third embodiment of the present invention may additionally include a controller (not shown) having a built-in control program for controlling injection of the coating liquid according to the manner of the dispersion coating. Start and stop operations. Such a controller (not shown) can be embodied by, for example, a microprocessor or a personal computer (PC), and the control program can be pre-programmed.

如上面所敘述,於根據本發明之第三具體實施例的塗佈裝置200中,仍然不需要之塗佈液體231被施加至該夾具240上,因為使用該分散式塗佈之方式,同時死區(DR)不會發生在該複數基板Ga,Gb,Gc上。於此案例中,其為明顯的是根據本發明之第三具體實施例的夾具240上之不需要的塗佈液體231之數量係少於根據本發明之第一具體實施例的夾具240上之不需要的塗佈液體231之數量。As described above, in the coating apparatus 200 according to the third embodiment of the present invention, the coating liquid 231 which is still unnecessary is applied to the jig 240 because the dispersion coating method is used to simultaneously die. The region (DR) does not occur on the plurality of substrates Ga, Gb, Gc. In this case, it is apparent that the number of unnecessary coating liquids 231 on the jig 240 according to the third embodiment of the present invention is less than that of the jig 240 according to the first embodiment of the present invention. The amount of coating liquid 231 that is not required.

圖2d概要地說明根據本發明之第四具體實施例的塗佈裝置之俯視圖及一側視圖。Figure 2d schematically illustrates a top view and a side view of a coating apparatus in accordance with a fourth embodiment of the present invention.

隨著圖1a及1b參考圖2d,根據本發明之第四具體實施例的塗佈裝置200包括夾具240,其具有用於承接複數基板Ga,Gb,Gc之複數承接零件242、及被設在該複數承接零件242的底部上且用於釋放該複數基板Ga,Gb,Gc之複數釋放孔洞244;空吸平台212,該夾具240被安裝在該空吸平台212上;噴嘴裝置220,其被定位在該空吸平台212上,用於以局部與分散式塗佈之方式將塗佈液體施加至該複數基板Ga,Gb,Gc上,以便在其上面形成個別之塗佈層230;及支架125,該噴嘴裝置220被安裝在該支架125上,用於在該夾具240之上以往復移動之方式移動該噴嘴裝置220。1a and 1b with reference to FIG. 2d, a coating apparatus 200 according to a fourth embodiment of the present invention includes a jig 240 having a plurality of receiving parts 242 for receiving a plurality of substrates Ga, Gb, Gc, and The plurality of receiving parts 242 are on the bottom of the part 242 for releasing the plurality of substrates Ga, Gb, Gc, the release holes 244, the suction platform 212, the fixture 240 is mounted on the suction platform 212, and the nozzle device 220 is Positioning on the suction platform 212 for applying a coating liquid to the plurality of substrates Ga, Gb, Gc in a partial and dispersion coating manner to form an individual coating layer 230 thereon; and a bracket 125. The nozzle device 220 is mounted on the bracket 125 for moving the nozzle device 220 in a reciprocating manner over the clamp 240.

根據上述本發明之第四具體實施例的塗佈裝置200大體上係與圖2a所說明之根據本發明的第一具體實施例之塗佈裝置200相同,除了局部與分散式塗佈之方式被使用於該複數基板Ga,Gb,Gc以外。因此,根據本發明之第四具體實施例的塗佈裝置200之局部與分散式塗佈方式將在下文被詳細地敘述。The coating apparatus 200 according to the fourth embodiment of the present invention described above is substantially the same as the coating apparatus 200 according to the first embodiment of the present invention illustrated in Fig. 2a, except that the partial and distributed coating methods are It is used in addition to the plurality of substrates Ga, Gb, and Gc. Therefore, the partial and dispersion coating method of the coating apparatus 200 according to the fourth embodiment of the present invention will be described in detail below.

回頭隨著圖1a及1b參考圖2d,於根據本發明之第四具體實施例的塗佈裝置200中,該塗佈液體係以局部與分散式塗佈之方式施加。於此案例中,該噴嘴裝置200具有複數排放部份222a,222b,222c,像在圖2b中所顯示之案例。雖然其在圖2d之具體實施例中說明性地顯示該噴嘴裝置200具有三個排放部份222a,222b,222c,任何熟諳該技藝者可充分地了解該複數排放部份222a,222b,222c之數目對應於該複數基板Ga,Gb,Gc之列方向(垂直於圖2d所顯示之箭頭的方向)之數目,且如此可為少於3個或4個或更多個。Referring back to Figures 2d with Figures 1a and 1b, in a coating apparatus 200 in accordance with a fourth embodiment of the present invention, the coating liquid system is applied in a partial and dispersion coating manner. In this case, the nozzle assembly 200 has a plurality of discharge portions 222a, 222b, 222c, as shown in Figure 2b. Although it is illustratively shown in the embodiment of Figure 2d that the nozzle assembly 200 has three discharge portions 222a, 222b, 222c, the skilled person will be fully aware of the plurality of discharge portions 222a, 222b, 222c. The number corresponds to the number of columns of the plurality of substrates Ga, Gb, Gc (perpendicular to the direction of the arrow shown in Fig. 2d), and may be less than three or four or more.

同時,該複數排放部份222a,222b,222c之個別寬度具有與該複數基板Ga,Gb,Gc之個別寬度Wa,Wb,Wc完全相同或比該複數基板Ga,Gb,Gc之個別寬度Wa,Wb,Wc更寬的寬度。Meanwhile, the individual widths of the plurality of discharge portions 222a, 222b, and 222c have the same widths as the individual widths Wa, Wb, and Wc of the plurality of substrates Ga, Gb, and Gc or the individual widths Wa of the plurality of substrates Ga, Gb, and Gc. Wb, Wc wider width.

如上面所敘述,於根據本發明之第四具體實施例的塗佈裝置200中,該噴嘴裝置220開始經過複數分配部份222a,222b,222c緊接在該複數基板Ga,Gb,Gc之第一列Ga1,Gb1,Gc1至第三列Ga3,Gb3,Gc3的個別前端之前注入塗佈液體,且緊接在該複數基板Ga,Gb,Gc之該第一列Ga1,Gb1,Gc1至該第三列Ga3,Gb3,Gc3的個別後端之後停止該塗佈液體之注入,同時該噴嘴裝置220沿著施加該塗佈液體之方向(亦即,在圖2d中所顯示的箭頭之方向)中移動。亦即,於本發明的第四具體實施例中之噴嘴裝置220以局部塗佈之方式施加該塗佈液體,以於該複數基板Ga,Gb,Gc之列方向中沿著一與施加該塗佈液體之方向垂直的方向具有該個別之寬度Wa,Wb,Wc,而遍及該複數基板Ga,Gb,Gc的一行方向(亦即,在圖2d中所顯示的箭頭之方向)之個別長度L1,L2,L3沿著施加該塗佈液體的方向同時以分散式塗佈之方式施加該塗佈液體。該塗佈液體之此一塗佈方式係引用局部與分散式塗佈之方式。根據本發明之第四具體實施例的塗佈裝置200可額外地包括具有內建之控制程式的控制器(未示出),用於控制根據該局部與分散式塗佈之方式注入該塗佈液體的開始及停止操作。此一控制器(未示出)可藉由譬如微處理器或個人電腦(PC)等被具體化,而該控制程式可被預先程式設計。As described above, in the coating apparatus 200 according to the fourth embodiment of the present invention, the nozzle unit 220 starts to pass through the plurality of distribution portions 222a, 222b, and 222c immediately adjacent to the plurality of substrates Ga, Gb, and Gc. a column of Ga1, Gb1, Gc1 to third columns Ga3, Gb3, Gc3 are injected with a coating liquid before the individual front ends, and immediately adjacent to the first column Ga1, Gb1, Gc1 of the plurality of substrates Ga, Gb, Gc The injection of the coating liquid is stopped after the individual rear ends of the three columns Ga3, Gb3, Gc3, while the nozzle device 220 is in the direction in which the coating liquid is applied (i.e., in the direction of the arrow shown in Fig. 2d) mobile. That is, the nozzle device 220 in the fourth embodiment of the present invention applies the coating liquid in a partial coating manner to apply the coating along the direction of the plurality of substrates Ga, Gb, and Gc. The direction perpendicular to the direction of the liquid of the cloth has the individual widths Wa, Wb, Wc, and the individual lengths L1 of the row direction of the plurality of substrates Ga, Gb, Gc (i.e., the direction of the arrow shown in Fig. 2d) , L2, L3 apply the coating liquid in a distributed coating manner along the direction in which the coating liquid is applied. This coating of the coating liquid is by way of partial and dispersion coating. The coating apparatus 200 according to the fourth embodiment of the present invention may additionally include a controller (not shown) having a built-in control program for controlling injection of the coating according to the partial and dispersion coating method. Start and stop operation of the liquid. Such a controller (not shown) can be embodied by, for example, a microprocessor or a personal computer (PC), and the control program can be pre-programmed.

再者,於根據本發明之第四具體實施例的塗佈裝置200中,如上面所敘述,其係說明性地顯示該複數排放部份222a,222b,222c之個別寬度具有與該複數基板Ga,Gb,Gc的個別列方向寬度Wa,Wb,Wc完全相同之寬度,且該塗佈液體係以分散式方式遍及該複數基板Ga,Gb,Gc之個別行方向長度L1,L2,L3施加。然而,任何熟諳該技藝者可充分地了解該複數排放部份222a,222b,222c之個別寬度可具有大於該複數基板Ga,Gb,Gc的個別列方向寬度Wa,Wb,Wc之值,且該塗佈液體可被以分散式方式稍微超過該複數基板Ga,Gb,Gc之個別行方向長度L1,L2,L3地施加。Furthermore, in the coating apparatus 200 according to the fourth embodiment of the present invention, as described above, it is illustratively shown that the individual widths of the plurality of discharge portions 222a, 222b, 222c have the same substrate Ga The individual column direction widths Wa, Wb, and Wc of Gb and Gc are exactly the same width, and the coating liquid system is applied in a dispersed manner over the individual row direction lengths L1, L2, and L3 of the plurality of substrates Ga, Gb, and Gc. However, any skilled person skilled in the art can fully understand that the individual widths of the plurality of discharge portions 222a, 222b, 222c may have values greater than the individual column direction widths Wa, Wb, Wc of the plurality of substrates Ga, Gb, Gc, and The coating liquid can be applied in a dispersion manner slightly beyond the individual row direction lengths L1, L2, L3 of the plurality of substrates Ga, Gb, Gc.

如上面所敘述,於根據本發明之第四具體實施例的塗佈裝置200中,不只是死區(DR)不會發生在該複數基板Ga,Gb,Gc上,而且不需要的塗佈液體之施加至該夾具240上被減至最小或去除,因為使用該局部與分散式塗佈之方式。據此,其明顯的是本發明之第四具體實施例為該最佳的具體實施例。As described above, in the coating apparatus 200 according to the fourth embodiment of the present invention, not only the dead zone (DR) does not occur on the plurality of substrates Ga, Gb, Gc, but also the coating liquid which is not required. Application to the clamp 240 is minimized or removed because of the use of this partial and dispersion coating. Accordingly, it is apparent that the fourth embodiment of the present invention is the preferred embodiment.

如上面所敘述,根據本發明之第一至第四具體實施例的塗佈裝置200可額外地包括傳送裝置(未示出),用於由該空吸平台212傳送該夾具240,以便在完成將該塗佈液體施加至該複數基板Ga,Gb,Gc上時施行隨後之操作。此一傳送裝置(未示出)可藉由譬如機器人手臂被具體化,並可將承接另一複數基板(未示出)之另一夾具(未示出)傳送至該空吸平台212上。在此之後,該塗佈裝置200可為另一複數基板在另一夾具上施行一施加該塗佈液體之操作,如在上面所詳細地敘述者。As described above, the coating apparatus 200 according to the first to fourth embodiments of the present invention may additionally include a conveying device (not shown) for conveying the jig 240 by the suction platform 212 so as to be completed The subsequent operation is performed when the coating liquid is applied to the plurality of substrates Ga, Gb, Gc. This transfer device (not shown) can be embodied by, for example, a robotic arm, and another jig (not shown) that receives another plurality of substrates (not shown) can be transferred to the suction platform 212. Thereafter, the coating apparatus 200 can perform an operation of applying the coating liquid on another jig for another plurality of substrates, as described in detail above.

再者,如上面所敘述,根據本發明之第一至第四具體實施例的塗佈裝置200可額外地包括被連接至該複數釋放孔洞244的空氣餵入管及空氣鼓風機,用於將藉由傳送裝置所傳送之空氣注入該夾具240的該複數釋放孔洞244,或具有能夠在該複數釋放孔洞244內上昇及下降之複數上昇及下降棒條的上昇及下降裝置(未示出)之任一者。該複數基板Ga,Gb,Gc可藉由使用空氣餵入管及空氣鼓風機的空氣注入操作、或藉由使用上昇及下降裝置之複數上昇及下降棒條的上昇及下降操作之任一者被由該夾具240釋放。在此之後,於如圖2a至2c中所說明之本發明的第一至第三具體實施例之案例中,駐留在該夾具240上之不需要的塗佈液體231係藉由清潔製程所去除,且另一複數基板(未示出)被承接於該夾具240上。在此之後,該夾具240被傳送至該空吸平台212上,且能被使用於將塗佈液體施加至另一複數基板(未示出)上。Furthermore, as described above, the coating apparatus 200 according to the first to fourth embodiments of the present invention may additionally include an air feed tube and an air blower connected to the plurality of release holes 244 for The air delivered by the conveyor is injected into the plurality of release apertures 244 of the clamp 240, or any of the rise and fall devices (not shown) of the plurality of ascending and descending bars that can be raised and lowered within the plurality of release apertures 244. By. The plurality of substrates Ga, Gb, Gc may be operated by an air injection operation using an air feed pipe and an air blower, or by a rise and fall operation of a plurality of ascending and descending bars using a rise and fall device The clamp 240 is released. Thereafter, in the case of the first to third embodiments of the present invention as illustrated in FIGS. 2a to 2c, the unnecessary coating liquid 231 residing on the jig 240 is removed by the cleaning process. And another plurality of substrates (not shown) are received on the jig 240. Thereafter, the jig 240 is transferred to the suction platform 212 and can be used to apply a coating liquid onto another plurality of substrates (not shown).

再者,被使用於根據本發明之第一至第四具體實施例的塗佈裝置200之夾具240可為由以下之任何一種材料所製成,包括:玻璃材料;金屬材料,諸如鋼鐵、不銹鋼、或鋁(Al);及非金屬材料,諸如PTFE(聚四氟乙烯)樹脂(商標名稱:鐵弗龍)。Furthermore, the jig 240 used in the coating apparatus 200 according to the first to fourth embodiments of the present invention may be made of any of the following materials, including: a glass material; a metal material such as steel, stainless steel. Or aluminum (Al); and non-metallic materials such as PTFE (polytetrafluoroethylene) resin (trade name: Teflon).

同時,在如於圖2d所顯示之本發明的第四具體實施例之案例中,該夾具240的清潔製程係不需要的,因為駐留在該夾具240上之不需要的塗佈液體大體上不存在。據此,緊接在另一複數基板(未示出)被承接至該夾具240上之後,該夾具240再次被傳送至該空吸平台212上,並可被使用於將塗佈液體施加至另一複數基板(未示出)。Meanwhile, in the case of the fourth embodiment of the present invention as shown in FIG. 2d, the cleaning process of the jig 240 is not required because the unnecessary coating liquid residing on the jig 240 is substantially not presence. Accordingly, immediately after another plurality of substrates (not shown) are received onto the jig 240, the jig 240 is again transferred to the suction platform 212 and can be used to apply the coating liquid to another A plurality of substrates (not shown).

如上面所詳細地敘述,既然能夠承接複數基板Ga,Gb,Gc且其尺寸被預先決定之夾具240被使用在本發明中,當將該塗佈液體施加至該複數基板Ga,Gb,Gc時,死區(DR)不會發生,且於完成施加該塗佈液體時,基板之另一切割製程係不需要的,不像先前技藝。As described in detail above, since the jig 240 capable of accepting the plurality of substrates Ga, Gb, Gc and whose size is predetermined is used in the present invention, when the coating liquid is applied to the plurality of substrates Ga, Gb, Gc The dead zone (DR) does not occur, and when the application of the coating liquid is completed, another cutting process of the substrate is not required, unlike the prior art.

同時,於如圖2b及2c中所說明之本發明的第二及第三具體實施例之案例中,塗佈液體之施加係分別以局部塗佈之方式及分散式塗佈之方式作成,且如此當與整個表面塗佈之方式比較時,該不需要地施加之塗佈液體231的數量被減少。再者,在如於圖2d所說明之本發明的第四具體實施例之案例中,塗佈液體之施加係以局部及分散式塗佈之方式作成,且如此當與整個表面塗佈之方式比較時,該不需要地施加之塗佈液體231的使用被減至最小或去除。Meanwhile, in the case of the second and third embodiments of the present invention as illustrated in FIGS. 2b and 2c, the application of the coating liquid is separately performed by a partial coating method and a dispersion coating method, and Thus, the amount of the coating liquid 231 which is not required to be applied is reduced when compared with the manner of coating the entire surface. Further, in the case of the fourth embodiment of the present invention as illustrated in Fig. 2d, the application of the coating liquid is performed in a partial and dispersion coating manner, and thus when applied to the entire surface. In comparison, the use of the undesirably applied coating liquid 231 is minimized or removed.

圖3說明根據本發明之一具體實施例的塗佈方法之流程圖。Figure 3 illustrates a flow chart of a coating process in accordance with an embodiment of the present invention.

隨著圖1a、1b、及2a至2d參考圖3,根據本發明之一具體實施例的塗佈方法300包括以下步驟:a)承接複數基板Ga,Gb,Gc進入配備有夾具240之複數承接零件242(步驟310);b)將該夾具240安裝至空吸平台212上(步驟320);及c)將塗佈液體施加至該複數基板Ga,Gb,Gc上,同時在該夾具240之上以往復移動之方式藉由使用支架125移動噴嘴裝置220,該噴嘴裝置被安裝在該支架上(步驟330)。1a, 1b, and 2a to 2d, referring to FIG. 3, a coating method 300 according to an embodiment of the present invention includes the following steps: a) receiving a plurality of substrates Ga, Gb, Gc into a plurality of substrates equipped with a jig 240 a part 242 (step 310); b) mounting the clamp 240 to the suction platform 212 (step 320); and c) applying a coating liquid to the plurality of substrates Ga, Gb, Gc, while at the fixture 240 The nozzle device 220 is moved in a reciprocating manner by using the holder 125, and the nozzle device is mounted on the holder (step 330).

如上面所敘述,本發明之塗佈方法300可額外地包括一步驟d)由該複數承接零件242釋放該複數基板Ga,Gb,Gc(步驟340)。於此案例中,該步驟d)能藉由使用被連接至複數釋放孔洞244的空氣餵入管及空氣鼓風機之空氣注入操作、或藉由具有對應於該複數釋放孔洞244之複數上昇及下降棒條的上昇及下降裝置之上昇及下降操作的任一者所施行,該複數釋放孔洞244係設在該複數承接零件242的底部上。As described above, the coating method 300 of the present invention may additionally include a step d) releasing the plurality of substrates Ga, Gb, Gc from the plurality of receiving parts 242 (step 340). In this case, the step d) can be performed by using an air injection operation of the air feed tube and the air blower connected to the plurality of release holes 244, or by having a plurality of rise and fall bars corresponding to the plurality of release holes 244. The rise and fall operations of any of the ascending and descending devices are performed on the bottom of the plurality of receiving members 242.

再者,如上面所敘述之本發明的塗佈方法300,於該步驟c)中施加該塗佈液體能藉由包括整個表面塗佈之方式、局部塗佈之方式、分散式塗佈之方式、及局部與分散式之方式的任一方式所施行。Furthermore, as described above, the coating method 300 of the present invention, in which the coating liquid is applied in the step c) can be carried out by means of a method including the entire surface coating, a partial coating method, and a dispersion coating method. And any of the methods of local and decentralized methods.

又再者,在該分散式塗佈之方式及該局部與分散式塗佈之方式的案例中,開始及停止塗佈液體之注入能藉由控制器(未示出)所控制,而控制程式被內建在該控制器中。Furthermore, in the case of the method of the dispersion coating and the method of the partial and dispersion coating, the injection of the start and stop coating liquid can be controlled by a controller (not shown), and the control program Built into the controller.

產業利用性Industrial utilization

因各種修改可在此中所敘述及所說明之結構及方法中被作成,而未由本發明之範圍脫離,其係意欲將該前面敘述中所包含或該等附圖中所顯示之所有情況被解釋為說明性而非限制性。如此,本發明之廣度及範圍將不被該等上述示範具體實施例之任一者所限制,但應僅只按照至此為止所附之以下申請專利範圍及其同等項被界定。Various modifications may be made to the structures and methods described and illustrated herein without departing from the scope of the invention, which is intended to be It is to be interpreted as illustrative and not limiting. As such, the breadth and scope of the present invention are not to be construed as limited

100,200...塗佈裝置100,200. . . Coating device

112,212...空吸平台112,212. . . Air suction platform

120,220...噴嘴裝置120,220. . . Nozzle device

125...支架125. . . support

222,222a,222b,222c...排放部份222, 222a, 222b, 222c. . . Emission part

230,230a,230b,230c...塗佈層230, 230a, 230b, 230c. . . Coating layer

132,231...不需要之塗佈液體132,231. . . Unwanted coating liquid

240...夾具240. . . Fixture

242...承接零件242. . . Undertake parts

244...釋放部份244. . . Release part

G,Ga,Gb,Gc...基板G, Ga, Gb, Gc. . . Substrate

DR...死區DR. . . dead zone

P...面板P. . . panel

W,Wa,Wb,Wc...排放部份之寬度W, Wa, Wb, Wc. . . Width of the discharge part

圖1a概要地說明一用於根據先前技藝製造PDP或LCD之塗佈裝置。Figure 1a schematically illustrates a coating apparatus for fabricating a PDP or LCD in accordance with the prior art.

圖1b概要地說明俯視圖及一側視圖,顯示圖1a所說明之塗佈裝置。Figure 1b schematically illustrates a top view and a side view showing the coating apparatus illustrated in Figure 1a.

圖2a概要地說明根據本發明之第一具體實施例的塗佈裝置之俯視圖及一側視圖。Figure 2a schematically illustrates a top view and a side view of a coating apparatus in accordance with a first embodiment of the present invention.

圖2b概要地說明根據本發明之第二具體實施例的塗佈裝置之俯視圖及一側視圖。Figure 2b schematically illustrates a top view and a side view of a coating apparatus in accordance with a second embodiment of the present invention.

圖2c概要地說明根據本發明之第三具體實施例的塗佈裝置之俯視圖及一側視圖。Figure 2c schematically illustrates a top view and a side view of a coating apparatus in accordance with a third embodiment of the present invention.

圖2d概要地說明根據本發明之第四具體實施例的塗佈裝置之俯視圖及一側視圖。Figure 2d schematically illustrates a top view and a side view of a coating apparatus in accordance with a fourth embodiment of the present invention.

圖3說明根據本發明的一具體實施例之塗佈方法的流程圖。Figure 3 illustrates a flow chart of a coating method in accordance with an embodiment of the present invention.

200...塗佈裝置200. . . Coating device

212...空吸平台212. . . Air suction platform

220...噴嘴裝置220. . . Nozzle device

222...排放部份222. . . Emission part

230...塗佈層230. . . Coating layer

231...不需要之塗佈液體231. . . Unwanted coating liquid

240...夾具240. . . Fixture

242...承接零件242. . . Undertake parts

244...釋放部份244. . . Release part

G...基板G. . . Substrate

Ga...基板Ga. . . Substrate

Gb...基板Gb. . . Substrate

Gc...基板Gc. . . Substrate

W1...寬度W1. . . width

W2...寬度W2. . . width

Claims (18)

一種塗佈裝置,包括:一夾具,其具有用於承接複數基板之複數承接零件、及設在該複數承接零件的底部上用於釋放該複數基板之複數釋放孔洞;一空吸平台,該夾具被安裝在該空吸平台上;一噴嘴裝置,其被定位在該空吸平台上,用於以整個表面塗佈之方式將塗佈液體施加至該複數基板上,以便形成一塗佈層;及一支架,該噴嘴裝置被安裝在該支架上,用於在該夾具之上以往復移動之方式移動該噴嘴裝置。A coating device comprising: a clamp having a plurality of receiving parts for receiving a plurality of substrates; and a plurality of release holes provided on the bottom of the plurality of receiving parts for releasing the plurality of substrates; a suction platform, the clamp is Mounted on the suction platform; a nozzle device positioned on the suction platform for applying a coating liquid to the plurality of substrates in a manner of coating the entire surface to form a coating layer; A bracket on which the nozzle device is mounted for moving the nozzle device reciprocally over the clamp. 如申請專利範圍第1項之塗佈裝置,其中該噴嘴裝置沿著與施加該塗佈液體之方向垂直的方向具有一排放部份,該排放部份之寬度與該複數基板之寬度完全相同或比該複數基板之寬度更寬。The coating device of claim 1, wherein the nozzle device has a discharge portion in a direction perpendicular to a direction in which the coating liquid is applied, the width of the discharge portion being exactly the same as a width of the plurality of substrates or It is wider than the width of the plurality of substrates. 一種塗佈裝置,包括:一夾具,其具有用於承接複數基板之複數承接零件、及設在該複數承接零件的底部上用於釋放該複數基板之複數釋放孔洞;一空吸平台,該夾具被安裝在該空吸平台上;一噴嘴裝置,其被定位在該空吸平台上,用於以局部塗佈之方式將塗佈液體施加至該複數基板上,以便沿著施加該塗佈液體之方向形成複數塗佈層;及一支架,該噴嘴裝置被安裝在該支架上,用於在該夾具之上以往復移動之方式移動該噴嘴裝置。A coating device comprising: a clamp having a plurality of receiving parts for receiving a plurality of substrates; and a plurality of release holes provided on the bottom of the plurality of receiving parts for releasing the plurality of substrates; a suction platform, the clamp is Mounted on the suction platform; a nozzle device positioned on the suction platform for applying a coating liquid to the plurality of substrates in a partial coating manner to apply the coating liquid Forming a plurality of coating layers in a direction; and a bracket mounted on the bracket for moving the nozzle device reciprocally over the clamp. 如申請專利範圍第3項之塗佈裝置,其中該噴嘴裝置沿著與施加該塗佈液體之方向垂直的方向具有複數排放部份,該複數排放部份之寬度與該複數基板之個別寬度完全相同或比該複數基板之個別寬度更寬。The coating device of claim 3, wherein the nozzle device has a plurality of discharge portions in a direction perpendicular to a direction in which the coating liquid is applied, the width of the plurality of discharge portions being completely different from the individual widths of the plurality of substrates The same or wider than the individual widths of the plurality of substrates. 一種塗佈裝置,包括:一夾具,其具有用於承接複數基板之複數承接零件、及設在該複數承接零件的底部上用於釋放該複數基板之複數釋放孔洞;一空吸平台,該夾具被安裝在該空吸平台上;一噴嘴裝置,其被定位在該空吸平台上,用於以分散式塗佈之方式將塗佈液體施加至該複數基板上,以便沿著與施加該塗佈液體之方向垂直的方向形成複數塗佈層;及一支架,該噴嘴裝置被安裝在該支架上,用於在該夾具之上以往復移動之方式移動該噴嘴裝置。A coating device comprising: a clamp having a plurality of receiving parts for receiving a plurality of substrates; and a plurality of release holes provided on the bottom of the plurality of receiving parts for releasing the plurality of substrates; a suction platform, the clamp is Mounted on the suction platform; a nozzle device positioned on the suction platform for applying a coating liquid onto the plurality of substrates in a distributed coating manner to apply the coating along and A plurality of coating layers are formed in a direction perpendicular to the direction of the liquid; and a bracket is mounted on the bracket for moving the nozzle device in a reciprocating manner over the jig. 如申請專利範圍第5項之塗佈裝置,其中該噴嘴裝置沿著與施加該塗佈液體之方向垂直的方向具有複數排放部份,該複數排放部份之寬度與該複數基板之個別寬度完全相同或比該複數基板之個別寬度更寬。The coating device of claim 5, wherein the nozzle device has a plurality of discharge portions in a direction perpendicular to a direction in which the coating liquid is applied, the width of the plurality of discharge portions being completely different from the individual widths of the plurality of substrates The same or wider than the individual widths of the plurality of substrates. 如申請專利範圍第5項之塗佈裝置,其中該噴嘴裝置緊接在該複數基板的前端之前及緊接在該複數基板的後端之後,沿著該複數基板與施加該塗佈液體之方向垂直的列方向,相繼地施行注入該塗佈液體之開始及停止操作。The coating device of claim 5, wherein the nozzle device is immediately before the front end of the plurality of substrates and immediately after the rear end of the plurality of substrates, along the plurality of substrates and the direction in which the coating liquid is applied In the vertical column direction, the start and stop operations of injecting the coating liquid are successively performed. 如申請專利範圍第5項之塗佈裝置,其中該塗佈裝置額外地包括具有內建之控制程式的控制器,用於控制注入該塗佈液體之開始及停止操作。A coating apparatus according to claim 5, wherein the coating apparatus additionally includes a controller having a built-in control program for controlling the start and stop operations of injecting the coating liquid. 一種塗佈裝置,包括:一夾具,其具有用於承接複數基板之複數承接零件、及設在該複數承接零件的底部上用於釋放該複數基板之複數釋放孔洞;一空吸平台,該夾具被安裝在該空吸平台上;一噴嘴裝置,其被定位在該空吸平台上,用於以局部與分散式塗佈之方式將塗佈液體施加至該複數基板上,以便在其上面形成個別之塗佈層;及一支架,該噴嘴裝置被安裝在該支架上,用於在該夾具之上以往復移動之方式移動該噴嘴裝置。A coating device comprising: a clamp having a plurality of receiving parts for receiving a plurality of substrates; and a plurality of release holes provided on the bottom of the plurality of receiving parts for releasing the plurality of substrates; a suction platform, the clamp is Mounted on the suction platform; a nozzle device positioned on the suction platform for applying a coating liquid to the plurality of substrates in a partial and dispersion coating manner to form an individual thereon a coating layer; and a bracket mounted on the bracket for moving the nozzle device reciprocally over the clamp. 如申請專利範圍第9項之塗佈裝置,其中該噴嘴裝置沿著與施加該塗佈液體之方向垂直的方向具有複數排放部份,該複數排放部份之寬度與該複數基板之個別寬度完全相同。The coating device of claim 9, wherein the nozzle device has a plurality of discharge portions in a direction perpendicular to a direction in which the coating liquid is applied, the width of the plurality of discharge portions being completely different from the individual widths of the plurality of substrates the same. 如申請專利範圍第10項之塗佈裝置,其中該噴嘴裝置以局部塗佈之方式施加該塗佈液體,以於該複數基板之列方向中沿著一與施加該塗佈液體之方向垂直的方向具有該等個別之寬度,而同時在該複數基板之行方向的個別長度之上沿著施加該塗佈液體的方向以分散式塗佈之方式施加該塗佈液體。The coating device of claim 10, wherein the nozzle device applies the coating liquid in a partial coating manner so as to be perpendicular to a direction in which the coating liquid is applied in a direction of the plurality of substrates. The direction has the individual widths while applying the coating liquid in a dispersed coating manner over the individual lengths of the plurality of substrates in the direction in which the coating liquid is applied. 如申請專利範圍第11項之塗佈裝置,其中該塗佈裝置額外地包括具有內建之控制程式的控制器,用於控制根據該局部與分散式塗佈之方式注入該塗佈液體的開始及停止操作。The coating apparatus of claim 11, wherein the coating apparatus additionally includes a controller having a built-in control program for controlling the start of injecting the coating liquid according to the partial and dispersion coating method And stop the operation. 如申請專利範圍第1、3、5及9項的任一項之塗佈裝置,其中該塗佈裝置額外地包括被連接至該複數釋放孔洞而用於將空氣注入該複數釋放孔洞的空氣餵入管及空氣鼓風機、或具有能夠在該複數釋放孔洞內上昇及下降之複數上昇及下降棒條的上昇及下降裝置之任一者。A coating apparatus according to any one of the preceding claims, wherein the coating apparatus additionally includes air fed to the plurality of release holes for injecting air into the plurality of release holes The inlet pipe and the air blower, or any of the rise and fall devices having a plurality of ascending and descending bars that can rise and fall within the plurality of release holes. 如申請專利範圍第1、3、5及9項的任一項之塗佈裝置,其中該夾具可為由以下之任何一種材料所製成,包括:玻璃材料;金屬材料,諸如鋼鐵、不銹鋼、或鋁(Al);及非金屬材料,諸如PTFE(聚四氟乙烯)樹脂。The coating device of any one of the preceding claims, wherein the jig can be made of any of the following materials, including: a glass material; a metal material such as steel, stainless steel, Or aluminum (Al); and non-metallic materials, such as PTFE (polytetrafluoroethylene) resin. 一種塗佈方法,包括以下步驟:a)承接複數基板進入配備有夾具之複數承接零件;b)將該夾具安裝至空吸平台上;及c)將塗佈液體施加至該複數基板上,同時在該夾具之上藉由使用支架以往復移動之方式移動噴嘴裝置,該噴嘴裝置係安裝在該支架上。A coating method comprising the steps of: a) receiving a plurality of substrates into a plurality of receiving parts equipped with a jig; b) mounting the jig to a suction platform; and c) applying a coating liquid to the plurality of substrates while A nozzle device is moved over the jig by reciprocating movement using a bracket, the nozzle device being mounted on the bracket. 如申請專利範圍第15項之塗佈方法,其中該塗佈方法額外地包括一步驟d)由該複數承接零件釋放該複數基板。The coating method of claim 15, wherein the coating method additionally comprises a step d) releasing the plurality of substrates from the plurality of receiving parts. 如申請專利範圍第16項之塗佈方法,其中該步驟d)係藉由使用被連接至複數釋放孔洞的空氣餵入管及空氣鼓風機之空氣注入操作、或藉由具有對應於該複數釋放孔洞之複數上昇及下降棒條的上昇及下降裝置之上昇及下降操作的任一者所施行,該複數釋放孔洞係設在該複數承接零件的底部上。The coating method of claim 16, wherein the step d) is performed by using an air injection operation of an air feed pipe and an air blower connected to the plurality of release holes, or by having a hole corresponding to the plurality of release holes Any of the rising and falling operations of the rising and falling bar of the plurality of rising and falling bars are provided on the bottom of the plurality of receiving parts. 如申請專利範圍第15至17項的任一項之塗佈方法,其中於該步驟c)中施加該塗佈液體能藉由包括整個表面塗佈之方式、局部塗佈之方式、分散式塗佈之方式、及局部與分散式之方式的任一方式所施行。The coating method according to any one of claims 15 to 17, wherein the application of the coating liquid in the step c) can be carried out by means including the entire surface coating, partial coating, and dispersion coating. The method of cloth, and the method of partial and decentralized mode are implemented.
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