201245703 六、發明說明： 【發明所屬之技術領域】 本發明侧於一種晶圓影像擁取裝置，尤其是一種具有内建光源之影 像擷取裝置，穩影像麻裝置_以_待測㈣之影像訊號。 【先前技術】 目前的半導體廢進行晶圓檢測時，會將制晶_人影像練裝置之 承載台上，爾細晶.晶格，並# 以操取晶圓影像中的特徵，與樣版庫中的樣版圖片比對，以判斷晶片是否 有缺陷，並將缺陷之晶格位置進行記錄；而藉由晶圓表面或是晶圓表面附 近的檢測結果，來判斷該晶圓是否可進行封裝製程，即可運用其記錄結果 剔除缺陷之晶格’㈣免韻加卫製麵浪f生產成本。 -般傳統用於晶圓之影賴取裝置如圖—所示，敍少包含有一殼體 卜-攝影機2及-外接式同轴光源3，其中該外接式嶋光源3如圖二及 圖三所示’係、包含有複數個發光二極體31及―反射鏡32，而發光二極體 31所發出之规能夠藉由該外接式同轴光源3之反射鏡力，將光源垂直投 射於待測晶圓4之表面， U係能夠將該待測晶圓4 之擷取。 而該殼體1具有-反射鏡1卜該殼體丨之反射鏡 之晶圓影像反射至輯韻2，以進行晶圓影像 然而，這-種外接式同軸光源其成本極高，同時對於影像掏取裝置來 說，該外接式同軸光源之體積較大，故需要較大的空間才能夠容置該具有 外接式_光源之影像_裝置；因此，若能提供—種晶圓影像操取裝置， 能夠於該影像·裝置内部設置光源，賜低其生產成本，並能夠節省設 201245703 備谷置空間，應為一最佳解決方案β 【發明内容】 本發明之一目的即在於提供一種晶圓影像擷取裝置，係於該晶圓影像 擷取裝置内部設置光源，為了能夠降低其生產成本，並節省該晶圓影像擷 取裝置之設置空間。 可達成上述發明目的之一種晶圓影像擷取裝置，係包含了一具有上開 口及下開口之殼體、一發光板、一反射鏡及一具有光學鏡組及影像感測器 之影像擷取模組，其中該發光板係設置於該殼體内，用以提供光源，並可 朝該下開口照亮一待測晶圓，而該反射鏡係設置於該上開口及該下開口之 路徑上，用以反射S玄待測晶圓之晶圓影像；另外該影像掏取模組係設置於 該殼體之上開口’因此該晶圓影像能夠經由該光學鏡組傳導並聚焦於該影 像感測器，使該晶圓影像能夠經由該影像感測器轉換成電訊號， 更具體的說，所述發光板係設置於殼體内之側面，而該發光板係與該 殼體之側面形狀相同，以容置於殼體内之側面。 更具體的說，所述發光板上係設置至少一個發光二極體。 更具體的說，該晶圓影像擷取裝置係能夠添加設置一外環光源，該外 環光源係設置於該下開口之周圍，用以提供一輔助光源；而該外環光源係 設置至少一個發光二極體。 更具體的說，所述影像感測器係為一光耗合元件。 更具體的說，所述上開口及該下開口之方向成90度。 【實施方式】 4 201245703 有關於本發明之前述及其他技術内容、特點與功效，在以下配合參考 圖式之較佳實施例的詳細說明中，將可清楚的呈現。 凊參閱圖四、圖五A、圖五B、圖六及圖七分別為本發明„_種晶圓影 像擷取裝置之第一實施立體結構圖、第一實施立體分解結構圖、第一實施 剖面結構圖及晶圓影像擷取示意圖。本發明之晶圓影像擷取裝置係包含一 殼體5、一發光板6、一反射鏡53及一影像擷取模組7 ^ 殼體5具有一上開口 51及一下開口 52 ,其中該上開口 51及該下開口 52之方向成90度。發光板6設置於該殼體5内之側面，用以提供光源，並 朝"亥下開口 52照亮一待測晶圓4 ;而該發光板6上係設置至少一個發光二 極體61»反射鏡53設置於該上開口 51及該下開口 52之路徑上，用以反射 該待測晶圓4之一晶圓影像。影像擷取模組7設置於該上開口 51，該影像 擷取模組7包括-光學鏡組71以及一影像感測器Μ;其中該晶圓影像經由 該光學鏡組71傳導並聚焦於該影像感測器72，使該晶圓影像能夠經由該影 像感測器72轉換成電訊號。 當该發光板6之發光二極體61提供光源，並朝該殼體5之下開口 52 照亮該待測晶圓4時，該殼體5之反射鏡53係能夠將該待測晶圓4之晶圓 影像反射至該影像擷取模組7之光學鏡組71，該影像感測器72係為一光耦 合元件，該晶圓影像經由該光學鏡組71傳導並聚焦於該影像感測器72，以 進行晶圓影像之擷取。 在本實施例中，該發光板6係與該殼體5之侧面形狀相同，以容置於 殼體5内之側面》 請參閱圖八，圖八為本發明一種晶圓影像擷取裝置之影像擷取示意圖 201245703 及第二實施立體結構圖，由圖中可知，為了加強該發光板照亮該待測晶圓 之亮度，故於該殼體5之下開口 52之周圍添加設置至少一個外環光源8， 用以提供一輔助光源。該外環光源8係設置至少一個發光二極體81。 請參閱圖九，圖九為本發明一種晶圓影像擷取裝置之影像擷取示意圖 及第三實施立體結構圖，由圖中可知，為了加強該發光板6照亮該待測晶 圓4之亮度，故於該待測晶圓4之周圍添加設置至少一個外接光源9,用以 提供一輔助光源。該外接光源9係具有至少一個發光二極體91。 本發明所提供之一種晶圓影像擷取裝置，與其他應用技術相互比較 時’更具備下列優點： 1. 本發明係能夠藉由具有發光二極體之發光板來取代外接式同軸 光源’故不需使用昂貴的外接式同軸光源，同時能夠降低其生產 成本。 2. 本發明係於該晶圓影像擁取裝置内部設置一發光源、，藉此取代外 接式同軸光源，故能夠明顯地節省該晶圓影像操取裝置之設置空 間。 藉由以上較佳具體實施例之詳述，係希望能更加清楚描述本發明之特 徵與精神，而並非以上述所揭露的較佳具贿施例來對本發明之範嘴加以 限制。相反地’其目岐梢赚各歡變及具鱗性的麵於本發明 所欲申請之專利範圍的範疇内。 【圖式簡單說明】 圖一為習用晶圓影像擷取裝置之立體結構圖。 圖二為習用晶圓影像擷取裝置之剖面結構圖。 6 201245703 圖三為習用晶圓影像麻裝置之晶圓影像擷取示意圖。 圖四為本㈣—種晶_像揭取裝置之第—實施立體結構圖。 結構圓 圖五Α及@五8為本發明_種晶圓影像裝置之第—實施立體分解 圖六為本發明一種晶圓影像嫌裝置之第-實施剖面結構圖。 圖七為本發明-種晶圓影像操取裝置之晶圓影像掏取示意圖。 圖八為本發明一種晶圓影像擷取裝置 , . , 第二實施立體結構圖。 圖九為本發明一種晶圓影像擷取裝置 第三實施立體結構圖。 【主要元件符號說明】 1 殼體 11 反射鏡 2 反射鏡 3 外接式同軸光源 31 發光二極體 32 反射鏡 4 待測晶圓 5 殼體 51 上開σ 52 下開〇 53 反射鏡 6 發光板 201245703 61 發光二極體 7 影像擷取模組 71 光學鏡組 72 影像感測器 8 外環光源 81 發光二極體 9 外接光源 91 發光二極體 8201245703 VI. Description of the Invention: [Technical Field] The present invention is directed to a wafer image capturing device, and more particularly to an image capturing device having a built-in light source, and an image forming device Signal. [Prior Art] When the current semiconductor waste is used for wafer inspection, it will be on the stage of the crystal-forming device, the fine crystal, the lattice, and the image in the wafer image, and the pattern. The sample images in the library are compared to determine whether the wafer is defective, and the position of the lattice of the defect is recorded; and whether the wafer is executable by the surface of the wafer or the vicinity of the surface of the wafer The packaging process can use the result of the record to eliminate the lattice of defects' (4) free rhyme to increase the production cost of the surface wave f. The conventionally used for the wafer-shading device is shown in the figure--there is a housing-battery 2 and an external coaxial light source 3, wherein the external xenon light source 3 is as shown in FIG. 2 and FIG. The display system includes a plurality of light-emitting diodes 31 and a mirror 32, and the light-emitting diode 31 emits a vertical light source by the mirror force of the external coaxial light source 3 On the surface of the wafer 4 to be tested, the U system can capture the wafer 4 to be tested. The housing 1 has a mirror image of the mirror 1 and the mirror of the housing 反射 is reflected to the image 2 for wafer image. However, the external coaxial light source is extremely expensive, and the image is In the case of the pick-up device, the external coaxial light source has a large volume, so that a large space is required to accommodate the external image source device; therefore, if a wafer image manipulation device can be provided It is possible to provide a light source inside the image/device, to lower the production cost thereof, and to save the 201245703 reserve space, which should be an optimal solution. [Invention] It is an object of the present invention to provide a wafer. The image capturing device is provided with a light source inside the wafer image capturing device, so as to reduce the production cost and save the installation space of the wafer image capturing device. A wafer image capturing device capable of achieving the above object includes a housing having an upper opening and a lower opening, a light emitting panel, a mirror, and an image capturing device having an optical mirror and an image sensor a module, wherein the illuminating panel is disposed in the housing for providing a light source, and illuminating a wafer to be tested toward the lower opening, wherein the mirror is disposed on the path of the upper opening and the lower opening The image capturing module is configured to reflect the wafer image of the S-substance to be tested; and the image capturing module is disposed on the opening of the housing. Therefore, the wafer image can be conducted through the optical lens group and focused on the image. a sensor for converting the wafer image into an electrical signal via the image sensor, and more specifically, the light emitting panel is disposed on a side of the housing, and the illuminating panel is coupled to the side of the housing The shape is the same to accommodate the side inside the housing. More specifically, at least one light emitting diode is disposed on the light emitting plate. More specifically, the wafer image capturing device can be additionally provided with an outer ring light source disposed around the lower opening for providing an auxiliary light source; and the outer ring light source is provided with at least one Light-emitting diode. More specifically, the image sensor is a light consuming component. More specifically, the direction of the upper opening and the lower opening is 90 degrees. The above and other technical contents, features and effects of the present invention will be apparent from the following detailed description of the preferred embodiments of the invention. 4, FIG. 5A, FIG. 5B, FIG. 6 and FIG. 7 are respectively a first embodiment three-dimensional structure diagram, a first embodiment three-dimensional exploded structure diagram, and a first implementation of the present invention. The structure of the wafer image capture device comprises a housing 5, a light-emitting panel 6, a mirror 53 and an image capturing module. The upper opening 51 and the lower opening 52, wherein the direction of the upper opening 51 and the lower opening 52 are 90 degrees. The illuminating panel 6 is disposed on the side of the housing 5 for providing a light source and facing the opening 52 Illuminating a wafer 4 to be tested; and the illuminating panel 6 is provided with at least one light emitting diode 61»mirror 53 disposed on the path of the upper opening 51 and the lower opening 52 for reflecting the crystal to be measured The image capturing module 7 is disposed on the upper opening 51. The image capturing module 7 includes an optical lens group 71 and an image sensor Μ; wherein the wafer image passes through the optical The mirror group 71 conducts and focuses on the image sensor 72 to enable the wafer image to pass through the image sense When the light-emitting diode 61 of the light-emitting panel 6 provides a light source and illuminates the wafer 4 to be tested toward the lower opening 52 of the casing 5, the mirror 53 of the casing 5 is The wafer image of the wafer 4 to be tested is reflected to the optical lens group 71 of the image capturing module 7 . The image sensor 72 is an optical coupling component. The wafer image is transmitted through the optical lens group 71 . Conducting and focusing on the image sensor 72 for capturing the image of the wafer. In the embodiment, the illuminating panel 6 has the same shape as the side of the housing 5 for housing in the housing 5. Referring to FIG. 8 , FIG. 8 is a schematic diagram of image capturing of a wafer image capturing device 201245703 and a second embodiment of the present invention. It can be seen that the illuminating panel illuminates the wafer to be tested. The brightness is so that at least one outer ring light source 8 is disposed around the lower opening 52 of the casing 5 for providing an auxiliary light source. The outer ring light source 8 is provided with at least one light emitting diode 81. FIG. 9 is a schematic diagram of image capture of a wafer image capturing device according to the present invention; And the third embodiment of the three-dimensional structure, as shown in the figure, in order to enhance the brightness of the light-emitting panel 6 to illuminate the wafer 4 to be tested, at least one external light source 9 is added around the wafer 4 to be tested for An auxiliary light source is provided. The external light source 9 has at least one light emitting diode 91. The wafer image capturing device provided by the present invention has the following advantages when compared with other application technologies: 1. The present invention is The external coaxial light source can be replaced by a light-emitting panel having a light-emitting diode, so that an expensive external coaxial light source is not required, and the production cost can be reduced. 2. The present invention is incorporated in the wafer image capturing device. By providing an illumination source instead of the external coaxial light source, the installation space of the wafer image manipulation device can be significantly saved. The features and spirit of the present invention are more clearly described in the above detailed description of the preferred embodiments, and are not intended to limit the scope of the present invention. On the contrary, it is within the scope of the patent scope of the present invention to make a variety of changes and scales. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective structural view of a conventional wafer image capturing device. FIG. 2 is a cross-sectional structural view of a conventional wafer image capturing device. 6 201245703 Figure 3 is a schematic diagram of wafer image capture for a conventional wafer imaging device. Figure 4 is a perspective view of the first embodiment of the (4)-grain-image removal device. The structure of the wafer is the first embodiment of the present invention. FIG. 6 is a cross-sectional view of the first embodiment of the present invention. FIG. 7 is a schematic diagram of wafer image capture of the wafer image manipulation device of the present invention. Figure 8 is a perspective view of a wafer image capturing device, and a second embodiment of the present invention. FIG. 9 is a perspective view showing a third embodiment of a wafer image capturing device according to the present invention. [Main component symbol description] 1 Housing 11 Mirror 2 Mirror 3 External coaxial light source 31 Light-emitting diode 32 Mirror 4 Film to be tested 5 Housing 51 Upper σ 52 Lower opening 53 Mirror 6 Light-emitting board 201245703 61 Light-emitting diode 7 Image capture module 71 Optical mirror 72 Image sensor 8 Outer ring light source 81 Light-emitting diode 9 External light source 91 Light-emitting diode 8