201234670 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種LED封裝點膠製造方法，尤其涉及一種具 有感測器執行偵測的LED封裝點膠製造方法。 【先前技術】201234670 VI. Description of the Invention: [Technical Field] The present invention relates to a method for manufacturing an LED package dispensing, and more particularly to a method for manufacturing an LED package dispensing with a sensor performing detection. [Prior Art]
[0002] LED產業是近幾年最受矚目的產業之一，發展至今，LED 〇[0002] The LED industry is one of the most watched industries in recent years.
產品已具有節能、省電、高效率、反應時間快、壽命週 期時間長、且不含汞、具有環保效益等優點。然而在LED 封裝的製程中，會使用載板來承載多個LED元件，然後通 過點膠設備以一般的順序程式，驅使膠針依序地、逐一 地對該LED元件進行封裝運作，使膠針吐膠的膠體覆蓋 LED晶片以完成封裝。但是，所述載板上所承載的多個 LED元件，並非都是已經過檢測的良品，其中必然會存在 有黑料、脫線或是晶粒未對位等壞品（NG產品）存在。兮 壞品未自該載板上去除時，點膠設備仍然以—般的程式 進行封裝，這樣對壞品進行的封裝作業，#㈣㈣ 良率降低，並且使得成本增加，錢筒重視以 改善的問題。 # 【發明内容】 闕有審於此，有必要提供-種避免對壞品封聚的咖封裝點 膠製造方法。 闺-種LED㈣點膠製造方法，其包括以下的步驟， [0005] 提供一載板，承載多個LED元件； [〇_独-感測器，對該載板上的LEDit件進行偵測，並製作 100112129 表單編號A0101 第3頁/共14頁 1002020241-0 201234670 偵測影像及位置參數； [0007] 設定膠針移動及點膠程式，依據該偵測影像及位置參數 [0008] 實施點膠，依據該膠針移動及點膠程式；及 [0009] 去除該載板上的壞品。 [0010] 上述的LED封裝點膠製造方法中，由於實施點膠的膠針移 動及點膠程式，是依據該偵測影像及位置參數所設定， 因此可精確掌握該載板上壞品的位置，避免膠針移動到 壞品的位置上進行封裝點膠的作業，有效控制膠針點膠 的程式，提高點膠封裝的效率以及良率，並且使得成本 降低。 【實施方式】 [0011] 下面將結合附圖對本發明作一具體介紹。 [0012] 請參閱圖1，所示為本發明LED封裝點膠製造方法的步驟 流程圖，其包括以下的步驟： [0013] S11提供一載板，承載多個LED元件； [0014] S12提供一感測器，對該載板上的LED元件進行偵測，並 製作偵測影像及位置參數； [0015] S13設定膠針移動及點膠程式，依據該偵測影像及位置參 數； [0016] S14實施點膠，依據該膠針移動及點膠程式；及 [0017] S15去除該載板上的壞品。 100112129 表單編號A0101 第4頁/共14頁 1002020241-0 201234670 [0018] ❹ 該步驟SI 1提供一載板’承載多個led元件；該載板10包 括有支架型（Lead frame)、陶瓷聯月緊密型或是燈條型 (Light bar)，所述載板1〇類型是依據所要封裝成型的 LED產品類型來選擇使用◊本實施例中，該載板1〇為陶 瓷聯片緊密型（如圖2所示），該載板10包括一頂面12，該 頂面12上具有多個容置空間14，該容置空間14自該頂面 12向下凹陷形成。該多個容置空間14以矩形陣列的方式 排列在該載板1 〇的頂面1 2上，該容置空間14用以設置該 LED元件20。該LED元件20具有一凹杯内框22，該凹杯内 框22中具有相對應的LED晶片24，該LED晶片24朝向該載 ο 板10的頂面12。該步驟S12提供一感測器，對該載板上的 LED元件進行偵測，並製作偵測影像及位置參數，該感測 器30(如圖3所示）為一影像感測器3〇，該影像感測器30 可以是電荷耦合元件（簡稱CCD)或是互補式金屬氧化物半 導體（簡稱CMOS)。該感測器30位於該載板1〇的頂面12 上’並聚焦於該載板10上的LED元件20。該感測器30以 座標軸的橫轴向（X轴向）以及座標軸的縱軸向（γ轴向）位 移’分別對該載板10頂面12上承載的該LED元件20逐一 地進行偵測。該感測器30對該LED元件20進行的偵測，包 括該LED元件20的影像資訊以及位置參數，該影像資訊用 以判斷該LED元件20為良品202或是壞品204，該位置參 數以座標軸的縱、橫兩轴的位移資料確定該LED元件20良 品202或疋壞品204所在的位置。例如，圖3實施例中，該 感測器30以偵測的影像資訊判定該led元件20中有兩個壞 品204 ’並以位置參數確定所述LED元件20壞品204分別 位於第一橫軸的第三位置以及第一縱軸的第四位置（如圖 100112129 表單煸號A0101 第5頁/共14頁 1002020241-0 201234670 2所不），並將該LED元件20這些影像資訊以及位置參數資 料製作成偵測影像及位置參數。接著該步驟s丨3設定膠針 移動及點膠程式，依據該偵測影像及位置參數，該膠針 40移動程式設定，依據該偵測影像及位置參數中的位置 參數資料，設定越過該壞品2〇4的位置。該膠針40點膠程 式设疋，依據該偵測影像及位置參數中的影像資訊資料 ，設定膠針40到達良品202位置時進行點膠作業。該步驟 S14實施點膠，依據該膠針移動及點膠程式，請參閲圖4 ，實施例中膠針40依據設定的所述移動程式，使該膠針 40在該第一橫軸的第一位置以及第二位置（良品202位置） 時’均會依據設定的該點膠程式在到達良品2〇2位置時進 行點勝作業。該膠針4 〇在完成該第一橫轴的第二位置點 膠作業程式後，依據該移動程式將會直接越過該第一橫 轴的第三位置（即所述壞品2 0 4的位置），到達該第一橫轴 的第四位置（良品202位置）繼續該點膠程式，或是該膠針 40依據該移動程式到達該第一橫軸的第三位置（即所述壞 品204的位置）時，依據設定的該點膠程式暫停進行點膠 (圖中未標示）作業。當該勝針40在第一縱軸實施點膠時 ，該膠針40同樣會依據設定的該膠針移動及點膠程式， 越過該第一縱軸的第四位置（即所述壞品204的位置），或 是到達該第一縱軸的第四位置時暫停進行點膠作業，用 以避免對該壞品204的位置進行點膠程式。該膠針40可避 開在該壞品204的位置進行點膠，從而可以減少膠材的浪 費降低成本。最後，該步驟S15去除該載板上的壞品204 。該載板10上的壞品為該載板上未進行點膠作業的該 LED元件20。實施例中該載板1〇的第一橫軸的第三位置以 100112129 表單編號 A0101 第 6 頁/共 14 頁 1002020241-0 201234670 及第一縱轴的第四位置上的LED料2Q未進行點膠 即確認是為壞品204將其去除，使該載板1〇上均為封裝一 好的⑽元件2〇良品202，因此可使LED封裝點膠的良率疋 有效地提升。 [晒綜上，本發机職裝點膠製造方法，該膠針獅動及點 _式’是依據該偵測參數所設定，避免膠針移動到壞 m204的位置上進行封裝點膠的作業，有效控制勝針點 膠的程式，減少膠材的浪費、確實去除壞品2〇4，進而提 0 升LED封裝點膠的良率並且降低封裝的成本。 [0020] 應該指出，上述實施例僅為本發明的較佳實施方式，本 領域技術人員還可在本發明精神内做其他變化。這些依 據本發明精神所做的變化，都應包含在本發明所要求保 護的範圍之内。 【圖式簡單說明】 [0021] 圖1是本發明LED封裝點膠製造方法的步驟流程圖。 [0022] 圖2是對應圖1提供一載板步驟的載板的俯視圖。 [0023] 圖3是對應圖1提供一感測器步驟的使用示意圖。 [0024] 圖4是對應圖1實施點膠步驟的使用示意圖。 【主要元件符號說明】 [0025] 載板：10 [0026] 頂面：1 2 [0027] 容置空間：14 [0028] LED元件：20 100112129 表單編號A0101 第7頁/共14頁 1002020241-0 201234670 [0029] LED元件良品：20 2 [0030] LED元件壞品：204 [0031] 凹杯内框：22 [0032] 感測器：3 0 [0033] 膠針：40 100112129 表單編號A0101 第8頁/共14頁 1002020241-0The products have the advantages of energy saving, power saving, high efficiency, fast reaction time, long life cycle, no mercury, and environmental benefits. However, in the process of the LED package, the carrier board is used to carry a plurality of LED components, and then the general order of the dispensing device is used to drive the glue pins to sequentially and one-by-onely package the LED components to make the plastic needles The glued gel covers the LED wafer to complete the package. However, the plurality of LED elements carried on the carrier board are not all good products that have been tested, and there are inevitably black products, off-line or unaligned grains (NG products). When the defective product is not removed from the carrier, the dispensing device is still packaged in a general procedure, so that the packaging operation for the defective product, #(4)(4) the yield is lowered, and the cost is increased, and the money cartridge is emphasized to improve. problem. # [Summary] 阙 审 审 审 , 审 审 审 审 审 审 审 审 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。闺-type LED (four) dispensing manufacturing method, comprising the following steps, [0005] providing a carrier plate carrying a plurality of LED components; [〇_独-sensor, detecting LEDit components on the carrier board, And make 100112129 Form No. A0101 Page 3 / 14 pages 1002020241-0 201234670 Detection of image and position parameters; [0007] Set the needle movement and dispensing program, according to the detection image and position parameters [0008] implementation of dispensing According to the needle movement and dispensing program; and [0009] remove the bad products on the carrier. [0010] In the above LED package dispensing manufacturing method, since the dispensing and dispensing process of the dispensing glue is set according to the detected image and the positional parameter, the position of the defective product on the carrier can be accurately grasped. In order to avoid the movement of the plastic needle to the position of the defective product, the operation of the package dispensing can effectively control the dispensing procedure of the plastic needle, improve the efficiency and yield of the dispensing package, and reduce the cost. [Embodiment] [0011] The present invention will be specifically described below with reference to the accompanying drawings. 1 is a flow chart showing the steps of a method for manufacturing an LED package dispensing according to the present invention, which includes the following steps: [1113] S11 provides a carrier plate carrying a plurality of LED elements; [0014] a sensor for detecting the LED component on the carrier and making a detection image and a position parameter; [0015] S13 setting the needle movement and dispensing program according to the detected image and position parameter; [0016] S14 performs dispensing according to the needle movement and dispensing program; and [0017] S15 removes the defective product on the carrier. 100112129 Form No. A0101 Page 4 of 14 1002020241-0 201234670 [0018] ❹ This step SI 1 provides a carrier board carrying a plurality of LED elements; the carrier board 10 includes a lead frame and a ceramic joint moon In the compact type or the light bar type, the carrier type is selected according to the type of LED product to be packaged. In this embodiment, the carrier 1 is a ceramic joint compact type (such as As shown in FIG. 2 , the carrier 10 includes a top surface 12 , and the top surface 12 has a plurality of accommodating spaces 14 , and the accommodating space 14 is recessed downward from the top surface 12 . The plurality of accommodating spaces 14 are arranged in a rectangular array on the top surface 12 of the carrier 1 , and the accommodating space 14 is used for arranging the LED elements 20 . The LED component 20 has a recessed inner frame 22 having a corresponding LED wafer 24 that faces the top surface 12 of the carrier 10. The step S12 provides a sensor for detecting the LED component on the carrier and preparing a detection image and a position parameter. The sensor 30 (shown in FIG. 3) is an image sensor. The image sensor 30 can be a charge coupled device (CCD) or a complementary metal oxide semiconductor (CMOS). The sensor 30 is located on the top surface 12 of the carrier 1 and is focused on the LED element 20 on the carrier 10. The sensor 30 detects the LED elements 20 carried on the top surface 12 of the carrier 10 one by one in the lateral axis (X-axis direction) of the coordinate axis and the longitudinal axis (γ-axis displacement) of the coordinate axis. . The detection of the LED component 20 by the sensor 30 includes image information of the LED component 20 and a positional parameter. The image information is used to determine whether the LED component 20 is a good product 202 or a bad product 204. The displacement data of the longitudinal and transverse axes of the coordinate axis determines the position of the LED component 20 or the defective product 204. For example, in the embodiment of FIG. 3, the sensor 30 determines, by the detected image information, that there are two bad products 204' in the LED element 20 and determines that the LED elements 20 are in the first horizontal direction by the positional parameters. The third position of the axis and the fourth position of the first vertical axis (as shown in FIG. 100112129, the form number A0101, page 5/14 pages, 1002020241-0 201234670 2), and the image information and positional parameters of the LED component 20 The data is made into detected images and positional parameters. Then, the step s丨3 sets the needle movement and the dispensing program. According to the detected image and the position parameter, the needle 40 moves the program setting, and according to the position parameter data in the detected image and the position parameter, the setting is over the bad. The position of the product 2〇4. The glue needle 40-point glue setting device sets the glue needle 40 to perform the dispensing operation when the glue needle 40 reaches the position of the good product 202 according to the image information in the detected image and the position parameter. In step S14, dispensing is performed. According to the needle movement and dispensing procedure, please refer to FIG. 4. In the embodiment, the needle 40 is in the first horizontal axis according to the set movement formula. When a position and a second position (good position 202) are used, the point win operation is performed according to the set dispensing program when the good product 2〇2 position is reached. After the plastic needle 4 is finished in the second position dispensing operation program of the first horizontal axis, the movement program will directly pass the third position of the first horizontal axis (ie, the position of the bad product 2 0 4 And reaching the fourth position of the first horizontal axis (the position of the good product 202) to continue the dispensing program, or the plastic needle 40 reaches the third position of the first horizontal axis according to the movement program (ie, the bad product 204 When the position is set, the dispensing (not shown) is paused according to the set dispensing program. When the winning needle 40 is dispensed on the first longitudinal axis, the plastic needle 40 will also pass the fourth position of the first longitudinal axis according to the set movement and dispensing procedure (ie, the defective product 204) Positioning), or when the fourth position of the first longitudinal axis is reached, the dispensing operation is suspended to avoid dispensing the position of the defective product 204. The glue needle 40 can avoid dispensing at the position of the defective product 204, thereby reducing the cost of the glue material and reducing the cost. Finally, step S15 removes the bad product 204 on the carrier. The defective product on the carrier 10 is the LED element 20 on the carrier which is not subjected to a dispensing operation. In the embodiment, the third position of the first horizontal axis of the carrier 1〇 is 100112129, the form number A0101, the 6th page, the total of the LEDs 2Q on the fourth position of the first vertical axis is not performed. The glue is confirmed to be removed for the bad product 204, so that the carrier board 1 is packaged with a good (10) component 2, which can effectively improve the yield of the LED package. [In the sun, the hair machine manufacturing method, the glue needle and the point _ type is set according to the detection parameters, to avoid the needle moving to the position of the bad m204 for packaging and dispensing operations Effectively control the program of the needle dispensing, reduce the waste of the glue, and indeed remove the bad goods 2〇4, thereby increasing the yield of the 0-liter LED package and reducing the cost of the package. [0020] It should be noted that the above-described embodiments are merely preferred embodiments of the present invention, and those skilled in the art may make other changes within the spirit of the present invention. All changes made in accordance with the spirit of the invention are intended to be included within the scope of the invention as claimed. BRIEF DESCRIPTION OF THE DRAWINGS [0021] FIG. 1 is a flow chart showing the steps of a method for manufacturing an LED package dispensing of the present invention. [0022] FIG. 2 is a top plan view of a carrier plate corresponding to FIG. 1 providing a carrier step. 3 is a schematic diagram showing the use of a sensor step corresponding to FIG. 1. 4 is a schematic view showing the use of the dispensing step corresponding to FIG. 1. [Main component symbol description] [0025] Carrier board: 10 [0026] Top surface: 1 2 [0027] Housing space: 14 [0028] LED component: 20 100112129 Form number A0101 Page 7 / Total 14 pages 1002020241-0 201234670 [0029] LED component good product: 20 2 [0030] LED component defective product: 204 [0031] concave cup inner frame: 22 [0032] sensor: 3 0 [0033] plastic needle: 40 100112129 form number A0101 8 Page / Total 14 pages 1002020241-0