CN1700851A - Positioning method of electronic component process - Google Patents
Positioning method of electronic component process Download PDFInfo
- Publication number
- CN1700851A CN1700851A CN 200410038263 CN200410038263A CN1700851A CN 1700851 A CN1700851 A CN 1700851A CN 200410038263 CN200410038263 CN 200410038263 CN 200410038263 A CN200410038263 A CN 200410038263A CN 1700851 A CN1700851 A CN 1700851A
- Authority
- CN
- China
- Prior art keywords
- glue
- processing procedure
- electronic component
- localization method
- location
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
This invention discloses one electrical process positioning method, which comprises the following steps: processing glue spotting on the workbench and using glue shape device to position the liquid status on the workbench and processing the drying by the glue; then putting the working pieces on the fixed element; after processing, testing whether the pieces are usable, if they are, then going back to setting step; otherwise then clearing the position glue and going back to glue spotting and gong back to upper position glue. In order to get accurate position, it can etch one limit groove on the glue area and spot the glue to the limit groove after drying process.
Description
Technical field
The present invention relates to the location of electronic component, particularly a kind of localization method of electronic component processing procedure.
Background technology
As shown in Figure 1, the localization method of traditional electronic component processing procedure, all adopt double faced adhesive tape 3 or adhesive tape 4 that work package 5 is sticked on microscope carrier 1, it is artificial location, and processing procedure can't be accelerated, and use adhesive tape, have the problem of meeting thermal deformation, chemical agent is stained with glutinous stained work package of meeting and workbench again, and its chemical agent is stained with glutinous difficult the removal again, accumulate over a long period, can make the workbench object thickness to increase, influence accuracy; When artificial applying, there is the situation of the skew of sliding in regular meeting, and chemistry is stained with agent itself and still is liquid condition, after binding the location, still may produce the deviation situation of vacillating because of factors such as vibrations, the precision of general electronic component requires very strict, with general bitcom and printed circuit board (PCB), and skew 0.2mm, this object will become defective products, and object is subject to locate mode, can't changeable appearance, and the software of using for communication handset, can't be changeable because of moulding, and adjust; Though in the method that the vacuum utilized location is arranged, cost is high.
Summary of the invention
The purpose of this invention is to provide a kind of low cost, locate the localization method that quick accurate and reusable electronic component is made journey.
The localization method that electronic component of the present invention is made journey may further comprise the steps:
On the work microscope carrier, carry out a glue, utilize out adhesive dispenser that liquid condition is located the glue point in microscope carrier, will locate glue again and carry out drying and other treatment, then work package is placed the regular worker of a glue place workpiece;
After waiting to finish processing procedure, check whether location glue may be used, if may be with then getting back to the step of putting work package, otherwise then cleaning be removed the location glue that can't bear usefulness, gets back to a glue, goes up again and locatees glue.
The present invention is described in detail with instantiation below in conjunction with accompanying drawing.
Description of drawings
Fig. 1 is the localization method of the electronic component processing procedure commonly used;
Fig. 2 is the process block diagram of this invention;
Fig. 3 is embodiments of the invention;
Fig. 4 is one of further embodiment of the present invention figure;
Fig. 4-the 1st, two of further embodiment of the present invention figure.
Description of reference numerals: 1 microscope carrier; 11 limiting grooves; 2 work packages; 3 double faced adhesive tapes; 4 adhesive tapes; 5 location glue; 6 go out adhesive dispenser; The A microscope carrier of working; B point glue; The C mummification; D fixes; Other processing procedure of E; F checks; The G cleaning.
Embodiment
The localization method of electronic component processing procedure of the present invention such as Fig. 2, shown in Figure 3, comprise work microscope carrier A, some glue B, mummification C, fixedly D, processing procedure E, check F and clean G.Its workflow is, on work microscope carrier A, carry out a glue B, utilize out adhesive dispenser 6 that liquid condition is located glue 5 and will put on microscope carrier 1, will locate glue 5 again and carry out mummification C processing, place a Jiao Chu in work package 2 again, after fixedly entering processing procedure E after the D work package 2, waiting to finish processing procedure E, check whether F location glue 5 may be used, if may be with then getting back to the step of putting work package, otherwise, then clean G and remove the location glue 5 that can't bear usefulness, get back to a glue B, again go up location glue 5, its location glue 5 is reusable hundreds of inferior again, reduces manufacturing cost, and when cleaning H, only utilize and strike off or both can remove location glue, meet environmental benefit with the solvent that closing property of alcohol isothermal is not hindered workbench.
The process of its mummification C comprises air-dry or heated volatile etc. is relevant that tool volatility in the fluid, the liquid of vapo(u)rability are shed, and forms the process of solid; Its location glue 5 is liquid colloidal cpds, after mummification, high temperature that can anti-hundreds of degree, the high temperature because of the electronic component processing procedure does not change its physical characteristic, and have special the upright physical characteristic that reaches cohesive force, when object contacts, produce capillarity, must both can not produce stickiness with the glutinous agent of chemistry.
Embodiments of the present invention are utilized out adhesive dispenser 6 will locate 5 in glue and behind the glue 5 of mummification location, work package 2 are placed on the glue 5 of location on specific point again as shown in Figure 3 on the microscope carrier 1, after fixedly finishing, both can enter processing procedure; It is applying of point again, can be in response to the target of turning round change more, and as S shape target, or the work package of changeableization, multi-angle bending.
Shown in Fig. 4, Fig. 4-1, in order further accurately to locate, in 1 required some Jiao Chu of support plate etching one limiting groove 11 of going ahead of the rest, again aqueous location glue 5 is clicked and entered in the limiting groove 11, after glue 5 mummification of location, put work package 2, can reach fitting tightly of work package 2 and support plate 1 this moment, reduces the micro-error that micro-thickness caused by location glue 5.
The present invention has following technique effect:
1, fast and accurate for positioning.
2, remove convenient can stained work microscope carrier, simple and easy drawing together removed, or do not hinder work with closing property of alcohol isothermal The solvent of platform just can be removed, and meets environmental benefit.
3, do not need manually-operated, available point gum machine, flow process is significantly promoted in automation mechanized operation.
4, do not have unnecessary be stained with glutinous.
5, can slippage behind the location.
6, reusable reaching hundreds of times, cost significantly reduces.
The applying of 7, only having a few must not used comprehensively.
8, can be in response to the target of turning round change more, as S shape target, or the work package of changeableization, multi-angle bending.
9, can be in response to the precision die requirement, the glue of estimating is gone up in the microscope carrier etching of will working earlier again, and glue is solidified, can accurate fully level.
Claims (4)
1, a kind of localization method of electronic component processing procedure may further comprise the steps:
On the work microscope carrier, carry out a glue, utilize out adhesive dispenser that liquid condition is located the glue point in microscope carrier, will locate glue again and carry out drying and other treatment, then work package is placed the regular worker of a glue place workpiece;
After waiting to finish processing procedure, check whether location glue may be used, if may be with then getting back to the step of putting work package, otherwise then cleaning be removed the location glue that can't bear usefulness, gets back to a glue, goes up again and locatees glue.
2, according to the localization method of the described electronic component processing procedure of claim 1, wherein, some glue step comprise manually or automatically utilize out adhesive dispenser with fixing point glue on support plate.
3, according to the localization method of the described electronic component processing procedure of claim 1, wherein, the mummification step comprises air-dry or the heated volatile operation, and the tool volatility in the fluid, the liquid of vapo(u)rability are shed, and forms solid.
4, according to the localization method of the described electronic component processing procedure of claim 1, wherein this location glue is liquid colloidal cpd, after mummification, high temperature that can anti-hundreds of degree, and have special the upright physical characteristic that reaches cohesive force, when object contacts, produce capillarity, must both can not produce stickiness with the glutinous agent of chemistry.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410038263 CN1700851A (en) | 2004-05-18 | 2004-05-18 | Positioning method of electronic component process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410038263 CN1700851A (en) | 2004-05-18 | 2004-05-18 | Positioning method of electronic component process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1700851A true CN1700851A (en) | 2005-11-23 |
Family
ID=35476653
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200410038263 Pending CN1700851A (en) | 2004-05-18 | 2004-05-18 | Positioning method of electronic component process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1700851A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102632023A (en) * | 2011-02-14 | 2012-08-15 | 展晶科技(深圳)有限公司 | Dispensing process for LED (light-emitting diode) encapsulation |
| CN101640466B (en) * | 2008-07-31 | 2012-08-29 | 鸿富锦精密工业（深圳）有限公司 | Voice coil motor |
| CN103117241A (en) * | 2013-01-31 | 2013-05-22 | 中国科学院上海技术物理研究所 | Coating method in physical etching technology |
| CN115915639A (en) * | 2022-12-05 | 2023-04-04 | 武汉光启源科技有限公司 | Electronic packaging glue dispensing method |
-
2004
- 2004-05-18 CN CN 200410038263 patent/CN1700851A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101640466B (en) * | 2008-07-31 | 2012-08-29 | 鸿富锦精密工业（深圳）有限公司 | Voice coil motor |
| CN102632023A (en) * | 2011-02-14 | 2012-08-15 | 展晶科技(深圳)有限公司 | Dispensing process for LED (light-emitting diode) encapsulation |
| CN102632023B (en) * | 2011-02-14 | 2014-11-05 | 展晶科技(深圳)有限公司 | Dispensing process for LED (light-emitting diode) encapsulation |
| CN103117241A (en) * | 2013-01-31 | 2013-05-22 | 中国科学院上海技术物理研究所 | Coating method in physical etching technology |
| CN115915639A (en) * | 2022-12-05 | 2023-04-04 | 武汉光启源科技有限公司 | Electronic packaging glue dispensing method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Saeidpourazar et al. | Laser-driven micro transfer placement of prefabricated microstructures | |
| US9500541B2 (en) | Method and device for determining the pressure distribution for bonding | |
| JP4637053B2 (en) | Pellicle and pellicle peeling device | |
| JP5390486B2 (en) | Electronic component post-processing system | |
| US8268389B2 (en) | Precast thermal interface adhesive for easy and repeated, separation and remating | |
| EP1770765A3 (en) | Substrate processing method | |
| TWM382891U (en) | Angle adjustment structure of right-angle robot arm | |
| CN1700851A (en) | Positioning method of electronic component process | |
| CN203003498U (en) | A processing structure for a slice-shaped precious metal target | |
| Banks | Microengineering, MEMS, and interfacing: a practical guide | |
| CN110749596A (en) | Method for testing thickness of paint film of automobile multi-coating paint part | |
| CN108855804B (en) | Dispensing method for assembling tiny products | |
| TW201016082A (en) | Packaging method of combining sleeve screw with printed circuit board | |
| KR100789298B1 (en) | Method for removing Anisotropic Conductive Film | |
| CN107251212B (en) | Method and apparatus for removing microchips from a wafer and applying the microchips to a substrate | |
| CN110155938B (en) | Method for preparing microsphere probe based on micro-cantilever transfer | |
| CN109470564B (en) | Device and method for testing clamping force of composite material in tensile test after clamping section slips | |
| JP5848952B2 (en) | Adhesive strength measuring apparatus and adhesive strength measuring method | |
| CN100344964C (en) | Method for preparing electrochemical micro-flor controlled chip of sunk copper electrode | |
| JPH0379314A (en) | Manufacture of optical part and mold for optical part | |
| CN113029942B (en) | Single-interface bonding strength evaluation test method | |
| TW582189B (en) | Positioning method for manufacturing process of electronic components | |
| CN205483876U (en) | Normal position nanometer indentation test system under environment is corroded and heated | |
| JP5703900B2 (en) | Dust evaluation method | |
| Westkämper et al. | Adhesive Gripper-a new approach to handling MEMS |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |