M350093 八、新型說明： 【新型所屬之技術領域】 本創作是有關於一種晶粒檢測裝置，特別是有關於一 可同時偵測點膠前位置、點膠後狀況、固晶前位置及固晶 狀況之晶粒檢測裝置。 【先前技術】 請參考第1圖，其係為習知技藝之固晶機之—示意圖。 固晶機包含一投料機構n、一輸送機構12、一點膠機構13、 -取置晶機構Η、一點膠檢測機構151及一固晶檢測機構 1 j 2 ° 投料機構11承載複數導電支架16’並依序將導電支架 :自動釋放至輸送機構上12。導電支架㈣有一陽極導電 呈女〜及陰極導電端子162。陰極導電端子162之-端 「二谷置空間163,其係用以承載—相對應之發光二極體 -、、盖端具有位用之定位孔164。輸送機構12具有 作時，曰刹^引件121及二定位件122。當輸送機構12運 送方狡引件121牽引位於溝槽内之導電支架16往輸 !:方向移動，並藉由定位件122穿設至相對應之定位孔 間163 Λ一固定機構123固定導電支架16 ’使每一容置空 注點膠位置及固晶位置。师機構13用以填 構14且右石點膠位置之容置空間163内。取置晶機 舟14具有一承恭A〗41 m 二極體19，並將；1定位至位於承載* 141之發光 固定發光二極體Γ9至/=電支架16上，且藉由銀膠18 至導電支架16上。點膠檢測機構151 5 M350093 及固晶檢測機構152係為CCD攝影機，係設置於輸送機構 12上方，用以分別拍攝點膠前後及固晶前後影像。 一凊參照第2圖，其係為習知技藝之固晶機之感測影像之 一不思圖。藉由導引件121帶動導電支架16，使此容置空 間163依序移動至點膠位置，再藉由點膠檢測機才籌i5i檢測 導電支架16之容置空間163之位£，待位置補償後，進行 點膠作業。當每-容置空間i 6 3於點膠位置完成點膠後，藉 由導引件121帶動導電支架16，使此容置空間163依序J ，至固曰曰位置，藉由固晶檢測機構152檢測導電支架丨6之 容置空間163之位置，待位置補償後進行固晶作業。 j而t知技藝之固晶機之缺點在於須以兩組檢測機 :別檢測點膠、固晶前之位置及點膠、固晶後狀況，提高了 设備成本，即間接提升生產成本。 習知技藝之固晶機之另—缺點在於其須待容置空間 1定後，先藉由點雜測機構151及固晶檢測機構152 =導電支架16之容置空間163之位置，待位置補償後， 降低了點膝或固晶作業，因而增加生產時間，導致生產效率 創作！f於習知技藝之各項問題’為了能夠兼顧解決之，本 究開發與諸多實務經驗，提出—種晶粒檢 义置，以作為改善上述缺點之實現方式與依據。 【新型内容】 置，本創作之目的就是在提供-種晶粒檢測裝 置以減少生產時間並降低設備成本。 根據本創作之目的，提出一種晶粒檢測裝置，係適用於 6 M350093 …曰曰、上其包含—輪送元件、—感測元件及-影像辨識 送疋件儀界預備位置及—點膠固晶位置，並用 時感:::=;:件:上方，當支架移 纪你 这，則70件係檢測支架以產生一感測影像。 : = : =感測影像產生-位移控制訊息。其中當 移控制訊m *動至卿固晶位置時’輸送元件係根據位 位i。5心又 架之移動距離，使其準確定位至點膠固晶 ，支架具有一容置空間，係承載相對應之一晶粒。 機構在依本創作之晶粒檢測裝置，可以—組檢測 =在，固“得知支架位置，並讀送支架之過程中， 二===位置’而避免習知技藝之固晶機須以兩組 段;=::::固晶前位置，並在輸送過程後再心 【實施方式】 實施^將參照相關圖式’說明依本創作之晶粒檢測裝置之 之干3間=圖，其係為本創作之晶粒檢測裝置之實_ 之不忍圖。圖t ’晶粒檢測裝霄」 一輸送元件Μ、一感測元株M LJ日日機上3,包含 架34。 ，]疋件32、一影像辨識單元33及一支 二參閱第^圖’其係為本創作之晶粒檢測裝 之感測7G件之示意圖。輸送元件31具有 ' 設置於輸送本體311上之夾持 ^ 則、本體311及 界定出一預備位㈣及且輸送本體州係 點膠固晶位置314。夹持單元312 M350093 係藉由馬達(圖未示)之 向方向或縱向方向移動，失持支架34,及於橫 補償。 > 勡以輪送支架34及對支架34作位置 之方二閱^圖’其係為本創作之晶粒檢測裝置之實施例M350093 VIII. New description: [New technical field] This creation is about a kind of grain detecting device, especially for the simultaneous detection of the position before dispensing, the condition after dispensing, the position before solid crystal and the solid crystal Conditional grain detection device. [Prior Art] Please refer to Fig. 1, which is a schematic diagram of a conventional crystallizer. The die bonding machine comprises a feeding mechanism n, a conveying mechanism 12, a dispensing mechanism 13, a picking mechanism 一点, a glue detecting mechanism 151 and a die bonding detecting mechanism 1 j 2 ° feeding mechanism 11 carrying a plurality of conductive supports 16' and the conductive brackets are automatically released to the transport mechanism 12 . The conductive support (4) has an anode conductive female and a cathode conductive terminal 162. The end of the cathode conductive terminal 162 is a two-dimensional space 163 for carrying the corresponding light-emitting diode-, and the cover end has a positioning hole 164 for the position. When the transport mechanism 12 has a function, the brake is provided. The guiding member 121 and the two positioning members 122. When the conveying mechanism 12 carries the square guiding member 121, the conductive bracket 16 located in the groove is moved to the direction of the transmission:: and is disposed between the corresponding positioning holes by the positioning member 122. 163 Λ a fixing mechanism 123 fixes the conductive bracket 16' so that each of the vacant dispensing positions and the solid crystal position is accommodated. The teacher mechanism 13 is used to fill the accommodating space 163 of the position 14 and the right stone dispensing position. The boat 14 has a 41 m diode 19 and is positioned to be placed on the illuminating fixed LED Γ9 to /= electric bracket 16 carrying the * 141, and is electrically conductive by silver glue 18 On the support 16, the dispensing detection mechanism 151 5 M350093 and the solid crystal detection mechanism 152 are CCD cameras, which are disposed above the transport mechanism 12 for respectively capturing the images before and after the dispensing and before and after the solid crystal. It is one of the sensing images of the solid crystal machine of the prior art. By the guide 12 1 driving the conductive bracket 16 to move the accommodating space 163 to the dispensing position, and then detecting the position of the accommodating space 163 of the conductive bracket 16 by the dispensing detector to determine the position of the accommodating space 163 of the conductive bracket 16 After the dispensing operation is completed, the conductive space 16 is driven by the guiding member 121 to make the accommodating space 163 sequentially to the solid position. The solid crystal detecting mechanism 152 detects the position of the accommodating space 163 of the conductive support 丨6, and performs the solid crystal working after the position compensation. The disadvantage of the solid crystal machine of the technical know-how is that two sets of detecting machines are required: The position before the solid crystal and the condition after dispensing and solid crystal increase the equipment cost, which indirectly increases the production cost. Another disadvantage of the conventional solid crystal machine is that it needs to be fixed after the space is set. By the point miscellaneous measuring mechanism 151 and the solid crystal detecting mechanism 152 = the position of the accommodating space 163 of the conductive bracket 16, after the position compensation, the knee or solid crystal working operation is reduced, thereby increasing the production time, resulting in production efficiency creation! In the various problems of the skill of the art, in order to be able to solve the problem In this case, the research and development and many practical experiences have proposed a kind of grain detection set as the implementation method and basis for improving the above shortcomings. [New content] The purpose of this creation is to provide a kind of grain detecting device. Reduce production time and reduce equipment cost. According to the purpose of this creation, a die detection device is proposed for 6 M350093 ..., its inclusion - wheeled components, - sensing components and - image recognition sending device The position of the boundary and the position of the glue solid crystal, and the sense of time:::=;: piece: above, when the bracket is moved to you, 70 pieces of the detection bracket to produce a sensing image. : = : = Sense image generation - Displacement control message. When the shift control signal is moved to the position of the solid crystal, the transport element is based on the position i. 5 The heart and the moving distance of the frame make it accurately position to the glue solid crystal. The bracket has a receiving space and carries one of the corresponding crystal grains. According to the invention, the grain detecting device can be used to detect the position of the bracket, and in the process of reading the bracket, and in the process of reading the bracket, the second === position to avoid the conventional technology. Two groups of segments; =:::: the position before the solid crystal, and then the heart after the transfer process [Implementation] Implementation ^ will refer to the relevant diagram 'describe the dry 3 between the die detection device created by the map = It is the unrealistic picture of the created grain detecting device. Figure t 'Graph detecting device 》 A conveying element Μ, a sensing element M LJ 日日机3, includes a frame 34. , the device 32, an image recognition unit 33 and a second reference to Fig. 2 are schematic diagrams of the sensed 7G device of the created die detection device. The conveying member 31 has a gripping member disposed on the conveying body 311, a body 311 defining a preparatory position (4), and a conveying body state dispensing solid crystal position 314. The clamping unit 312 M350093 is moved by the direction of the motor (not shown) or the longitudinal direction, the support bracket 34 is lost, and the lateral compensation is performed. > 勡 轮 轮 轮 34 及 及 轮 轮 轮 轮 轮 34 34 34 轮 轮 轮 轮 ’ ’ ’
元件31之I方1 7 32係為一 CCD攝影機’其設置於輸送 固曰德妝潢。冬士糸用以檢測點膠、固晶前之位置及點膠、 uH、丨虽支架34移動至預備位置313時，感測元件 32係檢測支架34’以產生一感測影像321，如第6圖所示。 ㈣雪係為—金屬製成之可導電支架，其具有複數陽 =導電端子341及複數陰極導電端子342，且陰極導電端子 之一端係為一容置空間343,係用以容置相對應之銀膠 5及旦晶粒36。在本實施例中，晶粒36係為一發光二極體。 衫像辨識單7C 33係為-影像辨識軟體，可根據感測影 像32丨辨識容置空間343位置，並據以產生一位移控制訊息 331，亦可辨識銀膠35及晶粒％是否準確定位至容置空間 343 内。 备固晶作業進行時，固晶機3之投料機構37釋放支架 34至輸送元件31上’使輸送元件31承載及輸送支架34。 輪送元件31藉由馬達驅動夾持單元312夾持支架34並帶動 支架34移動’使每一支架34之容置空間343依序通過預備 位置313及點膠固晶位置314。 當容置空間343位於預備位置313時，感測元件32拍 攝位於預備位置313之容置空間343以產生一感測影像 321。影像辨識單元33接收到感測影像321後，辨識此容置 空間343與固晶位置314比較後，產生一位移控制訊息 8The I side 1 7 32 of the component 31 is a CCD camera' which is placed on the transport solids. The winter scorpion is used to detect the position of the glue, the position before the solid crystal and the glue, uH, 丨. When the bracket 34 moves to the preparatory position 313, the sensing component 32 detects the bracket 34 ′ to generate a sensing image 321 . Figure 6 shows. (4) The snow system is a conductive support made of metal, which has a plurality of anodes = conductive terminals 341 and a plurality of cathode conductive terminals 342, and one end of the cathode conductive terminals is an accommodating space 343 for accommodating corresponding ones. Silver glue 5 and denier crystal 36. In this embodiment, the die 36 is a light emitting diode. The shirt image recognition system 7C 33 is an image recognition software, and the position of the accommodating space 343 can be identified according to the sensing image 32 ,, and a displacement control message 331 is generated, and the silver glue 35 and the crystal grain % can be accurately positioned. To the accommodation space 343. When the seeding operation is being performed, the feeding mechanism 37 of the die bonding machine 3 releases the holder 34 onto the conveying member 31, and the conveying member 31 carries and conveys the holder 34. The wheeling member 31 holds the bracket 34 by the motor-driven clamping unit 312 and drives the bracket 34 to move. The accommodating space 343 of each bracket 34 is sequentially passed through the preparatory position 313 and the dispensing solid crystal position 314. When the accommodating space 343 is located at the preparatory position 313, the sensing component 32 captures the accommodating space 343 at the preparatory position 313 to generate a sensing image 321 . After receiving the sensing image 321 , the image recognition unit 33 recognizes that the accommodating space 343 is compared with the solid crystal position 314 to generate a displacement control message.
M350093 331。輸送元件31根據此位移控制訊息331，於輸送支架％ 至點膠固晶位置314時，同時補償支架34之移動距離^使 此容置空間343能準確定位至點膠固晶位置314，因此點膠 機構38可直接進行點膠作業。點膠作業完成後，再進行固 晶位置補償，待作動完成後，進行固晶作業。而不需如習知 技藝之固晶機，於輸送完支架後，需再等待此容置空間3们 進行位置補償後，才能進行點膠或固晶作業，因而縮短固曰 作業時間。 Μ 、歸納上述，本創作之晶粒檢測裝置之功效在於藉由一組M350093 331. According to the displacement control message 331, the conveying element 31 compensates the moving distance of the bracket 34 at the time of conveying the bracket % to the glue solidifying position 314, so that the accommodating space 343 can be accurately positioned to the dispensing solid crystal position 314, so The glue mechanism 38 can perform the dispensing operation directly. After the dispensing operation is completed, the solid crystal position compensation is performed, and after the completion of the operation, the solid crystal working is performed. It is not necessary to use the solid crystal machine as the conventional technology. After the bracket is conveyed, it is necessary to wait for the position compensation of the accommodating space 3 to perform the dispensing or the die bonding operation, thereby shortening the fixing operation time. Μ In summary, the effect of the grain detecting device of the present invention is that
感測元件32即可檢測點膠、固晶前之位置及點膠、固晶後 狀況’因而降低生產成本。 M 本創作之晶粒檢測裝置之另一功效在於輸送元件3ι可 依，位移控制訊息331，於輸送支架34過程中，同時校正 支架34之定位位置，使其準確定位至點膠固晶位置gw， 使點膠機構38及固晶機構39能直接進行點膠 而減少生產時間。 作菜因 創作述f為舉例性，而非為限制性者。任何未脫離本 人AM月神/、粑嚀，而對其進行之等效修改或變更，均應包 含於後附之申請專利範时 观 【圖式簡單說明】 第1圖係為習知技藝固晶機之一示意圖； =2圖係為習知技藝固晶機之感測影像示意圖； 3圖係為本創作之晶粒檢測裝置之實施例之立體圖； 4圖係為本創作之晶粒檢測裝置之實施例之感測元 9 M350093 第5圖係為本創作之晶粒檢測裝置之實施例之方塊圖； 以及 第6圖係為本創作之晶粒檢測裝置之實施例之感測影 像示意圖。 【主要元件符號說明】 11 :投料機構， 31 :輸送元件； 12 :輸送機構； 311 :輸送本體； 121 :導引件； 312 :夾持單元； 122 :定位件； 313 :預備位置； 123 :固定機構； 314 :點膠固晶位置； 13 :點膠機構； 32 :感測元件； 14 :取置晶機構； 321 :感測影像； 141 :承載台； 33 :影像辨識單元； 151 :點膠檢測機構； 331 :位移控制訊息； 152 :固晶檢測機構； 34 :支架； 16 :導電支架； 341 :陽極導電端子； 161 :陽極導電端子； 342 :陰極導電端子； 162 :陰極導電端子； 343 :容置空間； 163 :容置空間； 35 :銀膠； 164 :定位孔； 3 6 .晶粒， 18 :銀膠； 37 :投料機構； 19 :發光二極體； 38 :點膠機構；以及 3 :固晶機； 39 :固晶機構。The sensing element 32 can detect the position of the dispensing, the position before the solid crystal, and the condition after dispensing and solidification, thereby reducing the production cost. Another function of the die detecting device of the present invention is that the conveying member 3ι can be controlled by the displacement control message 331 during the process of conveying the bracket 34, and simultaneously correcting the positioning position of the bracket 34 to accurately position the glued solid crystal position gw The dispensing mechanism 38 and the die bonding mechanism 39 can be directly dispensed to reduce production time. Cooking a recipe is an example, not a limitation. Any equivalent modification or change that has not been made from my AM Moon God/, 粑咛, shall be included in the attached patent application modal view [Simple Description] The first picture is a conventional technique Schematic diagram of a crystal machine; =2 diagram is a schematic diagram of the sensing image of the conventional technology solid crystal machine; 3 diagram is a perspective view of the embodiment of the created grain detecting device; 4 is the grain detection of the creation Sense element of the embodiment of the device 9 M350093 Fig. 5 is a block diagram of an embodiment of the die detecting device of the present invention; and Fig. 6 is a schematic view of the sensing image of the embodiment of the die detecting device of the present invention . [Description of main component symbols] 11: feeding mechanism, 31: conveying member; 12: conveying mechanism; 311: conveying body; 121: guiding member; 312: clamping unit; 122: positioning member; 313: preparation position; 123: Fixing mechanism; 314: dispensing solid crystal position; 13: dispensing mechanism; 32: sensing element; 14: taking crystal mechanism; 321 : sensing image; 141: carrying table; 33: image recognition unit; Glue detection mechanism; 331: Displacement control message; 152: Solid crystal detection mechanism; 34: Bracket; 16: Conductive support; 341: Anode conductive terminal; 161: Anode conductive terminal; 342: Cathode conductive terminal; 162: Cathode conductive terminal; 343: accommodation space; 163: accommodation space; 35: silver glue; 164: positioning hole; 3 6. die, 18: silver glue; 37: feeding mechanism; 19: light-emitting diode; 38: dispensing mechanism ; and 3: solid crystal machine; 39: solid crystal mechanism.