TWI420614B - A die detection method for 3d die stacking - Google Patents

Description

Three-dimensional layout die detection method

The present invention relates to a method for detecting a crystal grain, and more particularly to a method for detecting a grain applied to a three-dimensional layout.

With the evolution of semiconductor packaging processes, System on 3D package (So3D) has been widely used in die packaging processes for mobile electronic devices such as mobile phones.

For example, referring to FIG. 1, a die 1 laid out in a planar manner has six circuit elements A~F, which may generate a long connection path when electrically connecting different circuit components (such as circuit component D in FIG. 1). The P1 point is electrically connected to the connection path of the P2 point on the circuit component C), and referring to FIG. 2, when the die 1 is stereoscopically arranged into a first to-be-detected layer 11 and a second to-be-detected layer 12, Wherein, the first to-be-detected layer 11 has circuit elements A, B, D, E, and the second to-be-detected layer 12 has circuit elements C, F, and the P1 point on the circuit element D is electrically connected to the circuit element C. The connection path of the P2 point can be effectively shortened. Therefore, the most common system-level three-dimensional packaging technology is to use a die stacking technology on a single chip size package (CSP) to effectively Provides a related die-level packaging technology that considers the die size as the primary consideration, such as the relevant die package inspection of mobile electronic products (such as mobile phones, digital cameras, or consumer products such as digital cameras).

However, this prior art has a rather serious disadvantage. Referring to FIG. 3, it is assumed that a three-dimensional layout die 2 disposed on a substrate 1 has four layers C1 to C4 to be detected, and each layer to be inspected C1~ The areas of C4 are different, and the waiting detection layers C1 to C4 respectively have a contact w1~w4 connected to the substrate 1.

When the die 2 of the three-dimensional layout performs the detection of the contacts w1 to w4, a die detecting module 9 must move to the different position points S1 to S4 on the two straight lines L1 and L2 to detect each waiting. Whether the contacts w1~w4 of the detecting layer C1~C4 and the substrate 1 are effectively connected, since the positions of the contacts w1~w4 are different from the distance d1~d4 of the die detecting module 9, therefore, When the die detecting module 9 moves to a position point w1~w4, it must focus on different distances d1~d4 to effectively detect the corresponding contacts w1~w4, for example, when the die detecting module 9 After detecting the contact w1, when the contact w2 is to be detected, the die detecting module 9 needs to be moved from the position point S1 to the position point S2, and at the same time, the distance between the to-be-connected point w2 and the die detecting module 9 The d2 is greater than the distance d1 between the contact w1 and the die detecting module 9. Therefore, the die detecting module 9 must refocus to obtain a clear image of the contact w2 before detecting the contact w2. The correct test results can be obtained, and the number of layers to be detected by the die stacking technology in the industry today is It is between 8 and 32 layers. In the future, as the technology evolves, it does not even rule out that it will increase to more than 64 layers. Therefore, in the prior art, the die detection module 9 needs to be renewed every time a layer to be detected is detected. Focusing to obtain a clear detection image will undoubtedly increase the detection time of the crystal 2 of the three-dimensional layout, and the detection cost will also increase significantly.

Therefore, how to effectively reduce the detection time and detection cost of the three-dimensional layout of the die is one of the key factors for the system-level three-dimensional packaging technology So3D can become a new mainstream technology for chip package inspection.

Therefore, the object of the present invention is to provide a method for detecting a three-dimensional layout die, which is suitable for assembling a control module to control a die detection module to detect a plurality of layers to be detected disposed on the substrate. a plurality of contacts of the three-dimensional layout die, comprising the steps of: assembling the control module to detect a first imaginary line passing through the contacts; assembling the control module to obtain a first An angle, wherein the first angle is an angle of an acute angle of the first imaginary line intersecting a normal line of the waiting detection layer; the control module is assembled to control the die detection module to rotate the first angle Having the die detection module perpendicular to the first imaginary line; and assembling the control module to control the die detection module to move to a detection point on a second line to detect each detection The point corresponding to the point.

Another object of the present invention is to provide a method for detecting a three-dimensional layout die, which is suitable for assembling a control module to control a die detection module and a substrate to detect a configuration on the substrate and having a plurality of a plurality of contacts of the three-dimensional layout die of the layer to be detected, comprising the steps of: assembling the control module to detect a first imaginary line passing through the contacts; assembling the control module to obtain a second angle, wherein the second angle is an angle of an acute angle of the first imaginary line intersecting a normal line of the waiting detection layer; the control module is assembled to control the substrate to rotate the second angle, The die detection module is perpendicular to the first imaginary line; and the control module is assembled to control the die detection module to move to a detection point on a second line to detect each detection point The corresponding contact.

Another object of the present invention is to provide a method for detecting a three-dimensional layout die, which is suitable for assembling a control module to control a die detection module and a substrate to detect a plurality of substrates disposed on the substrate. a three-dimensional layout die of the layer to be inspected is electrically connected to a conductive line of the wire, and each of the conductive points is electrically connected to a wire and the wire is electrically connected to the substrate, and the method comprises the steps of: assembling the control module to Setting a third line parallel to the wire; assembling the control module to obtain a second angle, and the second angle is a complementary angle of the acute angle between the third imaginary line and the normal line of the waiting detection layer The control module is configured to control the substrate to rotate the second angle to make the die detection module perpendicular to the first imaginary line; and the control module is configured to control a die detection module The second line moves up to each detection point to detect the contact point corresponding to each detection point.

Another object of the present invention is to provide a method for detecting a three-dimensional layout die, which is suitable for assembling a control module to control a die detection module to detect a configuration on the substrate and having a plurality of a three-dimensional layout die of the layer to be inspected is electrically connected to a conductive line of the wire, and each of the conductive points is electrically connected to a wire and the wire is electrically connected to the substrate, and the method comprises the steps of: assembling the control module to Setting a third line parallel to the wire; assembling the control module to obtain a first angle, and the first angle is a complementary angle of the acute angle between the third imaginary line and the normal line of the waiting detection layer The control module is configured to control the die detection module to rotate the second angle to make the die detection module perpendicular to the first imaginary line; and the control module is assembled to control a die detection The module moves to a detection point on a second line to detect the contact point corresponding to each detection point.

Therefore, the effect of the present invention is to properly rotate the die detection module or the substrate, such that the distance between the die detection module and each contact or each conduction point is between the die detection mode tissue imaging. Between the focal lengths, therefore, the die detection module does not need to refocus when detecting each contact or each conduction point, so the detection time can be greatly reduced, thereby greatly reducing the detection time of the three-dimensional layout die, and effectively Reduce inspection costs.

The details of the related patents and the technical contents of the present invention will be apparent from the following detailed description of the preferred embodiments of the drawings.

First preferred embodiment

Referring to FIG. 4 and FIG. 5, the preferred embodiment is applicable to a control module (not shown) for controlling a die detection module 9 or a substrate 6 to be rotated to detect a configuration on the substrate 6. A plurality of contacts t1 to t4 of the plurality of solid layout patterns 4 of the plurality of layers C1 to C4 to be detected, each of which is electrically connected to the substrate 6 and includes the following steps Step 51 is to assemble the control module to detect a first imaginary straight line T passing through the contact t1~t4 of the waiting detection layer C1~C4; step 52 is to assemble the control module to obtain a first an angle α, and the first angle [alpha] is calculated as follows: the first virtual straight line T and the waiting a detection layer normal line M C1 ~ C4 one acute angle of intersection θ, then the complementary angle of acute angle [theta] which is the The first angle α is set; the step 53 is to assemble the control module to control the die detecting module 9 to rotate the first angle α until it is perpendicular to the first imaginary straight line T, and at the same time, the die detecting module 9 Movably moving on a second imaginary line L1 parallel to the first imaginary line T (that is, the die detection module 9 is interposed Parallel lines L1, L2 move in parallel), and the distance between the first imaginary line T and the second imaginary line L1 is within an imaging focal length F of the die detecting module 9; step 54 is to combine the control The module is configured to control the die detecting module 9 to move to a detecting point S1 on the second imaginary line L1 to detect the corresponding layer C1 to be detected. It is worth noting that the detecting points S1 to S4 respectively correspond to For the contact points t1~t4, the distance d1~d4 of each detection point to the corresponding contact point is equal to the distance between the first imaginary straight line T and the second imaginary straight line L1; step 55 is to assemble the control module To determine whether each layer to be detected has been detected, and if so, the die contact detection process is terminated, if not, step 56 is performed; and step 56 is to assemble the control module to control the die detection module. 9 moves from the current detection point (eg: S1) to the next detection point (eg, S2) to detect the corresponding contact layer (eg, t2), and returns to step 55.

As can be seen from the above, since each of the detecting points S1 to S4 has the same distance from the corresponding contact point t1~t4, or the error range does not exceed the imaging focal length F of the die detecting module 9, the die The detection module 9 can effectively obtain a clear image of each contact without re-focusing when detecting each contact, thereby reducing the test time and test cost of the die.

Second preferred embodiment

Referring to FIG. 6 and FIG. 7 , the biggest difference between the preferred embodiment and the first preferred embodiment is that, in the first preferred embodiment, the control module controls the die detecting module 9 to rotate the first An angle α , and in the preferred embodiment, the control module controls the substrate 6 to rotate by a second angle β .

Step 51 is to assemble the control module to detect a first imaginary straight line T passing through one of the contacts t1~t4 of the waiting detection layer C1~C4; step 52' is to assemble the control module to obtain a the second angle β, the calculation of the second angle beta] as follows: the first virtual straight line T and the waiting a detection layer normal line of one of C1 ~ C4 M intersect at an acute angle θ, then the complementary angle of acute angle [theta] is the The second angle β ; the step 53' is to assemble the control module to control the substrate 6 to rotate the second angle β until the die detecting module 9 is perpendicular to the first imaginary straight line T, and at the same time, the crystal The particle detecting module 9 is movably movable on a second imaginary straight line L1 parallel to the first imaginary straight line T (that is, the die detecting module 9 is moved in parallel between the two parallel lines L1 and L2), The distance between the first imaginary line T and the second imaginary line L1 is within the imaging focal length F of the die detecting module 9; and the step 54 is to assemble the control module to control the die detecting module. 9 is moved to a detection point S1 on the second imaginary line L1 to detect the corresponding layer C1 to be detected. It is worth noting that the inspection The points S1 to S4 correspond to the contacts t1 to t4, respectively, and the distances d1 to d4 of each of the detection points to the corresponding contacts are equal to the distance between the first imaginary line T and the second imaginary line L1; The control module is assembled to determine whether each layer to be detected has been detected. If yes, the die contact detection process is terminated. If not, step 56 is performed; and step 56 is to assemble the control module to control The die detection module 9 moves from the current detection point (eg, S1) to the next detection point (eg, S2) to detect the contact of the corresponding layer to be detected (eg, t2), and returns to step 55. .

Third preferred embodiment

Referring to FIG. 8, the biggest difference between the preferred embodiment and the first and second preferred embodiments is that the control module cannot detect one of the contacts t1~t4 passing through the waiting detection layers C1~C4. When the first imaginary straight line T (that is, a first imaginary straight line T cannot be obtained such that it coincides with the contact point t1~t4 of each layer to be detected), the control module is based on a wire electrically connected to the substrate 6, H And setting a third imaginary line parallel to the wire, and the contacts t1~t4 of each layer to be detected C1~C4 are electrically connected to the wire H to a conduction point w1~w4, respectively, and thus similar to the first In a preferred embodiment, the control module can control the die detecting module 9 to rotate the first angle α , and the first angle α is the normal of the first imaginary straight line T and the waiting detection layer C1~C4. M intersects one of the acute angles θ, and then the complementary angle of the acute angle θ is the first angle α . Therefore, the die detecting module 9 is movably movable on a second imaginary line parallel to the first imaginary straight line T L1 movement (that is, the die detection module 9 moves parallel between the two parallel lines L1, L2) to detect each conduction point w1~w4 In addition, the first imaginary straight line and the distance T of the second virtual straight line L1 between the die within one module 9 detects a focal length of the imaging F.

Similarly, similar to the second preferred embodiment, the control module can control the substrate 6 to rotate the second angle β , and the second angle β is the first imaginary straight line T and the waiting detection layer C1~ The normal line M of C4 intersects one of the acute angles θ, and then the complementary angle of the acute angle θ is the second angle β . Therefore, the die detecting module 9 is movably parallel to the first imaginary straight line T. The second imaginary line L1 moves to detect each of the conduction points w1 to w4. Further, the distance between the first imaginary line T and the second imaginary line L1 is within an imaging focal length F of the die detecting module 9. .

In summary, the present invention is characterized in that the die detecting module or the substrate is appropriately rotated, so that the distance between the die detecting module and each contact or the conductive point is within the imaging focal length thereof. Therefore, the die detection module does not need to repeat the focus when detecting each contact or the conduction point, so the detection time of the die of the three-dimensional layout can be greatly reduced, thereby greatly reducing the detection cost of the die of the three-dimensional layout. The object of the invention can be achieved.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

4. . . Three-dimensional layout grain

51~56. . . step

52’~53’. . . step

6. . . Substrate

9. . . Grain inspection module

Figure 1 is a schematic view of a planar layout die;

2 is a schematic view of a three-dimensional layout die;

3 is a side view of a three-dimensional layout die and a die detection module;

Figure 4 is a flow chart of a first preferred embodiment of the present invention;

Figure 5 is a schematic view of the first preferred embodiment;

Figure 6 is a flow chart of a second preferred embodiment of the present invention;

Figure 7 is a schematic view of the second preferred embodiment; and

Figure 8 is a schematic illustration of a third preferred embodiment of the present invention.

51~56. . . step

Claims (10)

A method for detecting a three-dimensional layout die is suitable for assembling a control module to control a die detection module to detect a plurality of contacts of a three-dimensional layout die disposed on the substrate and having a plurality of to-be-detected layers The method includes the following steps: assembling the control module to detect a first imaginary line passing through the contacts; assembling the control module to obtain a first angle, and the first angle is the first An imaginary straight line intersecting a normal angle of the waiting detection layer with an acute angle; the control module is assembled to control the die detecting module to rotate the first angle, so that the die detecting module and the The first imaginary line is vertical; and the control module is configured to control the die detection module to move to a detection point on a second line to detect the contact point corresponding to each detection point. The method for detecting a three-dimensional layout die according to claim 1, wherein the contacts are respectively electrically connected to the substrate to be detected. The method for detecting a three-dimensional layout die according to claim 1, wherein the second line is parallel to the first imaginary line and the distance from the first imaginary line is between the die detection module One of the straight lines within the imaging focal length. A method for detecting a three-dimensional layout die is suitable for assembling a control module to control a die detection module and a substrate to detect a majority of a three-dimensional layout die disposed on the substrate and having a plurality of to-be-detected layers The contact includes the following steps: assembling the control module to detect a first imaginary line passing through the contacts; assembling the control module to obtain a second angle, and the second angle a corner of the acute angle intersecting the first imaginary line with a normal line of the waiting detection layer; the control module is assembled to control the substrate to rotate the second angle, so that the die detection module and the first An imaginary line is vertical; and the control module is configured to control the die detection module to move to a detection point on a second line to detect a contact point corresponding to each detection point. The method for detecting a three-dimensional layout die according to claim 4, wherein the contacts are respectively electrically connected to the substrate to be detected. The method for detecting a three-dimensional layout die according to claim 4, wherein the second line is parallel to the first imaginary line and the distance from the first imaginary line is between the die detection module One of the straight lines within the imaging focal length. A method for detecting a three-dimensional layout die is suitable for assembling a control module to control a die detection module and a substrate to detect a three-dimensional layout die disposed on the substrate and having a plurality of to-be-detected layers a conducting point of the electrical connection of the wire, and each of the conducting points is electrically connected to a wire and the wire is electrically connected to the substrate, and the method comprises the steps of: assembling the control module to set a third line parallel to the wire The control module is assembled to obtain a second angle, and the second angle is a complementary angle of the acute angle between the third imaginary straight line and the normal line of the waiting detection layer; the control module is assembled to control The substrate rotates the second angle to make the die detection module perpendicular to the first imaginary line; and the control module is configured to control a die detection module to move to a detection point on a second line To detect the contact point corresponding to each detection point. The method for detecting a three-dimensional layout die according to claim 7 , wherein the second line is parallel to the first imaginary line and the distance from the first imaginary line is between the die detection module One of the straight lines within the imaging focal length. A method for detecting a three-dimensional layout die is suitable for assembling a control module to control a die detection module to detect a three-dimensional layout die disposed on the substrate and having a plurality of to-be-detected layers electrically connected to a wire a conduction point, and each of the conduction points is electrically connected to a wire and the wire is electrically connected to the substrate, and the method comprises the steps of: assembling the control module to set a third line parallel to the wire; The control module is configured to obtain a first angle, and the first angle is a complementary angle of an acute angle between the third imaginary line and the normal line of the waiting detection layer; the control module is assembled to control the die The detecting module rotates the second angle to make the die detecting module perpendicular to the first imaginary line; and the control module is configured to control a die detecting module to move to a second straight line to each detecting Point to detect the contact point corresponding to each detection point. The method for detecting a three-dimensional layout die according to claim 9 , wherein the second line is parallel to the first imaginary line and the distance from the first imaginary line is between the die detection module One of the straight lines within the imaging focal length.