TWM339366U - Structure of a gluing machine - Google Patents

Structure of a gluing machine Download PDF

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Publication number
TWM339366U
TWM339366U TW97204838U TW97204838U TWM339366U TW M339366 U TWM339366 U TW M339366U TW 97204838 U TW97204838 U TW 97204838U TW 97204838 U TW97204838 U TW 97204838U TW M339366 U TWM339366 U TW M339366U
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Taiwan
Prior art keywords
injection
syringes
head
glue
dispenser
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Application number
TW97204838U
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Chinese (zh)
Inventor
Hung-Yueh Hwang
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Hung-Yueh Hwang
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Publication date
Application filed by Hung-Yueh Hwang filed Critical Hung-Yueh Hwang
Priority to TW97204838U priority Critical patent/TWM339366U/en
Publication of TWM339366U publication Critical patent/TWM339366U/en

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Description

M339366 八、新型說明: 【新型所屬之技術領域j •、糊作係有關—種點膠機結構,尤指-種能夠有效量 • ft、、且針筒庄膠動作完成後之膠面高度,藉以檢測注膠 罝疋否正確,並透過控制裝置將各組針筒調整到正確的出 -膠量,使後續進行點膠作業的料片得以達到應有的品質。 Φ 【先前技術】 酼著電子製造業技術的不斷進步,製造過程中各環節 的相關a備的速度及精密度需求逐漸提高,用來封裝電子 疋件的點膠設備亦隨之產生對應需求。例如,SMD型發光 二極體因為可以在製造過程當中,將金屬料片沖壓成型具 有複數個供做為SMD型發光二極體導線架的“部件,,,因 此適合利用自動設備對料片上呈矩陣排列的部件進行點 膠、晶粒封裝等加工製程。 修在既有的技術領域當中,習用自動點膠設備係經击控 制注膠頭的移動方式,透過注膠頭的單一針筒或複數組排 列針筒對每一個單位料片上的所有部件進行點膠動作。至 於’注膠頭的位移量、各組針筒的注膠時機及注膠量則受 ~ 控制裝置所設定的模式運作。 再者,習用點膠設備的每一次注膠動作,係讓同一注 膠頭的所有針筒依照相同的注膠時間或壓力控制其注膠 蓋’但每一組針筒的出膠流量難免有所差異,因此在相同 的注膠時間或相同的壓力作用之下,有些針筒的出膠量會 M339366 相對不足或超過,導致注入部件實際的膠量太低或太高。 就第一圖所示的發光二極體90而言,將會因為注入的膠 量91過低而產生實際出光偏藍的瑕疵品,或是注入的膠 ' 量91過高而產生實際出光偏黃的瑕疵品。 【新型内容】 有鑑於此,本創作之主要目的即在提供一種能夠有效 ‘ 量測每一組針筒注膠動作完成後之膠面高度,藉以檢測注 膠量是否正確,並透過控制裝置释各組針筒調整到正確的 i 出膠量,使後續進行點膠作業的料片得以達到應有的品 質。 為達上揭目的,本創作之點膠機結構係在注膠頭裝置 一或複數組針筒,每一組針筒處設有一或複數組感測元件 用以量測注膠動作完成後之膠面高度,並且由控制裝置對 每一個感測元件所回授的量測值與預設值進行比對,藉以 檢測每一組針筒的注膠量是否正常,以便透過改變針筒注 _膠時間或注膠壓力的方式控制各組針筒維持正常的出膠 量,確保後續進行點膠作業的料片得以達到應有的品質。 【實施方式】 為能使貴審查委員清楚本創作之結構組成,以及整 體運作方式,茲配合圖式說明如下: 請參閱第二圖本創作之點膠機結構外觀結構圖所 示,本創作之點膠機結構基本上係包括有:一個機台10、 M339366 一注膠頭20、一輸送組件30及一控制裝置(圖略);其中: 注膠頭20係相對設於機台10上方處,具有一組或複 數組呈排列狀的針筒21,並且於每一組針筒21處設有一 ‘ 利用雷射測距或電荷偶合原件影像感測器(CCD)影像輔助 - 量測的感測元件22用以量測完成注膠動作之後的膠面高 度(如第三圖及第四圖所示);於實施時,注膠頭20的針 筒21係可以配合料片50上橫向或縱向排列的部件51數 量,而採用如圖所示之四組針筒21排列,或是其他如六 ® 組針筒或八組針筒排列的方式配置;又,整體注膠頭20 係以如第二圖所示,配合相對與料片50水平、垂直位移 的方式對料片50上的部件51進行點膠動作。 上述輸送組件30,係用以運送料片50進出注膠頭20 的作業區域;至於,控制裝置係供設定注膠頭20移動速 度及出膠量等相關參數,以供整合相關組件之運作;如第 五圖所示,整體控制裝置40除了設有一記憶單元41供紀 錄注膠頭20各組針筒21所預設的動作參數(例如注膠時 鲁間或注膠壓力)之外,另設有一比對單元42供進行每一個 感測元件22所回授的量測值與預設值進行比對,藉以檢 . 測每一組針筒21的注膠料是否正常,以便透過改變針筒 _ 21注膠時間或注膠壓力的方式控制各組針筒21維持正常 的出膠量,確保後續進行點膠作業的料片得以達到應有的 品質。 據以,本創作之點膠機結構實際運作時,如第六圖或 第七圖所示,係在針筒點膠於料片部件時,同時由各組針 M339366 筒的感測元件量測實p 至控制裝置進行比對度’並且將測量夠值傳E 不作任何的調整動作’時’控制裝s 膠面過低時,其控制|置即=。果顯不貫際完成注㈣ 示)或以增加注膠堡力( =注H間(如第六 到正常的出膠量;反之,圖所不)的方式使針筒調勒M339366 VIII, new description: [New technology field j ·, paste system related - kind of glue machine structure, especially - the amount of effective amount of ft, and the size of the rubber surface after the completion of the syringe In order to detect whether the glue is correct or not, and adjust the set of syringes to the correct amount of glue through the control device, the material of the subsequent dispensing operation can achieve the desired quality. Φ [Prior Art] With the continuous advancement of electronics manufacturing technology, the speed and precision requirements of the various parts of the manufacturing process are gradually increasing, and the dispensing equipment used to package electronic components is also in need. For example, the SMD type light-emitting diode can be formed by stamping and forming a metal piece into a "component" of the SMD type light-emitting diode lead frame during the manufacturing process, so that it is suitable for using an automatic device for the material sheet. The components arranged in the matrix are processed by dispensing, die encapsulation, etc. In the existing technical field, the conventional automatic dispensing equipment is controlled by the movement of the injection molding head, through a single syringe or plural of the injection head. The group arranges the syringe to perform the dispensing action on all the components on each unit of the sheet. As for the displacement of the injection head, the timing of injection of each group of syringes and the amount of glue injected are operated by the mode set by the control device. Moreover, each injection operation of the conventional dispensing device is to control all the syringes of the same injection head according to the same injection time or pressure, but the flow rate of each group of syringes is inevitable. The difference is that under the same injection time or the same pressure, some of the syringes will have a relative amount of M339366 that is insufficient or exceeded, resulting in the actual amount of glue injected into the part being too low or too In the case of the light-emitting diode 90 shown in the first figure, the actual amount of the blue light will be generated because the injected amount of glue 91 is too low, or the injected glue '91 is too high to produce the actual light output. Yellow-colored products. [New content] In view of this, the main purpose of this creation is to provide a kind of rubber surface height that can effectively measure the completion of each group of syringe injection operations, so as to detect whether the injection amount is correct. And through the control device, each group of syringes is adjusted to the correct amount of glue, so that the material of the subsequent dispensing operation can achieve the desired quality. In order to achieve the goal, the glue dispenser structure of the creation is The glue head device is one or a plurality of array syringes, and each group of needle barrels is provided with one or a plurality of array sensing elements for measuring the rubber surface height after the glue injection operation is completed, and each control element is controlled by the control device. The feedback measurement value is compared with the preset value to check whether the injection amount of each group of syringes is normal, so as to control the groups of the syringes to maintain normality by changing the syringe injection time or the injection pressure. The amount of glue to ensure follow-up The material of the dispensing operation can achieve the quality it should be. [Embodiment] In order to enable the reviewing committee to understand the structure of the creation and the overall operation mode, please refer to the following diagram: Please refer to the second figure. The structure of the dispenser structure is shown in the figure. The structure of the dispenser of the present invention basically comprises: a machine table 10, an M339366 injection molding head 20, a conveying assembly 30 and a control device (not shown); The glue injection head 20 is oppositely disposed above the machine table 10, and has a pair or a plurality of arrays of needles 21 arranged in a row, and a laser beam or charge coupling original is disposed at each group of the needle cylinders 21 Image sensor (CCD) image assisted - The measured sensing element 22 is used to measure the height of the rubber surface after the completion of the injection operation (as shown in the third and fourth figures); in practice, the injection head The syringe 21 of 20 can be matched with the number of members 51 arranged laterally or longitudinally on the web 50, and arranged in four sets of syringes 21 as shown, or other such as a six-group syringe or eight sets of syringes. Way of configuration; again, the overall injection head 20 is As shown, with the opposite horizontal web 50, vertical displacement of member 51 in the embodiment of web 50 for dispensing a second operation in FIG. The conveying assembly 30 is configured to transport the material 50 into and out of the working area of the rubberizing head 20; as a result, the control device is configured to set relevant parameters such as the moving speed and the amount of glue of the rubberizing head 20 for integrating the operation of the related components; As shown in the fifth figure, the overall control device 40 is provided with a memory unit 41 for recording the preset operating parameters of each group of syringes 21 of the glue injection head 20 (for example, the lug or glue injection pressure during the injection). A comparison unit 42 is provided for comparing the measured values fed back by each of the sensing elements 22 with the preset values, thereby checking whether the glue of each group of the syringes 21 is normal, so as to change the needles. The barrel _ 21 injection time or the injection pressure mode controls each group of syringes 21 to maintain a normal amount of glue, ensuring that the material of the subsequent dispensing operation can achieve the desired quality. According to the actual operation of the dispenser mechanism of the present invention, as shown in the sixth or seventh figure, when the syringe is dispensed to the material component, the sensing components of each group of needles M339366 are simultaneously measured. When the real p is to the control device to perform the 'degree of comparison' and the measured value is transmitted without any adjustment action 'when the control device s is too low, its control | is set to =. If the injection is not completed (4), or by increasing the glue injection force (=Note H (such as the sixth to the normal amount of glue; otherwise, the figure does not) to make the syringe

所示)或以降低注膠壓力:縮短注膠時間(如第六阁 整到正常的出膠量。 圖所不)的方式使 如上所述,本創作挺 i 依法提呈新料利之申請結構’ 示,係本創作較佳實施例者,並非以此偈貝^本兄^圖曰式 舉凡與本創作之構造、裝置、特徵等近似、^作者;^ 屬本創作之創設目的及申請專利範圍之内。 : 【圖式簡單說明】 第一圖係為發光二極體完成注膠後之膠面高度差異示意 圖。 ^ 第二圖係為本創作之點膠機結構外觀結構圖。 弟二圖係為本創作中注膠頭之外觀結構圖。 第四圖係為本創作中注膠頭之結構側視圖。 第五圖係為本創作中控制裝置之組成架構方塊示意圖。 第六圖係為本創作第一實施例之動作流程圖。 第七圖係為本創作第二貫施例之動作流程圖。 M339366 【主要元件代表符號說明】 10機台 _ 20注膠頭 • 21針筒 22感測元件 3 0輸送組件 40控制裝置 ’ 41記憶單元 42比對單元 50料片 51部件 90發光二極體 91膠量Show) or to reduce the injection pressure: shorten the injection time (such as the sixth cabinet to the normal amount of glue. The figure does not) so that as described above, this creation is quite a legal basis for the application of new materials ' Show, is the preferred embodiment of this creation, not the 偈 ^ ^ 本 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ Within the scope. : [Simple description of the diagram] The first figure is a schematic diagram of the difference in the height of the rubber surface after the injection of the LED. ^ The second picture shows the structure of the structure of the dispenser. The second figure of the brother is the appearance structure diagram of the plastic injection head in the creation. The fourth picture is a side view of the structure of the injection head in the creation. The fifth figure is a block diagram of the composition of the control device in this creation. The sixth figure is a flow chart of the action of the first embodiment of the creation. The seventh picture is the action flow chart of the second embodiment of the creation. M339366 [Main component representative symbol description] 10 machine _ 20 injection head • 21 syringe 22 sensing element 3 0 conveying unit 40 control device '41 memory unit 42 aligning unit 50 chip 51 part 90 light emitting diode 91 Glue amount

Claims (1)

M339366 九、申請專利範圍: 1、 一種點膠機結構,係包括有: 一機台; _ 一注膠頭,相對設於機台上方處,具有至少一組針筒, 每一組針筒處設有一或複數組感測元件用以量測完成注膠 ' 動作之後的膠面高度; - 一控制裝置,供設定注膠頭移動速度及出膠量等相關 參數,以及整合注膠頭之運作;以及對每一個感測元件所 Φ 回授的量測值與預設值進行比對,藉以檢測每一組針筒的 注膠料是否正確,並配合控制各組針筒維持正確的出膠量。 2、 如請求項1所述之點膠機結構,其中該注膠頭係 配合相對與料片水平、垂直位移的方式對料片上的部件進 行點膠動作。 3、 如請求項1或2所述之點膠機結構,其中該注膠 頭係具有四組呈排列狀的針筒。 : 4、 如請求項1或2所述之點膠機結構,其中該注膠 I 頭係具有六組呈排列狀的針筒。 5、 如請求項1或2所述之點膠機結構,其中該注膠 頭係具有八組呈排列狀的針筒。 ' 6、如請求項1所述之點膠機結構,其中各該感測元 件係利用雷射測距或以電荷偶合原件影像感測器(CCD)影 像輔助量測膠面的高度。 7、如請求項1所述之點膠機結構,其中該控制裝置 係設有一記憶單元供紀錄注膠頭各組針筒所預設的動作參 M339366 數’以及設有-比對單元供進行每—㈣測元件所回授的 量測值與預設值進行比對。 8、如請求項1或7所述之點膠機結構 中該控制 —··— 口 丹 1 H- 裝置係以改變注膠時間的方式調整針筒的注旦 9、如請求項W7所述之點膠機結構;^中 裝置係以改變注膠勤的方式調整針筒的注膠量。工制 1 0、如請求項1所述之點膠機結構,^ “M339366 Nine, the scope of application for patents: 1. A dispensing machine structure, including: a machine table; _ a plastic injection head, oppositely located above the machine table, having at least one set of syringes, each set of syringes A one- or multi-array sensing element is provided for measuring the height of the rubber surface after the completion of the injection molding operation; - a control device for setting the movement speed of the injection molding head and the amount of glue to be dispensed, and the operation of the integrated injection head And comparing the measured value of Φ feedback of each sensing component with the preset value, thereby detecting whether the glued material of each group of syringes is correct, and controlling the each group of syringes to maintain the correct dispensing the amount. 2. The dispenser structure of claim 1, wherein the glue head is adapted to dispense the components on the web in a manner that is horizontal and vertical relative to the web. 3. The dispenser structure of claim 1 or 2, wherein the glue injection head has four sets of arranged syringes. 4. The dispenser structure of claim 1 or 2, wherein the glue injection I head has six sets of arranged syringes. 5. The dispenser structure of claim 1 or 2, wherein the glue injection head has eight sets of arranged syringes. 6. The dispenser structure of claim 1, wherein each of the sensing elements measures the height of the rubber surface using a laser ranging or a charge coupled original image sensor (CCD) image. 7. The dispenser structure according to claim 1, wherein the control device is provided with a memory unit for recording the preset movement parameter M339366 of each group of syringes of the injection head and the setting-comparison unit for performing The measured value returned by each (four) measuring component is compared with the preset value. 8. The control in the dispenser structure of claim 1 or 7, wherein the mouth 1 H-device adjusts the injection of the syringe in a manner that changes the time of injection, as described in claim W7. The dispensing machine structure; the middle device adjusts the injection amount of the syringe by changing the manner of injection molding. System 1 0. The structure of the dispenser as described in claim 1, ^" 有-輸送組件,用以運送料片進出注膠頭㈣^域y又There is a transport component for transporting the material into and out of the injection head (4)
TW97204838U 2008-03-21 2008-03-21 Structure of a gluing machine TWM339366U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI408007B (en) * 2009-11-05 2013-09-11 Hung Yueh Hwang Dispenser feedback control system and feedback control method
TWI459596B (en) * 2011-02-14 2014-11-01 Advanced Optoelectronic Tech Dispenser manufacturing method of the led package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI408007B (en) * 2009-11-05 2013-09-11 Hung Yueh Hwang Dispenser feedback control system and feedback control method
TWI459596B (en) * 2011-02-14 2014-11-01 Advanced Optoelectronic Tech Dispenser manufacturing method of the led package

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