TW201233280A - Chemical palladium-gold plating film method - Google Patents

Chemical palladium-gold plating film method Download PDF

Info

Publication number
TW201233280A
TW201233280A TW100102661A TW100102661A TW201233280A TW 201233280 A TW201233280 A TW 201233280A TW 100102661 A TW100102661 A TW 100102661A TW 100102661 A TW100102661 A TW 100102661A TW 201233280 A TW201233280 A TW 201233280A
Authority
TW
Taiwan
Prior art keywords
layer
replacement
palladium
gold
reduction
Prior art date
Application number
TW100102661A
Other languages
English (en)
Chinese (zh)
Other versions
TWI409015B (enExample
Inventor
Ming-Hong Lin
Kun-Zheng Liu
Ying-Jie Li
guo-bin Qiu
Original Assignee
Taiwan Uyemura Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Uyemura Co Ltd filed Critical Taiwan Uyemura Co Ltd
Priority to TW100102661A priority Critical patent/TW201233280A/zh
Priority to CN2011101925171A priority patent/CN102605359A/zh
Priority to JP2011229483A priority patent/JP2012153974A/ja
Priority to US13/326,370 priority patent/US20120186852A1/en
Priority to KR1020120005470A priority patent/KR20120086253A/ko
Publication of TW201233280A publication Critical patent/TW201233280A/zh
Application granted granted Critical
Publication of TWI409015B publication Critical patent/TWI409015B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/019—Manufacture or treatment of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/522—Multilayered bond wires, e.g. having a coating concentric around a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu

Landscapes

  • Chemically Coating (AREA)
  • Wire Bonding (AREA)
  • Electroplating Methods And Accessories (AREA)
TW100102661A 2011-01-25 2011-01-25 Chemical palladium-gold plating film method TW201233280A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
TW100102661A TW201233280A (en) 2011-01-25 2011-01-25 Chemical palladium-gold plating film method
CN2011101925171A CN102605359A (zh) 2011-01-25 2011-06-28 化学钯金镀膜结构及其制作方法、铜线或钯铜线接合的钯金镀膜封装结构及其封装工艺
JP2011229483A JP2012153974A (ja) 2011-01-25 2011-10-19 化学パラジウム／金めっき皮膜構造及びその製造方法、銅線またはパラジウム／銅線で接合されたパラジウム／金めっき皮膜パッケージ構造及びそのパッケージプロセス
US13/326,370 US20120186852A1 (en) 2011-01-25 2011-12-15 Structure of electrolessly palladium and gold plated films and process for making the same, assembled structure of palladium and gold plated films bonded with copper or copper-palladium wire and assembling process therefore
KR1020120005470A KR20120086253A (ko) 2011-01-25 2012-01-18 무전해 팔라듐 및 금 도금 필름의 구조 및 이의 제조방법, 구리 또는 구리-팔라듐 와이어가 결합된 팔라듐 및 금 도금 필름의 조립구조 및 이의 조립방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW100102661A TW201233280A (en) 2011-01-25 2011-01-25 Chemical palladium-gold plating film method

Publications (2)

Publication Number Publication Date
TW201233280A true TW201233280A (en) 2012-08-01
TWI409015B TWI409015B (enExample) 2013-09-11

Family

ID=47069856

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100102661A TW201233280A (en) 2011-01-25 2011-01-25 Chemical palladium-gold plating film method

Country Status (1)

Country Link
TW (1) TW201233280A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI560317B (enExample) * 2015-04-10 2016-12-01
US9591753B2 (en) 2015-07-09 2017-03-07 Subtron Technology Co., Ltd. Circuit board and manufacturing method thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI251920B (en) * 2003-10-17 2006-03-21 Phoenix Prec Technology Corp Circuit barrier structure of semiconductor package substrate and method for fabricating the same
JP4379413B2 (ja) * 2005-12-06 2009-12-09 セイコーエプソン株式会社 電子部品、電子部品の製造方法、回路基板及び電子機器
JP5297083B2 (ja) * 2007-07-17 2013-09-25 新光電気工業株式会社 はんだバンプ形成方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI560317B (enExample) * 2015-04-10 2016-12-01
US9591753B2 (en) 2015-07-09 2017-03-07 Subtron Technology Co., Ltd. Circuit board and manufacturing method thereof

Also Published As

Publication number Publication date
TWI409015B (enExample) 2013-09-11

Similar Documents

Publication Publication Date Title
TW200417B (enExample)
JP2012153974A (ja) 化学パラジウム／金めっき皮膜構造及びその製造方法、銅線またはパラジウム／銅線で接合されたパラジウム／金めっき皮膜パッケージ構造及びそのパッケージプロセス
TW200302261A (en) Bonded member comprising different materials, and production method thereof
CN101379618A (zh) 具有改进的焊料接合的半导体装置
JPH02119153A (ja) 集積回路用ボンディング方法
TWI508234B (zh) Airtight sealing cover and electronic parts storage box
JP4062907B2 (ja) 回路基板およびその製造方法
CN109449087A (zh) 一种铜镀钯再镀镍键合丝及其制备方法
TW200908264A (en) Package substrate having electrical connection structure and method for fabricating the same
JPWO2006117961A1 (ja) 半導体パッケージ及びその製造方法
TW201309843A (zh) 薄鎳－鈀－金鍍層，帶有導線的此鍍層所成封裝結構以及彼等之製作方法
TW201039420A (en) Chip package structure and manufacturing method thereof
CN105575929B (zh) 电性连接结构及其制备方法
CN109741915A (zh) 一种金属化磁芯及其制备方法和贴片电感
TW455965B (en) Method for forming solder bumpers on IC package substrate and structure formed by the same
TW444253B (en) Semiconductor device and method of producing the same
KR100378489B1 (ko) 은 또는 은 합금도금을 이용한 반도체 패키지용 리드프레임 및 그 제조방법
CN100508173C (zh) 用于半导体封装的引线框及其生产方法
JPH02276249A (ja) 半導体回路バンプの製造方法
TW201134599A (en) Bond pad protection layer structure and manufacturing method thereof
TWI303147B (en) Method for forming a wiring on a soft polymer substrate
TW517315B (en) Ag-pre-plated lead frame for semiconductor package
TW201013875A (en) Circuit board and process thereof
JPH11111774A (ja) ハンダバンプによる電極接続方法及びハンダバンプ作成方法
CN202839591U (zh) 驱动ic封装凸块及封装结构

Legal Events

Date Code Title Description
MC4A Revocation of granted patent