TW201229248A - Electrical and electronic material - Google Patents

Electrical and electronic material Download PDF

Info

Publication number
TW201229248A
TW201229248A TW100142655A TW100142655A TW201229248A TW 201229248 A TW201229248 A TW 201229248A TW 100142655 A TW100142655 A TW 100142655A TW 100142655 A TW100142655 A TW 100142655A TW 201229248 A TW201229248 A TW 201229248A
Authority
TW
Taiwan
Prior art keywords
mass
alloy
hardness
bending
weight percent
Prior art date
Application number
TW100142655A
Other languages
English (en)
Chinese (zh)
Inventor
Ryu Shishino
Kenichiro Miyamoto
Original Assignee
Tokuriki Honten Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokuriki Honten Kk filed Critical Tokuriki Honten Kk
Publication of TW201229248A publication Critical patent/TW201229248A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • C22C5/08—Alloys based on silver with copper as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/04—Alloys based on a platinum group metal
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/14—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Contacts (AREA)
TW100142655A 2010-12-09 2011-11-22 Electrical and electronic material TW201229248A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010275103 2010-12-09

Publications (1)

Publication Number Publication Date
TW201229248A true TW201229248A (en) 2012-07-16

Family

ID=46206884

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100142655A TW201229248A (en) 2010-12-09 2011-11-22 Electrical and electronic material

Country Status (6)

Country Link
US (1) US20130292008A1 (ja)
JP (1) JPWO2012077378A1 (ja)
KR (1) KR20140001931A (ja)
CN (1) CN103249852A (ja)
TW (1) TW201229248A (ja)
WO (1) WO2012077378A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI600773B (zh) * 2012-09-28 2017-10-01 德力本店股份有限公司 電氣、電子機器用途之Ａｇ－Ｐｄ－Ｃｕ－Ｃｏ合金

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5767484B2 (ja) * 2011-02-01 2015-08-19 ササキジェム株式会社 銀ベース合金
KR20140113920A (ko) * 2011-12-27 2014-09-25 가부시키가이샤 토쿠리키 혼텐 전기·전자기기용 Pd 합금
SG10201610940SA (en) * 2012-08-03 2017-02-27 Yamamoto Precious Metal Co Ltd Alloy material, contact probe, and connection terminal
CN104646846B (zh) * 2013-11-21 2017-09-26 北京有色金属与稀土应用研究所 银铜钯金合金丝状钎料及其制备方法
DE102014214683A1 (de) * 2014-07-25 2016-01-28 Heraeus Deutschland GmbH & Co. KG Sputtertarget auf der Basis einer Silberlegierung
JP6647075B2 (ja) * 2016-02-19 2020-02-14 日本発條株式会社 合金材料、コンタクトプローブおよび接続端子
WO2019130511A1 (ja) * 2017-12-27 2019-07-04 株式会社徳力本店 析出硬化型Ａｇ－Ｐｄ－Ｃｕ－Ｉｎ－Ｂ系合金
CN113166848B (zh) * 2018-11-30 2024-02-06 田中贵金属工业株式会社 耐磨损性和耐热性优良的导电材料
CN110983147B (zh) * 2019-12-20 2021-05-11 有研亿金新材料有限公司 一种高强度钯基弱电接触材料及其制备方法
JP7072126B1 (ja) 2022-02-10 2022-05-19 田中貴金属工業株式会社 Ａｇ－Ｐｄ－Ｃｕ系合金からなるプローブピン用材料
JP2024037196A (ja) * 2022-09-07 2024-03-19 石福金属興業株式会社 プローブピン用合金材料
JP2024037261A (ja) * 2022-09-07 2024-03-19 株式会社ヨコオ プローブ

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5776706A (en) * 1980-10-30 1982-05-13 Shinko Electric Ind Co Method of producing electric contact piece
JPS5967354A (ja) * 1982-10-07 1984-04-17 Tanaka Kikinzoku Kogyo Kk 刷子用摺動接点材料
JPS5967355A (ja) * 1982-10-07 1984-04-17 Tanaka Kikinzoku Kogyo Kk 刷子用摺動接点材料
JPS5970740A (ja) * 1982-10-15 1984-04-21 Tanaka Kikinzoku Kogyo Kk 刷子用摺動接点材料
JPS5970737A (ja) * 1982-10-15 1984-04-21 Tanaka Kikinzoku Kogyo Kk 摺動接点材料
US5484569A (en) * 1994-08-12 1996-01-16 The J. M. Ney Company Silver palladium alloy
US5833774A (en) * 1997-04-10 1998-11-10 The J. M. Ney Company High strength silver palladium alloy
JP3196176B2 (ja) * 1998-08-24 2001-08-06 日本電子材料株式会社 異種金属接合プローブの製造方法
JP2007271472A (ja) * 2006-03-31 2007-10-18 Kanai Hiroaki 異種金属接合型プローブピンとその製造方法
JP4176133B1 (ja) * 2007-06-06 2008-11-05 田中貴金属工業株式会社 プローブピン
JP5657881B2 (ja) * 2009-12-09 2015-01-21 株式会社徳力本店 プローブピン用材料

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI600773B (zh) * 2012-09-28 2017-10-01 德力本店股份有限公司 電氣、電子機器用途之Ａｇ－Ｐｄ－Ｃｕ－Ｃｏ合金

Also Published As

Publication number Publication date
US20130292008A1 (en) 2013-11-07
JPWO2012077378A1 (ja) 2014-05-19
CN103249852A (zh) 2013-08-14
WO2012077378A1 (ja) 2012-06-14
KR20140001931A (ko) 2014-01-07

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