TW201221845A - Insulated LED device - Google Patents
Insulated LED device Download PDFInfo
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- TW201221845A TW201221845A TW100128335A TW100128335A TW201221845A TW 201221845 A TW201221845 A TW 201221845A TW 100128335 A TW100128335 A TW 100128335A TW 100128335 A TW100128335 A TW 100128335A TW 201221845 A TW201221845 A TW 201221845A
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- emitting diode
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/56—Cooling arrangements using liquid coolants
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V15/00—Protecting lighting devices from damage
- F21V15/01—Housings, e.g. material or assembling of housing parts
- F21V15/013—Housings, e.g. material or assembling of housing parts the housing being an extrusion
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V15/00—Protecting lighting devices from damage
- F21V15/01—Housings, e.g. material or assembling of housing parts
- F21V15/015—Devices for covering joints between adjacent lighting devices; End coverings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/56—Cooling arrangements using liquid coolants
- F21V29/58—Cooling arrangements using liquid coolants characterised by the coolants
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/75—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Securing Globes, Refractors, Reflectors Or The Like (AREA)
Description
201221845 六、發明說明: ~ 【相關申請案交又參照】 本申請案根據35 U.S.C.§ 119(e)主張於2010年8月9曰提出申 請之美國臨時申請案第61/372,060號之優先權,該美國臨時申請 案以引用方式併入本文中。 【發明所屬之技術領域】 本發明係關於發光二極體,且具體而言,本發明係關於一種冷 卻一使用發光二極體之裝置之方法,該等發光二極體係用於產I 及射出輻射。 【先前技術】 雖然發光-極體在產生用於工業用途(例如紫外光(UV )聚合 之印刷油墨及塗層)之転射方面係為—重大改良,然該等裝置會 產生大量熱量。假若不自利用發光二極體之裝置中散失或移除此 等熱量,此等熱量可使任何反射表面畸變並可嚴重地損壞發光二 極體本身。因此,需要提供-種高效且結構簡單之設計以自利用 發光二極體之裝置移除不需要之熱量。 【發明内容】 本發明藉由為發光二極體裝置提供—種用於自運作中之發光二 極體裝置移除熱量的結構簡單但高效之結構,而實質上滿足上述 工業需求。 本發明提供一種發光二極體裝置,咕 5亥發光二極體裝置包含一發 光二極體總成、複數個冷卻橋、一耑勒 1 ^ 欢熱片、一反射器罩、一侧罩、 4 201221845 反射益、以及連接器及跨接端帽。該發光二極體總成可包含複 數個發光二極體晶片。該等冷卻橋可附裝至或鄰接該散熱片。該 反射器可由該反射器草予以定位,用以引導來自該發光二極體總 成之転射。5亥等連接器及跨接端帽可包含—電隔絕或熱隔絕材料。 本發明亦提供-種製造一發光二極體裝置之方法,該方法包含 1)附裝複數個冷卻橋至-水冑,該水道具有一對沿軸向形成之通 道;2)定位一反射器,以引導自該等發光二極體晶片發出之輻射; 以及3)附裝一連接端帽及一跨接端帽至該水道,以形成一流體迴 路。 本發明亦提供一種冷卻一發光二極體裝置之方法,該發光二極 體裝置具有.一發光二極體陣列;一反射器,用於引導自該發光 一極體陣列發出之輻射;一水道,附裝至或鄰接該發光二極體陣 列,該水道亦附裝至或鄰接該冷卻橋,該方法包含:在形成於該 水道中之複數軸向通道内循環一冷卻劑。 結合附圖閱讀以下說明,本發明之該等及其他特徵將變得一目 了缺。 4 ”、、 【實施方式】 除非另有規定,否則本文中所用之所有科技術語皆具有與本發 明所屬技術領域中具有通常知識者所通常瞭解之含義相同之含 義。下文將對適宜之方法及材料予以說明,但亦可使用類似於或 等效於本文所述者之方法及材料來實踐本發明。本文所提及之所 有出版物、專利申請案、專利及其他參考文獻皆以引用方式全文 併入本文中。當存在衝突時,應以本說明書(包括定義在内)為 5 201221845 ' 準。另外,該等材料、方法及實例僅為例示性而非限制性的。 任何所提及之相對性術語(例如「前」及「後」、「左」及「右」、 「頂部」及「底部」、「上」及「下」、「水平的」及「垂直的」)皆 旨在便於說明,而非意欲將本發明或其組件限定至任一位置或空 間取向。在不背離本發明之範圍之情形下,附圖中各組件之尺寸 可隨本發明之實施例之一潛在設計及預期用途而變化。 本文中所揭示之各該額外特徵及方法可單獨使用或與其他特徵 及方法聯合使用,以提供本發明之改良裝置以及製造及使用該等 裝置之方法。現在將參照附圖詳細說明本發明之教示之代表性實 例,該等實例聯合利用許多此等額外特徵及方法。此詳細說明僅 旨在教示熟習此項技術者關於實踐本教示内容之較佳態樣之詳 情,而非意欲限制本發明之範圍。因而,以下詳細說明中所揭示 之特徵及方法之組合對於實踐本發明而言並非必不可少,且教示 該等特徵及方法之組合僅旨在具體闡述本發明之代表性及較佳實 施例。 本發明之一隔絕式發光二極體裝置之一實施例在附圖中以編號 100繪示,且包含一光引擎(例如一發光二極體總成102)、複數 個冷卻橋104、一散熱片(例如一水道106)、一反射器罩108、一 側罩110、一連接端帽總成112、及一跨接端帽總成114。此項技 術中之通常知識者將易知,發光二極體總成102含有支撐於一銅 板124上之複數個發光二極體晶片122。本發明中可存在發光二極 體總成102之若干組態及材料。 在所繪示之實施例中,水道106可由例如鋁等熱傳導材料製成。 6 201221845 然而,此項技術中之通'常知識者將易知其他可接受的用於製造本 發明之水道之材料。當連接至發光二極體總成102以及水道ι〇6 時’該等冷卻橋104用以傳導來自發光二極體總成1〇2之熱量並 用以定位發光二極體總成102,以引導自本發明之發光二極體總成 發出之幸备射。複數個韓片式通道(finned channel ) 132、134可沿 軸向界定於水道106中。鄰近各別通道132、134而形成之鰭片(πη) 136、138可增大鄰近通道132、134之水道106之表面積,藉此在 一冷卻劑循環穿過通道132、134時更高效地自水道106提取熱 量。如此循環之該冷卻劑可係為一液體或一氣體。適宜之液體包 括水、聚乙二醇-水溶液、液化氮等等。適宜之氣體則包括冷卻之 大氣。 一端子板(terminal block) 144可用以將各光引擎段跨接於一 起,或用以對光引擎予以分組,俾使該等光引擎其中之一或多者 可獨立於其他光引擎而受到控制,且端子板144可附裝至冷卻橋 之一底側及/或附裝至反射器罩。端子板能達成光引擎與外部電源 間之熱隔絕及電隔絕連接。 反射器罩108具有一外部部分(outer portion) 150及自外部部 分150延伸之複數内部凸角(inner lobe ) 152。外部部分150在一 通道153處附裝至一唇形結構154 ’唇形結構154形成一軸向狹槽 155。一狹槽156形成於外部部分150之一下部部分(lower Portion) 處。另一狹槽160向内側開口而形成於外部部分150之一下部位 置。狹槽155、156被定位成可容納一反射器162。反射器162藉 由在邊緣處設置於狹槽155、156内並藉由貼靠凸角152而維持一 201221845 期望之位置及組態。 側罩110於一通道170處附裝至或接觸水道106。側罩110向上 終止於一延伸部(extensi〇n) 172處’並向下終止於一狹槽174處。 延伸部172設置於反射器罩108之狹槽158内。然而’此項技術 中之通常知識者將認識到’延伸部170及狹槽158可分別存在於 反射器罩108及侧罩11〇上。側罩110之狹槽174與反射器罩108 之狹槽106協調容納及定位一視窗180。 視窗180可選自使所期望之輻射波長能夠穿過之材料,例如一 丙稀酸樹脂或此項技術中之通常知識者所易知之其他材料。 連接端帽總成112具有一連接端帽190及一連接隔絕板 (connection insulator block) 192。連接端帽190係固定至反射器 罩108及側罩110並用以定位反射器罩108及侧罩110。連接隔絕 板192係由例如乙醯基聚合物(aCetyl polymer )等電隔絕材料製 成,DelranTM即為一種適宜之材料。然而,此項技術中之通常知 識者將易知,亦可使用其他適宜之材料。複數管接頭(fitting) i94 可附裝至連接隔絕板192,以連接至冷卻劑源並使冷卻劑可進出水 道106。應認識到’管接頭194將根據所用冷卻劑以及所冷卻及維 持之水道106之狀態而異。 跨接端帽總成114包含一跨接端帽2〇〇及一連接隔絕板2〇2<>跨 接端巾s 200界定一狹槽2〇4,狹槽2〇4容納並定位連接隔絕板2〇2。 該連接隔絕板可如針對隔絕板192所述由Delran™或另一具有適 當隔絕性之材料製成。連接隔絕板2〇2界定一狹槽2〇6,狹槽2〇6 之尺寸及位置被確定成可將流出通道 132、134其中之一之冷卻劑 201221845 引導至該等通道其中之另一者,藉此為本發明之發光二極體裝置 100提供及接通一冷卻劑迴路。Ο形圈(圖未示出)於通道132、 134之各開口處之存在可有助於達成不漏流體之密封。該隔絕板之 一功能在於,使本發光二極體裝置中除發光二極體總成102、冷卻 橋104、水道106以及反射器罩1〇8及側罩110之外之其餘部分不 被冷卻,藉此可更高效地冷卻需要維持於一期望溫度之本發明組 件0 一可選導管206可含有電線,以對發光二極體總成102供電。 導管206 (若存在)亦可對發光二極體裝置100提供支撐及錨固作 用。雖然圖中未示出,但此項技術中之通常知識者將知,可存在 一可操作之冷卻劑供應裝置,用以提供循環冷卻劑至水道1〇6及 自水道106接收循環冷卻劑。該冷卻劑供應裝置將根據例如所用 冷卻劑以及所期望之冷卻劑溫度及流速等而異。 來自反射器罩108、側罩110以及水道1〇6之熱接觸22〇、222、 似係藉由該等部件分別與冷卻橋1〇4間之貼靠接觸而達成。一定 比之輕射月匕里(例如熱里)被受輕射之擠壓件(加⑽如)(罩 1〇6、1〇8)及反射器i62吸 ,、 叹進而造成該等外部擠壓件之非所 欲之加熱。本發明之冷卻橋1〇4 旦 4因而提供一路徑,將非所欲之埶 =反射器罩⑽及側罩110經由冷卻橋1〇6傳導至水道1〇6(: 為—散熱片),藉此降低該等外部擠壓件之溫度。 ” 冷卻橋104亦藉由將用以支# 明發1Λ *⑽^ 162之該等_件沿本發 月赞先—極體裝置1〇〇之長 1ΠΛ X在右干位置處精確地連結至水道 6而提供輻射源(發光二極辦曰 聪曰曰片I22)與反矽器I62間之均勻 201221845 ~光學對齊。 一個適宜之發光二極體總成具有複數個發光二極體晶片102,安 裝至一耐熱且具電隔絕性之樹脂(例如非晶形熱塑性聚醚醯亞胺 (polyethermide ))。一種適宜之此聚醚醯亞胺係為Ultem® (沙特 基礎創新塑膠部(SABIC Innovative Plastics)製造)。該耐熱樹脂 係安裝或黏結至一導熱性但電隔絕性樹脂(例如SARCON®),該 導熱性但電隔絕性樹脂則黏結或連接至一導熱性及導電性板124 (例如銅或紹)。 除以上所揭示者外,其他適宜之聚合物或合成樹脂揭示並闡述 於由Charles a Harper主編之「塑膠、彈性體與複合材料手冊」第 3 版(Handbook of Plastics, Elastomers, and Composites, Third Edition, Charles a Harper, Editor-in-Chief, McGraw-Hill New York (1996))中’該參考文獻以引用方式全文併入本文中。 此項技術中之通常知識者將易知,在不背離本發明之精神及範 圍之條件下,本發明之各實施例中所示之各組件在一定程度上可 以互換並可於其他實施例中添加或互換各組件。 由於可在不背離本發明之精神之條件下對本發明作出諸多修 改,故本發明之範圍並不限於所示及所述之實施例。而是,本發 明之範圍係由隨㈣請專利範圍以及其等效内容加以限定。 【圖式簡單說明】 第1圖係為本發明之隔絕式發光二極體裝置之—實施例之透視 圖。 10 201221845 第2圖係為第1圖之隔絕式發光二極體裝置之分解圖。 第3圖係為第1圖之隔絕式發光二極體裝置之側視圖。 第4圖係為沿第3圖之線A-A截取之剖視圖。 應理解,上述圖式僅用以例示本發明,而非意欲限制本發明之 範圍。 【主要元件符號說明】 100 :發光二極體裝置 102 :發光二極體總成 104 :冷卻橋 106 :水道 108 :反射器罩 110 :側罩 112 :連接端帽總成 114 :跨接端帽總成 122 :發光二極體晶片 124 :板 132 :通道 134 :通道 136 :鰭片 138 :鰭片 144 :端子板 150 :外部部分 152 :内部凸角 153 :通道 154 :唇形結構 155 :狹槽 156 :狹槽 158 :狹槽 60 :狹槽 162 :反射器 170 :通道 172 :延伸部 201221845 174 :狹槽 180 :視窗 190 :連接端帽 192 :連接隔絕板 194 :管接頭 200 :跨接端帽 202 :連接隔絕板 204 :狹槽 206 :狹槽 210 :導管 220 :熱接觸 222 :熱接觸 224 :熱接觸 12
Claims (1)
- 201221845 七、申請專利範圍: 1. 一種發光二極體(LED)裝置,包含: 一發光二極體總成; 複數個熱傳導冷卻橋(cooling bridge); 一散熱片(heat sink ),附裝至該等冷卻橋; 一反射器(reflector),由一反射器罩(reflector cover) 予以定位,用以引導來自該發光二極體總成之輻射;以及 連接器及跨接端帽。 2. 如請求項1所述之發光二極體裝置,更包含一供冷卻劑進出 之裝置。 3. 如請求項1所述之發光二極體裝置,其中該散熱片包含一水 道(water rail),該水道界定複數個供冷卻劑流動之通道。 4. 如請求項1所述之發光二極體裝置,其中該等冷卻橋包含一 金屬。 5. 如請求項1所述之發光二極體裝置,其中該等冷卻橋包含鋁。 6. 如請求項1所述之發光二極體裝置,其中該等連接器及跨接 端帽更包含鋁及一熱隔絕材料。 7. 如請求項6所述之發光二極體裝置,其中該隔絕材料包含一 乙酿基聚合物(acetyl polymer)。 B. 如請求項1所述之發光二極體裝置,其中該散熱片包含一水 道,該水道具有複數個沿軸向界定之水道通道。 9. 如請求項8所述之發光二極體裝置,其中該跨接端帽於該等 水道通道之間界定一跨接端帽通道。 10. 如請求項1所述之發光二極體裝置,其中該等連接器及跨接 13 201221845 ' 端帽之該隔絕材料接觸該散熱片。 11. 如請求項1所述之發光二極體裝置,更包含一反射器罩及一 側罩(side cover ),附裝至該等連接器及跨接端帽。 12. 如請求項11所述之發光二極體裝置,更包含延伸於該反射器 罩與該側罩間之一視窗。 13. —種製造一發光二極體裝置之方法,包含: 附裝一發光二極體總成至一散熱片,該發光二極體總成 具有複數個發光二極體晶片(chip); 附裝複數個冷卻橋至該散熱片,該散熱片具有一對沿轴 向形成之通道; 定位一反射器,以引導自該等發光二極體晶片發出之輻 射;以及 附裝一連接端帽及一跨接端帽至該水道,以形成一流體 迴路。 14. 如請求項13所述之方法,更包含附裝一反射器罩及一側罩至 該連接端帽及該跨接端帽。 15. 如請求項14所述之方法,更包含定位一視窗,俾使來自該反 射器之輻射穿透該視窗。 16. 如請求項14所述之方法,其中該反射器係定位於該反射器罩 中〇 17. 如請求項14所述之方法,其中附裝該反射器罩及該側罩至該 連接端帽及該跨接端帽會於該冷卻橋與該反射器罩之間、該 冷卻橋與該側罩之間、以及該冷卻橋與該水道之間建立熱接 觸。 - 14 201221845 18. —種冷卻一發光二極體裝置之方法,該發光二極體裝置包含 一發光二極體陣列 '用於引導自該發光二極體陣列發出之輻 射之一反射器、附裝至該發光二極體陣列並鄰接—冷卻橋之 一水道,該方法包含使一冷卻劑在形成於該水道♦之複數軸 向通道中循環。 19. 如睛求項18所述之方法,其中該發光二極體裝置更包含一跨 接端帽,用以將流體自該等軸向通道其中之—引導至該等軸 向通道其中之另一者。 X 如明求項18所述之方法,其中該發光二極體裝置更包含一連 接端帽,且其中該冷卻劑係自該連接端帽提供至該水道。
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2011
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- 2011-08-09 JP JP2013524154A patent/JP5657797B2/ja not_active Expired - Fee Related
- 2011-08-09 KR KR1020137003682A patent/KR101479012B1/ko active IP Right Grant
- 2011-08-09 TW TW105105849A patent/TWI635239B/zh not_active IP Right Cessation
- 2011-08-09 TW TW100128335A patent/TWI529343B/zh not_active IP Right Cessation
- 2011-08-09 WO PCT/US2011/046990 patent/WO2012021465A2/en active Application Filing
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WO2012021465A2 (en) | 2012-02-16 |
CN103180981B (zh) | 2017-04-12 |
CA2813369A1 (en) | 2012-02-16 |
US8641236B2 (en) | 2014-02-04 |
JP5657797B2 (ja) | 2015-01-21 |
EP2603939A2 (en) | 2013-06-19 |
JP2014504421A (ja) | 2014-02-20 |
US20120033431A1 (en) | 2012-02-09 |
WO2012021465A3 (en) | 2012-06-07 |
KR101479012B1 (ko) | 2015-01-05 |
JP6140672B2 (ja) | 2017-05-31 |
JP2015084330A (ja) | 2015-04-30 |
CA2813369C (en) | 2018-10-30 |
US20140185300A1 (en) | 2014-07-03 |
TWI529343B (zh) | 2016-04-11 |
EP2603939A4 (en) | 2014-07-16 |
EP2603939B1 (en) | 2018-05-16 |
KR20130040243A (ko) | 2013-04-23 |
CN103180981A (zh) | 2013-06-26 |
TWI635239B (zh) | 2018-09-11 |
TW201643349A (zh) | 2016-12-16 |
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