CN103180981A - 绝缘led装置 - Google Patents

绝缘led装置 Download PDF

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CN103180981A
CN103180981A CN2011800488965A CN201180048896A CN103180981A CN 103180981 A CN103180981 A CN 103180981A CN 2011800488965 A CN2011800488965 A CN 2011800488965A CN 201180048896 A CN201180048896 A CN 201180048896A CN 103180981 A CN103180981 A CN 103180981A
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led
end cap
connection end
led matrix
reflector
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CN103180981B (zh
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J·J·沃茨
A·D·马丁内斯
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Air Motion Systems Inc
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00Lighting devices or systems using a string or strip of light sources
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    • F21S4/28Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
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    • F21V15/00Protecting lighting devices from damage
    • F21V15/01Housings, e.g. material or assembling of housing parts
    • F21V15/013Housings, e.g. material or assembling of housing parts the housing being an extrusion
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/502Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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    • F21V15/00Protecting lighting devices from damage
    • F21V15/01Housings, e.g. material or assembling of housing parts
    • F21V15/015Devices for covering joints between adjacent lighting devices; End coverings
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    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/75Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
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    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
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  • Manufacturing & Machinery (AREA)
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  • Led Device Packages (AREA)
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Abstract

一种LED装置具有LED组件,LED组件连接至或贴靠散热器,散热器连接至冷却桥且视情况被封闭在绝缘连接器端盖及跨接端盖内及被封闭在反射器罩及侧罩内。冷却桥将热量从反射器罩及侧罩传导至散热器,在散热器中可通过循环的冷却剂移除所述热量。

Description

绝缘LED装置
技术领域
本发明涉及发光二极管(light-emitting diode;LED),具体而言,本发明涉及一种用于冷却使用发光二极管的装置的方法,所述装置用于产生并引导辐射。
背景技术
尽管LED在产生用于工业用途(例如紫外线聚合印刷油墨及涂层)的辐射方面代表着重大改进,然而这些装置会产生大量的热量。如果不从使用LED的装置消散或移除所述热量,所述热量可使任何反射表面变形并可严重地损坏LED本身。因此,需要提供一种用于从使用LED的装置移除有害热量的高效且结构简单的设计。
发明内容
本发明通过提供一种LED装置而实质上满足了业内的上述需求,所述LED装置具有用于从运行的LED装置移除热量的简单而高效的结构。
本发明提供一种LED装置,所述LED装置包括LED组件、多个冷却桥、散热器、反射器罩、侧罩、反射器、以及连接器端盖及跨接端盖。所述LED组件可包括多个LED芯片。所述冷却桥可附装至或贴靠所述散热器。所述反射器可由所述反射器罩进行定位以引导来自所述LED组件的辐射。所述连接器端盖及所述跨接端盖可包括电性绝缘材料或热绝缘材料。
本发明还提供一种制造LED装置的方法,所述方法包括:1)将多个冷却桥附装至水轨,所述水轨具有一对沿轴向成型的通道;2)对反射器进行定位,以引导LED芯片所发出的辐射;以及4)将连接端盖及跨接端盖附装至水轨以形成流体回路(fluidic circuit)。
本发明还提供一种冷却LED装置的方法,所述LED装置具有:LED阵列;反射器,用于引导自所述LED阵列发出的辐射;水轨,附装至或贴靠所述LED阵列,所述水轨还附装至或贴靠冷却桥,所述方法包括使冷却剂在所述水轨中所形成的轴向通道内循环。
参照附图阅读以下说明,本发明的这些及其他特征将变得显而易见。
附图说明
图1为本发明的绝缘LED装置的一个实施例的立体图。
图2为图1所示的绝缘LED装置的分解图。
图3为图1所示的绝缘LED装置的侧视图。
图4为沿图3所示的线A-A截取的剖面图。
应理解,上述图式仅用于例示本发明而并非旨在限制本发明的范围。
具体实施方式
除非另有定义,否则本文所用的所有技术及科学用语的意义与本发明所属领域的普通技术人员通常所理解的意义相同。尽管可使用与本文所述方法及材料类似或等效的方法及材料来实践本发明,然而在下文中将描述适宜的方法及材料。本文所提及的所有出版物、专利申请、专利及其他参考文献均以引用方式全文并入本文中。如果存在冲突,将以包括定义在内的本说明书为准。另外,各种材料、方法及实例仅为例示性的而并非旨在限制本发明。
每当提及例如“前”、“后”、“左“、“右”、“顶部”与“底部”、“上部”与“下部”、“水平”与“垂直”等相对性用语时,均旨在便于说明而并非旨在将本发明或其元件限制于任一位置或空间取向。在不背离本发明的范围的条件下,附图中各元件的尺寸可根据本发明实施例的潜在设计及预期用途而变化。
本文中所公开的每一额外特征及方法均可单独使用或与其他特征及方法组合使用来提供本发明的改进的装置以及用于制造及使用所述改进的装置的方法。现在,将参照附图详细说明本发明的教示内容的典型实例,所述实例将这些额外特征及方法中的多者结合使用。此详细说明仅旨在教示所属领域的技术人员进一步的细节以实践本教示内容的优选方面,而并非旨在限制本发明的范围。因此,在以下详细说明中所公开的特征及方法的仅有组合可能并非是在最广意义上实践本发明所必需的,相反,其仅用于具体地描述本发明的典型及优选实施例。
本发明的绝缘LED装置的一个实施例以符号100描绘于图式中,并包括光引擎(例如LED组件102)、多个冷却桥104、散热器(例如水轨106)、反射器罩108、侧罩110、连接端盖组件112以及跨接端盖组件114。所属领域的普通技术人员将轻易认识到,LED组件102包含多个LED芯片122,这些LED芯片122支撑于铜板124上。在所设想的发明中,LED组件102可存在多种构型及材料。
在所示的实施例中,水轨106可由导热材料(例如铝)制成。然而,所属领域的普通技术人员将易知用于制造本水轨的其他可接受的材料。当连接至LED组件102及水轨106时,所述多个冷却桥104用于从LED组件102传导热量并用于定位LED组件102以引导从本LED组件所发出的辐射。多个带鳍片的通道132、134可沿轴向界定于水轨106中。邻近相应通道132、134形成的鳍片136、138会增加水轨106的邻近通道132、134的表面积,从而当冷却剂经由通道132、134循环时能更高效地从水轨106抽取热量。如此循环的冷却剂可为液体或气体。适宜的液体包括水、聚乙二醇水溶液(polyethylene glycol-water solution)、液氮(liquefiednitrogen)等。适宜的气体包括经冷却的大气。
可使用端子板(terminal block)144将每一光引擎段跨接在一起或组合各光引擎以使这些光引擎中的一或多个光引擎能够独立于其他光引擎而受到控制,并且端子板144可附装至冷却桥的下侧及/或附装至反射器罩。端子板允许光引擎与外部电源之间进行热绝缘连接及电性绝缘连接。
反射器罩108具有外部150及从外部150延伸出的多个内凸起部152。外部150在通道153处附装至唇状结构154,唇状结构154形成轴向狭槽155。在外部150的下部形成狭槽156。在外部150的下部位置形成向内开口的另一狭槽160。狭槽155、156被定位成容置反射器162。反射器162沿边缘设置于狭槽155、156内且贴靠凸起部152,从而被保持于所需位置及构型。
侧罩110在通道170处附装至或接触水轨106。侧罩110向上终止于延伸部172处且向下终止于狭槽174处。延伸部172设置于反射器罩108的狭槽158内。然而,所属领域的普通技术人员将认识到,延伸部172及狭槽158可存在于相应的反射器罩108及侧罩110上。侧罩110的狭槽174与反射器罩108的狭槽160相互配合以容置并定位窗口180。
窗口180可选自允许所需辐射波长通过的材料,例如丙烯酸树脂(acrylic)或所属领域的普通技术人员熟知的其他材料。
连接端盖组件112具有连接端盖190及连接绝缘器区块192。连接端盖190被紧固至反射器罩108及侧罩110并对反射器罩108及侧罩110进行定位。连接绝缘器区块192是由电性绝缘材料(例如乙酰聚合物)制成,DelranTM为一种适宜的材料。然而,所属领域的普通技术人员将轻易认识到,也可使用其他适宜的材料。多个接头194可附装至连接绝缘器区块192以连接至冷却剂源并为水轨106提供冷却剂的入口及出口。应认识到,接头194将根据所用的冷却剂以及在冷却及保持水轨106时所处的条件而变化。
跨接端盖组件114包括跨接端盖200及连接绝缘器区块202。跨接端盖200界定狭槽204,狭槽204容置连接绝缘器区块202并对连接绝缘器区块202进行定位。如关于绝缘器区块192所述,所述连接绝缘器区块可由DelranTM或另一具有适宜绝缘性的材料制成。连接绝缘器区块202界定狭槽206,狭槽206具有适宜的尺寸且被定位成将从通道132、134中的一者流出的冷却剂引导至所述通道中的另一者,从而提供并接通本发明的LED装置100的冷却剂回路。通过在通道132、134的每一开口处存在O形环(图未示出),可有助于实现不透流体的密封。绝缘器区块的一个功能是,除LED组件102、冷却桥104、水轨106、反射器罩108及侧罩110之外,本LED装置的其余元件不被冷却,从而更高效地冷却需要被保持于所需温度的本发明的元件。
任选的管道206可容纳电线,以为LED组件102供电。管道206(如果存在)还可为LED装置100提供支撑及锚固。尽管图中未示出,然而所属领域的普通技术人员将认识到,可以可操作地存在冷却剂供应设备以向水轨106提供循环冷却剂并从水轨106接收循环冷却剂。冷却剂供应设备将根据例如所用的冷却剂以及所需的冷却剂温度及流速而变化。
来自相应的反射器罩108、侧罩110及水轨106的热触点220、222、224是通过这些部件与冷却桥104之间的贴靠接触而实现。所辐射能量(例如热量)的一部分被所辐射的突出部(罩106、108)及反射器162吸收,从而使这些外侧突出部被不利地加热。因此,本发明的冷却桥104提供使有害热量从反射器罩108及侧罩110经由冷却桥106传导至作为散热器的水轨106的路径,从而降低外侧突出部的温度。
冷却桥104还沿本发明的LED装置100的长度在多个位置处将用于支撑反射器162的突出部精确地束缚至水轨106,从而在辐射源(LED芯片122)与反射器162之间提供均匀的光学对准。
一个适宜的LED组件具有多个LED芯片102,LED芯片102粘着至耐热且电性绝缘的树脂,例如非晶态热塑性聚酰亚胺(polyethermide)。一种适宜的此类聚酰亚胺为
Figure BDA00003026836500051
(沙伯基础创新塑料公司(SABIC Innovative Plastics))。该耐热树脂被粘着或接合至导热但电性绝缘的树脂(例如
Figure BDA00003026836500052
),所述导热但电性绝缘的树脂则接合或连接至导热且导电的板124,例如铜或铝。
除上述材料外,在《塑料、弹性体与复合材料手册(the Handbook of Plastics,Elastomers,and Composites)》(第三版,Charles a Harper主编,纽约麦格劳-希尔教育出版集团(McGraw-Hill)出版(1996))中公开并描述了其他适宜的聚合物或合成树脂,所述《塑料、弹性体与复合材料手册》以引用方式全文并入本文中。
所属领域的普通技术人员将容易理解,本发明各种实施例中所示的各个元件在某种程度上可互换并可在不背离本发明的精神及范围的条件下添加或互换于其他实施例中。
由于可在不背离本发明的精神的条件下对本发明作出诸多修改,因此本发明的范围并不限于所示及所述的实施例。相反,本发明的范围将由随附权利要求及其等效内容决定。

Claims (20)

1.一种发光二极管(LED)装置,包括:
LED组件;
多个导热冷却桥;
散热器,附装至所述多个冷却桥;
反射器,由反射器罩进行定位,以引导来自所述LED组件的辐射;以及
连接器端盖及跨接端盖。
2.如权利要求1所述的LED装置,还包括用于冷却剂进出的构件。
3.如权利要求1所述的LED装置,其中所述散热器包括水轨(water rail),所述水轨界定多个通道以供冷却剂流动。
4.如权利要求1所述的LED装置,其中所述冷却桥包含金属。
5.如权利要求1所述的LED装置,其中所述冷却桥包含铝。
6.如权利要求1所述的LED装置,其中所述连接器端盖及所述跨接端盖还包含铝及热绝缘材料。
7.如权利要求6所述的LED装置,其中所述绝缘材料包括乙酰聚合物。
8.如权利要求1所述的LED装置,其中所述散热器包括水轨,所述水轨具有多个沿轴向界定的水轨通道。
9.如权利要求8所述的LED装置,其中所述跨接端盖在所述水轨通道之间界定跨接端盖通道。
10.如权利要求1所述的LED装置,其中所述连接器端盖及所述跨接端盖的所述绝缘材料接触所述散热器。
11.如权利要求1所述的LED装置,还包括附装至所述连接器端盖及所述跨接端盖的反射器罩及侧罩。
12.如权利要求11所述的LED装置,还包括在所述反射器罩与所述侧罩之间延伸的窗口。
13.一种制造LED装置的方法,包括:
将LED组件附装至散热器,所述LED组件具有多个LED芯片;
将多个冷却桥附装至所述散热器,所述散热器具有一对沿轴向成型的通道;
对反射器进行定位,以引导自所述LED芯片发出的辐射;以及
将连接端盖及跨接端盖附装至水轨以形成流体回路(fluidic circuit)。
14.如权利要求13所述的方法,还包括:将反射器罩及侧罩附装至所述连接端盖及所述跨接端盖。
15.如权利要求14所述的方法,还包括:对窗口进行定位,以使来自所述反射器的辐射穿过所述窗口。
16.如权利要求14所述的方法,其中所述反射器定位于所述反射器罩中。
17.如权利要求14所述的方法,其中将所述反射器罩及所述侧罩附装至所述连接端盖及所述跨接端盖会在所述冷却桥与所述反射器罩之间、在所述冷却桥与所述侧罩之间、以及在所述冷却桥与所述水轨之间建立热接触。
18.一种冷却LED装置的方法,所述LED装置包括:LED阵列;反射器,用于引导自所述LED阵列发出的辐射;以及水轨,附装至所述LED阵列且贴靠冷却桥,所述方法包括使冷却剂在所述水轨中所形成的多个轴向通道内循环。
19.如权利要求18所述的方法,其中所述LED装置还包括跨接端盖,所述跨接端盖将流体从所述多个轴向通道中的一者传导至所述多个轴向通道中的另一者。
20.如权利要求18所述的方法,其中所述LED装置还包括连接端盖,且其中所述冷却剂是从所述连接端盖提供至所述水轨。
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