201207381 六、發明說明： 【發明所屬技術領域】 發明領域 本發明係有關於一種基板檢查裝置及基板檢查方法。 C 冬奸 j 發明背景 S 知在液晶顯示器（LCD : Liquid Crystal Display)、 PDP(Plasma Display Panel)、或有機EL(ElectroLuminescence) 顯示器或表面傳導電子發射顯示器（SED :201207381 VI. Description of the Invention: Field of the Invention The present invention relates to a substrate inspection apparatus and a substrate inspection method. C Winter rape j Background of the invention S Known in liquid crystal display (LCD), PDP (Plasma Display Panel), or organic EL (ElectroLuminescence) display or surface conduction electron emission display (SED:
Surface-conduction Electron-emitter Display)等 FPD(FlatSurface-conduction Electron-emitter Display), etc. FPD(Flat
Panel Display)基板、半導體晶圓或印刷基板等各種基板之 製造上’為提高其成品率，於各圖形化製程後，逐次檢查 是否有配線之短路、連接不良、斷線、或圖形不良等圖形 化錯誤存在。在此種基板檢查中，首先，以線掃瞄照相機 或CCD照相機等檢測位於基板表面之缺陷（缺陷檢測檢 查）’之後’以CCD照相機等覆查照相機取得所檢測出之缺 陷之放大圖像(缺陷覆查）。 先行技術文獻 專利文獻 專利文獻1 日本專利公開公報2000-9661號 C 明内j 發明概要 發明欲解決之問題 然而’由於在上述習知技術中，對1個基板之缺陷檢查 201207381 束後’對同基板進行缺陷 為止所需1㈣長H 故有朗有檢查完畢 亦可抑制至檢查完畢為止所:’#限制缺陷之覆查時間， 實質地限—以2 之時間之增加，此時，由於 用以^㈣覆查之基板檢查裝置及基板檢查方法。 用乂从解決課題之手段 有將此目的，本發明之基板檢查裝置特徵在於包含 送中搬送之搬送部、檢測往前述第1方向搬 述基板之缺陷陷檢測部、及於前述搬送中取得以 前述缺陷檢測部所檢測出之缺陷之圖像之圖像取得部。 又’本發明之基板檢查方法特徵在於具有將基板往第1 :向搬送之第1搬送步驟、檢測在前述第！搬送步驟中，往 刚述第1方向搬送巾之前述基板之祕的缺陷檢測步驟、及 於在別述第1搬送步驟之前述搬送中取得在前述缺陷檢測 步驟所檢測出之缺陷之圖像的圖像取得步驟。 發明效果 根據本發明，由於對基板之缺陷檢查與取得此所檢測 出之缺陷之圖像同時進行，故不致使對丨個基板之產距時間 (takt time)增加，而可取得更多之缺陷之圖像。結果，可實 現可抑制至檢查完畢為止所需之時間之增加’並且可進行 詳細之缺陷覆蓋之基板檢查裝置及基板檢查方法。 201207381 圖式簡單說明 第1圖係顯示一實施形態之基板檢查裝置之概略結構 的立體圖。 第2圖係顯示實施形態之線掃瞄照相機之拍攝範圍與 覆查照相機之可動範圍的關係之一例之示意圖。 第3圖係顯示實施形態之線掃瞄照相機之拍攝範圍與 覆查照相機之可動範圍的關係之另一例之示意圖。 第4圖係顯示第1圖所示之基板檢查裝置之概略結構的 上視圖。 第5圖係顯示實施形態之基板檢查裝置之概略功能結 構的塊圖。 第6圖係顯示實施形態之基板檢查動作之概略流程的 流程圖。 第7圖係顯示實施形態之缺陷檢測處理之概略流程的 流程圖。 第8圖係顯示實施形態之缺陷覆查處理之概略流程的 流程圖。 第9圖係顯示實施形態之折返缺陷覆查處理之概略流 程的流程圖。 第10圖係顯示實施形態之框架之另一概略結構之上視 圖。 ί：實施方式3 用以實施發明之形態 以下，將用以實施本發明之形態與圖式一同詳細地說 201207381 明。此外，在以下之說明中，各圖僅係概略地將形狀、大 小及位置關係顯示至可理解本發明之内容之程度，因而， 本發明非僅以在各圖例示之形狀、大小及位置關係限定 者。又，在各圖中，為使結構明瞭化，而省略了截面之剖 面線之一部份。再者，在後述例示之數值僅為本發明之較 佳例’因而，本發明非限於所例示之數值者。 以下，利用圖式’詳細地說明本發明一實施形態之基 板檢查裝置及基板檢查方法。第1圖係顯示本實施形態之基 板檢查裝置之概略結構的立體圖。 如第1圖所示，本實施形態之基板檢查裝置1包含有本 體基座11、藉從設在基板載置面之無數孔吹出空氣，而使 基板W浮起之浮起台14、沿著基板W之搬送方向（圖式中為 X/-X方向）延伸之搬送台12、藉一面保持搬入至浮起台μ上 之基板W，一面移動搬送台12，而搬送基板W之基板搬送 單元22、於與搬送方向垂直之方向（圖式中為γ方向）跨越可 搬送基板W之浮起台14的檢查部之框架13、在框架13之近 處’將浮起台14從斜上方照明成於Y方向延伸之線狀的線式 照明18、可移動地設於框架13，而從線式照明18對側之斜 上方拍攝以線式照明18所照明之線狀區域的1個以上缺陷 檢查用線掃瞄照相機15、同樣可移動地設於框架π，將浮 起台14上之基板W放大拍攝之1個以上覆查用覆查照相機 19。其中，浮起台14、搬送台12及框架13固定於本體基座 11。又，亦可將線式照明18固定於本體基座11。本體基座 11可使用大理石塊等耐震性優異之構件、或藉具有振動衰 201207381 減。卩，提咼了耐震性能之構件等。此外，基板檢查裝置i亦 可收容於無塵室内。 洋起台14以圖中未示之框架固定於本體基座u。又， 於洋起台14之基板載置面設有連結於圖中未示之送風機構 之無數孔，藉從此孔吹出空氣，載置在浮起台14上之基板 W形成從基板載置面浮起之狀態。惟，不限於此，只要為 α複數個於基板w之搬送方向旋轉之輥，以此輥支撐成基 板W不致接觸浮起台14之結構等於基板搬送時不致損傷基 板W而搬送之結構，可進行各種變更。 用於缺陷檢查用線掃瞄照相機15之拍攝之線式照明18 為點光源排列成線狀而形成之光源或細長之面光源等。此 線式照明18調節其位置及角度，俾使在基板w表面反射之 照明光之光軸之排列面包含各線掃瞄照相機15之光軸。 與線式照明18平行而設之框架13係稱為所謂之高架 (gantry)者》於框架13設有將1個以上線掃瞒照相機15以使 其於與基板W之搬送方向垂直之方向（γ/_γ方向）排列的狀 態保持之掃瞄照相機台17。於各線掃瞄照相機15設有一面 將以線式照明18在基板W上所反射之觀察光以預定倍率變 倍，一面可在任一線掃瞄照相機15之線感測器位置成像之 照相機鏡頭16。 又，各線掃瞄照相機15可在圖中未示之控制部之控制 下，與其他線掃瞒照相機15獨立地，沿著掃晦照相機台17 於Υ/- Υ方向移動。此結構係線掃瞄照相機丨5可沿著γ方向四 處拍攝通過框架13下之基板…。因而，藉一面以線掃瞄照 201207381 相機15四處拍攝於¥方向延伸之帶狀拍攝區域，—面使用基 板搬送單元22 ’進行將基板W於X方向（或·χ方向)搬送之掃 動作，可拍攝基板w全體。惟，因線掃猫照相機15之台 數不同，亦有構造成藉進行複數次掃瞄動作，拍攝基板w 全體之情形。此時，當—次之_動作結束時，線掃猫照 相機15於下次掃瞄動作時，往Υ/-Υ方向移動一視野量。 另—方面，覆查照相機19以CCD照相機或CM〇s照相 機等構成。各覆查照相機19設於具有可進行同軸入射照明 與基板W之缺陷之放大投影之物鏡的鏡筒2〇内，以取得作 為目彳示之缺陷之放大圖像。此鏡筒20設於隔著框架η配置 於掃瞄照相機台17之對側之覆查照相機台21。複數個鏡筒 20可高速移動地保持於覆查照相機台21。覆查照相機台21 可在圖中未示之控制部之控制下，使各鏡筒20與其他鏡筒 20獨立地於Y/-Y方向高速移動。 在此，如第2圖所示，當線掃瞄照相機15之台數與覆查 照相機19之台數相同時，合併線掃瞄照相機15之第1次掃瞄 之拍攝範圍S1與第2次掃瞄之拍攝範圍S2的範圍ri可設計 為1個覆查照相機19之可動範圍。又，如第3圖所示，當覆 查照相機19之台數為線掃瞄照相機15之台數之一半時，合 併線掃瞄照相機15a之第1次掃瞄之拍攝範圍Sal及第2次掃 瞄之拍攝範圍S a 2、以及線掃瞄照相機15 b之第1次掃瞄之拍 攝範圍Sbl及第2次掃瞄之拍攝範圍Sb2的範圍R2可設計成1 個覆查照相機19之可動範圍。惟，不限於此，亦可構造成 可多移動覆查照相機19之拍攝範圍量。藉此，可解決在覆 201207381 查照相機19之可動範圍之端附近拍攝時，未照明拍攝區域 之一部份等之弊端的產生。 接著’就搬入至基板檢查裝置丨之基板W之搬送，使用 圖式，詳細地說明。第4圖係顯示第丨圖所示之基板檢查裝 置之概略結構的上視圖。如第4圖所示，在基板檢查裝置j， 當將基板W搬入至浮起台14上時，藉圖中未示之定位機 構，以機械式將基板W對準規定位置。已對準規定位置之 基板W以基板搬送單元22保持。具體言之，基板搬送單元 22具有設於搬送台12上，並沿著基板搬送方向延伸之y導 軌道223、/〇著搬送台12而設，以圖中未示之驅動源巡迴之 搬送帶221、固定於搬送帶221，而藉該搬送帶221之巡迴， 沿著引導軌道223行走之行走部222、固定於行走部222，保 持基板W之保持部224。保持部224具有連結於圖中未示之 排氣泵之1個以上之吸附墊225 ^可藉排氣泵之排氣，將基 板W吸引至吸附墊225。結果，基板w可保持於保持部224。 惟，尚有保持部224握持基板w之端部之結構等可進行各種 變更。 當基板搬送單元22藉搬送帶221之巡迴於χ/_χ方向移 動時，保持在基板搬送單元22之基板w可於χ/-χ方向搬 送。此時，由於基板W為藉空氣從浮起台14浮起之狀態， 故可防止基板W因與浮起台14之接觸等而損傷。 接著，就使基板檢查裝置丨動作之驅動機構，使用圖 式，詳細地說明。第5圖係顯示本實施形態之基板檢查裝置 之概略功能結構的塊圖。如第5圖所示，基板檢查裝置1包 201207381 含有控制基板檢查裝置[全體之動作之控制部⑻、驅動浮 起台U，以使基板W浮起之浮起台驅動部14、探測基板w 已從外部搬人至浮起⑽上之基板搬人朗和卜於基板 職入至浮起台14時，將基板|以機械式對準蚊位置之 機械對準驅動部132、-面保持基板w，_面使其在浮起台 14上於Χ/·Χ方向移動之搬送驅動部112、約即時地檢測浮： 台u上之基板w之位置的基板位置檢測部133、驅動線式照 明18 ’以照明線_照相機15之拍攝區域之線式照明驅動 部m'驅動線掃Μ_15 ’以按各線取得基板w之圖像 之線掃猫照相機驅動部115、驅動覆查照相機19，以取得基 板W之缺陷之放大圖像的覆查照相機驅動部119。 又’基板檢查裝置1包含有供使用者輸入各種設定或指 示之輸入部H)2、適當記憶各種程式、參數以及所取得之圖 像資料等之記憶柳3、_所取得/記憶之圖像或各種資 訊之顯示部1G4、控制與外部之通信之通信部1()5、檢測以 線掃瞒照相機15所拍攝之圖像所含之缺陷之圖像的缺陷檢 測部121、界定以缺陷檢測部121所檢測出之缺陷之基板〜 上之位置(缺陷座標）的缺陷座標界定部122。此外，基板搬 入探測部131依據设在浮起台14之基板搬入口之圖中未示 之感測器的k號，探測是否已搬入基板w。機械對準驅動 部13 2驅動設於浮起台14之基板搬入口附近之銷或輥等定 位機構’以將基板W定位於規定位置。 接著，就基板檢查裝置1之基板檢查時之動作，使用圖 式，詳細地說明。此外，在本實施形態之基板檢查動作中， 10 201207381 舉至少於最初之掃瞒動作時，同時進行檢測基板w之缺陷 之缺陷檢測處理與取得所檢測出之缺陷之圖像的缺陷處理 之情形為例。此外’若執行第2次以後之_動作於此第 2次以後之掃瞄動作時，可省略缺陷檢測處理，亦可不省略。 第6圖係顯示本實施形態之基板檢查動作之概略流程 的流程圖。惟，在以下之說明，著眼於第5圖所示之控制= 101之動作。如第6圖所示，在本基板檢查動作中，控制部 101首先以基板搬人_部131狀衫已將基板w從外部 搬入至浮起台14上（步驟Sl01)。此外，此時，控制部⑻在 驅動淨起台114之狀態下，即，從浮起台14之孔吹出空氣之 狀態下，等待基板w之搬入(步驟S101之否）。 當將基板W搬入至浮起台14上時(步驟sl〇1之是》控制 部101便藉藉由機械對準驅動部132，驅動圖中未示之定位 機構’以將基板w以機械式對準浮起台14之規定位置(步驟 S102) ’接著’藉藉由搬送驅動部112，驅動基板搬送單元 22，以移動至預定之基板保持位置之基板搬送單⑽保持 位於規定位置之基板w(步驟S103)。 然後，控制部ιοί藉驅動搬送驅動部112，開始使基板 搬送單元22以等速往X方向移動之動作，而開始使基板W往 X方向等速移動之動作（步驟Sl〇4)。接著，控制部1〇1依據 從基板位置制部133隨時輸人之基板w之位置，待機至基 板w到達在基板w之搬送路徑位於上狀線料照相機^ 的拍攝區域(掃晦區域)為止（步㈣G5之否）。當基板w到達 掃晦區域時(步驟議之是），控㈣⑻首先開始檢測基板 201207381 缺陷之缺陷檢測處理（步驟sl〇6)，接著，開始用以取得 在缺陷檢測處理所檢測出之缺陷之放大圖像的缺陷覆查處 理（步驟S107)。 接著控制部1〇1判定在後述之缺陷覆查處理或折返缺 覆查處理疋否要求折返之掃猫動作(步驟s⑽）。此外，折 之掃@動作係、指若已將基板w；^x方向搬送時，便往 向搬送反之，若已往_X方向搬送時，則往X方向搬送。 乂驟^08之判定之結果，要求折返之掃瞄動作時（步驟 08之疋）’控制部101驅動搬送驅動部112，而翻轉基板w 之搬运方向，以開始使基錢送單元22財速移動之動作 '驟S109)。然後’控制部1Q1開始對未覆查之剩餘之缺陷 之缺陷覆查處理(折返缺陷覆查處理)(步驟si⑼，之後，返 回步驟S108。 乃—万面，步驟测之判定之結果，未要求折返之掃 作時(步驟SH)8之幻’控制部1G1判定對基板w之掃猫 乍是R結⑽卿u)，#未結树(步·ui之否）， ，回步驟難。另—方面，當_動作結束時(步驟sin 疋）’則結束本動作。 細i接者就本實施形態之缺陷檢測處理，使用圖式，詳 也說明。第7_係_本實卿態之缺陷_處理之概略 :呈的流程圖。如第7圖所示，在缺陷檢測處理，控制部ι〇ι 以線掃㈣相機15拍攝通過_區域中之基板w，而 ^線量之基板W之圖像(步驟S121)。此外，i線量之圖像 1藉約同時驅動於對基_之搬送方向垂直之方向排列 12 201207381 之複數個線_照相機15，將—次所拍攝之複數個圖像接 合而生成之帶狀圖像。 然後，控制部101藉將藉由線掃瞄照相機驅動部115所 輸入之1線量之圖像輸人至缺陷檢測部12卜進行圖像解析 (步驟S122) ’檢測1線量之圖像所含之缺陷。接著，控制部 1〇1判定在步驟S122是否檢測出缺陷（步驟S123)，當檢測出 缺陷時(步驟S123之是）’在缺陷鍊界定部122界定所檢測 出之缺陷在基板w上之位置（缺陷座標）(步驟S124)，輸出所 界定之1線量之缺陷座標（步驟S125)。此外，缺陷座標之輸 出標的為控制部1〇1。另一方面，當在步驟S122，未檢測出 缺陷時（步驟S123之否），控制部1〇1便移往步驟S126。此 外，缺陷在基板w之位置(缺陷座標）可從基板冒在浮起台14 上之位置(座標）、各線掃瞄照相機15之拍攝區域在浮起台14 上之位置（座標）、以各線掃瞄照相機15所拍攝之圖像所含之 缺陷之位置(座標）算出。 在步驟S126，控制部1〇1待機至基板呢往乂方向移動1 線量為止（步驟S126之否）。當基板w往X方向移動丨線量時 (步驟S126之是），控制部101就對基板w之所有線判定掃瞄 是否已結束，即，判定對基板W全體之缺陷之檢測及缺陷 座標之界定是否已完畢（步驟S127)，當未結束時(步驟sm 之否），控制部1〇1返回步驟S121，執行之後之動作。另一 方面’對所有線之掃瞄結束時（步驟S127之是），控制部1〇1 則結束本缺陷檢測處理。 接著，就本實施形態之缺陷覆查處理，使用圖式，詳 13 201207381 細地說明》第8圖係顯示本實施形態之缺陷覆查處理之概略 流程的流程圖。如第8圖所示，在缺陷覆查處理，控制部1 1 首先判疋在第7圖所示之缺陷檢測處理，是否已從缺陷座標 界定部122輸入1線量之缺陷座標（步驟S141)，當輸入時(步 驟S141之是）’將此丨線量之缺陷座標記憶於記憶部1〇3等（步 驟S142)，之後，移往步驟SM3。另一方面，當未輸入〗線 量之缺陷座標時，即，在第7圖所示之缺陷檢测處理，該丄 線量之圖像未含有缺陷時(步驟S141之否），控制部〇1移往步 驟S143 。 在步驟S143，控制部ι〇1對於記憶部103等記憶有缺陷 座標之所有缺陷，作成包含覆查之順序或覆查時之覆查照 相機19之移動量以及移動時間等資訊等的覆查排程（步驟 S143)。此外，關於覆查排程之作成，在後述提及。又，所 作成之覆查排程暫時記憶於記憶部1〇3等。 接著，控制部1〇1在步驟S143所作之排程之結果，判定 是否有無法覆查、亦即無法以覆查照相機19任-者拍攝之 缺陷存在(步驟Sl44)。此判定之結果，有無法覆查之缺陷時 (步驟S144之是），控制部1G1便在記憶有缺陷座標之缺陷 中’依序預定之優先順位，選定作為覆絲象之缺陷（步驟 S145)。此外’預定之優先順位只要為依據缺陷之大小或缺 陷與配線等之位置關係者即可。X，未選定之缺陷座標用 其他方法記憶於記憶部103等。 接著’控制部HH對在步驟S145所選定之缺陷，再 覆查排程（步驟S146)，之後，移往步驟S147。另-方面， 201207381 4S144之判疋之結果’若無無法覆查之缺陷時(步驟s"4 之否）’控制部1G1便直接移往步·47。此外已先儲存 於記憶部103等之覆查排程以在步㈣倾作成之覆查排 程更新。 在步驟S147，控制部1〇1藉依據記憶於記憶部等之 覆查排程，驅動覆查照相機驅動部119，而可以覆查照相機 Η9取得作為覆查對象之缺陷之放大圖像。此外，所取得之 缺陷之放大圖像與缺陷座標—同記憶於記憶部⑽等。 之後，控制部101判定對基板^缺陷覆查處理是否己 結束(步驟S148)，未結束時(步驟S148之否），便返回步鄉 難，執行讀之動作。另-方面，#缺陷覆查動作結束 時(步驟SM8之是）’控㈣聊糊定是μ無法覆查之缺 陷，即，判定在步驟S144是否判定為有無法覆查之缺陷（步 驟S149) ’當有無法覆查之缺陷時(步驟Sl49之是），便生成 折返之掃_作(折返祕覆查處理)之要求(步驟⑽），之 後，結束本缺喊查處理。此外，折返之_動 存於記憶㈣作之狀㈣。又，步騎49之判定之結 果，當無無法覆查之缺陷時(步驟Sl49之否）’控制部ι〇ι便 直接結束本缺陷覆查處理。 又’第9圖係顯示本實施形態之折返缺陷覆查處理之概 略流程的流程圖。如第9圖所示，在折返缺陷覆查處理中， 控制部1G1S對所檢測出之缺陷中未覆查而剩餘之缺陷，作 成覆查排程(步驟S161)。所作成之覆查排程與上述同樣地， 記憶於記憶部103等。 15 201207381 然後，控制部101在步驟S161之排程之結果，判定是否 有無法覆查之缺陷（步驟S162)，當有無法覆查之缺陷存在時 (步驟S162之是），便在未選定之缺陷中，依據預定之優先順 位’選定作為覆查對象之缺陷（步驟S163)，對藉此所選定之 缺陷，再作成覆查排程（步驟S164)，之後，移往步驟S165。 另一方面，步驟S162之判定之結果，當無無法覆查之缺陷 存在時(步驟S162之否）’控制部101便直接移往步驟““。 此外，記憶於記憶部103等之覆查排程與上述同樣地，以再 作成之覆查排程更新。又，在步驟S163也未選定之缺陷座 標與上述同樣地，以其他方法記憶於記憶部1〇3等。 在步驟S165，控制部101藉依據記憶於記憶部ι〇3等之 覆查排程，驅動覆查照相機驅動部119，而以覆查照相機 取得作為覆查對象之缺陷之放大圖像。 Μ之後，控制部101判定是否有無法覆查之缺陷，即，判 杏疋否在步驟S162判疋為有無法覆查之缺陷（步驟S166)， t有無法覆查之缺陷時(步驟S166之是），便生成再度折返之 掃瞒動作(折返缺陷覆查處理)之要求(步驟⑽），之後，結 束本折返缺陷覆錢理。又，步驟S166之判定之结果，當 ^法«之缺_(步娜66之扑控制柳丨便直接結 果本折返缺陷覆查處理。 上動作，執行包含用以檢測存在於基板W之缺 :缺陷檢測處理、用以取得所檢測出之缺陷之放大圖像 作。、此^查處理（包含折返缺陷覆查處理）的基板檢查動 在以上之動作中，本案發明之缺陷檢測方法係 16 201207381 藉至少包含步驟S104之搬送步驟、步驟S106之缺陷檢測少 驟及步驟S107之圖像取得步驟來達成。 接著，就本實施形態之覆查排程之作成（包含再作成）’ 詳細地說明。在此，當令基板搬送單元22在X方向之移動速 度(基板W在X方向之移動速度）為Gs，令覆查照相機19在Y 方向之移動速度為Gr，令覆查照相機19之可動距離為Yr， 令覆查照相機19在可動距離γΓ移動時之移動時間為Tr時， 移動時間Tr可以以下式表示。Panel Display) In order to improve the yield of various substrates such as substrates, semiconductor wafers, and printed boards, it is necessary to check whether there are short circuits, poor connections, broken wires, or poor graphics after each graphic process. The error exists. In the substrate inspection, first, after detecting a defect (defect detection inspection) located on the surface of the substrate by a line scan camera or a CCD camera, the camera is scanned by a CCD camera or the like to obtain an enlarged image of the detected defect ( Defect review). PRIOR ART DOCUMENT PATENT DOCUMENT Patent Document Patent Document 1 Japanese Patent Laid-Open Publication No. 2000-9661 No. C. SUMMARY OF THE INVENTION The problem to be solved by the invention is however 'due to the fact that in the above-mentioned prior art, the defects of one substrate are inspected after 201207381 bundles' 1 (four) length H required for the substrate to be defected, so it can be suppressed until the inspection is completed: '#Restriction of defect inspection time, substantial limit - increase by 2 time, at this time, ^ (4) Review of the substrate inspection device and substrate inspection method. In order to solve the problem, the substrate inspection apparatus of the present invention is characterized in that it includes a conveyance unit that conveys the conveyance, a defect detection unit that detects the substrate in the first direction, and is acquired during the conveyance. An image acquisition unit that is an image of a defect detected by the defect detecting unit. Further, the substrate inspection method according to the present invention is characterized in that it has a first transfer step of transporting the substrate to the first: and is detected in the first step! In the transporting step, the defect detecting step of the substrate in which the towel is conveyed in the first direction is described, and the image of the defect detected in the defect detecting step is obtained during the transport in the first transport step. Image acquisition steps. Advantageous Effects of Invention According to the present invention, since the defect inspection of the substrate is performed simultaneously with the image of the defect detected, the takt time of the substrate is not increased, and more defects can be obtained. The image. As a result, it is possible to realize a substrate inspection apparatus and a substrate inspection method capable of suppressing an increase in the time required until the completion of inspection, and performing detailed defect coverage. 201207381 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing a schematic configuration of a substrate inspecting apparatus according to an embodiment. Fig. 2 is a view showing an example of the relationship between the imaging range of the line scan camera of the embodiment and the movable range of the review camera. Fig. 3 is a view showing another example of the relationship between the imaging range of the line scan camera of the embodiment and the movable range of the review camera. Fig. 4 is a top view showing a schematic configuration of a substrate inspecting apparatus shown in Fig. 1. Fig. 5 is a block diagram showing a schematic functional configuration of a substrate inspecting apparatus of the embodiment. Fig. 6 is a flow chart showing a schematic flow of the substrate inspection operation of the embodiment. Fig. 7 is a flow chart showing the outline flow of the defect detecting process of the embodiment. Fig. 8 is a flow chart showing the outline flow of the defect review processing of the embodiment. Fig. 9 is a flow chart showing a schematic flow of the folding defect inspection processing of the embodiment. Fig. 10 is a top plan view showing another schematic structure of the embodiment. [Embodiment 3] Embodiments for carrying out the invention Hereinafter, the form for carrying out the invention will be described in detail with reference to 201207381. In addition, in the following description, each figure only schematically shows the shape, size, and positional relationship to the extent that the content of the present invention can be understood. Therefore, the present invention is not limited to the shape, size, and positional relationship illustrated in the respective drawings. Qualifier. Further, in each of the drawings, in order to clarify the structure, a part of the section line of the cross section is omitted. Further, the numerical values exemplified below are only preferred examples of the present invention. Therefore, the present invention is not limited to the numerical values exemplified. Hereinafter, a substrate inspection device and a substrate inspection method according to an embodiment of the present invention will be described in detail with reference to the drawings. Fig. 1 is a perspective view showing a schematic configuration of a substrate inspecting apparatus of the present embodiment. As shown in FIG. 1, the substrate inspection apparatus 1 of the present embodiment includes a main body pedestal 11, and a floating table 14 that floats the substrate W by air blown from numerous holes provided in the substrate mounting surface. The transfer table 12 extending in the transport direction of the substrate W (in the X/-X direction in the drawing), and the substrate transport unit that transports the substrate W while moving the transfer table 12 while holding the substrate W loaded onto the floating table μ 22. The frame 13 of the inspection portion of the floating table 14 on which the substrate W can be transported is traversed in a direction perpendicular to the transport direction (in the γ direction in the drawing), and the floating table 14 is illuminated obliquely from the vicinity of the frame 13 A linear line illumination 18 extending in the Y direction is movably provided in the frame 13, and one or more defects of the linear region illuminated by the line illumination 18 are taken obliquely from the opposite side of the line illumination 18 The inspection line scan camera 15 is also movably provided in the frame π, and the substrate W on the floating table 14 is enlarged and photographed by one or more inspection cameras 19 for inspection. Among them, the floating table 14, the transfer table 12, and the frame 13 are fixed to the body base 11. Further, the line illumination 18 may be fixed to the body base 11. The body base 11 can be made of a member having excellent shock resistance such as a marble block, or with a vibration failure 201207381.卩, the components of the seismic performance are improved. Further, the substrate inspection device i can also be housed in a clean room. The riser 14 is fixed to the body base u by a frame not shown. Further, a plurality of holes that are connected to a blower mechanism (not shown) are provided on the substrate mounting surface of the ejector stage 14, and air is blown from the holes, and the substrate W placed on the floating table 14 is formed from the substrate mounting surface. The state of floating. However, the present invention is not limited thereto, and the structure in which the plurality of rollers are rotated in the transport direction of the substrate w is supported by the roller so that the substrate W does not contact the floating table 14 and is configured to be transported without damaging the substrate W during substrate transfer. Make various changes. The line illumination 18 used for the line scan camera 15 for defect inspection is a light source or a thin surface light source formed by arranging point light sources in a line shape. The line illumination 18 adjusts its position and angle so that the arrangement plane of the optical axis of the illumination light reflected on the surface of the substrate w includes the optical axis of each line scan camera 15. The frame 13 provided in parallel with the line illumination 18 is referred to as a so-called gantry. The frame 13 is provided with one or more line broom cameras 15 so as to be perpendicular to the direction in which the substrate W is transported ( The state in which the γ/_γ directions are arranged is maintained by the scanning camera stage 17. Each of the line scanning cameras 15 is provided with a camera lens 16 which can image the observation light reflected by the line illumination 18 on the substrate W at a predetermined magnification while being imaged at the line sensor position of the line scanning camera 15. Further, each of the line scan cameras 15 can be moved in the Υ/-Υ direction along the broom camera stage 17 independently of the other line broom cameras 15 under the control of a control unit not shown. This structure line scanning camera 丨 5 can photograph the substrate passing under the frame 13 in four directions in the γ direction. Therefore, the scanning operation of the substrate W in the X direction (or the χ direction) is performed by the substrate transfer unit 22 ′ by taking a line scan of the 201207381 camera 15 at a strip image capturing area extending in the direction of the ¥. The entire substrate w can be taken. However, since the number of the line sweeping cat cameras 15 is different, there are cases in which the entire substrate is photographed by performing a plurality of scanning operations. At this time, when the _ _ action ends, the line sweeping camera 15 moves a field of view in the direction of Υ/-Υ during the next scanning operation. On the other hand, the review camera 19 is constituted by a CCD camera, a CM〇s camera or the like. Each of the review cameras 19 is provided in a lens barrel 2 having an objective lens capable of performing coaxial projection illumination and an enlarged projection of the defects of the substrate W to obtain an enlarged image of the defect as a target. This lens barrel 20 is provided on the inspection camera stage 21 disposed on the opposite side of the scanning camera stage 17 via the frame η. The plurality of lens barrels 20 are held at the camera table 21 at a high speed. The review camera stage 21 can move the respective lens barrels 20 and the other lens barrels 20 at high speed in the Y/-Y direction independently under the control of a control unit not shown. Here, as shown in FIG. 2, when the number of the line scan cameras 15 is the same as the number of the review cameras 19, the first scanning range S1 and the second time of the line scan camera 15 are merged. The range ri of the scanning range S2 can be designed as a movable range of the review camera 19. Further, as shown in FIG. 3, when the number of the review cameras 19 is one-half of the number of the line scan cameras 15, the first scanning range of the line scan camera 15a is shot and the second time is taken. The scanning range S a 2, and the shooting range Sb of the first scanning of the line scanning camera 15 b and the range R2 of the shooting range Sb2 of the second scanning can be designed as one movable camera 19 range. However, the present invention is not limited thereto, and may be configured to move the inspection camera 19 by a plurality of shots. Thereby, it is possible to solve the problem of the disadvantage of one of the unilluminated shooting areas when photographing near the end of the movable range of the camera 07 of the 201207381. Then, the conveyance of the substrate W carried into the substrate inspection apparatus , is described in detail using a drawing. Fig. 4 is a top view showing the schematic configuration of the substrate inspecting apparatus shown in Fig. 。. As shown in Fig. 4, when the substrate W is carried onto the floating table 14 by the substrate inspection device j, the substrate W is mechanically aligned to a predetermined position by a positioning mechanism not shown. The substrate W that has been aligned with the predetermined position is held by the substrate transfer unit 22. Specifically, the substrate transport unit 22 includes a y-guide rail 223 that is provided on the transport table 12 and extends along the substrate transport direction, and is disposed next to the transport table 12, and is provided with a drive source tour transport belt (not shown). 221. The carrier belt 221 is fixed to the transport belt 221, and the traveling portion 222 that travels along the guide rail 223 is fixed to the traveling portion 222 by the tour of the transport belt 221, and the holding portion 224 of the substrate W is held. The holding portion 224 has one or more adsorption pads 225 connected to an exhaust pump (not shown), and the substrate W can be sucked to the adsorption pad 225 by the exhaust of the exhaust pump. As a result, the substrate w can be held by the holding portion 224. However, the configuration in which the holding portion 224 holds the end portion of the substrate w can be variously changed. When the substrate transport unit 22 moves in the χ/_χ direction by the transport belt 221, the substrate w held by the substrate transport unit 22 can be transported in the χ/-χ direction. At this time, since the substrate W is in a state of being floated from the floating table 14 by the air, it is possible to prevent the substrate W from being damaged by contact with the floating table 14 or the like. Next, the drive mechanism for operating the substrate inspection device will be described in detail using the drawings. Fig. 5 is a block diagram showing a schematic functional configuration of a substrate inspecting apparatus of the present embodiment. As shown in Fig. 5, the substrate inspection apparatus 1 package 201207381 includes a control board inspection device [the control unit (8) for the entire operation, the floating stage U for driving the substrate W, and the floating stage driving unit 14 and the detection substrate w for floating the substrate W. When the substrate has been moved from the outside to the floating (10), and the substrate is moved to the floating table 14, the substrate is mechanically aligned with the driving position of the mosquito position 132, and the surface holding substrate is mechanically aligned. The w, _ surface is moved to the transport drive unit 112 in the Χ/·Χ direction on the floating table 14, and the floating position detection unit 133 at the position of the substrate w on the stage u is driven, and the line illumination is driven. 18' drive the line broom _15' with the line illumination drive unit m' of the illumination area _ camera 15 in the imaging area of the camera 15 to obtain the image of the substrate w for each line to sweep the cat camera drive unit 115 and drive the review camera 19 to obtain The camera drive unit 119 is overlaid on the enlarged image of the defect of the substrate W. Further, the substrate inspection device 1 includes an input unit H) for inputting various settings or instructions by the user, and an image of the memory 3, _ acquired/memorized, which are suitable for storing various programs, parameters, and acquired image data. Or a display unit 1G4 for various kinds of information, a communication unit 1 for controlling communication with the outside, a defect detecting unit 121 for detecting an image of a defect included in an image captured by the line broom camera 15, and a defect detection The defect coordinate defining portion 122 of the position (defect coordinate) on the substrate to the defect detected by the portion 121. Further, the substrate loading detecting unit 131 detects whether or not the substrate w has been loaded, based on the k number of the sensor (not shown) provided in the substrate carrying inlet of the floating table 14. The mechanical alignment driving unit 13 2 drives a positioning mechanism such as a pin or a roller provided near the substrate carrying inlet of the floating table 14 to position the substrate W at a predetermined position. Next, the operation at the time of substrate inspection of the substrate inspection apparatus 1 will be described in detail using a drawing. Further, in the substrate inspection operation of the present embodiment, 10 201207381, in the case of at least the first broom operation, the defect detection process for detecting the defect of the substrate w and the defect processing of the image of the detected defect are simultaneously performed. For example. Further, when the second and subsequent scanning operations are performed after the second and subsequent operations, the defect detecting process may be omitted or omitted. Fig. 6 is a flow chart showing the outline flow of the substrate inspection operation of the embodiment. However, in the following description, attention is paid to the operation of control = 101 shown in Fig. 5. As shown in Fig. 6, in the substrate inspection operation, the control unit 101 first loads the substrate w from the outside onto the floating table 14 by the substrate transfer unit 131 (step S101). Further, at this time, the control unit (8) waits for the loading of the substrate w in a state where the air lifter 114 is driven, that is, in a state where air is blown from the hole of the floating table 14, (NO in step S101). When the substrate W is carried onto the floating table 14 (the step s1?), the control unit 101 drives the positioning mechanism (not shown) by the mechanical alignment driving portion 132 to mechanically drive the substrate w. The predetermined position of the floating table 14 is aligned (step S102). 'Next', the substrate transport unit 22 is driven by the transport drive unit 112, and the substrate transport sheet (10) moved to a predetermined substrate holding position holds the substrate w at a predetermined position. (Step S103) Then, the control unit ιοί starts the operation of moving the substrate transport unit 22 at the same speed in the X direction by the drive transport unit 112, and starts the operation of moving the substrate W to the X direction at a constant speed (step S1). 4) Next, the control unit 1〇1 stands by the position of the substrate w that is input from the substrate position forming unit 133 at any time, and waits until the substrate w reaches the imaging path where the transport path of the substrate w is located in the upper line camera ^ (broom) When the area is reached (step (4) G5), when the substrate w reaches the broom area (step is), the control (4) (8) first starts detecting the defect detection process of the substrate 201207381 (step sl6), and then starts to obtain In the defect The defect inspection process of the enlarged image of the defect detected by the measurement process (step S107). Next, the control unit 1〇1 determines whether or not the defect-sweeping operation is required to be performed in the defect review process or the foldback defect process described later ( Step s(10)). In addition, if the board is moved in the direction of the substrate w; ^x, it will be transported in the opposite direction. If it has been transported in the _X direction, it will be transported in the X direction. As a result of the determination, when the scan operation of the folding back is required (step 08), the control unit 101 drives the transport drive unit 112 to reverse the conveyance direction of the substrate w to start the operation of moving the money transfer unit 22 at a constant speed. Step S109). Then, the control unit 1Q1 starts the defect review processing (return defect inspection processing) for the remaining defects that have not been checked (step sh (9), and then returns to step S108. The result of the determination of the step measurement is not required. At the time of the sweeping back (step SH) 8, the control unit 1G1 determines that the sweeping cat for the substrate w is R knot (10) qing u), #不结树 (step ui no), and the returning step is difficult. On the other hand, when the _ action ends (step sin 疋), the action ends. The defect detection processing of the present embodiment will be described in detail using the drawings. The 7th _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ As shown in Fig. 7, in the defect detecting process, the control unit ι 〇 拍摄 ( ( ( 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四In addition, the image 1 of the i-line amount is simultaneously driven by a plurality of lines _ camera 15 arranged in the direction perpendicular to the transport direction of the base _ 12 201207381, and a strip chart generated by merging the plurality of images taken one time. image. Then, the control unit 101 inputs an image of one line amount input by the line scan camera driving unit 115 to the defect detecting unit 12 to perform image analysis (step S122) 'detecting the image of the one line amount. defect. Next, the control unit 101 determines whether or not a defect is detected in step S122 (step S123), and when a defect is detected (YES in step S123) 'defines the position of the detected defect on the substrate w at the defect chain defining portion 122 (Defect Coordinate) (Step S124), the defect coordinate of the defined one line amount is output (Step S125). Further, the output of the defective coordinates is the control unit 1〇1. On the other hand, when the defect is not detected in step S122 (NO in step S123), the control unit 1〇1 moves to step S126. Further, the position (coordinate) at which the defect is at the position of the substrate w (defect coordinates) from the substrate on the floating table 14 and the position (coordinate) of the imaging region of each line scanning camera 15 on the floating table 14 are in various lines. The position (coordinate) of the defect included in the image captured by the scan camera 15 is calculated. In step S126, the control unit 1〇1 waits until the substrate moves by one line in the 乂 direction (NO in step S126). When the substrate w moves the amount of the line in the X direction (YES in step S126), the control unit 101 determines whether or not the scanning of all the lines of the substrate w has been completed, that is, determines the detection of the defects of the entire substrate W and the definition of the defective coordinates. It is completed (step S127), and when it is not completed (NO of step sm), the control unit 1〇1 returns to step S121, and the subsequent operations are executed. On the other hand, when the scanning of all the lines is completed (YES in step S127), the control unit 1〇1 ends the defect detecting process. Next, the defect review processing of the present embodiment will be described using a schematic diagram, and the detailed description of the defect review processing of the present embodiment is shown in Fig. 8 . As shown in FIG. 8, in the defect inspection process, the control unit 1 1 first determines whether or not the defect coordinate of the one-line amount has been input from the defect coordinate defining unit 122 in the defect detecting process shown in FIG. 7 (step S141). When the input is made (YES in step S141), the defect coordinate of the line amount is stored in the memory unit 1〇3 or the like (step S142), and then the process proceeds to step SM3. On the other hand, when the defect coordinate of the line quantity is not input, that is, in the defect detection processing shown in Fig. 7, when the image of the line amount does not contain a defect (No in step S141), the control unit 移1 shifts Go to step S143. In the step S143, the control unit ι1 creates, for the memory unit 103 or the like, all the defects of the defective coordinates, and includes a review schedule including the order of the review or the information such as the amount of movement of the camera 19 and the movement time at the time of the review. Process (step S143). In addition, regarding the preparation of the review schedule, it will be mentioned later. Moreover, the prepared review schedule is temporarily stored in the memory unit 1〇3 and the like. Next, the result of the scheduling made in step S143 by the control unit 1〇1 determines whether or not there is a defect that cannot be checked, i.e., cannot be photographed by the camera 19 (step S144). If there is a defect that cannot be checked as a result of the determination (YES in step S144), the control unit 1G1 selects the priority order of the predetermined defect in the defect of the memory-retained coordinate, and selects the defect as the covered wire image (step S145). . In addition, the predetermined priority may be based on the size of the defect or the positional relationship between the defect and the wiring. X, the unselected defect coordinates are memorized in the memory unit 103 by other methods. Next, the control unit HH checks the schedule selected in step S145 again (step S146), and then proceeds to step S147. On the other hand, the result of the judgment of 201207381 4S144' If there is no defect that cannot be checked (step s"4), the control unit 1G1 moves directly to step 47. In addition, the review schedules stored in the memory unit 103 and the like are first stored to update the schedule in step (4). In step S147, the control unit 1〇 drives the review camera driving unit 119 based on the review schedule stored in the memory unit or the like, and can overwrite the camera Η9 to obtain an enlarged image of the defect to be inspected. Further, the enlarged image of the obtained defect and the defective coordinate are stored in the memory portion (10) and the like. After that, the control unit 101 determines whether or not the substrate defect inspection process has been completed (step S148), and if it has not been completed (NO in step S148), it returns to the hometown and performs the read operation. On the other hand, when the defect inspection operation is completed (YES in step SM8), the control (four) chatter is a defect that cannot be checked by μ, that is, it is determined whether or not it is determined that there is a defect that cannot be checked in step S144 (step S149). 'When there is a defect that cannot be checked (YES in step S49), a request for the scan-back of the foldback (step (10)) is generated, and thereafter, the call-out processing is ended. In addition, the retracement is stored in memory (4) (4). Further, as a result of the determination of the step ride 49, when there is no defect that cannot be checked (NO in step S49), the control unit ι〇ι directly ends the defect review processing. Further, Fig. 9 is a flow chart showing an outline flow of the folding defect inspection processing of the present embodiment. As shown in Fig. 9, in the folding defect inspection processing, the control unit 1G1S creates a review schedule for the defects remaining without being checked for the detected defects (step S161). The prepared review schedule is stored in the memory unit 103 and the like in the same manner as described above. 15 201207381 Then, the control unit 101 determines whether there is a defect that cannot be checked in the result of the scheduling of step S161 (step S162), and if there is a defect that cannot be checked (YES in step S162), it is not selected. In the defect, the defect to be inspected is selected based on the predetermined priority order (step S163), and the defect selected thereby is further subjected to the review schedule (step S164), and then the process proceeds to step S165. On the other hand, as a result of the determination in the step S162, when there is no defect that cannot be checked (NO in step S162), the control unit 101 directly moves to the step "". In addition, the review schedule stored in the memory unit 103 and the like is updated in the same manner as described above. Further, the defect coordinates which are not selected in step S163 are stored in the memory unit 1〇3 or the like by other methods as described above. In the step S165, the control unit 101 drives the review camera driving unit 119 based on the review schedule stored in the memory unit 〇3 or the like, and acquires the enlarged image of the defect to be inspected by the review camera. After that, the control unit 101 determines whether there is a defect that cannot be checked, that is, whether the apricot has determined that there is a defect that cannot be checked in step S162 (step S166), and t has a defect that cannot be checked (step S166) Yes), the request for the buckling action (return defect inspection process) for re-entry is generated (step (10)), and then the reentry defect is covered. Moreover, the result of the determination in step S166, when the method «the lack of _ (the step of the control of the 娜 66 66 丨 丨 will directly result in the reentry defect inspection process. The upper action, the implementation includes the detection of the presence of the substrate W: Defect detection processing, an enlarged image for obtaining the detected defect, and a substrate inspection operation including the reentry defect inspection processing. In the above operation, the defect detection method of the present invention is 16 201207381 This is achieved by including at least the transfer step of step S104, the defect detection step of step S106, and the image acquisition step of step S107. Next, the preparation of the review schedule (including re-production) of the present embodiment will be described in detail. Here, when the moving speed of the substrate transport unit 22 in the X direction (the moving speed of the substrate W in the X direction) is Gs, the moving speed of the review camera 19 in the Y direction is Gr, and the movable distance of the review camera 19 is Yr, when the moving time of the review camera 19 when the movable distance γΓ is moved is Tr, the moving time Tr can be expressed by the following expression.
Tr=Yr/Gr ⑴ 又’當令覆查照相機19靜止於目的位置後，至對象缺 陷之拍攝完畢為止之時間為Τα時，取得丨個缺陷之放大圖 像所需之時間Td可以以下式（2)表示。Tr=Yr/Gr (1) Further, when the time until the target defect is completed is Τα after the camera 19 is still at the target position, the time Td required to obtain the enlarged image of the defect can be expressed by the following equation (2). ) said.
Td=Tr+T α ⑺ 因此，於進行對丨個缺陷之缺陷覆查處理之期間，基板 搬送單7〇22往X方向移動之距離dXf便為以下式⑺。 dXr=GrxTd ⑺ 昭在此，當令基板W之X方向之長度為|乂時，以線掃瞄 照相機15掃8S1線量之期間’ 1台覆查照相機19可拍攝之缺 之數(可取知之缺陷圖像數)Img便為以下式⑷。Td=Tr+T α (7) Therefore, the distance dXf at which the substrate transport sheet 7〇22 moves in the X direction during the defect inspection process for one defect is expressed by the following formula (7). dXr=GrxTd (7) Here, when the length of the substrate W in the X direction is |乂, the period in which the line scan camera 15 scans the 8S1 line amount is the number of defects that can be taken by the camera 19 (the defect map can be known) The image number Img is the following formula (4).
Img=Wx/dXr ⑷ 杳日因而於以線掃猫照相機掃猫i線量之期間，可以復 機19全體取得之缺陷圖像之總數係於以上述式⑷所 數可取侍之缺陷圖像數1mg乘上覆查照相機19之台數的 17 201207381 惟’由於於處理1個缺陷之期間，基板搬送單元22在距 離dXr移動，故應以1個覆查照相機19拍攝之缺陷有2個時， 當該等之X方向之間距為dXr以下，便無法實質地拍任一缺 陷。是故’在本實施形態，為優先進行對較嚴重之缺陷之 缺陷覆查處理，乃對缺陷設定按程度之優先順位，作成覆 查排程’俾可根據此優先順位，優先地覆查較嚴重之缺陷。 舉例言之，基板W從線掃瞄照相機15之拍攝區域(掃瞄 區域)移動至覆查照相機19之拍攝區域之期間，以在缺陷檢 測處理所檢測出之順序，檢測出Dfl、Df2、Df3、Df4及Df5 作為應以1個覆查照相機19拍攝之缺陷。在此，令尺寸大之 缺陷為優先順位高之缺陷’令缺陷之尺寸之關係為Df3> Df2〉Df4 > Dfl > Df5，在檢測順序前後之2個缺陷之X方向 的間隔與距離dXr之關係分別為| 〇fl-Df2 | < dXr、 I Df2-Df3 I > dXr、I Df3-Df4 I < dXr、及 I Df4-Df5 I > dXr 時，依據此優先順位，缺陷Df3必定作為覆查對象之缺陷。 在此’對缺陷Df3於X方向相距距離dXr以上之缺陷為缺陷 Df2及Df52個。因此，在此情況，作為覆查對象之缺陷便為 缺陷Df2、Df3及Df53個。 是故，針對此情況，在本實施形態中，生成下述覆查 排程，前述覆查排程係包含以Df2—Df3wDf5之順序，覆杳 缺陷之資訊、在缺陷Df2後，覆查缺陷Df3前，使覆查照相 機19於Y方向移動之移動量及在缺陷do後，覆查缺陷Df5 前，使覆查照相機19於Y方向移動之移動量的資訊者。 又，如上述情況般，1次之掃瞄動作無法覆查所有缺陷 201207381 時，即，有以缺陷檢測處理檢測出，但不作為覆查對象而 仍剩餘之缺陷存在時，在本實施形態中，如上述執行以 此剩餘之缺陷為覆查對象之折返缺陷覆查處理（參昭第9 圖）。舉例言之，在第2次以後之掃猫動作中，基板w從覆杳 照相機⑼則往線掃瞒照相機15側移動之掃晦動作時執行之 折返缺陷覆查處理，即使同時執行缺陷檢測處理’對以此 缺陷檢測處理檢測出之缺陷’仍無法於同一掃猫動作中進 灯缺陷覆查處理。此時’非僅使基從覆查照相機⑼則 往線掃猫照相機15側移動，而藉進行折返缺陷覆查處理， 可抑制對丨懿板之處理時間之增加，並且相更多之缺陷 作為覆查對象。又’在折返缺陷覆查處理中覆查照相機 19之可拍攝範圍未包含缺陷之期間，亦可進行使基板w之 搬送速度提升之動作。 如以上所說明，根據本實施形態，由於同時執行對基 板W之缺陷檢測處理及用以取得此所檢測出之缺陷之圖像 的缺陷f查處理，故可在不使對1個基板W之產距時間增加 下，取得更多之缺陷之圖像。 t，上述基板檢查裝置i之裝置結構僅為—例，非以 、、疋。舉例言之，在本實施形態中 轉，-碰敎料搬送料_，但不限= ' 上相提及，村為—面以於搬 =r等)支撐基板w，-面搬送彻送方式等進行 3=':又’在本實施形態中，舉了保持對基板W之搬 仃之其中一端來搬送之情形為例，但不限於此， 19 201207381 亦可為保持兩端來搬送或保持基板w之中央部等來搬送等 進行各種變更。 又，在上述實施形態中，將線掃瞄照相機15及覆查照 相機19設於1個框架13，但不限於此，亦可分別設於與搬送 方向垂直地跨越浮起台14之其他框架。又，在本實施形態 中，以1條線式照明18照明了複數個線掃瞄照相機丨5全體之 拍攝區域，但不限於此，亦可於線掃瞄照相機15分別設個 別之照明。此時，由於可構造成照明與線掃瞄照相機15之 移動一同移動，故可抑制各照明之耗費電力。再者，亦可 為將線掃瞄照相機15設於具有同軸入射照明之鏡筒内之結 構。 再者，在本實施形態中，舉了線掃瞄照相機15及覆查 照相機19不於基板W之搬送方向（X/-X方向）移動之情形為 例’但非以此限定者。舉例言之，如第1〇圖所示，亦可為 各覆查照相機19分別設於可於X/-X方向突出之伸縮台2〇1 之結構。此時，伸縮台201在第5圖所示之控制台1〇1之控制 下’於覆查缺陷時，依需要，使覆查照相機19於X/-X方向 移動。藉此’由於可於一次之掃瞄動作中，覆查在X方向較 靠近之2個缺陷，故可更縮短對缺陷全體之產距時間。又， 可大巾§增加可取得之缺陷之放大圖像。 又，上述實施形態及其變形僅為用以實施本發明之 例’本發明非以該等限定者，按規格等進行各種變形係在 本發明之範圍内，再者，從上述記載，在本發明之範圍内， 可進行其他各種實施形態是不言而喻的。舉例言之，對各 20 201207381 實施形態適當例示之變形例亦可對其他實施形態適用是無 須贅言的。 l圖式簡單說明3 第1圖係顯示一實施形態之基板檢查裝置之概略結構 的立體圖。 第2圖係顯示實施形態之線掃瞄照相機之拍攝範圍與 覆查照相機之可動範圍的關係之一例之示意圖。 第3圖係顯示實施形態之線掃瞄照相機之拍攝範圍與 覆查照相機之可動範圍的關係之另一例之示意圖。 第4圖係顯示第1圖所示之基板檢查裝置之概略結構的 上視圖。 第5圖係顯示實施形態之基板檢查裝置之概略功能結 構的塊圖。 第6圖係顯示實施形態之基板檢查動作之概略流程的 流程圖。 第7圖係顯示實施形態之缺陷檢測處理之概略流程的 流程圖。 第8圖係顯示實施形態之缺陷覆查處理之概略流程的 流程圖。 第9圖係顯示實施形態之折返缺陷覆查處理之概略流 程的流程圖。 第10圖係顯示實施形態之框架之另一概略結構之上視 圖。 21 201207381 【主要元件符號說明】 1.. .基板檢查裝置 11.. .本體基座 12.. .搬送台 13.. .框架 14.. .浮起台 15.. .線掃瞄照相機 16.. .照相機鏡頭 17··.掃瞄照相機台 18.. .線式照明 19.. .覆查照相機 20…鏡筒 21.. .覆查照相機台 22.. .基板搬送單元 101.. .控制部 102.. .輸入部 103.. .記憶部 104.. .顯示部 105.. .通信部 112.. .搬送驅動部 114.. .浮起台驅動部 115.. .線掃瞄照相機驅動部 118.. .線式照明驅動部 119.. .覆查照相機驅動部 121.. .缺陷檢測部 122.. .缺陷座標界定部 131.. .基板搬入探測部 132.. .機械對準部 133.. .基板位置檢測部 201.. .伸縮台 221.. .搬送帶 222.. .行走部 223.. .引導軌道 224.. .保持部 225.. .吸附墊 IU，R2...範圍 SI，S2，Sal，Sa2，Sbl，Sb2... 拍攝範圍 S101-S111，S121-S127···步驟 S141-S150，S161-S167...步驟 W...基板 X，-X，Y，-Y...方向 22Img=Wx/dXr (4) The total number of defective images that can be obtained by the whole machine 19 is the number of defective images that can be taken by the above formula (4) during the period of the line scan of the cat camera. When the number of the cameras 19 is multiplied, the number of the cameras 19 is only 2012 201281. However, since the substrate transport unit 22 moves at the distance dXr during the processing of one defect, when there are two defects detected by the one camera 19, If the distance between the X directions is below dXr, it is impossible to take any defect substantially. In this embodiment, in order to prioritize the defect processing of the more serious defects, the priority setting of the defect is set to the priority of the schedule, and the review schedule can be made based on the priority order. Serious defects. For example, while the substrate W is moved from the imaging area (scanning area) of the line scan camera 15 to the imaging area of the review camera 19, Dfl, Df2, and Df3 are detected in the order detected by the defect detection processing. Df4 and Df5 are defects that should be taken by one review camera 19. Here, the defect with a large size is a defect with a higher priority. The relationship of the size of the defect is Df3> Df2>Df4 > Dfl > Df5, the interval and the distance dXr of the X directions of the two defects before and after the detection order The relationship is | 〇fl-Df2 | < dXr, I Df2-Df3 I > dXr, I Df3-Df4 I < dXr, and I Df4-Df5 I > dXr, according to this priority order, defect Df3 It must be a defect of the object of review. Here, the defect in which the defect Df3 is apart from the X direction by the distance dXr is 52 defects Df2 and Df. Therefore, in this case, the defects of the object to be examined are the defects Df2, Df3, and Df53. Therefore, in this case, in the present embodiment, the following review schedule is generated. The above-described review schedule includes information on the defects in the order of Df2 - Df3wDf5, and the defect Df3 after the defect Df2. Before, the amount of movement of the review camera 19 in the Y direction and the amount of movement of the camera 19 moving in the Y direction before the defect Df5 is checked after the defect do is made. Further, as in the case described above, when the scan operation of one scan cannot be performed for all the defects 201207381, that is, if there is a defect that is detected by the defect detection processing but is not the object of the inspection, in the present embodiment, The reentry defect review processing of the remaining defect is performed as described above (see Fig. 9). For example, in the second and subsequent sweeping operation, the substrate w is subjected to the folding defect inspection process performed when the cover camera (9) moves to the line sweeping camera 15 side, even if the defect detection processing is simultaneously performed. 'The defect detected by this defect detection process' is still unable to be processed in the same sweeping cat action. At this time, the non-only base camera is moved from the review camera (9) to the line scan camera 15 side, and by performing the foldback defect inspection process, the increase in the processing time of the seesaw can be suppressed, and more defects are Review the object. Further, during the review of the folding defect inspection process, the period in which the photographable range of the camera 19 is covered does not include a defect, and the operation of increasing the transport speed of the substrate w can be performed. As described above, according to the present embodiment, since the defect detection processing for the substrate W and the defect f check processing for acquiring the image of the detected defect are simultaneously performed, it is possible to prevent the substrate from being unpaired. As the production time increases, more images of defects are obtained. t, the device structure of the above-mentioned substrate inspection device i is only an example, and is not used. For example, in the present embodiment, the transfer, the contact with the feed material _, but not limited to = 'the above mentioned, the village is - face to move = r, etc.) support substrate w, - face transfer and delivery mode In the present embodiment, the case where the one end of the substrate W is held and transported is taken as an example. However, the present invention is not limited thereto, and 19 201207381 may be carried or held at both ends. The center portion of the substrate w is transported and the like, and various changes are made. Further, in the above embodiment, the line scan camera 15 and the review camera 19 are provided in one frame 13, but the present invention is not limited thereto, and may be provided in another frame that straddles the floating table 14 perpendicularly to the transport direction. Further, in the present embodiment, the imaging area of the entire plurality of line scan cameras 丨5 is illuminated by one line illumination 18, but the present invention is not limited thereto, and each of the line scan cameras 15 may be provided with illumination. At this time, since the illumination can be configured to move together with the movement of the line scan camera 15, the power consumption of each illumination can be suppressed. Furthermore, it is also possible to provide the line scan camera 15 in a structure having a coaxial incident illumination lens barrel. In the present embodiment, the case where the line scan camera 15 and the review camera 19 are not moved in the transport direction (X/-X direction) of the substrate W is exemplified, but is not limited thereto. For example, as shown in Fig. 1, each of the inspection cameras 19 may be provided in a telescopic table 2〇1 which is protruded in the X/-X direction. At this time, when the telescopic table 201 is under the control of the console 1〇1 shown in Fig. 5, when the defect is inspected, the review camera 19 is moved in the X/-X direction as needed. Therefore, since the two defects which are close to each other in the X direction can be examined in one scanning operation, the production time of all the defects can be shortened. Also, the large towel § increases the magnified image of the defects that can be obtained. Further, the above-described embodiments and modifications thereof are merely examples for carrying out the invention. The invention is not limited thereto, and various modifications are possible within the scope of the invention, and the description is based on the above description. It is needless to say that various other embodiments can be made within the scope of the invention. For example, it is needless to say that the modifications exemplified in the respective embodiments of the 2012 201281 can be applied to other embodiments. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing a schematic configuration of a substrate inspecting apparatus according to an embodiment. Fig. 2 is a view showing an example of the relationship between the imaging range of the line scan camera of the embodiment and the movable range of the review camera. Fig. 3 is a view showing another example of the relationship between the imaging range of the line scan camera of the embodiment and the movable range of the review camera. Fig. 4 is a top view showing a schematic configuration of a substrate inspecting apparatus shown in Fig. 1. Fig. 5 is a block diagram showing a schematic functional configuration of a substrate inspecting apparatus of the embodiment. Fig. 6 is a flow chart showing a schematic flow of the substrate inspection operation of the embodiment. Fig. 7 is a flow chart showing the outline flow of the defect detecting process of the embodiment. Fig. 8 is a flow chart showing the outline flow of the defect review processing of the embodiment. Fig. 9 is a flow chart showing a schematic flow of the folding defect inspection processing of the embodiment. Fig. 10 is a top plan view showing another schematic structure of the embodiment. 21 201207381 [Description of main component symbols] 1.. Substrate inspection device 11... Body base 12: Transfer table 13. Frame 14.. Float table 15.. Line scan camera 16. . Camera lens 17··. Scanning camera table 18.. Line illumination 19.. Review camera 20...Lens tube 21.. Review camera station 22.. Substrate transport unit 101.. Control Part 102.. Input unit 103.. Memory unit 104.. Display unit 105.. Communication unit 112.. Transport drive unit 114.. Floating table drive unit 115.. Line scan camera drive Section 118.. Line illumination drive unit 119.. Review camera drive unit 121.. Defect detection unit 122.. Defect coordinate defining unit 131.. Substrate loading detection unit 132.. Mechanical alignment unit 133.. substrate position detecting unit 201.. telescopic table 221.. conveying belt 222.. walking portion 223.. guide rail 224.. holding portion 225.. adsorption pad IU, R2... Range SI, S2, Sal, Sa2, Sbl, Sb2... Shooting range S101-S111, S121-S127 · Step S141-S150, S161-S167... Step W... Substrate X, -X, Y ,-Y...direction 22